| GM-APD阵列高精度像素读出电路设计 |
| |
| 引用本文： | 赵佳姮,赵毅强,叶茂,夏显召,周国清.GM-APD阵列高精度像素读出电路设计[J].红外与激光工程,2017,46(1):106007-0106007(8). |
| |
| 作者姓名： | 赵佳姮 赵毅强 叶茂 夏显召 周国清 |
| |
| 作者单位： | 1.天津市成像与感知微电子技术重点实验室(天津大学),天津 300072; |
| |
| 基金项目： | 国家海洋局项目（cxsf-39） |
| |
| 摘 要： | 提出并设计了一种适用于激光3D成像的盖革模式雪崩光电二极管（Geiger-mode avalanche photodiode，GM-APD）阵列像素读出电路。基于飞行时间（time-of-flight，TOF）原理，像素读出电路主要由两部分组成:有源淬火电路（active quenching circuit，AQC）和时间数字转换器（time-to-digital converter，TDC）。所采用的TDC是粗细结合的两段式计数方式，成功实现了时钟频率和时间分辨率间的折中。基于内插技术，由粗计数的线性反馈移位寄存器和细计数的延时线型TDC共同实现了高达18-bit的动态范围。同时两者的时钟频率分别降低至250 MHz和500 MHz，分别是常规设计频率的1/20和1/10，大大降低了设计和应用难度。电路采用SMIC 0.18 m工艺设计，后仿结果显示达到了200 ps的高精度时间分辨率，对应的距离分辨率为3 cm，完全能够满足3 km激光3D成像中的测距要求。像素电路版图面积小于5095 m2，总功耗为0.89 mW，具有小面积和低功耗的优势。
|
| 关 键 词： | 读出电路 盖革模式雪崩光电二极管 延时线型TDC 激光3D成像 |
| 收稿时间： | 2016-05-01 |
High precision pixel readout circuit design for GM-APD array |
| |
| Affiliation: | 1.Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology(Tianjin University),Tianjin 300072,China;2.Guangxi Key Laboratory for Spatial Information and Geomatics,Guilin University of Technology,Guilin 541004,China |
| |
| Abstract: | A pixel readout circuit was presented and designed for Geiger-mode avalanche photodiode (GM-APD) array applying to laser 3D imaging. Based on the principle of time-of-flight (TOF), the pixel readout circuit consisted of two main parts:active quenching circuit (AQC) and time-to-digital converter (TDC). The adopted TDC was a two-segment coarse-fine architecture to manage a trade-off between clock frequency and temporal resolution. Based on interpolation technique, the LFSR used for coarse counting and the delay-line type TDC used for fine counting achieved a wide dynamic range up to 18-bit together. Meanwhile the clock frequency used in those two parts were reduced to 250 MHz and 50 MHz, which are 1/20 and 1/10 of the conventional design frequency, respectively. Thus, the difficulties of design and applications were reduced significantly. The circuit was designed with SMIC 0.18 m process. The post-simulation results reveal a high precise temporal resolution of 200 ps and a responding range resolution of 3 cm, satisfying the ranging requirements of 3 km laser 3D imaging. Furthermore, the pixel circuit layout area is less than 5095 m2, and the total power consumption is 0.89 mW, having the advantages of small area and low power consumption. |
| |
| Keywords: | |
|
| 点击此处可从《红外与激光工程》浏览原始摘要信息 |
|
点击此处可从《红外与激光工程》下载全文 |
|
