广东工业大学学报 ›› 2023, Vol. 40 ›› Issue (01): 122-129.doi: 10.12052/gdutxb.210122

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复合型低介电常数聚酰亚胺复合材料研究进展

余文涛1, 宋建远2, 方基永1, 刘屹东1, 刘存生1, 闵永刚1   

  1. 1. 广东工业大学 材料与能源学院，广东 广州 510006;
    2. 深圳崇达多层线路板有限公司，广东 深圳 518052
  • 收稿日期:2021-08-20 出版日期:2023-01-25 发布日期:2023-01-12
  • 通信作者: 闵永刚(1963-),男,教授,博士,主要研究方向为有机光电功能材料与器件、高性能聚合物材料等,E-mail:ygmin@gdutedu.cn
  • 作者简介:余文涛(1997-),男,硕士研究生,主要研究方向为高性能聚酰亚胺的合成及性能
  • 基金资助:
    国家自然科学基金资助项目(U20A20340)；“珠江人才计划”引进创新创业团队项目(2016ZT06412)

Research and Application Progress of Composite Polyimide with Low Dielectric Properties

Yu Wen-tao1, Song Jian-yuan2, Fang Ji-yong1, Liu Yi-dong1, Liu Cun-sheng1, Min Yong-gang1   

  1. 1. School of Materials and Energy, Guangdong University of Technology, Guangzhou 510006 , China;
    2. Shenzhen Suntak Multilayer Circuit Board Co., Ltd., Shenzhen 518052, China
  • Received:2021-08-20 Online:2023-01-25 Published:2023-01-12

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摘要： 聚酰亚胺具有优异的力学性能及耐热性，一直是微电子产业的重要电介质材料之一。近年来，随着微电子行业的发展和5G通讯技术的兴起，从能耗要求到信号接收等方面都对降低聚酰亚胺的介电常数和介电损耗提出更高的要求。如何在保留聚酰亚胺优异性能的同时尽可能降低其介电常数与损耗是目前亟需解决的问题。本文综述了近年来多孔聚酰亚胺和聚合物填料、无机纳米填料复合改性聚酰亚胺等复合型低介电聚酰亚胺的研究及应用进展，探讨了如何在降低聚酰亚胺介电常数的同时保持其他性能，并对其发展进行了展望，为新型复合型低介电聚酰亚胺材料的设计与制备提供新思路。

关键词: 聚酰亚胺, 低介电常数, 多孔聚酰亚胺, 石墨烯衍生物, 聚倍半硅氧烷

Abstract: With excellent mechanical properties and heat resistance, polyimide has been one of the important dielectric materials in microelectronics industry. In recent years, with the rapid development of microelectronics industry and the rise of 5G communication technology, higher requirements are put forward for the dielectric constant and dielectric loss reduction of polyimide in terms of energy consumption requirements and signal reception. How to reduce as much as possible the dielectric constant and dielectric loss and retain the excellent properties of polyimide at the same time is an urgent problem to solve at present. The research and application progress of porous polyimides, polymers filler and inorganic nano filler composite modified polyimides and other composite low dielectric polyimides emerging in recent years are reviewed. How to reduce the dielectric constant of polyimides while maintaining other properties is discussed, and its development is prospected. It will provide a new idea for the design and preparation of new composite low dielectric polyimide materials.

Key words: polyimide, low dielectric constant, porous polyimide, graphene derivative, polysilsesquioxane

中图分类号: 

  • TQ323.7
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