碳纳米管表面化学镀银及场发射性能研究

利用化学镀方法对碳纳米管(carbon nano-tubes,CNTs)表面金属化镀银,研究表面化学镀银碳纳米管的场发射性能。碳纳米管经氧化处理后,表面存在一些羰基(CO)、羧基(—COOH)和羟基(—OH)等活性基团,经敏化、活化处理后,形成金属钯活化中心,进而还原金属银离子,从而获得表面化学镀银的碳纳米管。表面化学镀银碳纳米管阴极的开启电场约为0.19V/μm,当电场强度为0.37V/μm时,最大发射电流达6mA/cm2,场增强因子约为25565。实验结果表明,化学镀银层可以提高碳纳米管的电子传输和热传输能力,提高碳纳米管的场发射电流和发射稳定性,有利于碳纳米管在场发射平板显示领域的应用。     

Ni-P/Ag纳米复合化学镀层的耐磨损性能

Ni-P/非金属纳米化学镀溶液中纳米粒子容易团聚,镀液难以保持稳定性.在化学镀Ni-P溶液中添加纳米银粒子,在钢铁基体上制备了Ni-P/Ag纳米复合镀层.用显微硬度计、金相显微镜等技术分析了镀层的厚度、硬度和表面形貌,用磨损试验机研究了镀层的耐磨损性能.结果表明:银纳米粒子在镀液中的含量为1.0×10-7mol/,L,银纳米粒子加快了镀层的沉积速度,使纳米复合镀层厚度增加;在相同的施镀条件下,Ni-P/Ag纳米复合镀层比Ni-P镀层具有更高的硬度和更好的耐磨损性能.     

硅基体表面无钯活化化学镀镍工艺

硅材化学镀镍的活化是为了获取金属原子沉积中心,但现有的活化工艺存在种种不足。金纳米粒子具有小尺寸效应、表面与界面效应,呈现出良好的催化活性。采用金纳米粒子对硅基体进行活化后化学镀镍,并采用浸泡腐蚀试验,SEM及EDS测试将其与传统的钯活化法对比,研究了活化后的沉积速度及镀层形貌、结构、耐腐蚀性能,结果表明：金纳米粒子活...     

高速电弧喷涂FeNiCr/Ni包覆Cr3C2涂层组织和性能的研究

通过常温超声波辅助化学镀方法制备Ni包覆Cr3C2陶瓷粉体,以其作为增强相的粉芯材料通过高速电弧喷涂制备FeNiCr/Ni包覆Cr3C2涂层.采用光学显微分析、场发射扫描电镜分析(FE-SEM)、能谱分析(EDS)以及显微硬度测试方法,研究Ni包覆Cr3C2陶瓷粉体对涂层组织结构及性能的影响.试验结果表明:Ni包覆Cr3C2陶瓷粉体能改善涂层中各相之间的结合状态,显著减少涂层的氧化物和孔隙率,并提高涂层与基体的结合强度、抗热震性和抗高温冲蚀性能.     

Effect of carbon nanotubes and their dispersion on electroless Ni–P under bump metallization for lead-free solder interconnection

Electroless Ni–P under bump metallization (UBM) has advantages of even surface, low cost and simplicity to deposit, but their mechanical strength, corrosion resistance and stability still face challenges under high soldering temperature. Incorporating carbon nanotubes (CNTs) into electroless Ni–P UBM might be expected to provide Ni–P–CNT composites with high mechanical strength and stability. Ni–P–CNT composite coatings as well as Ni–P coatings were fabricated by electroless plating process. In order to homogeneously disperse CNTs in composite coatings, acid pre-treatment and surfactant dispersant were introduced. During composite electroless plating, the ultrasonic agitation was also employed. In this study, scanning electronic microscopy (SEM) was used to observe the morphology and the CNTs were proved to be uniformly distributed in Ni–P–CNT coatings by SEM and atomic force microscopy. It was verified that the surface of the composite was quite smooth and continuous; CNTs are equably embedded in the matrix, which is advantageous for conductivity, mechanical strength and corrosion resistance. Shear tests were conducted to evaluate the effect of CNT reinforcement on the mechanical properties of joints, and the joints with CNT additions exhibited higher shear strength at different reflow cycles. Moreover, deposition mechanism of CNTs with Ni was analyzed and confirmed by transmission electron microscopy. Factors that affecting plating process was also discussed, and the optimum plating condition was suggested in this study.     

