首页 | 官方网站   微博 | 高级检索  
     

碳纤维层合板低速冲击后的红外热波检测分析
引用本文:李晓霞,伍耐明,段玉霞,赵石彬,冯立春,李晓丽.碳纤维层合板低速冲击后的红外热波检测分析[J].复合材料学报,2010,27(6):88-93.
作者姓名:李晓霞  伍耐明  段玉霞  赵石彬  冯立春  李晓丽
作者单位:1. 北京航空航天大学现代测试实验室,北京,100191
2. 首都师范大学,物理系,北京,100037
基金项目:国家自然科学基金项目(10502035)
摘    要:采用红外热波无损检测技术对低速冲击后的碳纤维层合板进行检测和分析,研究了损伤面积与冲击能量之间的关系。对比发现,实验结果与文献结果一致;实验结果说明红外热波不仅可以检测冲击损伤的大小,还可以确定损伤在材料内部绕冲击点沿纤维方向呈旋转方式进行扩展的损伤模式。采用超声C扫描对相同复合材料层合板进行了检测,详细对比了2种检测方法的优缺点,发现对于碳纤维层合板的低速冲击损伤,红外热波检测技术是一种快速、有效、可靠的无损检测技术和评估手段。

关 键 词:碳纤维层合板  冲击损伤  分层损伤  基体开裂  红外热波检测  超声检测
收稿时间:2009-11-09
修稿时间:2010-06-12

Infrared thermal wave imaging for carbon fiber laminated boards after low velocity impact
LI Xiaoxia,WU Naiming,DUAN Yuxia,ZHAO Shibin,FENG Lichun,LI Xiaoli.Infrared thermal wave imaging for carbon fiber laminated boards after low velocity impact[J].Acta Materiae Compositae Sinica,2010,27(6):88-93.
Authors:LI Xiaoxia  WU Naiming  DUAN Yuxia  ZHAO Shibin  FENG Lichun  LI Xiaoli
Affiliation:(1. Laboratory of Modern Testing, Beihang University, Beijing 100191, China; 2. Dept of Physics, Capital Normal University, Beijing 100037, China)
Abstract:The carbon fiber laminated boards impacted at low velocity were tested and analyzed using infrared thermal wave testing.  The relationship between the damage area and impact energy was discussed. The  experimental results was consistent with the literature. It is found that infrared thermal wave testing can not only detect the size of impact damage but the expansion of internal damage which revolves round the impact point along the fiber direction. The same laminated boards were tested by ultrasound C-scan.   For carbon fiber laminated boards after low velocity impact, infrared thermal wave testing is a rapid, effective and reliable non-destructive evaluation method compared with the ultrasound C-scan.
Keywords:carbon fiber laminated board  impact damage  delamination  matrix cracking  infrared thermal wave testing  ultrasonic testing
本文献已被 CNKI 万方数据 等数据库收录!
点击此处可从《复合材料学报》浏览原始摘要信息
点击此处可从《复合材料学报》下载全文
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司    京ICP备09084417号-23

京公网安备 11010802026262号