共查询到17条相似文献,搜索用时 250 毫秒
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将内壁磨损套管月牙模型简化为偏心圆筒模型,通过直角坐标向双极坐标的转换和选取曲线坐标中表示应力的复势,得出了偏心磨损套管等效应力和剩余抗内压强度计算方法。磨损套管等效应力解析解和数值解对比分析表明,随着磨损深度的增加和作用在内表面压力的增大,磨损套管危险截面内、外表面的等效应力呈指数增大;磨损套管抗内压强度随磨损深度线性减少。采用双极坐标公式计算偏心磨损套管等效应力与有限元分析结果相差小于0.9%。偏心磨损套管抗内压强度理论解和月牙形磨损套管抗内压强度试验值之间相对误差小于10%。将月牙形磨损套管简化为偏心圆筒模型,采用偏心磨损套管抗内压强度公式计算月牙形磨损套管抗内压强度是可行的。 相似文献
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基于钻柱接头与套管磨损试验结果,采用Dawson和White的能量损失磨损理论计算得到套管磨损系数。运用ABAQUS建立钻柱接头-套管偏磨的三维有限元模型,采用二次开发的Umeshmotion子程序和Arbitrary Lagrange-Euler自适应网格技术准确模拟钻进过程中的套管局部偏磨过程,并对磨损后的套管的剩余抗挤和抗内压强度进行分析。结果表明:套管磨损后的形状为“月牙形”,且磨损最大深度与磨损时间呈非线性关系,而套管剩余强度与磨损最大深度近似呈线性关系;套管磨损对剩余抗挤强度影响最大,当剩余壁厚小于50%时,套管失去抵抗外挤作用的能力, 但仍然具有一定的抗内压强度;发生偏磨后的套管被外挤和内压载荷作用而破坏的形式分别为挤扁毁坏和拉断毁坏。 相似文献
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针对非均匀磨损套管进行了空间有限元分析,研究了磨损量、磨损长度、轴向拉力对套管抗内压强度的影响.计算结果表明非均匀磨损套管的抗内压强度随磨损厚度的增加而降低;不同的磨损长度对套管抗内压强度影响不明显,即抗内压强度主要受磨损厚度的影响;套管轴向拉力对其抗内压强度影响不大,并且这种影响随着磨损量的增加而逐渐减小.通过对磨损套管抗内压强度变化规律的研究,为合理制定井控措施提供了科学依据. 相似文献
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内压对射孔套管强度影响的有限元分析 总被引:1,自引:0,他引:1
射孔对套管抗挤强度的影响程度取决于多种因素.主要研究内压对射孔套管强度的影响.建立未射孔套管、不带水泥环射孔套管、外裹水泥环射孔套管有限元模型,并应用ANSYS有限元软件分析计算了未射孔、射孔及孔边开裂三种情况下套管的最大应力,同时研究了水泥环对射孔套管强度的影响.结果表明:射孔套管最大应力比未射孔套管增大了64%,孔... 相似文献
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在油田钻井过程中,由于钻具在井中旋转及起下钻会对套管内壁造成磨损,导致其抗内压强度降低,对油井安全构成威胁。本文使用有限元分析软件ANSYS建立套管模型,简化为平面应力问题进行分析,研究当套管内壁取不同磨损量,对磨损后套管施加载荷,计算在不同磨损量下套管的抗内压强度。结果表明,在一定的内压力范围内,套管的抗内压强度与内壁的磨损量基本成线性关系。分析结果为油井管柱下套管提供理论指导。 相似文献
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套管一旦发生点蚀,其表面可能出现孔洞,甚至穿孔现象,这严重削弱了套管的剩余强度,对井场的生产和安全构成了重大威胁。为了评估点蚀后套管的抗外挤强度,提出了一种模拟现场工况对套管抗外挤强度进行分析的方法。首先模拟现场工况下压力和温度条件,严格配比井下腐蚀液体作为介质对套管全尺寸试样和挂片样件进行腐蚀;然后对腐蚀后套管进行抗外挤试验,测量出其被挤毁时的失效压力;接着观察腐蚀后挂片的表面点蚀规律,并计算和测出其平均腐蚀速率、最大点蚀深度和点蚀密度,为有限元分析提供数据支撑;最后使用ABAQUS对不同条件下套管的抗外挤强度进行分析。结果表明:在一定温度和压力范围内,温度和压力越高,套管失效压力越高;平均腐蚀速率、最大点蚀深度和点蚀密度随温度和压力升高而增大,其中平均腐蚀速率增长率为112.5%,增长最为显著;套管的抗外挤强度随腐蚀时间增长而降低;点蚀密度会影响套管的应力分布情况和承载能力。 相似文献
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Carrying capacity of the casing will reduce after the casing is worn, which seriously affects the subsequent well drilling, well completion, oil extraction and well repair. A lot of researches on calculation of casing wear collapse strength have been done, but few of them focus on collapsing failure mechanism, and influencing factors and law of collapse strength. So, significant difference between estimated value and actual value of collapse strength comes into being. By theoretical analysis, numerical simulation and actual test, the collapsing failure mechanism of casing wear as well as the influencing factors and laws of collapse strength are investigated, and the investigation results show that collapse of crescent casing wear belongs to "three hinged" instability. The severely-worn position on the casing is yielded into the plastic zone first then deformed greatly, which causes the plastic instability of the whole structure. The casing wear collapse strength presents changes of exponent, power function and linear trend with the residual casing wall thickness, wear radius and axial load, respectively. When the flexibility is less than 10°/30 m, the borehole bending has less impact on casing collapse strength. Thus, the computation model for the casing wear collapsing strength is established by introducing wear radius coefficient and casing equivalent yield strength, at the same time, the model is tested. The test results show that the relative error for the computation model is less than 5%. The research results provide a basis for design of the casing string strength and evaluation of down-hole safety. 相似文献
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在水下航行器壳体连接设计中,卡箍连接设计在实际工程中得到了广泛应用.水下航行器入水过程及其复杂,目前研究对卡箍连接处的力学分析还不够充分.先对水下航行器入水瞬间,卡箍连接处进行力学分析,然后使用有限元和响应面近似法对受力分析加以验证,最后对某型水下航行器卡箍连接处最大弯曲应力进行函数拟合.最后对通过拟合的某型水下航行器... 相似文献
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Y.-Y. Lin S.-P. Lo 《The International Journal of Advanced Manufacturing Technology》2004,23(9-10):644-650
In this paper, relative velocity at a given point on the wafer was first derived. The revolutions of wafer and pad are assumed the same and the axisymmetric uniformly distributed pressure form is given. Thus, a 2D axisymmetric quasic-static model for chemical-mechanical polishing process (CMP) was established. Based on the principle of minimum total potential energy and axisymmetric elastic stress-strain relations, a 2D axisymmetric quasic-static finite element model for CMP was thus established. In this model, the four-layer structures including wafer carrier, carrier film, wafer and pad are involved. The von Mises stress distributions on the wafer surface were analysed, the effects of axial, hoop, radial and shear stresses to von Mises stress and the effects of axial, hoop, radial and shear strains to deformation of the wafer were investigated. The findings indicate that near the wafer centre, von Mises stress distribution on the wafer surface was almost uniform, then increased gradually with a small amount. However, near the wafer edge, it would decrease in a large range. Finally, it would increase dramatically and peak significantly at the edge. Besides, the axial stress and strain are the dominant factors to the von Mises stress distributions on the wafer surface and the wafer deformation, respectively. 相似文献