| 钛合金疏水表面微坑阵列的掩膜电解加工仿真与分析 |
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| 引用本文： | 张宏伟,孟建兵,周海安,曲凌辉,董小娟,李丽,关庆义,王帅柯.钛合金疏水表面微坑阵列的掩膜电解加工仿真与分析[J].机械科学与技术(西安),2023,42(1):106-112. |
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| 作者姓名： | 张宏伟 孟建兵 周海安 曲凌辉 董小娟 李丽 关庆义 王帅柯 |
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| 作者单位： | 山东理工大学 机械工程学院, 山东淄博 255000 |
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| 基金项目： | 山东省自然科学基金项目ZR2021ME159山东省自然科学基金项目ZR2021ME211 |
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| 摘 要： | 为改善钛合金疏水性能，获得较高的接触角，使用掩膜电解技术对钛合金进行了凹坑阵列表面微织构的加工。首先，建立微坑阵列掩膜电解加工的数学模型并进行多物理场耦合仿真；其次，分析掩膜电解加工参数对微坑阵列的作用，并借助润湿理论模型获得微坑阵列的固-液接触面积比；最后，以该面积比为因变量，以电解质质量分数、电解电压和掩膜尺寸为自变量，进行正交试验仿真和极差分析，获得最佳工艺参数组合。与仿真预测值相比，微坑阵列单元体直径、间距、深度、固-液接触面积比和表面接触角的测量值误差均小于8%,从而表明该方法在未经低表面能材料修饰的情况下，成功制备了接触角约为140°的微坑阵列。
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| 关 键 词： | 掩膜电解加工 微坑阵列 疏水表面 钛合金 多物理场耦合 |
| 收稿时间： | 2021-04-27 |
Simulation and Analysis on Micro Pit Array of Titanium Alloy with Hydrophobic Surface by Mask Electrochemical Micromachining |
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| Affiliation: | School of Mechanical Engineering, Shandong University of Technology, Zibo 255000, Shandong, China |
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| Abstract: | In order to obtain a higher contact angle and improve its hydrophobicity, the micro texture on the surface of dimple array of titanium alloy was machined by using the mask electrolysis technology. Firstly, a model for micro pit array mask electrochemical machining is established and multi physical field coupling simulation is carried out; Secondly, the effect of the mask electrochemical machining parameters on the micro pit array is analyzed, and the solid-liquid contact area ratio of the micro pit array is obtained by means of the wetting theory model; Finally, with the area ratio as the dependent variable, the electrolyte mass fraction, electrolytic voltage and mask size as the independent variables, the orthogonal experiment simulation and range analysis were carried out to obtain the best combination of process parameters. Comparing with the predicted values, the errors of the measured values of cell diameter, spacing, depth, solid-liquid contact area ratio and surface contact angle are less than 8%, which indicates that the micro pit array with a contact angle of about 140° is successfully fabricated without modification of low surface energy materials. |
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