未掺杂CdZnTe与掺铟CdZnTe晶体的热处理

对于未掺杂Cd0.9Zn0.1Te晶片,采用在Cd/Zn气氛下,以In作为气相掺杂源进行热处理;而对于低阻In-Cd0.9Zn0.1Te晶片,则采用在Te气氛下进行热处理.分别研究了不同的热处理条件,包括温度、时间、pIn或pTe等对晶片电学性能、红外透过率以及Te夹杂/沉淀相的影响.结果表明,在Cd/Zn气氛下适当的掺In热处理和在Te气氛下适当的热处理均有效地提高了晶片的电阻率,分别达到2.3×1010和5.7×109Ω·cm,同时晶片的其他性能也得到明显改善.     

高阻CdZnTe晶体的退火处理

获得高电阻率的、完整性好的 Cd Zn Te晶体是研制高性能的 Cd Zn Teγ射线探测器的关键 .运用热力学关系估算了 Cd1 - x Znx 熔体平衡分压 ,尝试以 Cd1 - x Znx 合金源替代 Cd源进行 Cd0 .8Zn0 .2 Te晶片的热处理 ,研究了退火对 Cd0 .8Zn0 .2 Te晶片质量的影响 .结果表明 :在 10 6 9K下用 Cd0 .8Zn0 .2 合金源 (PZn=0 .12 2e5 Pa和 PCd=1.2 0e5 Pa)对 Cd0 .8Zn0 .2 Te晶片退火 5天以上 ,可提高晶体电阻率一个数量级和晶体红外透过率 10 %以上 ,并可消除或减小晶片中的 Te沉淀 ,同时避免了 Zn的损失 ,改善 Zn的径向分布 .可见 ,采用 Cd1 - x Zn     

高阻CdZnTe晶体的退火处理

获得高电阻率的、完整性好的CdZnTe晶体是研制高性能的CdZnTe γ射线探测器的关键.运用热力学关系估算了Cd1-xZnx熔体平衡分压,尝试以Cd1-xZnx合金源替代Cd源进行Cd0.8Zn0.2Te晶片的热处理,研究了退火对Cd0.8Zn0.2Te晶片质量的影响.结果表明：在1069K下用Cd0.8Zn0.2合金源（PZn=0.122×105Pa和PCd=1.20×105Pa）对Cd0.8Zn0.2Te晶片退火5天以上,可提高晶体电阻率一个数量级和晶体红外透过率10%以上,并可消除或减小晶片中的Te沉淀,同时避免了Zn的损失,改善Zn的径向分布.可见,采用Cd1-xZnx合金源代替Cd源控制进行CZT退火处理优于仅采用Cd源控制的退火处理.     

热处理气氛及掺钴对NiO电极赝电容器性能的影响

在讨论赝电容形成机理的基础上,应用电化学阴极沉积法在Ni基片上制得Ni(OH)2膜,经热处理得到NiO膜。研究发现,Ni(OH)2在空气中热处理所得NiO在KOH水溶液中能形成赝电容,但在N2气氛中热处理所得的NiO在KOH水溶液中未能形成赝电容;钴掺入NiO使比电容量显著增大。     

铟掺杂ZnO体单晶的生长及其性质

研究了In掺杂n型zno体单晶的化学气相传输法生长和材料性质.利用霍尔效应、x射线光电子能谱、光吸收谱、喇曼散射、阴极荧光谱等手段对晶体的特性和缺陷进行r分析.掺In后容易获得浓度为1018～lO19cm-3的n型ZnO单晶,掺人杂质的激活效率很高.随着掺杂浓度的提高,znO单晶的带边吸收和电学性质等发生明显的变化.分析了掺In-ZnO单晶的缺陷及其对材料性质的影响.     

