Inhibition effects of 2,5-dimercapto-1,3,4-thiadiazole on the corrosion of mild steel in sulphuric acid solution

The effect of 2,5-dimercapto-1,3,4-thiadiazole (DMTD) on the corrosion of mild steel (MS) in 1.0 M H₂SO₄ was investigated. DMTD acted as a mixed-type inhibitor without change of the mechanism of hydrogen evolution. The inhibition efficiency increased with the increase in concentration of DMTD but decreased with the increase of temperature. Adsorption of the inhibitor on the MS surface obeyed the Langmuir adsorption isotherm. The potential of zero charge suggests MS surface is positively charged in 1.0 M H₂SO₄. Thermodynamics and quantum chemical calculations reveal that the adsorption process of DMTD includes electrostatic interaction and electron donor–acceptor interactions.     

Self-assembled monolayer of 2-(octadecylthio)benzothiazole for corrosion protection of copper

Self-assembled monolayer (SAM) of 2-(octadecylthio)benzothiazole (2-OTBT) was formed on a fresh copper surface obtained by nitric acid etching. Optimum conditions for formation of SAM have been established. XPS, AFM and FTIR studies have been used to characterize the SAM. Corrosion protection ability of the SAM has been evaluated in aqueous NaCl solution using electrochemical impedance, EQCN, potentiodynamic polarization and weight-loss studies. 2-OTBT SAM is found to have excellent corrosion protection efficiency in the aq. NaCl solution. The mechanism of corrosion inhibition of copper by 2-OTBT SAM is discussed.     

Influence of hydrolysis time on the structure and corrosion protective performance of (3-mercaptopropyl)triethoxysilane film on copper

Films of (3-mercaptopropyl)triethoxysilane with different hydrolysis time were formed on copper surface. To evaluate the influence of hydrolysis time on structures and corrosion resistance of these films, Fourier-transform infrared spectroscopy, polarization curves, cyclic voltammetry and electrochemical impedance spectroscopy tests were performed on covered and uncovered copper specimens. Results indicate that the optimum hydrolysis time is 48 h. The film obtained in this case shows the best corrosion resistance in 3.5% (w) NaCl solution.     

冷轧钢表面木薯淀粉接枝共聚物自组装膜的缓蚀性能

目的合成出木薯淀粉-苯乙烯-甲基丙烯酸甲酯接枝共聚物(CS-PE-MMA)及运用自组装技术形成在柠檬酸中对钢具有良好缓蚀性能的CS-PE-MMA分子膜。方法用扫描电子显微镜(SEM)、红外光谱(IR)表征了自组装分子膜的形貌和组成;采用动电位极化曲线、电化学阻抗谱(EIS)研究缓蚀性能。结果CS-PE-MMA在冷轧钢表面形成球斑状稳定有序而致密的分子膜。动电位极化曲线表明工作电极阴阳极反应同时被抑制,EIS谱主要呈半圆容抗弧,电荷转移电阻随CS-PE-MMA自组装温度升高,时间增大而增大,缓蚀率最高达73.04%。结论 CS-PE-MMA属于混合抑制型缓蚀剂,自组装分子膜在H3C6H5O7溶液中对冷轧钢有良好的缓蚀作用。     

Inhibition of copper corrosion in sodium chloride solution by the self-assembled monolayer of sodium diethyldithiocarbamate

Sodium diethyldithiocarbamate (DDTC) self-assembled monolayer (SAM) on copper surface has been investigated by SERS and EDS and the results show that DDTC SAM is chemisorbed on copper surface by its S atoms with tilted orientation. Corrosion inhibition ability of DDTC SAM was measured in 3% NaCl solution using electrochemical methods. The impedance results indicate that the maximum inhibition efficiency of DDTC SAM can reach 99%. Quantum chemical calculations show that DDTC has relatively small ΔE between HOMO and LUMO and large negative charge in its two sulfur atoms, which facilitates the formation of a DDTC SAM on copper surface.     

