2D Ruddlesden–Popper Perovskite Single Crystal Field-Effect Transistors

2D Ruddlesden–Popper perovskites (2D PVKs) have attracted huge interest because of their excellent optoelectronic properties, yet the understanding of their electrical properties is inadequate due to the difficulties in obtaining 2D PVK field-effect transistors (FETs) with decent performance. Herein, the fabrication and characterization of 2D PVK ((BA)₂(MA)_n−1Pb_nI_3n+1) single crystal FETs are reported, which exhibit reliable field effect electrical characteristics at low temperatures. Kelvin probe force microscopy (KPFM) results reveal that both ion migration and contact resistance seriously degrade device performance. While ion migration can be suppressed at low temperatures, contact resistance seems to fundamentally determine device performance. On one hand, Schottky contacts are observed to form at the metal/2D PVK interface because of Fermi level pinning, resulting in significant charge injection resistance, although this can be remarkably improved by replacing Au electrodes with Ca. On the other hand, the out-of-plane mobility is found to be three orders of magnitude lower than the in-plane mobility in 2D PVKs, causing large interlayer transport resistance. Thus, a low work-function metal and a thin crystal are important for achieving high device performance. This work provides important experimental insights into fabrication and electrical properties of 2D PVK FETs.     

Fully Transparent p‐MoTe2 2D Transistors Using Ultrathin MoOx/Pt Contact Media for Indium‐Tin‐Oxide Source/Drain

Since transition metal dichalcogenide (TMD) semiconductors are found as 2D van der Waals materials with a discrete energy bandgap, many 2D‐like thin field effect transistors (FETs) and PN diodes are reported as prototype electrical and optoelectronic devices. As a potential application of display electronics, transparent 2D FET devices are also reported recently. Such transparent 2D FETs are very few in report, yet no p‐type channel 2D‐like FETs are seen. Here, 2D‐like thin transparent p‐channel MoTe₂ FETs with oxygen (O₂) plasma‐induced MoO_x/Pt/indium‐tin‐oxide (ITO) contact are reported for the first time. For source/drain contact, 60 s short O₂ plasma and ultrathin Pt‐deposition processes on MoTe₂ surface are sequentially introduced before ITO thin film deposition and patterning. As a result, almost transparent 2D FETs are obtained with a decent mobility of ≈5 cm² V^?1 s^?1, a high ON/OFF current ratio of ≈10⁵, and 70% transmittance. In particular, for normal MoTe₂ FETs without ITO, O₂ plasma process greatly improves the hole injection efficiency and device mobility (≈60 cm² V^?1 s^?1), introducing ultrathin MoO_x between Pt source/drain and MoTe₂. As a final device application, a photovoltaic current modulator, where the transparent FET stably operates as gated by photovoltaic effects, is integrated.     

Implementation of Low‐Power Electronic Devices Using Solution‐Processed Tantalum Pentoxide Dielectric

The development of solution‐processed field effect transistors (FETs) based on organic and hybrid materials over the past two decades has demonstrated the incredible potential in these technologies. However, solution processed FETs generally require impracticably high voltages to switch on and off, which precludes their application in low‐power devices and prevent their integration with standard logic circuitry. Here, a universal and environmentally benign solution‐processing method for the preparation of Ta₂O₅, HfO₂ and ZrO₂ amorphous dielectric thin films is demonstrated. High mobility CdS FETs are fabricated on such high‐κ dielectric substrates entirely via solution‐processing. The highest mobility, 2.97 cm² V^?1 s^?1 is achieved in the device with Ta₂O₅ dielectric with a low threshold voltage of 1.00 V, which is higher than the mobility of the reference CdS FET with SiO₂ dielectric with an order of magnitude decrease in threshold voltage as well. Because these FETs can be operated at less than 5 V, they may potentially be integrated with existing logic and display circuitry without significant signal amplification. This report demonstrates high‐mobility FETs using solution‐processed Ta₂O₅ dielectrics with drastically reduced power consumption; ≈95% reduction compared to that of the device with a conventional SiO₂ gate dielectric.     

