紫外光UV固化粘合剂

紫外光固化粘合剂随着紫外光固化技术的发展获得了快速发展。详细介绍了紫外光固化粘合剂的应用机理及其组成成份 ,如齐聚物、反应单体、光引发剂。并列举了几种不同类型的紫外光固化粘合剂 ,即层压粘合剂、压敏粘合剂和双重光固化粘合剂等。     

光引发剂及其在紫外光固化粘合剂中的应用研究进展

光引发剂在光固化领域里有着非常重要的作用。随着各种光引发剂的发展,带动了紫外光固化粘合剂的一系列同步发展。综述了光引发剂以及它们在紫外光固化粘合剂中的应用研究进展。     

FLEXcon公司推出丙烯酸酯胶粘剂新品

德国汉高（中国）投资有限公司日前成功研制出绿色环保新系列乐泰粘合剂和密封剂。该新型粘合剂主要用于便携式电子设备（如手机、笔记本电脑和硬盘驱动器等）,配方中溴和氯含量均低于0．09％,总卤素含量低于0．15％（即卤素含量均低于可检测值）。新系列产品包括氰基丙烯酸酯粘合剂、光固化氰基丙烯酸酯粘合剂、环氧树脂粘合剂、聚氨酯粘合剂、紫外光固化丙烯酸酯粘合剂、     

ZUV-X紫外光固化粘合剂的研制

介绍了一种紫外光固化粘合剂ZUV-X的制备,讨论了预聚物、单体、光引发剂和固化装置对产品性能的影响,并将该产品的性能与同类胶作了对比。     

紫外光辐射固化粘合剂主成分的分离和鉴定

本文介绍了ＴＢ－３０５１型紫外光辐射固化粘合剂主成分的分离和鉴定。实验结果表明该粘合剂的主成分是预聚体双酚Ａ环氧双丙烯酸醋树脂，活性稀释剂甲基丙烯酸Ｂ－羟乙酯和双酚Ａ环氧双丙烯酸酯；光引发剂安息香乙醚。     

新型可见光固化口腔正畸粘合剂研制

介绍了一种新型可见光固化正畸粘合剂的组成、性能及正畸粘接的工艺。此粘合剂由一种单组分液体底胶和单组分糊剂组成。与化学固化粘合剂相比,其操作使用方便,固化时间短。这种新型粘合剂的粘接强度完全满足了正畸粘合剂的要求。     

紫外光固化导电胶的研究进展

紫外光固化导电胶是近年来发展出来的粘合剂新品种,本文主要从紫外光固化导电胶的固化机理、导电机理、组成、固化设备等方面进行综述。此外,还简要介绍了混合电路用导电胶的发展动向。     

光固化粘合剂

简介了光固化粘合剂中紫外光固化粘合剂、电子束固化粘合剂的优缺点及光固化设备;举例介绍了光固化树脂的制备方法、光固化粘合剂配方及其应用。     

硅酸盐无机粘合剂的固化机理探讨

用X射线衍射、热分析、红外光谱、电子显微镜等测试手段,探讨了硅酸盐类无机粘合剂的固化机理。这种粘合剂由①钾—钠水玻璃、②高岭土、③P_2O_5、CaO、MgO、SiO_2等混合氧化物经处理后的产物三种组份组成。实验结果表明:加热固化过程中,由于硅酸盐之间发生硅烷醇的缩合以及硅烷醇与高岭石晶体上和铝相联接的羟基之间的缩合而固化。粘合剂固化后,构成了三维空间的硅、氧、铝为主的坚强结构,从而从固化机理角度解释为什么这种粘合剂具有较高粘接力。     

导电性粘合剂

日本大阪市立工业研究所研制成功的导电性粘合剂 ,是以环氧树脂、固化剂、金属 (银 ,铜 )粉末 (占总质量分的 80 % )及稀释剂混合而成的。这种粘合剂可替代铅 -锡材料的焊接 ,以解决废弃电子产品的铅污染环境的难题。伴随电子产品的小型化 ,导电粘合剂还可解决难于焊接的微细作业。经导电粘合剂粘接的电子原件 ,具有接触电阻小 ,粘合力强 ,在高温、高湿条件下 ,稳定性好等优点。日本共荣社化学公司研制成功的紫外光固化型二丙烯酸酯系列产品 ,是以双酚Ａ与环氧乙烷经加成反应而制成的。其紫外光固化性能优于甲基丙烯酸酯。由于二丙烯酸酯肯…     

