Cold sintering process: A new era for ceramic packaging and microwave device development |
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| Authors: | Jing Guo Amanda L Baker Hanzheng Guo Michael Lanagan Clive A Randall |
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| Affiliation: | Department of Materials Science and Engineering, Materials Research Institute, Center for Dielectrics and Piezoelectrics, The Pennsylvania State University, University Park, Pennsylvania |
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| Abstract: | Cold sintering process (CSP) is an extremely low‐temperature sintering process (room temperature to ~200°C) that uses aqueous‐based solutions as transient solvents to aid densification by a nonequilibrium dissolution‐precipitation process. In this work, CSP is introduced to fabricate microwave and packaging dielectric substrates, including ceramics (bulk monolithic substrates and multilayers) and ceramic‐polymer composites. Some dielectric materials, namely Li2MoO4, Na2Mo2O7, K2Mo2O7, and (LiBi)0.5MoO4 ceramics, and also (1?x)Li2MoO4?xPTFE and (1?x)(LiBi)0.5MoO4?xPTFE composites, are selected to demonstrate the feasibility of CSP in microwave and packaging substrate applications. Selected dielectric ceramics and composites with high densities (88%‐95%) and good microwave dielectric properties (permittivity, 5.6‐37.1; Q × f, 1700‐30 500 GHz) were obtained by CSP at 120°C. CSP can be also used to potentially develop a new co‐fired ceramic technology, namely CSCC. Li2MoO4?Ag multilayer co‐fired ceramic structures were successfully fabricated without obvious delamination, warping, or interdiffusion. Numerous materials with different dielectric properties can be densified by CSP, indicating that CSP provides a simple, effective, and energy‐saving strategy for the ceramic packaging and microwave device development. |
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| Keywords: | ceramic‐polymer composites ceramics co‐fired ceramics cold sintering process microwave dielectric materials |
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