A 2.4-GHz dual-mode 0.18-/spl mu/m CMOS transceiver for Bluetooth and 802.11b

High-level integration of the Bluetooth and 802.11b WLAN radio systems in the 2.4-GHz ISM band is demonstrated in scaled CMOS. A dual-mode RF transceiver IC implements all transmit and receive functions including the low-noise amplifier (LNA), 0-dBm power amplifier, up/down mixers, synthesizers, channel filtering, and limiting/automatic gain control for both standards in a single chip without doubling the required silicon area to reduce the combined system cost. This is achieved by sharing the frequency up/down conversion circuits in the RF section and performing the required baseband channel filtering and gain functions with just one set of reconfigurable channel filter and amplifier for both modes. A chip implemented in 0.18-/spl mu/m CMOS occupies 4/spl times/4 mm/sup 2/ including pad and consumes 60 and 40 mA for RX and TX modes, respectively. The dual-mode receiver exhibits -80-dBm sensitivity at 0.1% BER in Bluetooth mode and at 12-dB SNR in WLAN mode.     

A 1.2 mW RDS receiver for portable applications

A 0.9 V 1.2 mA fully integrated radio data system (RDS) receiver for the 88-108 MHz FM broadcasting band is presented. Requiring only a few external components (matching network, VCO inductors, loop filter components), the receiver, which has been integrated in a standard digital 0.18 /spl mu/m CMOS technology, achieves a noise figure of 5 dB and a sensitivity of -86dBm. The circuit can be configured and the RDS data retrieved via an I/sup 2/C interface so that it can very simply be used as a peripheral in any portable application. A 250 kHz low-IF architecture has been devised to minimize the power dissipation of the baseband filters and FM demodulator. The frequency synthesizer consumes 250 /spl mu/A, the RF front-end 450 /spl mu/A while providing 40 dB of gain, the baseband filter and limiters 100 /spl mu/A, and the FM and BPSK analog demodulators 300 /spl mu/A. The chip area is 3.6 mm/sup 2/.     

A fully integrated SOC for 802.11b in 0.18-/spl mu/m CMOS

A fully integrated system-on-a-chip (SOC) intended for use in 802.11b applications is built in 0.18-/spl mu/m CMOS. All of the radio building blocks including the power amplifier (PA), the phase-locked loop (PLL) filter, and the antenna switch, as well as the complete baseband physical layer and the medium access control (MAC) sections, have been integrated into a single chip. The radio tuned to 2.4 GHz dissipates 165 mW in the receive mode and 360 mW in the transmit mode from a 1.8-V supply. The receiver achieves a typical noise figure of 6 dB and -88-dBm sensitivity at 11 Mb/s rate. The transmitter delivers a nominal output power of 13 dBm at the antenna. The transmitter 1-dB compression point is 18 dBm and has over 20 dB of gain range.     

A 35-ns 128K/spl times/8 CMOS SRAM

A 128 K/spl times/8-b CMOS SRAM with TTL input/output levels and a typical address access time of 35 ns is described. A novel data transfer circuit with dual threshold level is utilized to obtain improved noise immunity. A divided-word-line architecture and an automatic power reduction function are utilized to achieve a low operational power of 10 mW at 1 MHz, and 100 mW at 10 MHz. A novel fabrication technology, including improved LOCOS and highly stable polysilicon loads, was introduced to achieve a compact memory cell which measures 6.4/spl times/11.5 /spl mu/m/SUP 2/. Typical standby current is 2 /spl mu/A. The RAM was fabricated with 1.0-/spl mu/m design rules, double-level polysilicon, and double-level aluminum CMOS technology. The chip size of the RAM is 8/spl times/13.65 mm/SUP 2/.     

A 5-GHz direct-conversion CMOS transceiver utilizing automatic frequency control for the IEEE 802.11a wireless LAN standard

A fully integrated CMOS direct-conversion 5-GHz transceiver with automatic frequency control is implemented in a 0.18-/spl mu/m digital CMOS process and housed in an LPCC-48 package. This chip, along with a companion baseband chip, provides a complete 802.11a solution The transceiver consumes 150 mW in receive mode and 380 mW in transmit mode while transmitting +15-dBm output power. The receiver achieves a sensitivity of better than -93.7dBm and -73.9dBm for 6 Mb/s and 54 Mb/s, respectively (even using hard-decision decoding). The transceiver achieves a 4-dB receive noise figure and a +23-dBm transmitter saturated output power. The transmitter also achieves a transmit error vector magnitude of -33 dB. The IC occupies a total die area of 11.7 mm/sup 2/ and is packaged in a 48-pin LPCC package. The chip passes better than /spl plusmn/2.5-kV ESD performance. Various integrated self-contained or system-level calibration capabilities allow for high performance and high yield.     