Microstructure and Electrical Properties of Low Temperature Processed Ohmic Contacts to p‐Type GaN

With Ni/Au and Pd/Au metal schemes and low temperature processing, we formed low resistance stable Ohmic contacts to p‐type GaN. Our investigation was preceded by conventional cleaning, followed by treatment in boiling HNO₃:HCl (1:3). Metallization was by thermally evaporating 30 nm Ni/15 nm Au or 25 nm Pd/15 nm Au. After heat treatment in O₂ + N₂ at various temperatures, the contacts were subsequently cooled in liquid nitrogen. Cryogenic cooling following heat treatment at 600 ·C decreased the specific contact resistance from 9.84·10^?4 Ωcm² to 2.65·10^?4 Ωcm² for the Ni/Au contacts, while this increased it from 1.80·10^?4 Ωcm² to 3.34·10^?4 Ωcm² for the Pd/Au contacts. The Ni/Au contacts showed slightly higher specific contact resistance than the Pd/Au contacts, although they were more stable than the Pd contacts. X‐ray photoelectron spectroscopy depth profiling showed the Ni contacts to be NiO followed by Au at the interface for the Ni/Au contacts, whereas the Pd/Au contacts exhibited a Pd:Au solid solution. The contacts quenched in liquid nitrogen following sintering were much more uniform under atomic force microscopy examination and gave a 3 times lower contact resistance with the Ni/Au design. Current‐voltage‐temperature analysis revealed that conduction was predominantly by thermionic field emission.     

2D TMD Channel Transistors with ZnO Nanowire Gate for Extended Nonvolatile Memory Applications

2D transition metal dichalcogenides (TMDs) have been extensively studied due to their excellent physical properties. Mixed dimensional devices including 2D materials have also been studied, motivated by the possibility of any synergy effect from unique structures. However, only few such studies have been conducted. Here, semiconducting 1D ZnO nanowires are used as thin gate material to support 2D TMD field effect transistors (FETs) and 2D stack‐based interface trap nonvolatile memory. For the trap memory, deep level electron traps formed at the first MoS₂/second MoS₂ stack interface are exploited, since the first MoS₂ is treated in an atomic layer deposition chamber for a short while. On the one hand, a complementary inverter type memory device can also be achieved using a long single ZnO wire as a common gate to simultaneously support both n‐ and p‐channel TMD FETs. In addition, it is found that the semiconducting ZnO nanowire itself operates as an n‐type channel when the TMD materials can become a top‐gate to charge the ZnO channel. It means that 2D (bottom gated) and 1D channel (top gated) FETs are respectively operational in a single device structure. The 1D–2D mixed devices seem deserving broad attention in both aspects of novelty and functionality.     

Controlled Vapor–Solid Deposition of Millimeter‐Size Single Crystal 2D Bi2O2Se for High‐Performance Phototransistors

Atomically thin 2D materials have received intense interest both scientifically and technologically. Bismuth oxyselenide (Bi₂O₂Se) is a semiconducting 2D material with high electron mobility and good stability, making it promising for high‐performance electronics and optoelectronics. Here, an ambient‐pressure vapor–solid (VS) deposition approach for the growth of millimeter‐size 2D Bi₂O₂Se single crystal domains with thicknesses down to one monolayer is reported. The VS‐grown 2D Bi₂O₂Se has good crystalline quality, chemical uniformity, and stoichiometry. Field‐effect transistors (FETs) are fabricated using this material and they show a small contact resistivity of 55.2 Ω cm measured by a transfer line method. Upon light irradiation, a phototransistor based on the Bi₂O₂Se FETs exhibits a maximum responsivity of 22 100 AW^?1, which is a record among currently reported 2D semiconductors and approximately two orders of magnitude higher than monolayer MoS₂. The Bi₂O₂Se phototransistor shows a gate tunable photodetectivity up to 3.4 × 10¹⁵ Jones and an on/off ratio up to ≈10⁹, both of which are much higher than phototransistors based on other 2D materials reported so far. The results of this study indicate a method to grow large 2D Bi₂O₂Se single crystals that have great potential for use in optoelectronic applications.     