镁合金磷化处理对化学镀镍层性能的影响

为了有利于环保,采用磷化工艺对AZ31B镁合金进行化学镀镍前处理.采用直观法、扫描电子显微镜和阴极极化曲线法对磷化膜及其化学镀镍层进行了分析.结果表明:AZ31B镁合金表面经磷化处理后得到了良好的化学镀镍层;AZ31B镁合金化学镀镍层的耐蚀性随磷化时间的延长先增加后减小,当磷化时间为75 s时,化学镀镍层的腐蚀电势比直...     

SiC颗粒的表面修饰及结构表征

利用简单的化学镀方法,实现了SiC颗粒的表面化学修饰.通过对酸性、碱性修饰液的比较研究,证实在相同条件下,碱性镀液的修饰效果较好;采用SEM,TEM,EDS和XRD,对修饰前、后的SiCP的物相、晶形、成分等进行了研究,初步表征了Ni/SiC颗粒复合粒子的微结构;并考察了热处理对修饰后SiC颗粒的影响.     

Gas ionization sensors with carbon nanotube/nickel field emitters

Gas ionization sensors based on the field emission properties of the carbon nanotube/nickel (CNT/Ni) field emitters were first developed in this work. It is found that the breakdown electric field (E(b)) slightly decreases from 2.2 V/microm to 1.9 V/microm as the pressure of H2 gas increases from 0.5 Torr to 100 Torr. On the contrary, E(b) obviously increases from 2.9 V/microm to 6.5 V/microm as O2 gas pressure increases from 0.5 Torr to 100 Torr. This may be explained by the depression of the electron emission that caused by the adsorption of the O2 gas on the CNT emitters. The Raman spectra of the CNT/Ni emitters also show that more defects were generated on the CNTs after O2 gas sensing. The Joule heating effect under high current density as performing H2 sensing was also observed. These effects may contribute the pressure dependence on the breakdown electric field of the CNT/Ni gas ionization sensors.     

Adsorption characteristic of copper ions and its application in electroless nickel plating on a hydrogel-functionalized poly(vinyl chloride) plastic

A facile and palladium-free process for the electroless plating on poly(vinyl chloride) (PVC) plastic has been demonstrated. The process is based on the Cu adsorption capacity of semi-interpenetrating polymer network (semi-IPN) hydrogel chemically bonded to PVC surface via a simple and one-step approach that applying a chitosan/polyethylene glycol/glutaraldehyde system under mild stirring at room temperature. Therefore, electroless plating can be achieved in the following three steps, namely: (1) the functionalization of PVC by the semi-IPN hydrogel film (2) the adsorption and formation of the catalyst Cu⁰ on the PVC surface, and (3) the electroless nickel plating in plating bath. Batch adsorption experiments are conducted to determine the effects of pH, initial Cu²⁺ ions concentration and the dosage of crosslinking agent glutaraldehyde on copper adsorption and the surface resistance of the corresponding plated-PVC. The activated reaction progress and resulting nickel–phosphorus (Ni–P) layer were characterized by attenuated total reflection Fourier transform infrared, scanning electron microscopy, X-ray photoelectron spectroscopy, energy dispersive X-ray spectroscopy, and X-ray diffraction. The results show that the Cu nanoparticles chemisorbed on the functionalized PVC substrate, could effectively initial the subsequent electroless nickel plating; and a compact and continuous Ni–P layer with amorphous phase was successfully deposited on PVC by this process. Besides, the surface resistance of the plated-PVC as low as 0.5 Ω sq^?1 showed an excellent adhesion with the PVC substrate proved by Scotch-tape test.     

Electroless plating and magnetic properties of Co–Zn–P coating on short carbon fibres

A layer of Co–Zn–P alloys was coated on short carbon fibre (CFs) surfaces using electroless plating method. The influence of the concentration of Co^2?+? and Zn^2?+? and reaction time on the plating rate were measured by comparing the relative mass gain rate of Co–Zn–P-coated fibres with uncoated carbon fibres prepared under different conditions. The materials characterizations were analysed by field emission scanning electron microscopy, X-ray diffraction and energy dispersive spectroscope. The magnetic properties of Co–Zn–P/CFs composites prepared in different Zn^2?+? concentration baths were measured by the vibrating sample magnetometer. The best processing parameters of electroless plating of Co–Zn–P coating on short carbon fibres were obtained.     

