| 雷达功率组件的金刚石微通道热沉激光加工工艺 |
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| 引用本文： | 姜海涛,崔健磊,殷东平,梅雪松.雷达功率组件的金刚石微通道热沉激光加工工艺[J].中国机械工程,2021,32(3):261. |
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| 作者姓名： | 姜海涛 崔健磊 殷东平 梅雪松 |
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| 作者单位： | 1.中国电子科技集团公司第三十八研究所，合肥,230088
2.西安交通大学机械制造系统工程国家重点实验室，西安,710054 |
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| 基金项目： | 装备预研教育联合基金（6141A02033118）；
国家自然科学基金（51735010）；
国家重点研发计划（2016YFB1102500） |
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| 摘 要： | 为研究雷达功率组件金刚石微通道热沉的加工难题，开展了飞秒激光加工多晶金刚石微流道的工艺研究，仿真模拟了飞秒激光作用于金刚石表面的温度场分布，以及诱导去除过程，理论与实验研究了金刚石的烧蚀阈值，系统研究了激光能量、扫描速度、扫描次数、焦点位置等参量及其优化工艺参数对金刚石微槽尺寸的影响规律。结果表明:当飞秒激光功率大于0.3 W时，激光作用于金刚石的最高温度超过材料去除的气化温度，温度最高位置处于光斑中心，功率不会改变温度场的分布情形；飞秒激光加工金刚石的烧蚀阈值为1.80 J/cm2，金刚石微槽深度与激光功率、扫描次数正相关，与扫描速度负相关，与正负离焦量基本成对称分布关系，而金刚石微槽表面宽度则变化不明显；在激光功率为5 W，扫描速度为100 mm/s，扫描次数为30，离焦量为-0.5 mm的优化参数下，加工出的金刚石微槽结构形状规则，截面侧壁锥度控制在3°以内，表面无残渣、裂纹、崩边等缺陷，且内部也无裂纹等缺陷，加工一致性较高，实现了微通道的 “冷”加工，可满足雷达功率组件金刚石热沉对微通道的高质量加工要求。
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| 关 键 词： | 飞秒激光 金刚石 微通道热沉 微通道尺寸 截面形貌 |
Femtosecond Laser Processing Technology of Diamond Micro-channel Heat Sink Based on Radar Power Module |
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| JIANG Haitao,CUI Jianlei,YIN Dongping,MEI Xuesong.Femtosecond Laser Processing Technology of Diamond Micro-channel Heat Sink Based on Radar Power Module[J].China Mechanical Engineering,2021,32(3):261. |
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| Authors: | JIANG Haitao CUI Jianlei YIN Dongping MEI Xuesong |
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| Affiliation: | 1.The 38th Research Institute of China Electronics Technology Group Corporation,Hefei,230088
2.State Key Laboratory for Manufacturing Systems Engineering,Xian Jiaotong University,Xian,710054 |
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| Abstract: | In order to study the processing problems of the diamond micro-channel heat sinks of the radar power module, the femtosecond laser processing research of polycrystalline diamond micro-channel was carried out. The temperature field distribution and removal processes of diamond irradiated by femtosecond laser were simulated. The ablation threshold of the diamond was studied theoretically and experimentally. The influences of parameters such as laser energy, scanning speed, scanning times, focus position, and optimized parameter on the size of diamond microgrooves were investigated. The results show that the highest temperature of diamond may exceed the gasification temperature of material removal when the power of femtosecond laser is greater than 0.3 W. The highest temperature is in the center of the spot, and the power does not change the distribution of temperature field. The ablation threshold of femtosecond laser processing diamond is as 1.8 J/cm2. The depth of diamond microgrooves is positively correlated with laser power and scanning times, negatively correlated with scanning speed, and basically symmetrically distributed with positive and negative defocus. In addition, the surface width of diamond microgrooves does not change obviously. Under the optimized parameters of laser power of 5 W, scanning speed of 100 mm/s, scanning times of 30 and defocusing amount of -0.5 mm, the diamond micro-grooves have regular structure. The taper of side wall of sectional morphology is controlled within 3° and there are no defects such as residue, crack and edge collapse on the surfaces. There are no cracks in the inner part of micro-channels which have high consistency. The ‘cold’ machining of diamond material may realize, and the requirements of high-quality machining for micro-channels of diamond heat sinks in radar power components may be satisfied. |
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| Keywords: | femtosecond laser diamond micro-channel heat sink micro-channel size sectional morphology |
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