Carrier Type Control of WSe2 Field‐Effect Transistors by Thickness Modulation and MoO3 Layer Doping

Control of the carrier type in 2D materials is critical for realizing complementary logic computation. Carrier type control in WSe₂ field‐effect transistors (FETs) is presented via thickness engineering and solid‐state oxide doping, which are compatible with state‐of‐the‐art integrated circuit (IC) processing. It is found that the carrier type of WSe₂ FETs evolves with its thickness, namely, p‐type (<4 nm), ambipolar (≈6 nm), and n‐type (>15 nm). This layer‐dependent carrier type can be understood as a result of drastic change of the band edge of WSe₂ as a function of the thickness and their band offsets to the metal contacts. The strong carrier type tuning by solid‐state oxide doping is also demonstrated, in which ambipolar characteristics of WSe₂ FETs are converted into pure p‐type, and the field‐effect hole mobility is enhanced by two orders of magnitude. The studies not only provide IC‐compatible processing method to control the carrier type in 2D semiconductor, but also enable to build functional devices, such as, a tunable diode formed with an asymmetrical‐thick WSe₂ flake for fast photodetectors.     

Contact Engineering of Layered MoS2 via Chemically Dipping Treatments

The performance of electronic/optoelectronic devices is governed by carrier injection through metal–semiconductor contact; therefore, it is crucial to employ low‐resistance source/drain contacts. However, unintentional introduction of extrinsic defects, such as substoichiometric oxidation states at the metal–semiconductor interface, can degrade carrier injection. In this report, controlling the unintentional extrinsic defect states in layered MoS₂ is demonstrated using a two‐step chemical treatment, (NH₄)₂S(aq) treatment and vacuum annealing, to enhance the contact behavior of metal/MoS₂ interfaces. The two‐step treatment induces changes in the contact of single layer MoS₂ field effect transistors from nonlinear Schottky to Ohmic behavior, along with a reduction of contact resistance from 35.2 to 5.2 kΩ. Moreover, the enhancement of I_ON and electron field effect mobility of single layer MoS₂ field effect transistors is nearly double for n‐branch operation. This enhanced contact behavior resulting from the two‐step treatment is likely due to the removal of oxidation defects, which can be unintentionally introduced during synthesis or fabrication processes. The removal of oxygen defects is confirmed by scanning tunneling microscopy and X‐ray photoelectron spectroscopy. This two‐step (NH₄)₂S(aq) chemical functionalization process provides a facile pathway to controlling the defect states in transition metal dichalcogenides (TMDs), to enhance the metal‐contact behavior of TMDs.     

Ir Diffusion Barriers in Ni/Au Ohmic Contacts to <Emphasis Type="Italic">p</Emphasis>-Type CuCrO<Subscript>2</Subscript>

The use of Ir diffusion barriers in Ni/Au-based Ohmic contacts to p-type CuCrO₂ layers was investigated. A specific contact resistance of ~5 × 10⁻⁴ Ω cm² was achieved after annealing at 500°C for the Ir-containing contacts, and the contacts were rectifying for lower anneal temperatures. In this case, the contact resistance was basically independent of the measurement temperature, indicating that tunneling is the dominant transport mechanism in the contacts. The morphology for the Ir-containing contacts was still smooth at 500°C although Auger electron spectroscopy depth profiling showed that some of the nickel had diffused to the surface and had oxidized. Contacts annealed at 800°C showed that some copper and most of the nickel had diffused to the surface and oxidized. The presence of the Ir diffusion barrier does increase the thermal stability of the contacts by ∼200°C compared to conventional Ni/Au contacts. By contrast, the use of other materials such as TaN, ZrN, and W₂B₅ as the diffusion barrier led to poorer thermal stability, with the contact resistance increasing sharply above 400°C.     

Highly Conductive Optical Quality Solution‐Processed Films of 2D Titanium Carbide

MXenes comprise a new class of solution‐dispersable, 2D nanomaterials formed from transition metal carbides and nitrides such as Ti₃C₂. Here, it is shown that 2D Ti₃C₂ can be assembled from aqueous solutions into optical quality, nanometer thin films that, at 6500 S cm^?1, surpass the conductivity of other solution‐processed 2D materials, while simultaneously transmitting >97% of visible light per‐nanometer thickness. It is shown that this high conductivity is due to a metal‐like free‐electron density as well as a high degree of coplanar alignment of individual nanosheets achieved through spincasting. Consequently, the spincast films exhibit conductivity over a macroscopic scale that is comparable to the intrinsic conductivity of the constituent 2D sheets. Additionally, optical characterization over the ultraviolet‐to‐near‐infrared range reveals the onset of free‐electron plasma oscillations above 1130 nm. Ti₃C₂ is therefore a potential building block for plasmonic applications at near‐infrared wavelengths and constitutes the first example of a new class of solution‐processed, carbide‐based 2D optoelectronic materials.     