铟掺杂ZnO体单晶的生长及其性质

研究了In掺杂n型zno体单晶的化学气相传输法生长和材料性质.利用霍尔效应、x射线光电子能谱、光吸收谱、喇曼散射、阴极荧光谱等手段对晶体的特性和缺陷进行r分析.掺In后容易获得浓度为1018～lO19cm-3的n型ZnO单晶,掺人杂质的激活效率很高.随着掺杂浓度的提高,znO单晶的带边吸收和电学性质等发生明显的变化.分析了掺In-ZnO单晶的缺陷及其对材料性质的影响.     

In/Al掺杂高电阻CdZnTe晶体载流子传输特性研究

To evaluate the charge transport properties of as-grown high resistivity CdZnTe crystals doped with In/Al, the α particle spectroscopic response was measured using an un-collimated 241Am （5.48 MeV） radioactive source at room temperature. The electron mobility lifetime products （μτ）e of the CdZnTe crystals were predicted by fitting plots of photo-peak position versus electrical field strength using the single carrier Hecht equation. A TOF technique was employed to evaluate the electron mobility for CdZnTe crystals. The mobility was obtained by fitting the electron drift velocities as a function of the electrical field strengths, where the drift velocities were achieved by analyzing the rise-time distributions of the voltage pulses formed by a preamplifier. A fabricated CdZnTe planar detector based on a low In concentration doped CdZnTe crystal with （μτ）e = 2.3 × 10？3 cm2/V and μe =1000 cm2/（V·s）, respectively, exhibits an excellent γ-ray spectral resolution of 6.4% （FWHM = 3.8 keV） for an un-collimated 241Am @ 59.54 keV isotope.     

不同Te掺杂量对InSb晶体性能的影响

InSb原料因含受主杂质,制备出的InSb晶体通常呈P型特性,其迁移率低无法满足低温(77 K)时红外探测器需求.为了获得高迁移率特性,通过直拉法(Cz)生长了不同Te掺杂量的InSb:Te晶体.利用霍尔测试仪测量晶体电学特性,结果表明,InSb:Te晶体在77 K下的导电类型为N型.随着Te掺杂浓度从1016 cm-...     

垂直布里奇曼法生长CdZnTe晶体时固液界面形状的控制

采用有限元法对探测器材料CdZnTe的晶体生长过程进行了热分析,研究了不同因素对生长过程中固液界面形状的影响.模拟结果表明,当坩埚下降速度约为1mm/h时,可获得接近水平的固-液界面.晶体生长实验结果与计算机模拟的结论基本一致.因此,通过适当选择和调节坩埚下降速度可获得高质量晶体.     

垂直布里奇曼法生长CdZnTe晶体时固液界面形状的控制

采用有限元法对探测器材料 Cd Zn Te的晶体生长过程进行了热分析 ,研究了不同因素对生长过程中固液界面形状的影响 .模拟结果表明 ,当坩埚下降速度约为 1m m/ h时 ,可获得接近水平的固 -液界面 .晶体生长实验结果与计算机模拟的结论基本一致 .因此 ,通过适当选择和调节坩埚下降速度可获得高质量晶体 .     

Vapor phase equilibria in the Cd1−xZnxTe alloy system

Cd_1−xZn_xTe compounds of different compositions have been prepared at temperatures ranging from 400 to 1000°C by annealing elemental Te in sealed quartz ampoules, in an atmosphere comprising vapors of Cd and Zn whose partial pressures were varied by varying the composition of the binary Cd_1−yZn_y alloys which provided the Cd and Zn vapors in these annealing experiments. The chemical compositions of the resulting Cd_1−xZn_xTe compounds have been analyzed using electron probe microanalytical techniques. Results indicate that presence of a 0.5%Zn along with Cd in a closed or semi-closed system may prove to be beneficial in preventing decomposition and/or formation of a metal/non metal phase during annealing of Cd_0.96Zn_0.04 Te substrates. Using the thermodynamic data in the literature for the binary Cd_1−yZn_y alloys and with the assumption that the activities of the Cd and Zn components are weakly dependent on temperature, the partial pressures of Cd and Zn in equilibrium with the Cd_1−xZn_xTe compounds at various temperatures have been evaluated.     

