Temperature dependant crosstalk analysis in coupled single‐walled carbon nanotube (SWCNT) bundle interconnects |
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| Authors: | Mayank Kumar Rai Sankar Sarkar |
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| Affiliation: | 1. Department of Electronics and Communication Engineering, Thapar University, Patiala, India;2. Department of Electronics and Computer Engineering, Indian Institute of Technology Roorkee, Roorkee, India |
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| Abstract: | The temperature‐dependent, crosstalk‐induced, noise voltage waveform and its frequency spectrum, in capacitive coupled single‐walled carbon nanotube (SWCNT) bundle interconnects, at the far end of victim line, have been analyzed at 22‐nm technology node. A similar analysis is performed for copper interconnects and a comparison is made between the results of these two analyses. The SPICE simulation results reveal that at temperature variations ranging from 300 to 500 K, compared with conventional metal (copper) conductors, crosstalk noise voltage levels in CNT, at the far end of victim line, are significantly low. Simulated results further reveal that, with rise in interconnect temperatures, compared with copper interconnects, coupled interconnects of SWCNT bundle filter more noise frequency components. Based on these comparative results, an improved model for extracting inter‐bundle, real life, coupling capacitances between SWCNT bundles has been proposed. Copyright © 2014 John Wiley & Sons, Ltd. |
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| Keywords: | Carbon nanotubes (CNT) Interconnects Single‐walled carbon nanotube (SWCNT) CNT bundle interconnect Very large scale integration (VLSI) Crosstalk analysis |
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