HT系列UV胶及在LCD、手机按键制造中的应用

简述了LCD(液晶显示器)和手机按键种类、结构及其生产中所使用的UV固化胶粘剂品种;LCD组装所使用的UV封口胶粘剂及管脚胶粘剂的性能要求和测试方法;手机按键的材料种类及粘接的工艺、技术要求、测试方法;UV胶粘剂的配方研究中必须解决的技术关键。介绍了一些重要齐聚体的化学结构式和单体、引发剂、助剂的选用原则,以及几种HT系列UV固化胶粘剂的性能指标。     

Elimination of Outgassing from UV Curable Adhesives

Outgassing of volatile compounds from UV curable adhesives was shown to corrode thin film magnetic disks. Volatility of the corrosive species was dependent on the adhesive's glass transition temperature, which varied linearly with flexibilizer concentration. Thermogravimetric analysis revealed that outgassing was reduced an order of magnitude in adhesives containing reduced concentrations of a polycaprolactone-based flexibilizer.     

可见光固化型胶粘剂

本文对可见光固化胶粘剂制备、活性单体、光引发剂、光敏增效剂等原料选取原则及可见光固化胶粘剂的特点、优势、应用范围进行了全面的介绍。     

Elimination of Outgassing from UV Curable Adhesives

Outgassing of volatile compounds from UV curable adhesives was shown to corrode thin film magnetic disks. Volatility of the corrosive species was dependent on the adhesive's glass transition temperature, which varied linearly with flexibilizer concentration. Thermogravimetric analysis revealed that outgassing was reduced an order of magnitude in adhesives containing reduced concentrations of a polycaprolactone-based flexibilizer.     

Synthesis,characterization and end-use evaluation of epoxy resins prepared from diallyl and dipropyl bisphenol A

We have synthesized 2,2'(6')-diallyl-4,4'-isopropylidenediphenol (diallyl bisphenol A), 2,2'(6')-dipropyl-4,4'-isopropylidenediphenol (dipropyl bisphenol A), and epoxy resins (glycidyl ether oligomers) of different average molecular weights. The acrylic and methacrylic esters were prepared by reacting the epoxy resin with acrylic and methacrylic acids, respectively. The amine-cured epoxy resins showed promise as general-purpose adhesives, while the epoxy acrylates were found to be useful as reactive oligomers in ultraviolet (UV) radiation curable coatings, and the epoxy methacrylates as anaerobic adhesives.     

光固化胶粘剂的研究进展

介绍了紫外光和可见光固化型胶粘剂体系中光引发剂的最新研究进展,重点论述了紫外光和可见光固化型胶粘剂的最新发展。     

室温快固全透明环氧胶粘剂的研制

介绍了一种室温快固全透明环氧胶粘剂，讨论了不饱和树脂及促进剂等组分对胶粘剂性能的影响。     

Ultraviolet/heat dual‐curable film adhesives with pendant‐acryloyl‐functional‐group‐modified epoxy resin

To facilitate the fabrication of a reliable semiconductor package, the UV/heat dual curing of film adhesives was investigated. The curing system of the epoxy resin affected the film adhesive properties. As the UV/heat dual‐curable epoxy resin, a modified o‐cresol novolak epoxy resin, in which half of the glycidyl groups were substituted by acryloyl groups (OCN‐AE), was applied to the film adhesive. The formulated film adhesive contained acrylic copolymer, OCN‐AE, phenolic aralkyl resin as a heat‐curing agent of the glycidyl groups, and 1‐hydroxycyclohexyl phenyl ketone as a photoinitiator of the acryloyl groups. The formulated reference film adhesive contained unmodified o‐cresol novolak epoxy resin (OCN‐E) in place of OCN‐AE. Formulated film adhesives containing a mixture of OCN‐E and o‐cresol novolak epoxy acrylate were also used as references. The morphology and the film adhesive properties were investigated. In these investigations, the film adhesive of OCN‐AE showed better adhesive properties, lower modulus, and a better stress‐relaxation ability than the referenced adhesives. As a result, a reliable film adhesive for semiconductor packages was successfully developed. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

UV光固化胶粘剂的研究与应用

紫外光(UV)固化胶粘剂是发展迅速的绿色精细化工产品。本文从光引发剂、预聚物和活性稀释剂3方面介绍了UV光固化胶粘剂的最新研究进展,以及UV固化胶粘剂在医疗、电子电器、汽车等方面的应用。展望了UV固化胶粘剂的研究与发展方向。