海洋防腐涂料用纳米硫氰酸亚铜的制备

以六偏磷酸钠为无机分散剂,通过CuCl沉淀的转化制备了纳米硫氰酸亚铜(CuSCN)粉体.讨论了粉体合成的原理及pH值、分散剂用量和反应物浓度对产物粒径的影响,其中pH值对产物的影响最大.实验原理一方面是利用了高溶度积的CuCl向低溶度积的CuSCN的逐渐转化过程;另一方面利用了无机分散剂双电层的作用.用透射电镜、扫描电镜、X射线衍射和红外光谱表征产物的形貌和结构.结果表明:当pH=6.7～7.2,分散剂质量分数w=0.05%,反应物摩尔浓度为03mol/L时,可以制备出粒径为80～90 nm、粒度均匀且不含杂质的CuSCN粉体.     

p型CuSCN半导体薄膜电沉积特征的研究

采用电化学沉积法分别用水和乙醇作溶剂在In2O3-SnO2(ITO)透明导电玻璃上制备出了CuSCN薄膜。通过XPS分析表明：2种溶剂中制备的CuSCN薄膜均为SCN化学剂量比过量,具有P型半导体特征。研究了溶剂对CuSCN薄膜结构和光电学特性的影响。结果表明：在乙醇溶剂中能够制备出晶粒更加细化,致密度较高的CuSCN薄膜,电化学沉积制备的CuSCN薄膜具有β-CuSCN结构,属于六方晶系,直接光学带隙为3.7eV,具有较高的透光率。电流-时间或电位-时间的变化曲线表明：利用薄膜的半导体电阻特性,可以影响薄膜的沉积行为。     

硫氰酸铵-乙醇-水体系萃取浮选铜法间接测定抗坏血酸

微量Cu(II)被抗坏血酸还原成Cu(I)后可与SCN-生成CuSCN沉淀,在乙醇与水分相的过程中,CuSCN被浮选,且抗坏血酸用量和浮选率之间存在良好的线性关系。抗坏血酸的检出限为5×10-5mol/L。该方法简单、快速、干扰离子少,已成功应用于水果中抗坏血酸的检测。     

电沉积法制备固态染料敏化太阳能电池(英文)

本文采用一步电化学沉积的方法在导电玻璃上先后沉积了ZnO/染料复合薄膜以及CuSCN薄层,实现仅以电沉积法制备结构为ZnO/染料/CuSCN的固态染料敏化太阳能电池,电池的光电转换效率达到0.1%。在电沉积CuSCN前,脱附电沉积制备的ZnO/染料复合薄膜中的染料以形成多孔ZnO薄膜,然后通过染料再吸附得到染料敏化ZnO纳晶多孔薄膜。在电沉积过程中,ZnO和CuSCN的晶体尺寸、晶体取向和膜层形貌都可以进行比较精准的控制。探讨了影响沉积薄膜形貌和光电转换效率的因素,如旋转圆盘电极的旋转速度、电沉积温度以及染料敏化剂的选择。本文报道的低温电沉积制备全固态太阳能电池的方法为制备柔性染料敏化太阳能电池提供了一种新的思路。     

均匀沉淀法制备不同粒径的纳米Cu（OH）2

以无水硫酸铜和氢氧化钡为原料,采用均匀沉淀法研究了不同粒径纳米Cu（OH）2的制备,考察了搅拌温度、硫酸铜溶液浓度等反应条件对纳米Cu（OH）2粒径的影响。实验结果表明,用均匀沉淀法可以制备出不同粒度的纳米Cu（OH）2颗粒。反应条件对纳米Cu（OH）2的粒径有显著影响,反应温度越高,纳米粒子的粒径越小;硫酸铜溶液的浓度越高,纳米粒子的粒径越大。     

铜改性聚酰胺6抗菌纤维的制备与性能研究

采用不同表面活性剂对不同粒度和形状的铜(Cu)粉进行表面改性,将改性Cu粉与聚己内酰胺(PA 6)切片共混造粒制得Cu粉质量分数为1.1％的Cu-PA 6抗菌切片,再通过熔融纺丝制备Cu-PA 6抗菌纤维;分析了Cu粉、Cu-PA 6抗菌切片的微观结构形貌及热稳定性,研究了Cu-PA 6抗菌切片的可纺性、Cu-PA 6...     

