Ti(CN)/TiC/Al2O3/TiN多层涂层的结构和界面结合力研究

采用中温、高温复合化学气相沉积技术(MHCVD)在WC- (6％wt)Co硬质合金基体表面制备了Ti(CN)/TiC/Al2O3/TiN 多层陶瓷涂层.通过光学显微镜(OM)、扫描电镜(SEM)、X射线衍射仪(XRD)和数显显微硬度计等手段分析多层陶瓷涂层的表面及断面形貌、物相组成、显微硬度;采用表面划痕实验,结合形貌观察及X射线能谱分析(EDS)研究多层陶瓷涂层/硬质合金基体的界面结合力及其影响因素.结果表明:Ti(CN)/TiC/Al2O3/TiN 多层陶瓷涂层结构均匀致密,涂层后硬质合金的显微硬度明显提高,约2600 HV,多层陶瓷涂层与基体界面结合良好,划痕实验显示临界载荷高达105 N,多层陶瓷涂层界面间的原子扩散作用对涂层/基体界面附着力有较大贡献,而涂层内部少量Ti2O3、W6Co6C 等物相的存在对提高界面结合力也有帮助.     

VGCF的表面处理对VGCF/SMPU复合材料力学和热学性能的影响

用二步法对气相生长碳纤维(VGCF)进行表面改性处理,然后用溶液混合法制备了VGCF/形状记忆聚氨酯(SMPU)复合材料.用扫描电镜观察分析了VGCF在SMPU基体中的分散性以及与基体的界面结合情况,研究了复合材料的力学性能和热学性能.结果表明:与未经二步法处理的VGCF相比,用二步法表面处理使VGCF在基体中的分散性及与基体的界面结合能力得到较大的提高,且使其对复合材料的拉伸强度及拉伸弹性模量的增强效果更为明显;虽然SMPU与VGCF复合后的断裂伸长率有所降低,但是与未处理的VGCF制备的复合材料相比,断裂伸长率有明显增大;表面处理的VGCF更有利于提高复合材料的热稳定性.     

超声外场对SiCp/7085复合材料界面及拉伸性能的影响

为研究超声辅助制备工艺对SiC_p/7085复合材料界面结合及拉伸性能的影响,用机械搅拌、机械搅拌+超声施振、超声施振3种工艺制备体积分数为10%的SiC_p/7085复合材料.采用扫描电子显微镜(SEM)、能谱(EDS)研究各工艺对SiC_p/7085复合材料的界面微观组织和拉伸性能的影响.实验结果表明:机械搅拌工艺促进大颗粒(80μm)与熔体结合,但产生了粗大Al4C3界面产物包裹层,且难改善小颗粒(37μm)与熔体界面结合差的问题;超声施振能促进界面反应,生成尺寸细小、排列规整、紧密的Mg O、Mg Al2O4界面强化相覆盖层,有效改善小颗粒与熔体界面结合;相比于7085铝合金,机械搅拌不能改善SiC_p/7085复合材料拉伸性能,而超声施振的加入能显著提升材料拉伸性能.     

SiCp/Al-Si复合材料中SiC/Si的晶体学位向关系

用TEM研究了离心铸造和挤压铸造的SiCp/ZL109复合材料,发现Si优先在SiC表面上形核、长大,并形成大量"界面Si"及SiC/Si界面.SiC与Si之间不存在固定的晶体学位向关系,但存在(1101)sic//(111)si,[1120]sic∥[112]si优先出现的位向关系,而(0001)sic∥(111)si不是优先出现的位向关系.     

添加微量Ti 元素对Diamond/Cu复合材料组织及性能的影响

分别采用在Cu基体添加0. 1 wt%的Ti 元素形成Cu₂Ti合金和在Diamond 颗粒表面镀钛(DiamondTi) 的方法, 制备了含Diamond 体积分数为60 %的Diamond/Cu₂Ti 复合材料和DiamondTi/Cu 复合材料。对比分析了Ti 元素对复合材料微观组织、界面结合及性能的影响规律。结果表明: 添加0. 1 wt%Ti 元素能改善Diamond与Cu 的界面结合, 在界面处观察到明显的碳化物反应层; 且以Cu₂Ti合金的方式添加Ti 元素改善界面的效果优于在Diamond 颗粒表面镀Ti 的方式。所制备的Diamond/Cu₂Ti 复合材料的热导率为621 W(m·K) - 1, 而DiamondTi/Cu复合材料的热导率仅为403. 5 W(m·K) -1, 但均高于未添加Ti 制备的Diamond/Cu 复合材料。      