Copper outdiffusion from CdZnTe substrates and its effect on the properties of metalorganic chemical vapor deposition-grown HgCdTe

We report that HgCdTe (MCT) epilayers grown by metalorganic chemical vapor deposition can be doped by copper outdiffusing from CdZnTe substrates. The copper content in the substrates was determined by the choice of the purity of the starting raw materials. Copper diffusion could be controlled by adjusting the tellurium precipitate density in the substrates. Growing on substrates with a high concentration of tellurium precipitates resulted in low doped MCT epilayers whereas a high copper concentration was found in MCT grown on substrates with a lower concentration of tellurium precipitates. A mechanism whereby tellurium precipitates getter copper during the post-growth cooldown of CdZnTe boules and trap copper in the substrates is proposed.     

空间微重力汽相生长CdZnTe的研究进展

微重力条件下汽相生长CdZnTe晶体可以克服浮力对流,实现“无接触”生长,获得厚度均匀、结构完整、纯度高的材料.本文综述了国内外空间汽相生长CdZnTe晶体的研究进展.     

Cd气氛退火对CdZnTe晶片质量影响

在CdZnTe晶体生长时,有时会产生大颗粒的沉积相,严重的影响了CdZnTe晶片的质量,通过电子探针测试证明其为Cd沉积相.采用Cd气氛退火来消除Cd沉积相,可以改善CdZnTe晶片的质量.实验发现:在较高的温度(600℃)条件下,退火可以有效的消除大颗粒(＞5 (m)的Cd沉积相,改善CdZnTe晶片红外透过率、X射线双晶回摆曲线半峰宽(FWHM)和腐蚀坑密度(EPD).在此条件下对CdZnTe晶片进行退火,有助于提高CdZnTe晶片的性能.     

Low-temperature annealing of (Hg,Cd)Te

Many methods for the employment of (Hg,Cd)Te alloys employ anneals at temperatures <300°C to convert the p type left over from the growth process or to adjust the concentration of the native acceptors. An investigation of the kinetics of this annealing process has been performed as functions of (1) vacancy concentration; (2) composition, or the CdTe mole fraction in the alloy; and (3) temperature. If these anneals are carried out under mercury-saturated conditions, the tellurium precipitates in the material, which result either from the growth process or from specific thermal histories, are annihilated by in-diffusing mercury, which results in a significant multiplication of dislocations. This interface, delineated by defect etching, has been employed to investigate the kinetics of the annealing process. These results will be unaffected by the uncertainties introduced in determining this interface by electrical measurements, which arise from incomplete ionizations of the metal vacancies at 77 K for Hg_1−xCd_xTe with CdTe mole fractions exceeding ∼0.26. The annealing rate appears to be strongly dependent on both the temperature and composition of the alloy, decreasing with increasing CdTe mole fraction, within 0.15 and 0.5, with the behavior resembling a composition-dependent, activated-diffusion process. The depth of the interface appears to vary inversely as the root of the metal-vacancy concentration.     

A comparative study and performance characteristics of ion-implanted and heterojunction short-wave infrared HgCdTe focal-plane arrays

Short-wave infrared (SWIR) HgCdTe focal-plane arrays (FPAs) with a cutoff wavelength of 2.5 μm have been produced using both planar ion-implanted and heterojunction-mesa device structures. The two-dimesnional FPAs are comprised of a 320×256 format with 30-μm pixel pitch and are cooled by a multistage thermo-electric (TE) cooler. Measured R₀A values of the two types of device structures show similar results below about 130 K because of the performance-limiting effect of the surface passivation of the heterojunction. However, a substantial difference is seen above 130 K and up to 300 K between the two structures types, with the heterojunction-mesa p-on-n device having an order of magnitude higher R₀A value than the planar ion-implanted n-on-p configuration. The difference in the R₀A values is reflected in the FPA images of the two different device types, where at 200 K, both FPAs display a clear picture with the n-on-p implanted device having a somewhat lesser resolution. However, no image can be seen from the planar-implanted FPA at 300 K, whereas the heterojunction-mesa FPA still exhibits a notable image at this temperature. These differences are examined and are attributed largely to higher diffusion and generation-recombination (g-r) currents that are thought to be prevalent in the ion-implanted n-on-p device structure. Yet, baking studies carried out show the ion-implanted diodes to be slightly more robust, as experiments reveal that they tend to survive a 120°C heat treatment longer than the mesa devices, which tend to degrade after a certain period of time. The nature of n-type donors in ion-implanted diodes is discussed, and a new theory based on Te antisites is proposed to explain recent experimental findings.     