Graphene-Enhanced Metal Transfer Printing for Strong van der Waals Contacts between 3D Metals and 2D Semiconductors

2D semiconductors have shown great potentials for ultra-short channel field-effect transistors (FETs) in next-generation electronics. However, because of intractable surface states and interface barriers, it is challenging to realize high-quality contacts with low contact resistances for both p- and n- 2D FETs. Here, a graphene-enhanced van der Waals (vdWs) integration approach is demonstrated, which is a multi-scale (nanometer to centimeter scale) and reliable (≈100% yield) metal transfer strategy applicable to various metals and 2D semiconductors. Scanning transmission electron microscopy imaging shows that 2D/2D/3D semiconductor/graphene/metal interfaces are atomically flat, ultraclean, and defect-free. First principles calculations indicate that the sandwiched graphene monolayer can eliminate gap states induced by 3D metals in 2D semiconductors. Through this approach, Schottky barrier-free contacts are realized on both p- and n-type 2D FETs, achieving p-type MoTe₂, p-type black phosphorus and n-type MoS₂ FETs with on-state current densities of 404, 1520, and 761 µA µm⁻¹, respectively, which are among the highest values reported in literature.     

Non‐Lithographic Fabrication of All‐2D α‐MoTe2 Dual Gate Transistors

As one of the emerging new transition‐metal dichalcogenides materials, molybdenum ditelluride (α‐MoTe₂) is attracting much attention due to its optical and electrical properties. This study fabricates all‐2D MoTe₂‐based field effect transistors (FETs) on glass, using thin hexagonal boron nitride and thin graphene in consideration of good dielectric/channel interface and source/drain contacts, respectively. Distinguished from previous works, in this study, all 2D FETs with α‐MoTe₂ nanoflakes are dual‐gated for driving higher current. Moreover, for the present 2D dual gate FET fabrications on glass, all thermal annealing and lithography processes are intentionally exempted for fully non‐lithographic method using only van der Waal's forces. The dual‐gate MoTe₂ FET displays quite a high hole and electron mobility over ≈20 cm² V^?1 s^?1 along with ON/OFF ratio of ≈10⁵ in maximum as an ambipolar FET and also demonstrates high drain current of a few tens‐to‐hundred μA at a low operation voltage. It appears promising enough to drive organic light emitting diode pixels and NOR logic functions on glass.     

Multifunctional Crosslinkable Iridium Complexes as Hole Transporting/Electron Blocking and Emitting Materials for Solution‐Processed Multilayer Organic Light‐Emitting Diodes

Here, a new series of crosslinkable heteroleptic iridium (III) complexes for use in solution processed phosphorescent organic light emitting diodes (OLEDs) is reported. These iridium compounds have the general formula of (PPZ‐VB)₂Ir(CˆN), where PPZ‐VB is phenylpyrazole (PPZ) vinyl benzyl (VB) ether; and the CˆN ligands represent a family of four different cyclometallating ligands including 1‐phenylpyrazolyl (PPZ) (1), 2‐(4,6‐difluorophenyl)pyridyl (DFPPY) (2), 2‐(p‐tolyl)pyridyl (TPY) (3), and 2‐phenylquinolyl (PQ) (4). With the incorporation of two crosslinkable VB ether groups, these compounds can be fully crosslinked after heating at 180 °C for 30 min. The crosslinked films exhibit excellent solvent resistance and film smoothness which enables fabrication of high‐performance multilayer OLEDs by sequential solution processing of multiple layers. Furthermore, the photophysical properties of these compounds can be easily controlled by simply changing the cyclometallating CˆN ligand in order to tune the triplet energy within the range of 3.0–2.2 eV. This diversity makes these materials not only suitable for use in hole transporting and electron blocking but also as emissive layers of several colors. Therefore, these compounds are applied as effective materials for all‐solution processed OLEDs with (PPZ‐VB)₂IrPPZ (1) acting as hole transporting and electron blocking layer and host material, as well as three other compounds, (PPZ‐VB)₂IrDFPPY ( 2 ), (PPZ‐VB)₂IrTPY(3), and (PPZ‐VB)₂IrPQ( 4 ), used as crosslinkable phosphorescent emitters.     

