| 工艺参数对高铟高锡银基钎料粉末电磁压制成形的影响 |
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| 引用本文： | 张婕,胡建华.工艺参数对高铟高锡银基钎料粉末电磁压制成形的影响[J].粉末冶金技术,2019,37(3):207-213. |
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| 作者姓名： | 张婕 胡建华 |
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| 作者单位： | 武汉理工大学材料科学与工程学院,武汉 430070 |
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| 摘 要： | 根据离散元相关理论, 利用EDEM软件对高铟高锡银基钎料粉末电磁压制过程进行仿真模拟, 探究工艺参数对Ag–Cu–Sn–In系钎料压制过程中的影响规律, 分析钎料粉末的致密化行为, 并研究Sn元素和In元素对钎料粉末相对密度的影响; 在不同电压和电容条件下, 对Ag–19.5Cu–15In–15Sn钎料粉末压制过程进行了仿真模拟, 分析不同放电参数对压坯相对密度的影响; 最后通过压制设备制备钎料压坯, 对仿真结果进行验证。结果表明, 在相同压制力下, In质量分数越高, 获得的压坯相对密度越大; 在电容相同的情况下, 电压越大压坯的相对密度越大, 但增幅逐渐减缓; 在电压相同的情况下, 电容越大压坯的相对密度越大, 但增幅大致不变。实验验证结果表明, 仿真误差小于8%, 钎料电磁压制离散元仿真模型具有一定的参考价值。
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| 关 键 词： | 钎料粉末 离散元 电磁压制 工艺参数 相对密度 |
| 收稿时间： | 2018-06-28 |
Effect of technological parameters on high indium and high tin silver-based brazing filler metal powders by electromagnetic compaction molding |
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| Affiliation: | School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China |
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| Abstract: | The electromagnetic compaction process of high indium and high tin silver-based brazing filler metal powders was simulated by EDEM software, according to the theory of discrete element, the influences of technological parameters on Ag–Cu–Sn–In series brazing filler metal powders during the compaction process were investigated, the densification behavior of silver-based brazing filler metal powders was analyzed, and the effects of indium and tin on the relative density of compact was studied.The compaction process of Ag–19.5 Cu–15 In–15 Sn solder powders was simulated in different voltages and capacitance; the effects of discharge parameters on the relative density of compact were analyzed.Finally, the simulation was verified by preparing solder compact in the suppression equipment.The results show that, in the same compacting force, the higher the contents of indium by mass are, the higher the relative density of compact is; in the same capacitance, the higher the voltage is, the higher the relative density of compact is, but the amplification gradually slows down; in the same voltage, the higher the capacitance is, the higher the relative density of compact is, and the amplification is roughly constant.The verification results show that, the simulation error is less than 8%, the discrete element simulation model of brazing filler metal electromagnetic compaction has a certain reference value. |
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