A single-chip CMOS transceiver for 802.11a/b/g wireless LANs

A dual-band trimode radio fully compliant with the IEEE 802.11a, b, and g standards is implemented in a 0.18-/spl mu/m CMOS process and packaged in a 48-pin QFN package. The transceiver achieves a receiver noise figure of 4.9/5.6 dB for the 2.4-GHz/5-GHz bands, respectively, and a transmit error vector magnitude (EVM) of 2.5% for both bands. The transmit output power is digitally controlled, allowing per-packet power control as required by the forthcoming 802.11 h standard. A quadrature accuracy of 0.3/spl deg/ in phase and 0.05 dB in amplitude is achieved through careful analysis and design of the I/Q generation parts of the local oscillator. The local oscillators achieve a total integrated phase noise of better than -34 dBc. Compatibility with multiple baseband chips is ensured by flexible interfaces toward the A/D and D/A converters, as well as a calibration scheme not requiring any baseband support. The chip passes /spl plusmn/2 kV human body model ESD testing on all pins, including the RF pins. The total die area is 12 mm/sup 2/. The power consumption is 207 mW in the receive mode and 247 mW in the transmit mode using a 1.8-V supply.     

A Bluetooth radio in 0.18-/spl mu/m CMOS

This paper describes the results of an implementation of a Bluetooth radio in a 0.18-/spl mu/m CMOS process. A low-IF image-reject conversion architecture is used for the receiver. The transmitter uses direct IQ-upconversion. The VCO runs at 4.8-5.0 GHz, thus facilitating the generation of 0/spl deg/ and 90/spl deg/ signals for both the receiver and transmitter. By using an inductor-less LNA and the extensive use of mismatch simulations, the smallest silicon area for a Bluetooth radio implementation so far can be reached: 5.5 mm/sup 2/. The transceiver consumes 30 mA in receive mode and 35 mA in transmit mode from a 2.5 to 3.0-V power supply. As the radio operates on the same die as baseband and SW, the crosstalk-on-silicon is an important issue. This crosstalk problem was taken into consideration from the start of the project. Sensitivity was measured at -82 dBm.     

A 123-mW W-CDMA uplink baseband receiver IC with beamforming capability

In this paper, architecture and circuit design of a beamforming baseband receiver IC for uplink W-CDMA communication systems is presented. In the proposed receiver, a four-antenna-element beamformer and a four-finger RAKE combiner are adopted to exploit both spatial diversity and path diversity receiving. To minimize the size and power consumption of the receiver, a latch-based 1024-tap complex delay line is custom designed for the matched filter in the channel estimation circuit. The receiver chip was fabricated in a 0.35-/spl mu/m n-well CMOS single-poly quadruple-metal technology. The minimum supply voltage with the chip running at the nominal 15.36-MHz clock rate is measured at 2.15 V. The chip has an area of 6 mm by 6.3 mm and a power consumption of about 123 mW.     

A single-chip digitally calibrated 5.15-5.825-GHz 0.18-/spl mu/m CMOS transceiver for 802.11a wireless LAN

The drive for cost reduction has led to the use of CMOS technology in the implementation of highly integrated radios. This paper presents a single-chip 5-GHz fully integrated direct conversion transceiver for IEEE 802.11a WLAN systems, manufactured in 0.18-/spl mu/m CMOS. The IC features an innovative system architecture which takes advantage of the computing resources of the digital companion chip in order to eliminate I/Q mismatch and achieve accurately matched baseband filters. The integrated voltage-controlled oscillator and synthesizer achieve an integrated phase noise of less than 0.8/spl deg/ rms. The receiver has an overall noise figure of 5.2 dB and achieves sensitivity of -75 dBm at 54-Mb/s operation, both referred to the IC input. The transmit error vector magnitude is -33 dB at -5-dBm output power from the integrated power-amplifier driver amplifier. The transceiver occupies an area of 18.5 mm/sup 2/.     