Ohmic contacts to n-type GaN using Pd/Al metallization

Ohmic contacts to n-type GaN grown by metalorganic chemical vapor deposition were formed using a Pd/Al-based metallization. Ohmic contact resistances and specific contact resistances were investigated as a function of rapid thermal annealing temperature, Pd interlayer thickness, and annealing time. As-deposited Pd/AI was found to produce rectifying contacts while the metallization exhibited ohmic characteristics after annealing at temperatures as low as 400°C. A minimum contact resistance of 0.9 ohm-mm (specific contact resistance = 1.2 × 10⁻⁵ ohm-cm²) was obtained upon annealing at 650°C for 30 s. For comparison, Al and Ti/Al contacts were also investigated. Auger electron spectroscopy, secondary ion mass spectrometry, and x-ray diffraction were used to investigate metallurgical reactions.     

Ambipolar Charge Transport in Air‐Stable Polymer Blend Thin‐Film Transistors

Ambipolar thin‐film transistors based on a series of air‐stable, solution‐processed blends of an n‐type polymer poly(benzobisimidazobenzophenanthroline) (BBL) and a p‐type small molecule, copper phthalocyanine (CuPc) are demonstrated, where all fabrication and measurements are performed under ambient conditions. The hole mobilities are in the range of 6.0 × 10^–6 to 2.0 × 10^–4 cm² V^–1 s^–1 and electron mobilities are in the range of 2.0 × 10^–6 to 3.0 × 10^–5 cm² V^–1 s^–1, depending on the blend composition. UV‐vis spectroscopy and electron diffraction show crystallization of CuPc in the metastable α‐crystal form within the semicrystalline BBL matrix. These CuPc domains develop into elongated ribbon‐like crystalline nanostructures when the blend films are processed in methanol, but not when they are processed in water. On methylene chloride vapor annealing of the blend films, a phase transformation of CuPc from the α‐form to the β‐form is observed, as shown by optical absorption spectroscopy and electron diffraction. Ambipolar charge transport is only observed in the blend films where CuPc crystallized in the elongated ribbon‐like nanostructures (α‐form). Ambipolar behavior is not observed with CuPc in the β‐polymorph. Unipolar hole mobilities as high as 2.0 × 10^–3 cm² V^–1 s^–1 are observed in these solution‐processed blend field‐effect transistors (FETs) on prolonged treatment in methanol, comparable to previously reported hole mobilities in thermally evaporated CuPc FETs. These results show that ambipolar charge transport and carrier mobilities in multicomponent organic semiconductors are intricately related to the phase‐separated nanoscale and crystalline morphology.     

Fast and Ultraclean Approach for Measuring the Transport Properties of Carbon Nanotubes

In this work, a fast approach for the fabrication of hundreds of ultraclean field‐effect transistors (FETs) is introduced, using single‐walled carbon nanotubes (SWCNTs). The synthesis of the nanomaterial is performed by floating‐catalyst chemical vapor deposition, which is employed to fabricate high‐performance thin‐film transistors. Combined with palladium metal bottom contacts, the transport properties of individual SWCNTs are directly unveiled. The resulting SWCNT‐based FETs exhibit a mean field‐effect mobility, which is 3.3 times higher than that of high‐quality solution‐processed CNTs. This demonstrates that the hereby used SWCNTs are superior to comparable materials in terms of their transport properties. In particular, the on–off current ratios reach over 30 million. Thus, this method enables a fast, detailed, and reliable characterization of intrinsic properties of nanomaterials. The obtained ultraclean SWCNT‐based FETs shed light on further study of contamination‐free SWCNTs on various metal contacts and substrates.     

Very low resistance ohmic contacts to n-GaN

Ohmic contacts with low resistance are fabricated on n-GaN films using Al/Ti bilayer metallization. GaN films used are 0.3 μm thick layers with carrier concentrations of 1 × 10¹⁹ cm⁻³ grown on the c-plane sapphire by ion-removed electron cyclotron resonance molecular beam epitaxy. The lowest value for the specific contact resistivity (ρ_c) of 1.2×10⁻⁸ Ω·cm² was obtained with furnace annealing at 500°C for 60 min. This result shows the effectiveness of high carrier concentration GaN layers and the low temperature annealing for the realization of low resistance ohmic contacts. Sputtering Auger electron spectroscopy analysis reveals that Al diffuses into Ti layer and comes into contact with the GaN surface.     

