| 保温时间对铝/铜钎焊接头界面化合物和力学性能的影响 |
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| 引用本文： | 叶政,羊浩,黄继华,陈树海.保温时间对铝/铜钎焊接头界面化合物和力学性能的影响[J].焊接学报,2016,37(12):9-12. |
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| 作者姓名： | 叶政 羊浩 黄继华 陈树海 |
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| 作者单位： | 北京科技大学 材料先进焊接与连接技术研究室, 北京 100083 |
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| 基金项目： | 国家国际科技合作专项资助项目(2014DFR50820) |
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| 摘 要： | 采用Zn-22Al钎料配合KAlF4-CsAlF4无腐蚀钎剂，在不同保温时间下对铝/铜进行炉中钎焊，研究了保温时间对钎焊接头、微观组织形貌，铜侧界面元素分布以及接头力学性能的影响.结果表明，随着保温时间的延长，Al/Cu接头Cu/钎缝界面CuAl2化合物由层片状逐渐转变为树枝状并向钎缝内部生长；钎缝中的CuAl2相由粗大块状转变为长条状或薄片状；Cu/钎缝界面处Zn元素含量峰值在保温时间为2 min时出现在铜母材与AlCu化合物之间，随着保温时间延长，Zn元素峰值逐渐向钎缝内部迁移.同时，铝/铜钎焊接头的抗剪强度随保温时间延长先提高后降低.
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| 关 键 词： | 铝/铜钎焊 保温时间 显微组织 抗剪强度 |
| 收稿时间： | 2014/11/25 0:00:00 |
Influence of dwelling time on interfacial compounds and mechanical properties of aluminum/copper brazing joints |
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| YE Zheng,YANG Hao,HUANG Jihua and CHEN Shuhai.Influence of dwelling time on interfacial compounds and mechanical properties of aluminum/copper brazing joints[J].Transactions of The China Welding Institution,2016,37(12):9-12. |
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| Authors: | YE Zheng YANG Hao HUANG Jihua and CHEN Shuhai |
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| Affiliation: | Lab. of Materials Welding and Joining, University of Science and Technology BeiJing, BeiJing 100083, China |
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| Abstract: | Aluminum and Copper was brazed using Zn-22Al solder with KAlF4-CsAlF4 non-corrosive flux at different dwelling time. The influence of dwelling time on the interfacial microstructure, interfacial elements distribution and mechanical properties of the brazing joints was studied. Results showed that the CuAl2 interfacial compounds transformed from Lamellar structure to dendritic structure gradually and grew into the brazing seam; CuAl2 phase transformed from massive structure to strip or foliated structure in the solder layer; the peak of Zn content on the interface of Cu/Solder layer appeared between the AlCu compounds and Cu substrates when dwelling time came to 2 mins, it moved toward the inside of the solder layer if dwelling time extended. Meanwhile, shear strength of Al/Cu brazing joints increased before reducing with the extending of dwelling time. |
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| Keywords: | Al/Cu brazing dwelling time microstructure shear strength |
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