偏压对阴极电弧离子镀AIN薄膜的影响

在不同基体负偏压作用下,用阴极电弧离子镀等离子体物理气相沉积（PVD）方法在单晶Si(100）基片上获得六方晶系的晶态AIN薄膜。用X射线衍射仪分析了沉积膜的物相组成和晶格位向随偏压的变化。在扫描电子显微镜（SEM）下观察沉积膜的显微组织形貌。结果表明,在较小偏压下,AIN膜呈（002）择优取向,表面致密均匀;在较大偏压下,AIN膜呈（100）择优取向,表面形貌则粗糙不平,AIN薄膜的择优取向及表面形貌受到不同偏压下不同离子轰击能量的影响。     

Effect of beam voltage on the properties of aluminium nitride prepared by ion beam assisted deposition

The effects of nitrogen-beam voltage on the structure, stress, energy band gap and hardness of AIN thin films deposited on Si (111), Si (100) and sapphire (0001) by ion beam assisted deposition (IBAD) are reported. As the nitrogen-beam voltage was increased from 50 to 200 V, the stress and disorder in the AIN films increased as determined by X-ray diffraction, FTIR and Raman spectroscopy. The preferred orientation of the film's c-axis changed from completely normal to the film at 100 V, to a mixture of normal and in the plane of the film at 200 V. For AIN films deposited under the same conditions, the films were more highly oriented on sapphire (0001) than in Si (111). The hardness of the films increased from 18.2 to 23.7 GPa with the nitrogen-beam voltage, and possible reasons for this change in hardness are considered.     

Oxidation behaviour of Ti2AIN films composed mainly of nanolaminated MAX phase

In this paper, we reported the oxidation behaviour of Ti2AIN films on polycrystalline Al2O3 substrates. The Ti2AIN films composed mainly of nanolaminated MAX phase was obtained by first depositing Ti-Al-N films using reactive sputtering of two elemental Ti and Al targets in Ar/N2 atmosphere and subsequent vacuum annealing at 800 degrees C for 1 h. The Ti2AIN films exhibited excellent oxidation resistance and thermal stability at 600-900 degrees C in air. Very low mass gain was observed. At low temperature (600 degrees C), no oxide crystals were observed on film surface. Blade-like Theta-Al2O3 fine crystals formed on film surfaces at 700-800 degrees C. At high temperature (900 degrees C), firstly Theta-Al2O3 formed on film surface and then transformed into alpha-Al2O3. At 700-900 degrees C, a continuous Al2O3 layer formed on Ti2AIN films surface, acting as diffusion barrier preventing further oxidation attack. The mechanism of the excellent oxidation resistance of Ti2AIN films was discussed based on the experimental results.     

Mo电极形貌对AIN薄膜择优取向生长的影响

采用射频磁控溅射方法在不同形貌的Mo电极上制备了(002)择优取向的AlN薄膜。采用XRD、FESEM表征了Mo电极及AlN薄膜的结构、表面形貌及择优取向。结果表明,Mo电极的形貌影响AlN薄膜的择优取向生长,在较高溅射气压下沉积的Mo电极晶粒细小、分布均匀,有助于AlN薄膜(002)择优取向生长。     

Influence of process parameters on the microstructure of scandium films deposited by electron-beam evaporation

Microstructures of scandium films deposited on molybdenum (Mo) substrates by electron-beam evaporation are investigated. Influences of substrate temperatures and deposition rates are considered. It is found that the microstructural changes of scandium films with the substrate temperatures are consistent with the reported structure-zone models. Sc films, deposited at 5 nm/s with the temperature range of 373-923 K, as well as deposited at 923 K with the deposition rate from 0.5 to 5 nm/s, show a (002) preferred orientation. Both the texture coefficients of (002) peaks and the grain sizes increase with the substrate temperature. For films deposited at various deposition rates, the films show smoother surfaces at the lower deposition rate. Moreover, the grain sizes first increase with the increasing deposition rate and then decrease with it. The largest grain size (∼246 nm) is obtained at the deposition rate of 5 nm/s. The texture coefficients of the (002) preferred orientation decrease when the deposition rate increases from 0.5 nm/s to 5 nm/s. And the preferred growth of the film disappears at deposition rate of 10 nm/s.     