优化制备粒度均匀分布的Ce-Cu/TiO2空心微球及其光-显性能

以Ce(NO3)3?6H2O和Cu(NO3)2?3H2O为改性剂制备Ce–Cu/TiO2空心微球，通过均匀设计与BP神经网络模型优化Ce–Cu/TiO2空心微球的制备工艺参数。用激光粒度分析仪对Ce–Cu/TiO2空心微球的粒度分布进行测试，用SEM和TEM对Ce–Cu/TiO2空心微球的微观形貌进行表征，用比表面积及孔径测定仪对Ce–Cu/TiO2空心微球的孔结构进行测试，采用等温吸放湿法对粒度均匀分布的Ce–Cu/TiO2空心微球的湿性能进行测试，用紫外–可见分光光度计测试其光性能。结果表明，粒度均匀分布的Ce–Cu/TiO2空心微球制备工艺参数为：磁力搅拌速度VMS=910 r/min、溶液B加入溶液A的速度VAB=1.32 mL/min、溶液D加入溶液C的速度VCD=0.86 mL/min、煅烧升温速度VTC=2.47℃/min和煅烧温度TC=485℃，所制空心微球d10=103.74 nm，d50=141.46 nm和d90=188.84 nm，粒径分布区间d90–d10为85.10 nm，空心微球具有良好的光–湿性能，1~6 h对甲醛气体的降解率为21.6%~53.9%，相对湿度32.28%~84.34%的平衡含湿量为0.0364~0.2746 g/g。     

速生桉树皮制备吸附剂去除水中铜离子的研究

本研究将速生桉树林业废弃物树皮为原料,制备生物质吸附剂MEUB,用于去除废水中的铜离子(Cu(II))。结果表明:溶液初始p H、Cu(II)初始浓度、反应温度、吸附剂粒度、盐度是主要影响因素。去除率随着p H的增大而增大,在p H为4.0以后变化不大。MEUB吸附Cu(II)离子的过程符合二级反应动力。     

包裹法SiC颗粒增强铝基复合材料的研究

本利用包裹法和置换原理，将Cu均匀地包裹在SiC表面，得到了可用于制备增强Al基复合材料的Cu／SiC复合粉体。讨论了SiC粒度以及表面粗化工艺对包裹效果的影响．并对Al-Cu／SiC复合材料的烧成温度进行了探讨。     

颗粒粒度对Cu基载氧体反应性能的影响

基于化学链燃烧新流程,采用固定床反应器研究了Cu基载氧体粒度、作为活性组分的Cu粉粒度及作为惰性载体的g-Al2O3粒度对载氧体反应性能的影响. 结果表明,载氧体的还原率及氧化率随Cu粉粒度减小而增大,Cu粉平均粒度小于63 mm时,载氧体还原率和氧化率达95%和93%以上. 载氧体还原过程中有少量CH4生成,生成量随Cu粉粒度减小而减少,Cu粉平均粒度小于32 mm时低于1%;当载氧体粒度接近g-Al2O3粒度时,载氧体的性能明显降低,只有g-Al2O3粒度明显小于载氧体粒度时,g-Al2O3才能起到分散活性组分、抑制活性组分烧结的作用.     

On the structure-sensitivity of 2-butanol dehydrogenation over Cu/SiO2 cogelled xerogel catalysts

Cu/SiO₂ cogelled xerogel catalysts were synthesized by cogelation of tetraethoxysilane (TEOS) and chelates of Cu with 3-(2-aminoethylamino)-propyltrimethoxysilane (EDAS). The resulting catalysts are composed of metallic crystallites with a diameter of about 3 nm located inside microporous silica particles and larger metallic particles with a diameter of 8–30 nm located outside silica network. Cu/SiO₂ catalysts were tested for 2-butanol dehydrogenation. This reaction over Cu/SiO₂ cogelled xerogel catalysts is a structure-sensitive reaction: large metallic particles located outside silica particles are responsible for the dehydrogenation reaction, while small metallic particles located inside silica particles do not participate to the reaction.     

