基于子模型法的焊点热应力分析

基于ABAQUS有限元分析软件,利用子模型法对PBGA封装结构的焊点在温度循环载荷下的应力场进行了研究,并比较了不同焊点直径、焊点高度、焊点间距对其应力场的影响规律.结果表明,焊点的最大应力值与焊点直径和焊点间距成正比,与焊点高度成反比.研究结果对焊点的可靠性评估和优化设计有一定的指导意义.     

冲击环境下PBGA焊点动态特性分析

根据焊点成形理论和影响焊点可靠性因素对PCB和PBGA256组件进行有限元建模，并以此为基础对其进行模态分析及瞬态冲击动态响应分析，得出了最大应力应变在PGBA256上分布曲线；并根据实际情况简化得出焊点局部模型应变分布，从而找出焊点最易断裂失效的区域。最后，通过激光测振系统测得的实验模态和计算结果比较，表明所建立的有限元模型，可作为以后进行焊点疲劳寿命估计和焊点形态优化的基础。     

随机振动条件下SMT焊点半经验疲劳寿命累积模型

研究了SMT焊点在随机振动条件下引起的振动疲劳情况,给出了SMT焊点半经验随机振动疲劳寿命累积模型,并通过对某SMT电路板进行随机振动疲劳测试,验证了模型的正确性。     

板级跌落冲击载荷下无铅焊点形状对BGA封装可靠性的影响

焊点高度和焊盘尺寸相同情况下,分析焊点形状（桶形、柱形、沙漏形）对BGA封装在板级跌落冲击载荷下可靠性的影响。根据不同焊点形状建立3种3D有限元模型,采用Input-G方法将加速度曲线作为数值模型的载荷输入,对BGA封装件在板级跌落冲击载荷下的可靠性进行分析。结果表明：在跌落冲击过程中,在0.1ms左右PCB板出现最大弯曲变形;焊点形状对BGA封装件在跌落冲击过程中的可靠性有较大的影响;以最大剥离应力作为失效准则对三种焊点进行寿命预测, 沙漏形焊点的平均碰撞寿命值最大,其次是柱形焊点,桶形焊点最小,表明沙漏形焊点在跌落测试中表现出较好的抗跌落碰撞性能。     

基于Patran及频域分析的叠层焊点随机振动可靠性分析

基于Patran软件建立了叠层焊点三维有限元分析模型,分析了随机振动条件下叠层焊点的固有频率、振型和频率响应规律,获得了叠层焊点应力应变分布和应变功率谱密度响应曲线,并基于功率谱和雨流计数法计算出了叠层焊点振动疲劳寿命;分析了焊盘直径和焊点最大径向直径对叠层焊点随机振动寿命影响。仿真结果表明:在叠层焊点高0.5 mm、焊盘直径0.3 mm和焊点径向最大直径0.4 mm时其随机振动疲劳寿命为3 132 h;当焊盘直径从0.2 mm增加到0.35 mm时,叠层焊点振动疲劳寿命随焊盘直径增大而增大;当焊点最大径向直径从0.4 mm增加到0.55 mm时,叠层焊点振动疲劳寿命随焊点最大径向直径增大而减少。     

基于随机振动理论的焊接结构疲劳寿命概率预测方法研究

为了能够在设计阶段对承受随机载荷作用的焊接结构的焊缝进行疲劳寿命预测,该文以随机振动理论为基础,结合主S-N曲线法,通过推导证明了用于焊接结构疲劳寿命评估的等效结构应力与激励载荷之间存在线性传递关系,从而提出了一个频域的焊接结构随机振动疲劳寿命概率预测新方法。该方法能够解决多随机载荷作用下复杂焊接结构振动疲劳寿命预测问题。通过T型接头的算例对比分析,证明了该方法能够考虑激励载荷的频率对焊缝疲劳寿命的影响。直接以线路实测随机加速度谱做为激励载荷,对某轨道集装箱平车车体结构关键焊缝的振动疲劳寿命进行预测,结果表明:该方法的预测结果与实际情况吻合,便于工程应用。     

6082-T6铝合金回填式搅拌摩擦点焊接头的疲劳性能的有限元分析

利用有限元分析软件ANSYS模拟了6082-T6铝合金回填式搅拌摩擦点焊接头在不同载荷作用下的应力场,进而分别运用名义应力法和局部应力-应变法计算得到当前载荷水平下的疲劳寿命。结果表明:在较大的载荷水平下,应力法分析结果与试样实际寿命接近,在较小的载荷水平下,局部应力-应变法分析结果与试样实际寿命接近;试样疲劳寿命随焊点间距的增加而减小。通过分析6082-T6铝合金回填式搅拌摩擦点焊接头疲劳断口形貌,发现疲劳裂纹起裂于焊点根部的热影响区和热力影响区,同时沿上板焊点边缘和下板母材处横向扩展。     