Evaluation of the effect of dosage, pH and contact time on high-dose phosphate inhibition for copper corrosion control using response surface methodology (RSM)

The response surface methodology (RSM), particularly Box-Behnken design model, was used in this study to obtain the optimum operating conditions for reduction of copper corrosion by-product release using high-dose polyphosphate inhibition. Furthermore, the RSM was also applied to study the main and interactive effects of the parameters investigated. Both analysis of variance (ANOVA) and coefficient of determination (R²) showed that the RSM approach was appropriate for the optimization of high-dose polyphosphate inhibition. The main effects of polyphosphate dosage and pH were found significant in reducing copper release using high-dose polyphosphate whereas the effect of contact time was less significant. In terms of interactions between the effects, the relation between polyphosphate dosage and the pH was the most significant. The optimal polyphosphate dosage, pH and contact time were found to be 22-28 mg/L of polyphosphate as P, 9-10, and 36 h, respectively. The highest total copper release reduction was estimated as 95.86% under the optimum condition. Surface analysis using both SEM-EDX and XRD discovered that cupric phosphate was present on the copper surface treated with high-dose polyphosphate inhibition. This implied that cupric phosphate could be responsible for the reduction of copper release by forming a protective layer.     

Corrosion control of copper in nitric acid solutions using some amino acids - A combined experimental and theoretical study

Inhibition performance of three amino acids, namely l-methionine (MIT), l-methionine sulfoxide (MITO) and l-methionine sulfone (MITO2), as corrosion-safe inhibitors for copper surface in 1.0 M nitric acid was investigated by weight loss, dc polarization and ac impedance techniques. A significant decrease in the corrosion rate of copper was observed in the presence of the investigated compounds. The reactivates of the compounds under investigation were analyzed through Fukui functions, to explain their inhibition performance. Simulation techniques incorporating molecular mechanics and molecular dynamics were used to simulate the adsorption of l-methionine derivatives, on copper (1 1 1) surface in nitric acid.     

The investigation of synergistic inhibition effect of rhodanine and iodide ion on the corrosion of copper in sulphuric acid solution

The synergistic inhibition effect of rhodanine (Rdn) and iodide ion on the corrosion of copper in 0.5 M H₂SO₄ solution was studied using electrochemical techniques. The surface morphologies of the substrates were examined by scanning electron microscopy (SEM). Elemental analysis of electrode surface exposed to test solution was determined by energy dispersive X-ray spectroscopy (EDX). It was found that Rdn provided satisfactory inhibition on the corrosion of copper. Moreover, its inhibition efficiency further increased in the presence of iodide ions due to synergistic effect. Finally, a mechanism of inhibition is proposed and discussed.     

Effects of two fungicides on the corrosion resistance of copper in 3.5% NaCl solution under various conditions

Effects of two fungicides (myclobutanil and hexaconazole) on the corrosion resistance of copper in 3.5% NaCl solution under various conditions were evaluated via weight loss, electrochemical techniques, SEM and EDS. Results show that these compounds act as mixed-type inhibitors, suppressing the charge transfer process by the adsorption on copper surface. Chemisorption between inhibitors and copper is accordance with the Langmuir adsorption isotherm. The corrosion resistance of copper with inhibitors under near neutral conditions is better than that under acidic or alkaline conditions. Good inhibition performances at different temperatures and during a long time of immersion are also observed.     

Effects of blending on surface characteristics of copper corrosion products in drinking water distribution systems

Copper scales formed over 6-months during exposure to ground, surface and saline waters were characterized by EDS, XRD and XPS. Scale color and hardness were light red-brown-black/hard for high alkalinity and blue-green/soft for high SO₄ or Cl waters. Cl was present in surface or saline copper scales. The Cu/Cu₂O ratio decreased with time indicating an e transfer copper corrosion mechanism. Cu₂O, CuO, and Cu(OH)₂ dominated the top 0.5-1 A° scale indicating continuous corrosion. Cu₂O oxidation to CuO increased with alkalinity, and depended on time and pH. Total copper release was predicted using a Cu(OH)₂ model.     

