| 振动辅助固结磨料抛光氟化钙晶体 |
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| 引用本文： | 黄俊阳,李军,王健杰,张羽驰,朱永伟,左敦稳.振动辅助固结磨料抛光氟化钙晶体[J].金刚石与磨料磨具工程,2019,39(1):41-46. |
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| 作者姓名： | 黄俊阳 李军 王健杰 张羽驰 朱永伟 左敦稳 |
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| 作者单位： | 南京航空航天大学 机电学院,南京,210016;南京航空航天大学 机电学院,南京,210016;南京航空航天大学 机电学院,南京,210016;南京航空航天大学 机电学院,南京,210016;南京航空航天大学 机电学院,南京,210016;南京航空航天大学 机电学院,南京,210016 |
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| 基金项目： | 国家自然科学基金资助项目(51675276)江苏省自然科学基金资助项目(BK20181294)大连理工大学精密与特种加工教育部重点实验室研究基金资助项目(JMTZ201801)。 |
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| 摘 要： | 为了改善氟化钙晶体加工后的表面质量、提高加工时的材料去除率，提出了振动辅助固结磨料抛光氟化钙晶体的加工方法。利用振动与固结磨料抛光有效结合，采用正交实验研究加工工艺参数对材料去除率和表面质量的影响。结果表明:振动辅助固结磨料抛光氟化钙晶体的最优工艺参数为转速40 r/min，振动频率40 kHz，抛光液pH值9，转速比0.95；在最优参数下抛光氟化钙晶体的材料去除率为324 nm/min，表面粗糙度Sa值为1.92 nm；与无振动辅助的固结磨料抛光相比，材料去除率提高了57%，表面粗糙度降低了35%。研究表明:振动辅助能够利用空化作用及规律化间歇性接触，在固结磨料抛光中提高材料去除率及表面质量。
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| 关 键 词： | 振动辅助 固结磨料抛光 材料去除率 表面粗糙度 |
Vibration-assisted fixed abrasive polishing CaF2 crystal |
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| HUANG Junyang,LI Jun,WANG Jianjie,ZHANG Yuchi,ZHU Yongwei,ZUO Dunwen.Vibration-assisted fixed abrasive polishing CaF2 crystal[J].Diamond & Abrasives Engineering,2019,39(1):41-46. |
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| Authors: | HUANG Junyang LI Jun WANG Jianjie ZHANG Yuchi ZHU Yongwei ZUO Dunwen |
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| Affiliation: | College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China |
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| Abstract: | In order to improve polished surface quality of CaF2 crystal and increase material removal rate, the method of vibration-assisted fixed abrasive polishing of CaF2 crystal is proposed, which combined ultrasonic vibration with fixed abrasive polishing effectively. The effect of process parameters on material removal rate and surface quality are investigated by orthogonal experiment. The optimal parameters of CaF2 crystal polishing is obtained with rotational speed 40 r/min, vibration frequency 40 kHz, slurry pH value 9, and rotation speed ratio 0.95. Under the optimal parameters, material removal rate is 324 nm/min, and surface roughness Sa is 1.92 nm in vibration-assisted fixed abrasive polishing CaF2 crystal process. Compared with the results of fixed abrasive polishing without vibration, material removal rate is increased by 57% and surface roughness Sa is reduced by 35%. Vibration-assistance can increase material removal rate and enhance surface quality of the wafer by cavitation and intermittent contact in fixed abrasive polishing process. |
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