| 激光晶片抛光中磨粒运动轨迹分布均匀性分析 |
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| 引用本文： | 康仁科,赵海洋,朱祥龙,焦振华.激光晶片抛光中磨粒运动轨迹分布均匀性分析[J].金刚石与磨料磨具工程,2017,37(3):40-45. |
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| 作者姓名： | 康仁科 赵海洋 朱祥龙 焦振华 |
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| 作者单位： | 大连理工大学 精密与特种加工教育部重点实验室, 辽宁 大连 116024 |
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| 基金项目： | 国家自然科学基金项目（91323302）；国家重点研发计划项目（2016YFB1102205） |
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| 摘 要： | 为分析晶片抛光过程中，转动比α和摆动比β对磨粒轨迹分布均匀性的影响，建立晶片与抛光垫的相对速度模型及磨粒在晶片表面的运动轨迹模型，并分析晶片相对抛光垫的速度的分布规律、统计磨粒轨迹密度。结果表明:晶片转速与抛光垫转速一致时，其对抛光垫的相对速度大小一致；晶片随抛光头的往复运动主要影响相对速度变化的周期性及磨粒轨迹分布的随机性；当α=1.01，β=0.2时，磨粒在晶片上的轨迹分布均匀性最好。
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| 关 键 词： | 速度分布 转动比 摆动比 轨迹密度 |
| 收稿时间： | 2017-04-12 |
Analysis on uniformity of particle trajectories in laser wafer polishing |
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| KANG Renke,ZHAO Haiyang,ZHU Xianglong,JIAO Zhenhua.Analysis on uniformity of particle trajectories in laser wafer polishing[J].Diamond & Abrasives Engineering,2017,37(3):40-45. |
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| Authors: | KANG Renke ZHAO Haiyang ZHU Xianglong JIAO Zhenhua |
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| Affiliation: | Dalian University of Technology, Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian 116024, Liaoning, China |
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| Abstract: | To analyze effect of rotation ratio α and swing ratio β on distribution uniformity of grain trajectory during wafer polishing, two models are established, namely relative velocity between wafer and pad, and grain trajectory on wafer surface.Distribution law of relative velocity and particle trajectory density statistics are studied.Resultsshow that when the rotation speeds of wafer and pad are kept consistent, the relative speed is stable.It is also found that the reciprocating motion of wafer following polishing head mainly influences periodicity of relative speed changes and randomness of grain trajectory distribution.In conclusion, when α=1.01 and β=0.2, the homogeneity of grain trajectory distribution on wafer is the best. |
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