Molecular modeling of the inhibition mechanism of 1-(2-aminoethyl)-2-alkyl-imidazoline

Inhibition mechanism of five 1-(2-aminoethyl)-2-alkyl-imidazoline derivatives for carbon steel against CO2 corrosion was studied by molecular modeling. Molecular reactivity derived from quantum chemical calculation is insensitive to alkyl length. Inhibitor molecules can be adsorbed preferentially on metal surface with imidazoline ring attached on the surface. And with increase of alkyl length, interaction between inhibitor molecule and metal surface is enhanced to enable more stable adsorption of inhibitor molecules, which will form more compact self-assembly membrane with higher inhibition efficiency. The efficiency order of the inhibitors obtained by theoretical analysis was verified by experimental results.     

Effect of serine, threonine and glutamic acid on the corrosion of copper in aerated hydrochloric acid solution

The corrosion inhibition of three amino acid compounds on copper was investigated by electrochemical method. They suppressed cathodic current densities and shifted the corrosion potential towards more negative values. The interaction between amino acid and copper surface was certified by reflected FT-infrared spectroscopy. The quantum chemical parameters were obtained by PM3 semi-empirical calculation. Glutamic acid has the smaller net positive charge of nitrogen atom and the more net negative charge of oxygen atoms. The improved inhibition of glutamic acid was due to the stabilization of its adsorption on the copper surface by the oxygen atoms in its structure.     

Determination of corrosion potential of coated hollow spheres

Copper hollow spheres were created on porous iron particles by electro-less deposition. The consequent Ni plating was applied to improve the mechanical properties of copper hollow micro-particles. Corrosion properties of coated hollow spheres were investigated using potentiodynamic polarisation method in 1 mol dm⁻³ NaCl solution. Surface morphology and composition were studied by scanning electron microscopy (SEM), light microscopy (LM) and energy-dispersive X-ray spectroscopy (EDX). Original iron particles, uncoated copper spheres and iron particles coated with nickel were studied as the reference materials. The effect of particle composition, particularly Ni content on the corrosion potential value was investigated. The results indicated that an increase in the amount of Ni coating layer deteriorated corrosion resistivity of coated copper spheres. Amount of Ni coating layer depended on conditions of Ni electrolysis, mainly on electrolysis time and current intensity. Corrosion behaviour of sintered particles was also explored by potentiodynamic polarisation experiments for the sake of comparison. Formation of iron rich micro-volumes on the particle surface during sintering caused the corrosion potential shift towards more negative values. A detailed study of the morphological changes between non-sintered and sintered micro-particles provided explanation of differences in corrosion potential (E_corr).     

Corrosion of ultra-fine grained copper fabricated by equal-channel angular pressing

Corrosion of ultra-fine grain (UFG) copper fabricated by equal-channel angular pressing (ECAP) has been investigated in comparison with that in recrystallized coarse grain (CG) copper. Corrosion current was estimated by a Tafel extrapolation method to examine the kinetics of corrosion in a modified Livingstone etchant, which is sensitive to dislocations and grain boundaries. UFG copper exhibited a lower corrosion current in comparison with that in its recrystallized coarse grain (CG) counterpart despite the fact that the dislocation density and total fraction of grain boundaries are much greater in UFG copper than in CG copper. Corrosion damage on the surface of UFG copper is macroscopically rather uniform whereas obvious attack at grain boundaries and selective corrosion of some grain interiors were observed in CG copper.     

Surface characterization and corrosion behavior of a novel gold-imitation copper alloy with high tarnish resistance in salt spray environment

A novel gold-imitation copper alloy (CuZnAlNiSnBRe) was designed and its corrosion behavior in salt spray environment was investigated. The new alloy has better tarnish resistance and corrosion resistance than the current coinage alloy used in China (H7211). A multi-layer film formed on the surface of the new alloy after a period of exposure to salt spray was responsible for the good resistance of the alloy. The corrosion products were a mixture of CuO, Cu₂O, ZnO, Al₂O₃ and Al(OH)₃, with the transition from Cu₂O to CuO occurring during the corrosion process.     