镁合金硫酸镍体系化学镀镍工艺及镀层性能研究

采用酸性钼酸盐酸洗、碱性钼酸盐活化工艺,研究了AM60镁合金上硫酸镍溶液体系化学镀镍的方法.采用扫描电子显微镜(SEM)观察镀层表面形貌,电子探针(EDX)分析镀层成分,电化学方法研究镀层腐蚀性能,锉刀试验测试镀层与基体结合力.结果表明,所得镀层为Ni-P合金镀层,磷质量分数为10%～14%;镀层均匀致密,无明显缺陷;镀层的自腐蚀电位接近-0.4 V(vs SCE),阳极极化曲线有明显的钝化区;Ni-P镀层耐蚀性好,与基体结合牢固.     

锦纶织物超声波纳米颗粒化学复合镀银层的结构与性能

为了改善锦纶织物普通化学镀银层的性能,在化学镀银液中分别添加Al2O3,Si3N4,ZrC纳米颗粒,并在超声波辅助条件下对锦纶织物进行了纳米颗粒复合镀银.采用扫描电镜(SEM)、X射线能谱仪(EDS)、X射线衍射仪(XRD)和热重分析仪对镀层表面形貌、成分、结晶度、晶拉大小和织物热性能进行了表征,还测试了织物的阻燃性、...     

Fabrication of carbon nanotubes field emission cathode by composite plating

Carbon nanotubes (CNTs) have high aspect ratio and have great potential to be applied as the field emission cathode because of its large field enhancement factor. In this work, a high performance carbon nanotube field emission cathode (CNTFC) was fabricated by using a composite plating method. The CNTs were purified by acid solutions and then dispersed in electrobath with nickel ions at temperatures of 60, 70, or 80 degrees C for the electroless plating process on glass substrate. The resulting CNT-Ni composite film has strong adhesion on the glass substrate. The degree of graphitization and the microstructure of the CNTFCs were studied by Raman spectroscopy and scanning electron microscopy. The field emission properties of the CNTFCs show a low turn-on electric field E(on) of about 1.2 V/microm, and a low threshold electric field E(th) of about 1.9 V/microm. Such a composite plating method could be applied to the fabrication of large area CNT field-emission displays.     

Deposition of electroless Ni on micro-sized acrylic spheres

In this work a thin film of electroless Ni was deposited on the surface of commercial acrylic spheres about 4 μm in size. After the acrylic spheres were cleaned, sensitized and activated successively, they were put into an acid plating bath containing sodium hypophosphite as reducing agent for the electroless Ni deposition. The acrylic spheres with a film of Ni deposit were molded into a cold set resin and ground and polished to form a cross section for observation. The thickness of the Ni film was measured and the state of the adhesion of Ni film to the surface of the acrylic sphere was observed by a scanning electron microscope. The results showed that the Ni film deposited in a plating bath with pH 4.2 can tightly adhere on the surface of the acrylic sphere due to the compressive stress of the Ni film. The thickness of the Ni film on the acrylic sphere can reach about 0.35 μm in 3 min of deposition time at 50–70 °C of plating temperature. The activation energy of electroless Ni deposition in plating bath with pH 4.2 is about 28.50 kJ/mole. The acrylic spheres with a layer of electroless Ni film deposited by the method proposed in this work can be further applied to anisotropic conductive adhesives in flip chip package.     

Synthesis of polyacrylonitrile/Ag core–shell nanowire by an improved electroless plating method

A simple synthetic route for fabricating continuous Ag shell on electrospun polyacrylonitrile (PAN) nanofibers has been presented via an improved electroless plating method. To avoid the complex steps (wet surface activation, pre-treatment) of the electroless plating methods reported before, UV photoreduction is used to fabricate dense Ag nanoparticles on the outer surfaces of PAN nanofibers. These Ag nanoparticles act as seeds in the following metal electroless plating step for the growth of continuous Ag shell. Additionally, our method can be easily applied to synthesize other metallic shell on the outer surfaces of PAN nanofibers with Ag nanoparticles as seeds.     