Glass-ceramic interactions and thick-film metallization of aluminium nitride

A frit-bonded thick-film metallization for aluminium nitride (AIN) ceramic substrates has been developed. The glass system is thermodynamically stable with respect to AIN at the temperatures employed during thick-film processing. The model glass, a lithium borate, has comparable physical properties to that of the standard lead borosilicate glasses used in fritbonded films designed for oxide ceramics. The wetting properties of the glass on AIN, in both air and nitrogen atmospheres, have been determined by use of a hot-stage microscope. The low-temperature oxidation of the AIN surface was found to be a significant factor in the glass spreading rate. The glass was formulated into a palladium-silver thick-film metallization and the performance of this material on three types of AIN substrate was determined. Examination of the film morphology and the fracture surfaces was carried out using scanning electron microscopy.     

热处理温度和掺杂浓度对AZO薄膜微结构的影响

采用溶胶-凝胶法在普通裁玻片上制备了（002）择优取向的AZO薄膜,研究了不同的热处理温度和掺杂浓度对薄膜微结构的影响。利用XRD和SEM表征了AZO薄膜晶体结构的择优取向和表面形貌。结果表明,热处理温度为450℃,择优取向最强,热处理温度高于或低于450℃时,择优取向都减弱;当掺杂浓度为2％时,AZO的择优取向最强,随着Al掺杂浓度的增大,薄膜的晶粒尺寸减小,薄膜变得更加致密。     

Effect of crystallographic orientations on electrical properties of sputter-deposited nickel oxide thin films

Nickel oxide thin films of various preferred orientations were deposited by radio-frequency (RF) magnetron sputtering process in different gas ratios of oxygen atmosphere at RF power 200 W on unheated and heated for (673 K) substrates. The relationships among substrate temperature, preferred orientation and electrical properties of the NiO films were investigated. The resulting films were analyzed by grazing-incidence X-ray diffraction, high-resolution transmission electron microscopy (HR-TEM), and ultrahigh resolution scanning electron microscopy (HR-SEM). The electrical properties were measured using four probe and Hall effects measurements. The results show that films deposited at room temperature with the ratio of oxygen varying from 0 to 100% develop a (111) preferred orientation. At temperature of 673 K, while the (111)-orientated film was obtained under a low ratio of oxygen (<50% O₂), a (200) preferred orientation was developed under 100% oxygen. The lowest sheet resistance 0.01 MΩ/□, resistivity 0.83 Ω-cm and higher carrier density 7.35 × 10¹⁸ cm⁻³ could be obtained on (111) preferred orientation samples prepared on unheated substrates in pure oxygen atmosphere. The relationship between preferred orientation and electrical properties was proposed in this paper.     

Field emission from nanostructured AlN/GaN films on Si substrate prepared by pulsed laser deposition

Nanostructured AIN/GaN films with different thickness are synthesized on Si substrates by pulsed laser deposition (PLD). GaN and AIN single-layer films are also deposited for comparison. It is found that the turn-on field of the nanostructured AIN/GaN films is considerably decreased 2 orders of magnitude than that of single-layer films. The improvement of field emission (FE) characteristics is attributed to the quantum structure effects, which supplies a favorable location of electron emission and enhances tunneling ability. We show that by tuning the thickness of AIN/GaN, various FE characteristics can be obtained. It indicates that the optimal thickness of the nanostructured AIN/GaN films exists for their best field emission performance.     

沉积气压对电弧离子镀制备ZnO薄膜的结构和性能影响

采用阴极真空电弧离子镀技术在玻璃衬底上制备出了具有择优取向的透明ZnO薄膜. 利用X射线衍射仪、扫描电子显微镜及紫外-可见吸收光谱仪分别对ZnO薄膜的结构、表面形貌及可见光透过率进行了分析.XRD结果表明,所制备的ZnO薄膜具有六角纤锌矿结构的(002)和(101)两种取向,在沉积气压＞1.0Pa时所制备的ZnO薄膜具有(002)择优取向,并且非常稳定.SEM图表明,ZnO晶粒大小较为均匀,晶粒尺寸随着气压升高而变小.在400～1000nm范围内,ZnO薄膜的可见光透过率超过80%,吸收边在370nm附近,所对应的光学带隙约为3.33～3.40eV,并随着沉积气压上升而变大.     

PZT/ZnO薄膜制备及其结构特性研究

利用固相反应制备的ZnO-Li_(2.2%)陶瓷靶和RF射频磁控溅射技术在Si(100)基片上制备了高度c轴择优取向的ZnO薄膜,XRD和电性能分析表明掺杂Li离子改善了ZnO靶材的结构和性能,同时研究了不同RF溅射温度对ZnO薄膜结构与取向的影响;然后采用sol-gel前驱单体薄膜制备方法,以ZnO为过渡层淀积PZT薄膜,探讨高度c轴(002)择优取向ZnO薄膜对PZT薄膜结构与性能的影响,实验发现在PZT/ZnO异质结构中,致密、均匀和高度c轴择优取向的ZnO可作为晶核,促进PZT钙钛矿结构转化、晶粒(110)择优取向生长,相应降低PZT薄膜的退火温度.     