A 10-Gb/s receiver with series equalizer and on-chip ISI monitor in 0.11-/spl mu/m CMOS

A 10-Gb/s receiver is presented that consists of an equalizer, an intersymbol interference (ISI) monitor, and a clock and data recovery (CDR) unit. The equalizer uses the Cherry-Hooper topology to achieve high-bandwidth with small area and low power consumption, without using on-chip inductors. The ISI monitor measures the channel response including the wire and the equalizer on the fly by calculating the correlation between the error in the input signal and the past decision data. A switched capacitor correlator enables a compact and low power implementation of the ISI monitor. The receiver test chip was fabricated by using a standard 0.11-/spl mu/m CMOS technology. The receiver active area is 0.8 mm/sup 2/ and it consumes 133 mW with a 1.2-V power supply. The equalizer compensates for high-frequency losses ranging from 0 dB to 20 dB with a bit error rate of less than 10/sup -12/. The areas and power consumptions are 47 /spl mu/m /spl times/ 85 /spl mu/m and 13.2 mW for the equalizer, and 145 /spl mu/m /spl times/ 80 /spl mu/m and 10 mW for the ISI monitor.     

A fully integrated low-IF CMOS GPS radio with on-chip analog image rejection

A fully integrated Global Positioning System (GPS) radio is presented. Low-IF architecture was used for a high level of integration and low power consumption. An on-chip analog image-reject filter provides 18 dB of image-noise rejection to prevent noise figure (NF) degradation. With image rejection performed in the analog radio, a single-path (nonquadrature) output was used. The integrated synthesizer only requires an off-chip phase-locked loop-filter to function. Implemented in a 0.35-/spl mu/m 2P4M CMOS process, the integrated radio has a chip area of 9.5 mm/sup 2/. The radio operates over a wide range of voltage and temperature, from 2.2 to 3.6 V and from -40/spl deg/C to +85/spl deg/C and consumes 27 mW from a 2.2-V supply. The receiver has 4 dB NF.     

A low-power 2.4-GHz transmitter/receiver CMOS IC

A 2.4-GHz CMOS receiver/transmitter incorporates circuit stacking and noninvasive baseband filtering to achieve a high sensitivity with low power dissipation. Using a single 1.6-GHz local oscillator, the transceiver employs two upconversion and downconversion stages while providing on-chip image rejection filtering. Realized in a 0.25-/spl mu/m digital CMOS technology, the receiver exhibits a noise figure of 6 dB and consumes 17.5 mW from a 2.5-V supply, and the transmitter delivers an output power of 0 dBm with a power consumption of 16 mW.     

2.5 Gbit/s multifunctional CMOS transceiver for chip-to-chip optical link

A novel multifunctional transceiver for chip-to-chip optical interconnects operating at 2.5 Gbit/s is proposed, which shares a common block between a receiver and a transmitter. This transceiver provides four conversion functions - electrical-to-optical, optical-to-optical, optical-to-electrical, and electrical-to-electrical - depending on the selection switch on a single chip. The whole chip integrated in 0.18 /spl mu/m CMOS occupies an area measuring 0.82/spl times/0.82 mm/sup 2/.     

A 1.8-V 10-Gb/s fully integrated CMOS optical receiver analog front-end

A fully integrated 10-Gb/s optical receiver analog front-end (AFE) design that includes a transimpedance amplifier (TIA) and a limiting amplifier (LA) is demonstrated to require less chip area and is suitable for both low-cost and low-voltage applications. The AFE is fabricated using a 0.18-/spl mu/m CMOS technology. The tiny photo current received by the receiver AFE is amplified to a differential voltage swing of 400 mV/sub (pp)/. In order to avoid off-chip noise interference, the TIA and LA are dc-coupled on the chip instead of ac-coupled though a large external capacitor. The receiver front-end provides a conversion gain of up to 87 dB/spl Omega/ and -3dB bandwidth of 7.6 GHz. The measured sensitivity of the optical receiver is -12dBm at a bit-error rate of 10/sup -12/ with a 2/sup 31/-1 pseudorandom test pattern. Three-dimensional symmetric transformers are utilized in the AFE design for bandwidth enhancement. Operating under a 1.8-V supply, the power dissipation is 210 mW, and the chip size is 1028 /spl mu/m/spl times/1796 /spl mu/m.     

Design and anaylsis of a 2.5-Gbps optical receiver analog front-end in a 0.35-/spl mu/m digital CMOS technology

This paper presents the design of an optical receiver analog front-end circuit capable of operating at 2.5 Gbit/s. Fabricated in a low-cost 0.35-/spl mu/m digital CMOS process, this integrated circuit integrates both transimpedance amplifier and post limiting amplifier on a single chip. In order to facilitate high-speed operations in a low-cost CMOS technology, the receiver front-end has been designed utilizing several enhanced bandwidth techniques, including inductive peaking and current injection. Moreover, a power optimization methodology for a multistage wide band amplifier has been proposed. The measured input-referred noise of the optical receiver is about 0.8 /spl mu/A/sub rms/. The input sensitivity of the receiver front-end is 16 /spl mu/A for 2.5-Gbps operation with bit-error rate less than 10/sup -12/, and the output swing is about 250 mV (single-ended). The front-end circuit drains a total current of 33 mA from a 3-V supply. Chip size is 1650 /spl mu/m/spl times/1500 /spl mu/m.     