界面层对CVI-mini SiCf/SiC复合材料力学性能的影响

利用化学气相渗透法(CVI)在束丝SiC纤维表面沉积BN和BN/SiC两种界面层,并将其制备成mini碳化硅复合材料.应用扫描电镜(SEM)观察了界面层和mini复材的表面和断口形貌,应用原子力显微镜(AFM)表征了界面层的表面粗糙度.采用X射线衍射(XRD)和透射电镜(TEM)对界面层结构进行表征,利用电子万能试验机对mini复材的拉伸性能进行分析.结果表明,CVI方法制备的BN表面光滑,为层状-岛状生长,与基体结合较弱,其mini复材拉伸强度为970 MPa.热处理后的BN结晶度增强,表面粗糙度增大,与基体的结合略微增强,其mini复材拉伸强度有所提升,为1050 MPa.BN/SiC界面层表面粗糙,为岛状生长,与基体的结合较强,其mini拉伸强度最高,为1720 MPa.     

喷涂功率对碳/碳复合材料表面羟基磷灰石涂层的影响

采用等离子喷涂技术在碳/碳复合材料表面制备了羟基磷灰石(HA)涂层,采用电子拉伸机和自制装置测定了不同喷涂功率下涂层与基体的抗剪强度,采用扫描电镜观察了涂层表面、剪切断裂表面的形貌,采用电子探针分析了试样截面的形貌和成分线分布.结果表明:随着喷涂功率的增加,涂层中HA颗粒的熔化程度和涂层与基体的抗剪强度均增加,涂层与基体的界面属于机械结合,其剪切断裂的形式主要有界面失效和涂层内部失效两种.     

电子封装用Cu/Mo/Cu复合材料的工艺研究

研究了浸涂助复剂(铝基合金)和室温轧制工艺对Cu/Mo/Cu复合界面结合强度的影响,简述了Cu/Mo/Cu复合板室温轧制成形工艺过程,详细分析了表面和界面清理、初道次轧制临界变形率及热处理工艺等因素对复合板结合强度的影响.实验结果得出,钼板浸涂Al-Mn-Zn-Sn合金助复剂后的热处理温度为800～850℃;初道次轧制变形率为45%最佳;复合轧制后合适的退火工艺为450℃,保温60 min.     

羟基磷灰石(HA)表面改性对HA/聚乳酸复合材料力学性能的影响

采用三种高分子有机物聚乙二醇(PEG)、聚乙烯醇(PVA)和聚丙烯酸(PAA)对羟基磷灰石(HA)颗粒表面进行改性处理,以便改善两相在复合时的界面结合强度,从而获得力学性能优良的复合材料.首先,将三种高分子聚合物分别溶于含HA颗粒的水溶液中,均匀分散后经喷雾干燥获得改性的粉体;然后,利用流延法获得HA/PLLA复合材料薄膜.研究了3种高分子表面改性HA颗粒后复合材料的力学性能,以及自然断面的界面结合情况.结果表明HA表面经PEG改性后,HA与PLLA间的界面结合状态优良,HA/PEG/PLLA的断裂强度较未经表面改性处理的HA颗粒与PLLA的复合材料的断裂强度提高了31%.     

Ti镀层对金刚石-铜基合金复合材料界面结构和性能的作用

为了提高金刚石-铜合金复合材料的界面粘结强度,本文用差热分析(DTA)、X射线衍射分析、SEM观察及磨削试验研究了金刚石表面的Ti镀层对金刚石-铜基合金复合材料界面结构及性能的影响.结果表明,在600～1200℃镀Ti层与金刚石发生界面反应,在金刚石表面外延生成岛状TiC,从而实现了金刚石与铜基合金的冶金结合.镀Ti金刚石与铜合金的粘结强度可达8×107Pa.用镀Ti金刚石制成的铜基合金磨块对花岗岩的磨削比与不镀钛金刚石相比提高30%.     

