热压温度对真空热压法制备Cu–30Ni–5Nb合金组织及性能的影响 |
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引用本文: | 侯晨阳,卢百平.热压温度对真空热压法制备Cu–30Ni–5Nb合金组织及性能的影响[J].粉末冶金技术,2021,39(5):434-438. |
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作者姓名: | 侯晨阳 卢百平 |
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作者单位: | 南昌航空大学轻合金加工科学与技术国防重点学科实验室, 南昌 330063 |
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基金项目: | 国家高技术研究发展计划资助项目(2013AA064001) |
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摘 要: | 采用真空热压法制备了Cu–30Ni–5Nb合金,研究了热压温度对合金组织、相对密度、熔点及热导率的影响。结果表明,在800~950 ℃热压温度范围内,Cu–30Ni–5Nb合金的熔点先降低后升高,900 ℃时铜合金的熔点最低(1178.92 ℃);Cu–30Ni–5Nb合金的热导率先增大后减小,900 ℃时铜合金的热导率最大(30.65 W·m?1·K?1)。热压温度为875 ℃时,Cu–30Ni–5Nb合金具有较好的综合性能,相对密度为98.66%,熔点为1180.86 ℃,热导率为29.54 W·m?1·K?1,且合金屈服强度达到355.74 MPa,符合冷却水套的性能要求。
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关 键 词: | 热压温度 真空热压法 Cu–30Ni–5Nb合金 组织 性能 |
收稿时间: | 2020-03-05 |
Effect of hot-pressing temperature on microstructure and properties of Cu–30Ni–5Nb alloys prepared by vacuum hot-pressing method |
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Affiliation: | National Defense Key Discipline Laboratory of Light Alloy Processing Science and Technology, Nanchang Hangkong University, Nanchang 330063, China |
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Abstract: | Cu–30Ni–5Nb alloys were prepared by vacuum hot-pressing method. The effects of hot-pressing temperature on the microstructure, relative density, melting point, and thermal conductivity of the Cu–30Ni–5Nb alloys were studied. The results show that, with the increase of the hot-pressing temperature from 800 to 950 ℃, the melting point of the Cu–30Ni–5Nb alloys firstly decreases and then increases, and the melting point is the lowest (1178.92 ℃) at 900 ℃. However, the thermal conductivity of the copper alloys increases firstly and then decreases with the increase of the hot-pressing temperature from 800 to 950 ℃, and the thermal conductivity is the highest (30.65 W·m?1·K?1) at 900 ℃. When the hot-pressing temperature is 875 ℃, the Cu–30Ni–5Nb alloys show the good comprehensive properties with the relative density of 98.66 %, the melting point of 1180.86 ℃, the thermal conductivity of 29.54 W·m?1·K?1, and the alloy yield strength of 355.74 MPa, which are more suitable for the performance requirements of the cooling water jacket. |
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