原位合成Al6．1 Cu1．2 Ti2．7／Al2O3／TiAl复合材料及热力学分析

采用真空热压烧结方法在Ti—Al—CuO体系下原位合成了Al6.1 Cu1.2 Ti2、Al2O3物相共同增强的TiAl基复合材料。通过DSC,XRD以及相关热力学计算研究了热压反应过程。结果表明：Al在高温熔化后对Ti、CuO颗粒润湿并发生反应,Ti颗粒表层形成中间产物TiaAly,在富Ti区生成稳定TiAl相;CuO颗粒表层由于Al-CuO置换反应的发生,生成稳定的Al2O3相和活度较高的Cu单质,一定条件下TiaAly与Cu反应形成Al6.1Cu1.2Ti2.7三元相。     

Controlled synthesis of copper nano/microstructures using ascorbic acid in aqueous CTAB solution

This paper describes a low-temperature green chemical synthesis of various morphologies of copper nano/microstructures. These syntheses achieved high yields in aqueous solution using ascorbic acid as a reductant and the cationic surfactant cetyltrimethylammonium bromide (CTAB) as a capping agent. The resulting copper particles were characterised by X-ray diffraction (XRD), scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDX), and UV-Vis. absorption spectroscopy techniques. From the SEM analysis, it was found that different morphologies of copper particles, including submicron polyhedrons, micrometer rods, spherical nanoparticles, and nanowires were obtained by varying factors such as the molar ratio of reactants (ascorbic acid and CuSO₄·5H₂O), pH, reaction time, and temperature. Increasing the molar ratio of ascorbic acid to precursor salt and increasing the pH led to a decrease in the size of copper particles formed. At short reaction times, spherical copper nanoparticles with an average diameter of 90 nm are obtained. When the reaction time was prolonged, the nanoparticles transformed into nanowires with diameters in the range of 100-250 nm, and lengths of up to 6-8 μm. When the reaction temperature was decreased, Cu mixed with Cu₂O particles were obtained instead of Cu particles. The resultant copper particles were confirmed by EDX and XRD to be pure Cu, with face-centred cubic (fcc) structures.     

Adhesion and interface studies between copper and polyimide

The adhesion and interface structure between copper and polyimide have been studied. Polyimide films were prepared by spinning a polyamic acid solution (Du Pont PMDA-ODA) in an NMP solvent onto a Cu foil, followed by thermal curing up to 400°C. The adhesion strength was measured by a 90° peel test. The peel strength of 25 μm thick Cu foil to 25 μm thick polyimide substrate was about 73 g/mm with the peel strength decreasing with increasing polyimide thickness. Cross-sectional TEM observation revealed very fine Cu-rich particles distributed in the polyimide. Particles were not found closer than 80-200 nm from Cu boundary. These Cu-rich particles were formed as a result of reaction of polyamic acid with Cu during thermal curing. We attribute the high peel strength to interfacial chemical bonding between Cu and polyimide. This behavior is in contrast to vacuum-deposited Cu onto fully cured polyimide.     

Ti_2SnC原位自生TiC_(0.5)增强Cu基复合材料的制备及压缩特性

本文以Ti_2SnC陶瓷为先驱体,利用其高温下与Cu的反应原位自生TiC_(0.5)颗粒增强Cu基复合材料并研究了其压缩特性。通过差热分析、X射线衍射和扫描电子显微镜等手段分析了Ti_2SnC与Cu的反应行为,并探讨了制备工艺对复合材料的物相组成、增强相形貌及材料特性的影响。结果表明,Ti_2SnC与Cu在900°C就开始发生反应,Ti_2SnC中的部分Sn原子逃逸扩散到Cu基体内,留下TiC_(0.5)作为增强相颗粒;随着温度的升高,反应程度加剧;当温度达到1150°C时,Ti_2SnC全部分解,形成亚微米TiC_(0.5)增强Cu(Sn)复合材料。TiC_(0.5)颗粒随保温时间增加而更加均匀地分布在基体内。对于初始Ti_2SnC体积含量为30%的TiC_(0.5)/Cu(Sn)复合材料,保温时间从0 h增加至2 h,其抗压强度和压缩变形率分别从1109 MPa±11 MPa和24.4%±0.6%增加到1260 MPa±22 MPa和28.9%±1.1%。     