High temperature stability of chromium boride ohmic contacts to p-type 6H-SiC

Ohmic contacts have been fabricated on p-type 6H-SiC using CrB₂. Two hundred nanometer thick films were sputter-deposited on substrates of doping concentration 1.3×10¹⁹ cm⁻³ in a system with a base pressure of 3×10⁻⁷ Torr. Specific contact resistances were measured using the linear transmission line method, and the physical properties of the contacts were examined using Rutherford backscattering spectrometry, x-ray photoelectron spectroscopy, and transmission electron microscopy. The as-deposited CrB₂ contacts exhibited rectifying characteristics and contained oxygen as a major contaminant. Ohmic behavior with linear current-voltage characteristics was observed following short anneals at 1100°C for 2 min at a pressure of 5×10⁻⁷ Torr. The oxygen in the CrB₂ films was removed by the annealing process, and the lowest value of the specific contact resistance (r_c) measured at room temperature was 8.2×10⁻⁵ Ω-cm². Longer anneals at 1100°C for 3.5 h and 1200°C for 2 h reduced the room temperature values of r to 1.4×10⁻⁵ Ω-cm². A thin reaction region has been identified at the CrB₂/SiC interface; however, the interface remains essentially stable. Thermal stressing at 300°C in vacuum for over 2200 h produced only a slight increase in the specific contact resistance. The low value of the specific contact resistance and the excellent high temperature stability of the CrB₂/SiC interface make this contact a candidate for high power/high temperature SiC device applications.     

Scalable All‐Evaporation Fabrication of Efficient Light‐Emitting Diodes with Hybrid 2D–3D Perovskite Nanostructures

Quasi‐2D (Q2D) lead halide perovskites have emerged as promising materials for light‐emitting diodes (LEDs) due to their tunable emission, slowed‐down carrier diffusion, and improved stability. However, they are primarily fabricated through solution methods, which hinders its large‐scale manufacture and practical applications. Physical‐vapor‐deposition (PVD) methods have well demonstrated the capability for reproducible, scalable, and layer‐by‐layer fabrication of high quality organic/inorganic thin films. Herein, for the first time, the full‐evaporation fabrication of organic–inorganic hybrid ((BA)₂Cs_n?1Pb_nBr_3n+1) Q2D–3D PeLEDs is demonstrated. The morphology and crystal phase of the perovskite are controlled from 3D to 2D by modulating material composition, annealing temperature, and film thicknesses. The confinement of carriers in 3D layers and the energy funnel effect are discovered and discussed. Importantly, a record high external quantum efficiency (EQE) of 5.3% based on evaporation method is achieved. Moreover, a centimeter‐scale PeLED (1.5 cm × 2 cm) is obtained. Furthermore, the T₅₀ lifetime of the device with an initial brightness of 100 cd m^?2 is found to be 90 min with a thin layer PMMA passivation, which is among the longest for all PVD processed PeLEDs. Overall, this work casts a solid stepping stone towards the fabrication of high‐performance PeLEDs on a large‐scale.     

Organic Electronics: High Tg Cyclic Olefin Copolymer Gate Dielectrics for N,N′‐Ditridecyl Perylene Diimide Based Field‐Effect Transistors: Improving Performance and Stability with Thermal Treatment (Adv. Funct. Mater. 16/2010)

A novel application of ethylene‐norbornene cyclic olefin copolymers (COC) as gate dielectric layers in organic field‐effect transistors (OFETs) that require thermal annealing as a strategy for improving the OFET performance and stability is reported. The thermally‐treated N,N′‐ditridecyl perylene diimide (PTCDI‐C13)‐based n‐type FETs using a COC/SiO₂ gate dielectric show remarkably enhanced atmospheric performance and stability. The COC gate dielectric layer displays a hydrophobic surface (water contact angle = 95° ± 1°) and high thermal stability (glass transition temperature = 181 °C) without producing crosslinking. After thermal annealing, the crystallinity improves and the grain size of PTCDI‐C13 domains grown on the COC/SiO₂ gate dielectric increases significantly. The resulting n‐type FETs exhibit high atmospheric field‐effect mobilities, up to 0.90 cm² V^?1 s^?1 in the 20 V saturation regime and long‐term stability with respect to H₂O/O₂ degradation, hysteresis, or sweep‐stress over 110 days. By integrating the n‐type FETs with p‐type pentacene‐based FETs in a single device, high performance organic complementary inverters that exhibit high gain (exceeding 45 in ambient air) are realized.