ABS塑料表面化学镀镍无钯活化工艺研究

提出了一种非金属表面化学镀镍无钯活化工艺,即在常温下,以NaBH4为还原剂,在ABS塑料上沉积活性镍,以此活性镍为活化中心,进行化学镀镍.研究确定了活化液的最佳配方,并利用均匀设计方法确定了在ABS塑料表面化学镀镍最佳工艺条件为:19g/L Ni(Ac)2·4H2O,22g/LNaH2PO2,0.02 mL/L N2H4·H2O,40 mg/L糖精;镀液pH值5.0～5.6,温度70～80℃.采用SEM、XRD、EDS等手段对镀层的形貌、结构、成分及含量进行了表征.结果表明:所得镀液稳定,镀速快,镀镍层均匀,结合力强,说明在ABS塑料表面用该无钯活化新工艺取代钯活化是可行的.     

1060铝材两步化学浸锌工艺

铝材化学性质活泼,欲获得不同性能的镀层,前处理非常重要。选用两步碱性化学浸锌体系对1060铝材进行了前处理,随后镀镍。通过自腐蚀电位-时间曲线,浸锌层扫描电镜(SEM)形貌分析,弯折试验、热震试验等考察了浸锌层与铝基体的附着力,并确定了获得结合力优良的浸锌层的最佳工艺条件:300 g/L NaOH,65 g/LZnO,50 g/L KOCO(CHOH)2COONa,1 g/L FeCl3,2 g/L NaNO3;温度20~30℃,一次浸锌时间60 s,二次浸锌时间30 s,所获浸锌层可满足后续电镀工艺的需要。     

PCB铜基表面非钯活化化学镀镍的研究

印刷电路板(PCB)铜线路借助钯活化的化学镀镍法不但价格昂贵,而且容易造成溢镀,因此开发非钯活化的化学镀镍工艺具有重要意义。以硫脲为铜的强配位剂,通过降低铜电极的电极电位,开发出了先在铜表面置换预镀薄镍层、再自催化化学镀镍的新工艺。镀镍工艺流程为除油、除锈、微刻蚀、预镀镍、激活、化学镀镍。扫描电镜(SEM)观察显示得到的镍镀层平整、均匀、致密。EDS谱分析结果显示镀层主要由镍和磷组成,含量分别约为92%和6%,X射线荧光衍射仪(EDXRF)测得镀层厚度为5.95μm,镀层的沉积速率约为14.19μm/h。镀层与基体结合力良好,后续镀金层在镍镀层上附着力良好。     

Electron field emitters based on multi-walled carbon nanotubes coated with conducting polymer/metal/metal-oxide composites

The present work describes the field emission properties of multi-walled nanotubes (MWNTs)-based conducting polymer/metal-oxide/metal/MWNTs composites (polyaniline (PANI)/SnO₂/Sn/MWNTs). MWNTs were synthesised by chemical vapour deposition technique. SnO₂/Sn/MWNTs were prepared by using chemical reduction followed by calcination. By in situ polymerisation method, surface of SnO₂/Sn/MWNTs were coated with PANI. PANI/SnO₂/Sn/MWNTs field emitters were fabricated over flexible graphitised carbon fabric substrate by spin coating technique. High-resolution transmission electron microscopy and scanning electron microscopy were used to characterise the field emitters. Field emission properties have been studied using an indigenously made facility. The fabricated PANI/SnO₂/Sn/MWNTs field emitters exhibited excellent field emission properties with a turn on field of 1.83 V µm^?1 and a field enhancement factor of 4800.     

Preparation of magnetic ZSM-5/Ni/fly-ash hollow microspheres using fly-ash cenospheres as the template

Magnetic ZSM-5/Ni/fly-ash hollow microspheres are prepared by using fly-ash cenospheres as the template. The preparation procedure mainly includes two steps, i.e., preparation of magnetic nickel/fly-ash composites by electroless plating and growth of the ZSM-5 layers on the nickel/fly-ash composites by a secondary growth method. The samples are characterized by scanning electron microscope, X-ray diffraction, nitrogen adsorption and vibrating sample magnetometer. The resulting ZSM-5/Ni/fly-ash hollow microspheres show integral hollow structure and magnetic property. They are floatable on water surface when the electroless plating time is 10 min and the hydrothermal synthesis time is 12 h at 180 °C. The floatability of these hollow microspheres can further be adjusted by changing the electroless plating and hydrothermal synthesis times. Furthermore, their magnetic property can also be managed by controlling the synthesis conditions.