Growth and characterization of tin oxide films prepared by chemical vapour deposition

Undoped tin oxide films have been prepared by a chemical vapour deposition technique. The effect of different deposition parameters on the sheet resistance of the films has been studied. Films are highly transparent (about 90%) in the visible region, have a quite low sheet resistance (25 Ω/□) and have reproducible properties. X-ray diffraction shows the structure to be polycrystalline with a grain size of about 570 Å. The preferred orientation is (101) for the films deposited at substrate temperatures up to 350 °C, after which the preferred orientation changes to (200). The electrical properties of the films also exhibit a change at this deposition temperature. Direct and indirect band gaps are calculated to be 3.93 eV and 2.53 eV respectively. Degradation of the films with time has also been studied. The figure of merit = T¹⁰/R_sh (9.45 × 10^-3Ω^-1 at 0.66 μm) obtained is the highest amongst the values reported for undoped tin oxide films.     

Nano-structural characteristics of Ti/glass and Ti/Mo films as a function of deposition rate and angle of incidence

Titanium films of 90 nm thickness were deposited under UHV condition at different deposition rates, ranging from 0.3 to 10.2 Å s^− 1, at room temperature on glass and Mo substrates at two incidence angles of 8.5° and 45°. The samples were analyzed using XRD and AFM techniques. The grain sizes were obtained from AFM images, while the crystallite sizes and preferred orientation of the films were obtained from XRD profiles. Results show that Ti/glass films at 8.5° angle of incidence show (002) preferred orientation, while at 45° incidence angle, at lower deposition rates, films show an almost amorphous structure, which develops to a strong (002) preferred orientation for deposition rate of 1.6 Å s^− 1, and again at much higher deposition rate of 10.2 Å s^− 1 it changes to an amorphous structure. Ti/Mo films deposited at 45° incidence angle showed (101) preferred orientation.     

Structural and thermoelectric properties of HfNiSn half-Heusler thin films

The bulk thermoelectric properties of half-Heusler alloys have recently been extensively studied due to their potential as thermoelectric materials. However, only a few publications have been addressed on thin film systems. The present study investigated the structural and thermoelectric properties of HfNiSn half-Heusler alloy thin films grown at different substrate temperatures: 25 °C, 200 °C, and 400 °C. The crystalline phase and structural variation of the films were determined by X-ray diffraction and scanning electron microscopy. Polycrystalline thin films were obtained for utilizing lower substrate temperatures. The HfNiSn thin films exhibited preferred (111) orientation when substrate temperature was higher than 400 °C. The in-plane Seebeck coefficient and resistivity of HfNiSn thin films with preferred orientation were much lower than those of films without orientation. This implies the thermoelectric properties of HfNiSn alloy may exhibit anisotropic characteristics. The best Seebeck coefficient and power factor of HfNiSn thin films obtained in this work are −68 μV/K and 1.3 μW/K²cm, respectively, measured at room temperature. The effects of partial substitution of Sn by Sb on thermoelectric properties of HfNiSn thin films were also studied with a “pseudo-combinatorial” approach.     

Effect of particle bombardment on the orientation and the residual stress of sputtered AlN films for SAW devices

We present a study of the effect of particle bombardment on the preferred orientation and the residual stress of polycrystalline aluminum nitride (AlN) thin films for surface acoustic wave (SAW) applications. Films were deposited on silicon (100) substrates by radio frequency (RF) sputtering of an aluminum target in an argon and nitrogen gas mixture. The main deposition parameters were changed as follows: the total pressure from 4 mTorr to 11 mTorr, the N2 content in the gas mixture from 20% to 80%, and the substrate self-bias voltage from -10 V to -30 V. If a sufficiently high negative substrate self-bias voltage is induced, (00.2)-oriented films are obtained over the full ranges of pressure and N2 content. Such films have values of residual stress ranging from -3 GPa to +1 GPa, depending on the deposition conditions. Our results suggest that the energy of the Ar ions colliding with the substrate controls the preferred orientation of the films, whereas the directionality of the ions (for the same energy) is the main factor determining the residual stress. To demonstrate the suitability of our material for the intended application, SAW filters with good electroacoustic response have been fabricated using AlN thin films with optimized (00.2) orientation and controlled residual stress.     