Influence of silane coupling agent on quality of interfacial transition zone between concrete substrate and repair materials

Silane coupling agent (SCA) was introduced as a modifying material to significantly improve the bond quality of the repaired interfacial transition zone. SCA aqueous solutions with various concentrations were used to coat the surfaces of a granite and of old concrete substrates before applying the repair materials. Both pull-off bond strength test and microstructure observation of the different repair interfacial layers were performed. The test results show that coating a concrete substrate with a SCA aqueous solution with an appropriate concentration can noticeably modify the microstructure of the interfacial transition zone, and therefore, significantly increase the bond strength.     

Interface modification by irradiation with alpha particles

The performance of electronic devices and systems get degraded when they are exposed to radiation above a certain limit or over longer duration and the process is called radiation damage. The performance degradation is due to the damage caused to the interface by the radiation. The damage takes place in the form of dangling or unsatisfied bonds and, trapped charges, formed at the interface. Interfaces and surfaces cannot be ignored and are indispensable in many problems like creation of numerous semiconductor junctions while forming devices, in chemical reactions, intricate biological reactions and processes, and corrosions of material surfaces etc. Substrate surfaces and interface of substrates and oxides play a key role in the performance of the metal oxide/insulator semiconductor field effect transistor and various other similar types of devices. Surfaces are abrupt termination of one material and formation of a second material so the surfaces may have unsaturated chemical bonds forming chemically active surfaces. Even after growing a thin layer of other required material over it, all the unsaturated chemical bonds are not satisfied. Later these surfaces with unsaturated bonds play an important role in the performance reliability of the semiconductor devices. Annealing is one of the processes that is used to modify these unsaturated dangling bonds. This investigation is to explore the possibility of interface modification by alpha particle irradiation, after the fabrication of the interfaces/devices. Here we present a method to improve the interface of silicon and hafnium dioxide, through alpha particle irradiation. This method can be used to improve the interface quality even after fabrication process is over.     

玄武岩纤维增强环氧树脂复合材料复合机制

用三种硅烷偶联剂KH550、KH560和KH570分别处理玄武岩纤维(BF), 以未经偶联剂处理的BF为对照组。X射线电子能谱(XPS)分析三种偶联剂对BF的改性, 发现BF表面的Si元素与偶联剂中的Si元素形成了Si—O—Si键, 其含量顺序为KH550>KH570>KH560。测定了不同方法处理后的BF增强环氧树脂(BF/EP)复合材料水浴前后的弯曲性能和层间剪切强度(ILSS), 同时用SEM观察了BF/EP水浴前后的断裂面微观形貌, 结果发现水浴前三种偶联剂处理BF后都能提高BF/EP的界面粘结性能, 提高效果为KH550>KH560>KH570, 试样破坏时界面无脱粘, 主要发生的是基体破坏, 界面力学性能优于基体力学性能; 水浴处理后, 不同BF/EP的力学性能下降程度不同, 耐水性较差, 试样断裂面呈脆性断裂, 界面脱粘, 部分纤维被拔出后在基体中留下空洞。      

FATIGUE PROPERTIES OF C/Al METAL-MATRIX COMPOSITES WITH DIFFERENT INTERFACIAL BONDS

The fatigue properties of four kinds of composite wires with different interface bonds, together with the effects of a notch in the surface of the composite wires, have been studied. Fatigue endurance (S-N) curves of these materials revealed that no definitive fatigue limit was obvious. The C/Al composites with weak interfacial bonds were insensitive to the notch, but the notch was an important source of cracks which propagated rapidly when the interface bonding was strong. Although initial cracks would occur very early in the fatigue life, their propagation were arrested by the internal structure of the composite wires with suitable interface bonds.     

不同层次界面对C/C复合材料断裂行为的影响

采用快速化学液相气化渗透法制备了C/C复合材料;利用扫描电子显微镜观察了材料的断口形貌特征;研究了不同层次界面状态对C/C复合材料力学行为及断裂模式的影响. 研究表明:束内纤维与基体间结合要适度,既不能过强也不能过弱,保证材料具有高强度同时又具有一定塑韧性;当碳布层间或束间的基体热解碳与纤维柬表面之间残余孔隙量较多或者结合较弱时,则裂纹沿碳布层表面的纤维与基体热解碳之间扩展而分层;热解碳碳层面排列的越紧密,层面间的结合强度越高,则倾向于在基体热解碳内形成齐茬形断面;若碳层面之间存在过多间隙或结合较弱,则倾向于沿碳层面剥离而分层.     