Super-hydrophobic metal-complex film fabricated electrochemically on copper as a barrier to corrosive medium

Metal-complex film with super-hydrophobic property is fabricated on copper (Cu) surface with one-step electrochemical method in laurylamine/ethanol solution. “Dissolution–coordination–precipitation” model is proposed to illuminate formation mechanism of Cu(II)-laurylamine complex film. The super-hydrophobic film can act as a barrier to corrosion of underlying copper with inhibition efficiency close to 100%, and it maintains stability within a wide potential range. The origin of such corrosion protection property is explained from view point that hierarchical micro-structure of the super-hydrophobic film can maintain a stable air/liquid interface which inhibits erosion of corrosive medium.     

Corrosion inhibition of copper in chloride media by 1,5-bis(4-dithiocarboxylate-1-dodecyl-5-hydroxy-3-methylpyrazolyl)pentane

The efficiency of 1,5-bis(4-dithiocarboxylate-1-dodecyl-5-hydroxy-3-methyl-pyrazolyl)pentane (BDTCPP) as copper corrosion inhibitor in 3.5% NaCl solutions was studied by electrochemical polarization methods (Tafel extrapolation and polarization resistance method), electrochemical impedance spectroscopy and immersion assays. Results obtained in this study reveal that BDTCPP is a good inhibitor and the potentiodynamic polarization studies clearly show that BDTCPP is a mixed-type inhibitor for copper in chloride solutions. It decreases the anodic reaction rate more strongly than the cathodic reaction rate and it renders the open circuit potential of copper more positive in 3.5% NaCl solutions. The UV analysis of the protective layer of BDTCPP after corrosion experiments shows that the inhibitor prevents copper corrosion by physisorption on the metal surface, followed by chemisorption of a protective Cu(II)-complex. This Cu(II) is generated by oxidation of the Cu(I) ion formed at the beginning of the corrosion process in the aerated solution of NaCl.     

Corrosion inhibition of flaky aluminium powders prepared through sol–gel process

In order to prevent corrosion of aluminium pigment in water, coated flaky aluminium powder was prepared through the sol–gel process, in which tetraethoxysilane (TEOS) and tris(2-methoxyethoxy)vinylsilane (VTMOEO) were adopted as precursors. The influences of the dosage of precursors, ethylenediamine, water and ethanol, as well as the reaction temperature and reaction time on the corrosion inhibition efficiency were investigated. Under the optimum conditions, the corrosion inhibition efficiency reached 99.2% in alkaline media of pH 11. The analysis with SEM, FTIR, EDS and XPS showed that sol–gel coatings had successfully encapsulated on the surface of clear flaky aluminium powders.     

Adsorption and corrosion inhibition of phytic acid calcium on the copper surface in 3 wt% NaCl solution

The adsorption and corrosion protection effect of phytic acid calcium (PAC) film on the copper surface in 3 wt% NaCl solution was investigated using potentiodynamic polarization, electrochemical impedance spectroscopy (EIS), and Raman spectroscopy. Polarization curves indicate that PAC is a mixed inhibitor, affecting both cathodic and anodic corrosion currents. The inhibition efficiency of PAC film reached 92.53% at an optimized condition. Adsorption of PAC molecules on the surface followed Langmuir adsorption isotherm and the standard Gibbs energy of −37.32 kJ mol⁻¹ indicated a chemisorptive way. Raman studies suggested that PAC molecule chemically anchored at the surface via PO groups.     

The influence of adenine on corrosion of copper in chloride solutions

The influence of the concentration of adenine (AD) on the corrosion and the spontaneous dissolution of copper in 1.0 M NaCl solutions of pH 6.8 was studied. The investigations involved electrochemical polarization methods as well as weight loss measurements, quartz crystal microbalance (QCM) techniques and scanning electron microscopy (SEM). The inhibition efficiency increases with an increase in the concentration of AD. An adherent layer of inhibitor is postulated to account for the protective effect. The adsorption of adenine has been found to occur on the surface of copper according to the Langmuir isotherm. The values of standard free energies of adsorption suggest chemical adsorption of AD on copper surface. The use of adenine can effectively prevent various new installations made of copper and exposed to the action of aqueous solutions of chlorides from corrosion damage.