Continuous synthesis of metal nanoparticles in supercritical methanol

Metal nanoparticles were synthesized continuously in supercritical methanol (scMeOH) without using reducing agents at a pressure of 30 MPa and at various reaction temperatures ranging 150-400 °C. Wide angle X-ray diffraction (WAXD) analysis revealed that metallic nickel (Ni) nanoparticles were synthesized at a reaction temperature of 400 °C while mixtures of nickel hydroxide (α-Ni(OH)₂) and metallic Ni were produced at lower reaction temperatures of 250-350 °C. In contrast, metallic silver (Ag) nanoparticles were produced at reaction temperatures above 150 °C while metallic cupper (Cu) nanoparticles were produced at reaction temperatures above 300 °C. Mixtures of copper oxide (CuO and Cu₂O) and metallic Cu were produced at lower reaction temperatures of 250 °C. Scanning electron microscopy (SEM) showed that the particles size and morphology changed drastically as the reaction temperature increased. The average diameters of Ni, Cu and Ag particles synthesized at 400 °C were 119 ± 19 nm, 240 ± 44 nm, and 148 ± 32 nm, respectively. The scMeOH acted both as a reaction medium and a reducing agent. A possible reduction mechanism in scMeOH is also presented.     

Electrochemical properties of Cu2O/Cu composite particles prepared by a novel and facile method

Cu₂O/Cu composite particles were synthesized by a novel and facile chemical reduction method without any template or surfactant. X-ray diffraction (XRD) results showed that the product mainly consisted of the Cu₂O phase coexisting with a few Cu phases. Typical FE-SEM images indicated that the particles with an octahedral shape were Cu₂O. In addition, the electrochemical performance of the Cu₂O/Cu particles as the working electrode material in alkaline solution was systematically investigated. The particles showed a maximum discharge capacity of 222.9 mAh g⁻¹ at a discharge current density of 60 mA g⁻¹ and a high value of 109.1 mAh g⁻¹ after 50 charge–discharge cycles. The results of cyclic voltammetry demonstrated that the reaction between Cu₂O and Cu is the major electrochemical reaction during the charging and discharging process. The results of electrochemical impedance spectroscopy indicated that the formation of Cu₂O on the surface of Cu particles significantly increased the contact resistance and the charge transfer resistance of the electrode during the discharging process.     

利用酸性CuCl2蚀刻废液制备微米级Cu2O粉体

以含CuCl2酸性蚀刻废液为原料,葡萄糖为还原剂,采用液相还原法制备分散性好的微米级Cu2O粉. 实验确定最佳制备条件为：反应温度80℃,终点pH值8~9,反应时间1 h,还原剂和铜离子摩尔比为0.8. 所制Cu2O产品纯度为99.34%,Cu回收率可达99.7%. 进一步采用XRD, SEM, LZS, TG等手段对产物进行表征,结果表明产品为高纯Cu2O,粒径为1.8~2.2 mm,空心多面体结构,且常温下抗氧化性好,有可能用于催化剂、涂料、染料等的制备.     

铜含量对Cu/CeO2水煤气变换催化剂性能的影响

采用共沉淀法制备了不同铜含量的Cu/CeO₂水煤气变换催化剂，考察了铜含量对催化活性的影响。结果表明，Cu/CeO₂催化剂呈现出良好的水煤气变换活性。铜含量对催化活性有显著影响，铜摩尔分数为50%时，催化剂的低温活性最高，在200 ℃时CO转化率达到66.1%。Cu/CeO₂与FBD型铁基高温变换催化剂相比，具有低温活性好、活性温区宽的特点。用XRD、N2吸附法、H₂-TPR和CO-TPD对催化剂进行了表征，结果表明,无定形CuO、纳米颗粒CuO等可能是催化反应的活性物种，晶粒CuO对催化活性影响不大。铜含量的催化剂在不同温度下呈现出不同的活性。     

Cu-doped ZrO2 aerogel: A novel catalyst for CO hydrogenation to CH3OH

Sol-gel derived Cu/ZrO₂ aerogels have been prepared and then their potential for CO hydrogenation towards methanol has been explored. These aerogels had very high surface areas (i.e. up to 250 m² g^-1) even after reduction in H₂ at 573 K. X-ray diffraction and transmission electron microscopy showed that fresh aerogels were amorphous and composed of clusters of particles below 5 nm in size. A fraction of these primary particles grew to about 10 nm after 24 h of the catalysed reaction. The fresh aerogel was very active and stable in this methanol synthesis reaction. A relatively strong interaction of the support with the Cu is indicated by TPR and this appears to correlate well with the high activity shown. Certainly, the high activity was not simply attributable to the high surface area of such aerogel samples.