碳纳米管浸润剂对碳纤维/环氧树脂界面性能的影响

制备了含碳纳米管(CNTs)的水溶液, 将该水溶液作为浸润剂浸渍碳纤维并进行烘干, 采用扫描电镜(SEM)和原子力显微镜(AFM)研究了CNTs含量及浸润工艺对碳纤维表面CNTs分布的影响, 运用单丝断裂法分析了CNTs浸润剂处理对碳纤维/环氧树脂界面粘结性能的影响和作用机制。结果表明: CNTs可在T700和T300纤维表面黏附, 浸润剂中CNTs含量越高, CNTs在纤维表面含量越高; 对于CNTs含量较低的浸润剂, 采用增加浸润次数的方法, 能有效提高碳纤维表面CNTs的含量和碳纤维表面粗糙度; 经过CNTs浸润剂处理后, 碳纤维/树脂界面处的机械啮合作用增强, 界面粘结强度明显提高, 增幅最高达35.8%。     

Mechanisms of Peeling Failures of Bonds During Ultrasonic Wedge Bonding

The metallization of wire bonding pads on Si-based integrated circuits (ICs) contains Ti, TiN, and Al layers with vertical W-plugs located through the Ti and TiN layers. One percent Si-Al wire (32 µm in diameter) was bonded on the pads by an ultrasonic transducer using a wire bonding machine. Peeling failures occurred during the ultrasonic bonding process. The peeling fractures were examined using a scanning electron microscope (SEM) with an energy-dispersive spectroscopy (EDS) system. The results showed that bonds peeled off from the interface between the Al layer and the top surface of the W-plugs or from the interface between the Si-base and the bottom surface of the W-plugs. The distribution of W-plugs also affected the bond peeling from the top or bottom surfaces of the W-plugs. Mechanisms giving rise to the peeling failure of bonds were analyzed based on the acoustic impedance of materials, which determined the amount of ultrasonic energy transmitted from one material to another. Two different paths of ultrasonic energy transmission occurred during the bonding process due to the different acoustic impedances of the materials. One is from the Al layer, through the TiN and Ti layers, to the IC. The other is from the Al layer, through the W-plugs, to the IC. The different distributions of ultrasonic energy at the positions with W-plugs and without W-plugs caused stress concentrations around the top or bottom surfaces of the W-plugs, which resulted in peeling failures of the bonds.     

Influence of fiber/matrix interfacial adhesion on composite fracture behavior

A systematic study has been conducted to identify the effect of fiber/matrix interface strength on various composite properties. A new fiber treatment technique was developed to allow fibers to be treated and then made into prepregs and composites of acceptable quality. T500 carbon fibers were treated with release agent to establish the extreme case of poor fiber/matrix interface. Composite systems made of toughened epoxy R6376 and T500 fibers with and without such a treatment were subjected to a number of fracture and impact tests. For tests involving propagating pre-existing delamination cracks, such as double cantilever beam (DCB), end notched flexural (ENF) and crack lap shear (CLS) methods, the material properties were not appreciably affected by the release agent-treated fiber surfaces. For tests that had to initiate cracks in specimens without pre-introduced cracks, such as impact and edge delamination, the material variables and failure modes were highly sensitive to the fiber/matrix interface. The critical role of the fiber/matrix interface in crack initiation was demonstrated in this study.     

不连续界面相Al4C3对SiC/Al复合材料界面结合影响的第一性原理及实验

采用密度泛函理论的第一性原理及实验相结合的方法,探讨了不连续界面相Al₄C₃对SiC/Al复合材料界面结合的影响,并与无界面新相生成时进行对比。研究表明,当Al(111)表面吸附C原子时,在Bridge位置上吸附C原子最为稳定;随着C覆盖率的增加,C原子吸附能逐渐减小;当界面相呈不连续分布时,界面由原来的SiC/Al转变为(SiC+Al₄C₃)/Al,界面黏着功由原来的0.851 J/m2增加至1.231 J/m2,这主要由于当C原子在Al表面吸附时,C原子和Al原子间形成共价键和离子键,且与界面处的Si原子也形成共价键,从而促进界面结合。利用第一性原理计算的SiC/Al和(SiC+Al₄C₃)/Al体系黏着功与实验值较为接近,且变化规律相同,具有较高的参考价值。