| 电子封装用环氧树脂固化温度与应变的三维有限元模拟 |
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| 引用本文： | 康峻铭,孙亮亮,王继辉,李小阳,杨鹏.电子封装用环氧树脂固化温度与应变的三维有限元模拟[J].复合材料学报,2019,36(10):2330-2340. |
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| 作者姓名： | 康峻铭 孙亮亮 王继辉 李小阳 杨鹏 |
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| 作者单位： | 1.武汉理工大学 材料科学与工程学院, 武汉 430070; |
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| 摘 要： | 环氧树脂因具有许多优异的性能而被广泛用作电子封装材料，然而环氧树脂在固化过程中产生的内应力会对封装产品的性能产生严重影响。针对一种用于电子封装的环氧树脂，通过实验分析了其固化动力学、密度、导热系数、玻璃化转变温度、弹性模量、化学收缩应变和热应变等性能参数，建立了固化过程中的数学模型。通过ABAQUS建立三维有限元模型，采用顺序耦合分析方式，分步进行传热分析和应力应变分析，模拟环氧树脂固化过程中的温度场、固化度场和应力应变场。最后采用光纤布拉格光栅（FBG）监测环氧树脂在固化过程中内部的温度和应变变化，并与模拟进行对比，结果表明本文所建立的有限元模型具有较高的可靠性。
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| 关 键 词： | 电子封装 环氧树脂 固化过程 有限元分析 光纤布拉格光栅(FBG) |
| 收稿时间： | 2018-09-11 |
Three-dimensional finite element simulation of temperature and strain in epoxy resin used to electronic packaging during curing |
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| KANG Junming,SUN Liangliang,WANG Jihui,LI Xiaoyang,YANG Peng.Three-dimensional finite element simulation of temperature and strain in epoxy resin used to electronic packaging during curing[J].Acta Materiae Compositae Sinica,2019,36(10):2330-2340. |
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| Authors: | KANG Junming SUN Liangliang WANG Jihui LI Xiaoyang YANG Peng |
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| Affiliation: | 1.School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China;2.Electronic Engineering Institute, China Academy of Engineering Physics, Mianyang 621900, China |
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| Abstract: | Epoxy resin is widely used as electronic packaging material with many excellent performances, however, the internal stress of epoxy resin induced in the curing process will bring about unfavorable influence on packaged products. Many experiments were carried out to research the performance parameters of epoxy resin used to electronic packaging, such as curing kinetics, density, thermal conductivity, glass transition temperature, elastic modulus, chemical shrinkage strain, thermal strain, etc. After that, mathematic models of these parameters in the curing process were established. Three-dimensional finite element model was established with ABAQUS to simulate the temperature field, curing degree field, stress and strain field of epoxy resin in the curing process. Sequentially coupled analysis was used to perform heat conduction analysis and stress-strain analysis successively in ABAQUS. The fiber Bragg grating(FBG) experiment was carried out to monitor the evolution of temperature and strain in epoxy resin during the curing process. Comparison of the results between experiment and simulation demonstrates that the finite element model established in this paper is of high reliability. |
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| Keywords: | electronic packaging epoxy resin curing process finite element analysis fiber Bragg grating(FBG) |
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