A fully integrated UHF RFID reader SoC for handheld applications in the 0.18 μm CMOS process

A low cost fully integrated single-chip UHF radio frequency identification(RFID) reader SoC for short distance handheld applications is presented.The SoC integrates all building blocks—including an RF transceiver,a PLL frequency synthesizer,a digital baseband and an MCU—in a 0.18μm CMOS process.A high-linearity RX frontend is designed to handle the large self-interferer.A class-E power amplifier with high power efficiency is also integrated to fulfill the function of a UHF passive RFID reader.The measure...     

A 16 ns 2K/spl times/8 bit full CMOS SRAM

A high-speed 2K/spl times/8 bit full CMOS SRAM fabricated with a platinum silicide gate electrode and single-level aluminum technology is described. A typical address access time of 16 ns, which is comparable to the 16-kb bipolar SRAMs, was achieved. Typical active and standby power dissipations are 150 mW and 25 nW, respectively. The platinum silicide word line reduces the total address access time by 25%. A compact cell layout design, as well as a 1.5-/spl mu/m device feature size, also gives fast access time. The properly controlled bit line swing voltage provides reliable and fast readout operation. The chip size of the SRAM is 2.7/spl times/3.5 mm.     

A CMOS ultra-wideband impulse radio transceiver for 1-mb/s data communications and /spl plusmn/2.5-cm range finding

A CMOS ultra-wideband impulse radio (UWB-IR) transceiver was developed in 0.18-/spl mu/m CMOS technology. It can be used for 1-Mb/s data communications as well as for precise range finding within an error of /spl plusmn/2.5 cm. The power consumptions of the transmitter and receiver for data communication are 0.7 and 4.0 mW, respectively. When an LNA operates intermittently through bias switching, the power consumption of the transceiver is only 1 mW. The range for data communication is 1 m with BER of 10/sup -3/. For ranging applications, the transmitter can reduce the power to 0.7 /spl mu/W for 1k pulses per second, and the receiver consumes little power. The transceiver design, all-digital transmitter, and intermittent circuit operation at the receiver reduce the power consumption dramatically, which makes the transceiver well suited for applications like sensor networks. The electronic field intensity is lower than 35 /spl mu/V/m, and thus the UWB system can be operated even under the current Japan radio regulations.     

A 2.4-GHz 0.25-/spl mu/m CMOS dual-mode direct-conversion transceiver for bluetooth and 802.11b

A dual-mode transceiver integrates the transmitter of 0-dBm output power and the receiver for both Bluetooth with -87 dBm sensitivity and 802.11b with -86 dBm sensitivity in a single chip. A direct-conversion architecture enables the maximum reuse and the optimal current consumption of the various building blocks in each mode for a low-cost and low-power solution. A single-ended power-amplifer (PA) driver transmits the nominal output power of 0 dBm with 18-dB gain control in 3-dB steps. Only little area overhead is required in the baseband active filter and programmable gain amplifier (PGA) to provide the dual-mode capability with optimized current consumption. The DC-offset cancellation scheme coupled with PGAs implements the very low high-pass cutoff frequency with a smaller area than required by a simple coupling capacitor. Fabricated in 0.25-/spl mu/m CMOS process, the die area is 8.4 mm/sup 2/ including pads, and current consumption in RX is 50 mA for Bluetooth and 65 mA for 802.11b from a 2.7-V supply.     

A 10-Gb/s CDR/DEMUX with LC delay line VCO in 0.18-/spl mu/m CMOS

A monolithic 10-Gb/s clock/data recovery and 1:2 demultiplexer are implemented in 0.18-/spl mu/m CMOS. The quadrature LC delay line oscillator has a tuning range of 125 MHz and a 60-MHz/V sensitivity to power supply pulling. The circuit meets SONET OC-192 jitter specifications with a measured jitter of 8 ps p-p when performing error-free recovery of PRBS 2/sup 31/-1 data. Clock and data recovery (CDR) is achieved at 10 Gb/s, demonstrating the feasibility of a half-rate early/late PD (with tri-state) based CDR on 0.18-/spl mu/m CMOS. The 1.9/spl times/1.5 mm/sup 2/ IC (not including output buffers) consumes 285 mW from a 1.8-V supply.