| 复合型低介电常数聚酰亚胺复合材料研究进展 |
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| 引用本文： | 余文涛,宋建远,方基永,刘屹东,刘存生,闵永刚.复合型低介电常数聚酰亚胺复合材料研究进展[J].广东工业大学学报,2023,40(1):122-129. |
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| 作者姓名： | 余文涛 宋建远 方基永 刘屹东 刘存生 闵永刚 |
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| 作者单位： | 1. 广东工业大学 材料与能源学院，广东 广州 510006;2. 深圳崇达多层线路板有限公司，广东 深圳 518052 |
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| 基金项目： | 国家自然科学基金资助项目(U20A20340)；“珠江人才计划”引进创新创业团队项目(2016ZT06412) |
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| 摘 要： | 聚酰亚胺具有优异的力学性能及耐热性，一直是微电子产业的重要电介质材料之一。近年来，随着微电子行业的发展和5G通讯技术的兴起，从能耗要求到信号接收等方面都对降低聚酰亚胺的介电常数和介电损耗提出更高的要求。如何在保留聚酰亚胺优异性能的同时尽可能降低其介电常数与损耗是目前亟需解决的问题。本文综述了近年来多孔聚酰亚胺和聚合物填料、无机纳米填料复合改性聚酰亚胺等复合型低介电聚酰亚胺的研究及应用进展，探讨了如何在降低聚酰亚胺介电常数的同时保持其他性能，并对其发展进行了展望，为新型复合型低介电聚酰亚胺材料的设计与制备提供新思路。
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| 关 键 词： | 聚酰亚胺 低介电常数 多孔聚酰亚胺 石墨烯衍生物 聚倍半硅氧烷 |
| 收稿时间： | 2021-08-20 |
Research and Application Progress of Composite Polyimide with Low Dielectric Properties |
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| Yu Wen-tao,Song Jian-yuan,Fang Ji-yong,Liu Yi-dong,Liu Cun-sheng,Min Yong-gang.Research and Application Progress of Composite Polyimide with Low Dielectric Properties[J].Journal of Guangdong University of Technology,2023,40(1):122-129. |
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| Authors: | Yu Wen-tao Song Jian-yuan Fang Ji-yong Liu Yi-dong Liu Cun-sheng Min Yong-gang |
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| Affiliation: | 1. School of Materials and Energy, Guangdong University of Technology, Guangzhou 510006 , China;2. Shenzhen Suntak Multilayer Circuit Board Co., Ltd., Shenzhen 518052, China |
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| Abstract: | With excellent mechanical properties and heat resistance, polyimide has been one of the important dielectric materials in microelectronics industry. In recent years, with the rapid development of microelectronics industry and the rise of 5G communication technology, higher requirements are put forward for the dielectric constant and dielectric loss reduction of polyimide in terms of energy consumption requirements and signal reception. How to reduce as much as possible the dielectric constant and dielectric loss and retain the excellent properties of polyimide at the same time is an urgent problem to solve at present. The research and application progress of porous polyimides, polymers filler and inorganic nano filler composite modified polyimides and other composite low dielectric polyimides emerging in recent years are reviewed. How to reduce the dielectric constant of polyimides while maintaining other properties is discussed, and its development is prospected. It will provide a new idea for the design and preparation of new composite low dielectric polyimide materials. |
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| Keywords: | polyimide low dielectric constant porous polyimide graphene derivative polysilsesquioxane |
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