Metalorganic vapor phase epitaxy of (100) CdZnTe layers using diisopropylzinc source

Growth characteristics of (100) Cd_1−xZn_xTe (CZT) have been studied using metalorganic vapor phase epitaxy. CZT layers were grown on (100) GaAs substrates using diisopropylzinc (DiPZn), dimethylcadmiun (DMCd), and diethyltelluride (DETe) as precursors. Growths were carried out in the temperature range from 375 to 450°C. Since DiPZn has lower vapor pressure than DMCd, CZT layers with Zn composition below 0.06 were grown with good compositional control. Layers with uniform Zn composition and thickness over an area of 10 × 15 mm² were grown. Enhancement of CZT growth rate was observed when a small amount of DiPZn is introduced under fixed flows of DMCd and DETe. Zn composition increases abruptly for further increase of DiPZn flow rate, where growth rate decreases. Growth mechanisms for the above growth conditions were also discussed.     

Thermomigration of tellurium precipitates in CdZnTe crystals grown by vertical bridgman method

Te precipitates in CdZnTe have been characterized by x-ray diffraction at room and higher temperatures. From the x-ray results at room temperature, it has been confirmed that Te precipitates in CdZnTe have the same structural phase as observed in elemental Te under high pressure. The x-ray results at higher temperature indicate that Te precipitates melt around 440°C. CdZnTe samples containing Te precipitates have been annealed at temperatures below and above 440°C with thermal gradient of ∼70°C/cm. Results of the observation with infrared microscope before and after the annealings indicate distinct occurrence of thermomigration of Te precipitates in samples annealed at temperature above 440°C compared with ones annealed at temperature below 440°C. Thermomigration velocity obtained from these results is ∼50 μm/h. The average value for the effective diffusion coefficient of the metallic atoms in Te precipitates calculated by using the thermomigration velocity is ∼3 x 10⁻⁵ cm²/s.     

Infrared absorption behavior in CdZnTe substrates

Infrared (IR) optical transmission measurements of polished CdZnTe wafers can provide useful information about excess impurities, stoichiometry, and inhomogeneities (precipitates and inclusions). We have investigated the IR transmission behavior of Cd_0.96Zn_0.04Te between 8 m and 20 m at room temperature. The measurements were made before and after thermal treatments involving control of the Cd and Zn overpressures, which served to minimize the Cd (cation) vacancy population. Our results support the polar optical phonon scattering theory of Jensen, according to which the absorption in donor dominated CdZnTe varies as^m with m=3. For material dominated by acceptors, we show that the theoretical absorption by inter-valence band transitions can be approximated by a similar power law with exponent m=1, and that Cd-vacancy dominated wafers are in reasonable agreement with this. We find some wafers in which the asgrown condition exhibits partial compensation of impurity donors by Cd vacancy acceptors, and demonstrate removal of the compensation by annealing to fill the vacancies. In a separate group of wafers, we find that an observed increase in absorption occurring during growth of a HgCdTe layer by liquid phase epitaxy can be explained in terms of an increase in Cd vacancies caused by diffusion of Cd to Te precipitates. This effect can be reversed by annealing in Cd−Zn vapor, which fills vacancies and eliminates some precipitates. Impurity concentrations were measured by glow discharge mass spectrometry (GDMS).