不同尺寸参数对QFP封装热应力场的影响

基于ABAQUS有限元分析软件,利用子模型法,对四边扁平封装(QFP)器件在热循环载荷下的应力场进行了研究,比较了不同引线宽度、引线间距、引线高度等参数对QFP封装器件应力场的影响规律。结果表明,在热循环载荷条件下,QFP封装应力集中区域位于焊点的根部以及焊趾部位,且最大应力位置出现在焊点根部,即焊点最内侧的尖角处;QFP封装的最大应力值与引线间距成正比,与引线宽度和引线高度成反比;利用子模型法,可以方便地对复杂模型中的关键部件进行较准确的分析。     

球栅阵列无铅焊点随机振动失效研究

通过非接触式激光全息激振方法对试件(电路板组件)进行试验模态分析,了解其动态特性;以其第一阶固有频率作为中心频率,分别进行了三种不同加速度功率谱密度幅值的窄带随机振动疲劳试验,并对失效焊点进行金相剖面分析,探究球栅阵列(BGA)无铅焊点在随机振动载荷下的失效机理。结果表明,三种加速度功率谱密度幅值的随机振动试验中BGA无铅焊点的失效机理不尽相同,随着功率谱密度幅值增加,焊点失效位置由靠近电路板(PCB)一侧向靠近封装一侧转变,分别是靠近PCB一侧的焊球体,焊点颈部以及靠近封装一侧的Ni/金属间化合物(IMC)界面处,相应的失效模式由疲劳断裂转为脆性断裂     

层板复合材料的疲劳剩余寿命预报模型

应用可靠性分析的方法 ,导出了层板复合材料在疲劳载荷作用下的疲劳剩余寿命的预报模型。该模型已用典型层板复合材料在恒幅疲劳载荷作用下的实验数据进行了验证。实验结果表明 ,理论预测结果与实验值的接近程度是合理的     

Application of a combined high and low cycle fatigue life model on life prediction of SC blade

A combined high and low cycle fatigue life prediction model for nickel-base single crystal (SC) has been presented to analyze the low cycle fatigue (LCF) and high cycle fatigue (HCF) life of SC blade. In the paper, a power law function of life model based on crystallographic theory is adopted to predict the LCF life. A power law function based on elastic analysis is adopted to predict the HCF life. Furthermore, the LCF and HCF experiments at different temperature are carried out to obtain the model parameters. The predicted results show that the model is reasonable for LCF and HCF. The linear life model introduced in the paper satisfies the combined high and low cycle fatigue life prediction of nickel-base single crystal superalloy. Special attention is put on the combined high and low cycle fatigue life of SC turbine blade. The resolved shear stress and first-order vibration stress are analyzed by the crystallographic rate dependent finite element analysis (FEA) and orthotropic elastic FEA, respectively. It is shown that the prediction model can be well used in the fatigue life prediction of SC blade.     

Fatigue life estimations of solid-state drives with dummy solder balls under vibration

An investigation of the effect of dummy solder balls on the fatigue life of a solid-state drive (SSD) under vibration was studied. Finite element analysis and forced vibration experiments of an SSD were conducted to evaluate the fatigue life of an SSD. Global–local analysis techniques were adopted in the finite element analysis to calculate the stress of the solder balls in the SSD. In the vibration experiments, the SSD with dummy solder balls was excited via a sinusoidal sweep vibration around the first resonant frequency until the SSD failed. Using the stress results from global–local analysis and the cycle to failure results from the experiment, an S–N curve was derived for the SSD. This study showed that the solder joints at the corners of the controller package were the most vulnerable components, and that applying the dummy solder balls to those areas decreased the stress of the solder balls and increased the fatigue life of the SSD.     

Fatigue failure of pb-free electronic packages under random vibration loads

The electronic equipment are used in several fields like, automotive, aerospace, consumer goods where they are subjected to vibration loads leading to failure of solder joints used in these equipment. This paper presents a methodology to predict the fatigue life of Pb-free surface mounted BGA packages subjected to random vibrations. The dynamic characteristics of the PCB, such as the natural frequencies, mode shapes and damping ratios were determined. Spectrum analysis was used to determine the stress response of the critical solder joint and the cumulative fatigue damage accumulated by the solder joint for a specific duration was determined.     