Preparation of high (100) oriented PST thin films deposited on PT/Tb inducing layer by rf-sputtering method

Tb doped PbTiO₃ (PT) thin films with (001)/(100) preferred orientation are prepared by sol-gel method. High (100) oriented Pb_0.4Sr_0.6(Ti_0.97Mg_0.03)O_2.97(PST) thin films are then deposited on the Tb doped PbTiO₃ inducing layer by rf-sputtering technique. The crystalline phase structure and orientation of the thin film are determined by X-ray diffraction. The dielectric properties of the thin films are measured by an Impedance Analyzer. Results show that the Tb doped PT films exhibit preferred orientation. The PST thin films deposited on substrate with and without PT inducing layer show (100) orientation and random orientation respectively. Higher (100) orientation appears in the PST thin films deposited on thinner inducing PT layer (one layer compare to more layers). A dielectric tunability of 39% is obtained in the PST thin film deposited on thinner PT inducing layer. It is a little higher than that deposited on thicker inducing layer.     

Preparation of crystalline beta barium borate thin films on Sr-doped alpha barium borate substrates by liquid phase epitaxy

Thin films of beta barium borate have been prepared by liquid phase epitaxy on Sr²⁺-doped -BaB₂O₄ (-BBO, the high temperature phase of barium borate) (001) and (110) substrates. The results of X-ray diffraction indicate that the films show highly (00l) preferred orientation on (001)-oriented substrates while the films grown on (110) substrates are textured with (140) orientation. The crystallinity of these films was found to depend on growth temperature, rotation rate, dip time and orientation of substrate. Growth conditions were optimized to grow films with (00l) orientation on (001) substrates reproducibly. The films show second harmonic generation of 400 nm light upon irradiation with 800 nm Ti: Sapphire femtosecond laser light.     

铁电极化诱导的PbTiO3薄膜的取向聚集生长和晶粒尺寸调控

用溶胶凝胶法制备了PbTiO₃薄膜。将含量为0.2%、0.5%和0.8%(摩尔比)的钙钛矿铁电PbTiO₃纳米片加入溶胶体系中,利用纳米片的自发极化调控薄膜的生长。结果表明,纳米片的加入显著影响了薄膜的生长过程和结晶学取向,可制备出(100)高度取向的PbTiO₃薄膜;改变纳米片的浓度,可将薄膜晶粒尺寸由100 nm调控到2 μm。扫描电子显微镜(SEM)、透射电子显微镜(TEM)观测和原位X射线衍射(in-situ XRD)的结果表明,固态薄膜中的晶粒表现出类液相的取向聚集生长特征。其原因可能是,铁电纳米片极化表面的静电力诱导小晶粒的吸附和取向排列,调控了薄膜的(100)取向和晶粒尺寸。     

Influence of deposition conditions and substrate structure on the structure of sputtered tellurium films

A study has been made of the growth of tellurium films sputtered onto four substrate materials (cover glass, spinel, quartz and alumina), unheated as well as heated to 100°, 150°, 200° and 250°C. It was found that the structure of the substrate exerted no measurable influence on the structure of the films. However, sputtering conditions do influence the preferred orientation. Tellurium films sputtered onto unheated substrates have a preferred orientation of the (100) type (i.e. with the (100) planes parallel to the substrate). Those on heated substrates show a preferred orientation of the (101) type. Furthermore, thickness is an important factor. Tellurium films with thickness less than 6000 Å have a (100)-type preferred orientation, but thicker films have a (101) orientation. All the observations can be explained in terms of recrystallization taking place during deposition due to heating of the film.     

Controlling of the electrical resistivity of GaN layer using AIN nucleation layer

The sheet resistance (Rs) of undoped GaN films on AIN/c-plane sapphire substrate was investigated. The Rs was strongly dependent on the AIN layer thickness and semi-insulating behavior was observed. To clarify the effect of crystalline property on Rs, the crystal structure of the GaN films has been studied using X-ray scattering and transmission electron microscopy. A compressive strain was introduced by the presence of AIN nucleation layer (NL) and was gradually relaxed as increasing AIN NL thickness. This relaxation produced more threading dislocations (TD) of edge-type. Moreover, the surface morphology of the GaN film was changed at thicker AIN layer condition, which was originated by the crossover from planar to island grains of AIN. Thus, rough surface might produce more dislocations. The edge and mixed dislocations propagating from the interface between the GaN film and the AIN buffer layer affected the electric resistance of GaN film.