Fracture mechanics analysis of the effect of substrate flexibility on solder joint reliability

Solder joint fatigue failure is a serious reliability concern in area array technologies, such as flip chip and ball grid array packages of integrated-circuit chips. The selection of different substrate materials could affect solder joint thermal fatigue life significantly. The reliability of solder joints in real flip chip assembly with both rigid and compliant substrates was evaluated by the accelerated temperature cycling test and thermal mechanical analysis. The mechanism of substrate flexibility on improving solder joint thermal fatigue lifetime was investigated by fracture mechanics methods. Two different methods (crack tip opening displacement, CTOD and virtual crack closure technique, VCCT) are used to determine the crack tip parameters which are considered as the indices of reliability of solder joints, including the strain energy release rate and phase angle for the different crack lengths and temperatures. It was found that the thermal fatigue lifetime of solder joints in flip chip on flex assembly (FCOF) was much longer than that of flip chip on rigid board assembly (FCOB). The flex substrates could dissipate energy that otherwise would be absorbed by solder joints, that is, substrate flexibility has a great effect on solder joint reliability and the reliability improvement was attributed to flex buckling or bending during thermal cycling.     

Decrease in fatigue life of Sn - 3.8 wt-%Ag - 1.2 wt-%Cu alloy solder joints due to thermal cycling

Abstract

Copper plates joined with a thin solder layer (60 μm thick) of Sn - 3.8 wt-%Ag - 1.2 wt-% Cu alloy were subjected to heat treatments: a thermal cycling of a temperature range between 321 K and 381 K (Δ T = 60 K) and an isothermal heating at 357 K, and then subjected to a fatigue test at 6 MPa stress amplitude. Solder joints made with a thin solder layer of Sn - Pb eutectic alloy were also examined for comparison. After heat treatments, the η phase developed and dispersed at the bonding interface of the solder joints with increasing numbers of thermal cycling and with increasing time of isothermal heating. Small voids also appeared in the η phase after heat treatments. Fine cracks appeared in the η phase after thermal cycling for 2000 cycles and higher, but no cracks were observed after isothermal heating. There was no large difference in fatigue lifetime after thermal cycling between Sn - Ag - Cu alloy solder joints and Sn - Pb eutectic alloy solder joints. The fatigue lifetime of Sn - Ag - Cu alloy solder joints and Sn - Pb eutectic alloy solder joints was 2 - 3 × 105 with no thermal cycling and was greatly reduced to 0.1 - 0.6 × 10⁵ after 8000 thermal cycles. The fatigue lifetime was also decreased to 0.6 - 1.0 × 10⁵ after isothermal heating for 16 000 min, but the decrease in fatigue lifetime was gradual compared to that after thermal cycling. The decrease in fatigue lifetime after smaller numbers of thermal cycles is explained by coarsening of the η phase, and the large decrease in fatigue lifetime after a large number of thermal cycles is explained by the appearance of cracks in the η phase during thermal cycling.     

Effect of axial ratcheting deformation on torsional low cycle fatigue life of lead-free solder Sn–3.5Ag

Multiaxial fatigue tests were conducted on Sn–3.5Ag solder specimens under axial/torsional loading at room temperature. It was found that the ratcheting strain increased while the fatigue life decreased with the increase of axial stress and shear strain amplitude. A power relationship of ratcheting strain rate versus fatigue life was observed. Equivalent strain approach and critical plane approaches were evaluated with fatigue life data obtained in the tests. Since those approaches excluded the consideration of the ratcheting strain and mean stress, the methods for fatigue life prediction were improper for multiaxial fatigue with ratcheting strain. Coffin model, considered the effect of ratcheting on fatigue life depending on the ratio of ratcheting strain to material ductility, brought the fatigue life predictions on non-conservative side if the ratcheting deformation was large. For this reason, a model with the maximum shear strain range and axial ratcheting strain rate was proposed as a new damage parameter. The new model could not only describe the fatigue life in torsion test, but also predicted torsional fatigue life of the lead-free solder with axial ratcheting.     

Reliability behavior of lead-free solder joints in electronic components

With more consumer products moving towards environmentally friendly packaging, making solder Pb-free has become an urgent task for electronics assemblies. Solder joints are responsible for both electrical and mechanical connections. Solder joint does not have adequate ductility to ensure the repeated relative displacements due to the mismatch between expansion coefficients of the chip carrier and the circuit board. Materials behavior of solder joints involves a creep–fatigue interaction, making it a poor material for mechanical connections. The reliability of solder joints of electronics components has been found playing a more important role in service for microelectronics components and micro-electro-mechanical systems. So many researchers in the world investigated reliability of solder joints based on finite element simulation and experiments about the electronics devices, such as CR, QFP, QFN, PLCC, BGA, CSP, FCBGA and CCGA, which were reviewed systematically and extensively. Synchronously the investigation on reliability of solder joints was improved further with the high-speed development of lead-free electronic packaging, especially the constitutive equations and the fatigue life prediction equations. In this paper, the application and research status of constitutive equations and fatigue life prediction equations were reviewed, which provide theoretic guide for the reliability of lead-free solder joints.