Microstructural and optical characterization of CdTe(211)B/ZnTe/Si(211) grown by molecular beam epitaxy

CdTe layers have been grown by molecular beam epitaxy on 3 inch nominal Si(211) under various conditions to study the effect of growth parameters on the structural quality. The microstructure of several samples was investigated by high resolution transmission electron microscopy (HRTEM). The orientation of the CdTe layers was affected strongly by the ZnTe buffer deposition temperature. Both single domain CdTe(133)B and CdTe(211)B were obtained by selective growth of ZnTe buffer layers at different temperatures. We demonstrated that thin ZnTe buffer layers (<2 nm) are sufficient to maintain the (211) orientation. CdTe deposited at ∼300°C grows with its normal lattice parameter from the onset of growth, demonstrating the effective strain accommodation of the buffer layer. The low tilt angle (<1°) between CdTe[211] and Si[211] indicates that high miscut Si(211) substrates are unnecessary. From low temperature photoluminescence, it is shown that Cd-substituted Li is the main residual impurity in the CdTe layer. In addition, deep emission bands are attributed to the presence of As_Te and Ag_Cd acceptors. There is no evidence that copper plays a role in the impurity contamination of the samples.     

High-Quality (211)B CdTe on (211)Si Substrates Using Metalorganic Vapor-Phase Epitaxy

High-quality (211)B CdTe buffer layers are required during Hg_1−x Cd _x Te heteroepitaxy on Si substrates. In this study, direct metalorganic vapor-phase epitaxy (MOVPE) of (211)B CdTe on Si, as well as CdTe on Si using intermediate Ge and ZnTe layers, has been achieved. Tertiary butyl arsine was used as a precursor to enable As surfactant action during CdTe MOVPE on Si. The grown CdTe/Si films display a best x-ray diffraction rocking-curve full-width at half-maximum of 64 arc-s and a best Everson etch pit density of 3 × 10⁵ cm⁻². These values are the best reported for MOVPE-grown (211)B CdTe/Si and match state-of-the-art material grown using molecular-beam epitaxy.     

Cyclic Annealing During Metalorganic Vapor-Phase Epitaxial Growth of (211)B CdTe on (211) Si Substrates

High-quality (211)B CdTe buffer layers on Si substrates are required to enable Hg_1–x Cd _x Te growth and device fabrication on lattice-mismatched Si substrates. Metalorganic vapor-phase epitaxy (MOVPE) of (211)B CdTe on Si substrates using Ge and ZnTe interlayers has been achieved. Cyclic annealing has been used during growth of thick CdTe layers in order to improve crystal quality. The best (211)B CdTe/Si films grown in this study display a low x-ray diffraction (XRD) rocking-curve full-width at half-maximum (FWHM) of 85 arcsec and etch pit density (EPD) of 2 × 10⁶ cm⁻². These values are the best reported for MOVPE-grown (211) CdTe/Si and are comparable to those for state-of-the-art molecular beam epitaxy (MBE)-grown CdTe/Si.     

分子束外延CdTe（211）B／Si复合衬底材料

报道了用MBE的方法，在3英寸Si衬底上制备ZnTe／CdTe（211）B复合衬底材料的初步研究结果，该研究结果将能够直接应用于大面积Si基HgCdTe IRFPA材料的生长．经过Si（211）衬底低温表面处理、ZnTe低温成核、高温退火、高温ZnTe、CdTe层的生长研究，用MBE方法成功地获得了3英寸Si基ZnTe／CdTe（211）B复合衬底材料．CdTe厚度大于10μm，XRD FWHM平均值为120arc sec，最好达到100arc sec，无（133）孪晶和其他多晶晶向．     

ZnTe/Si(211)与ZnTe/GaAs(211)异质结构的热应变研究

通过理论计算获得ZnTe/Si（211）与ZnTe/GaAs（211）异质结构样品室温下的热应变分布与曲率半径,并采用激光干涉仪测量两个样品室温下的曲率半径。研究发现,在（211）面上进行异质外延,两个互相垂直的晶向方向[1-1-1]和[01-1]的应变分布呈现各向异性,且沿两个方向上的表面曲率半径亦存在差异。ZnTe/GaAs（211）样品的激光干涉测量结果与理论计算较为吻合,均为同一数量级的表面曲率半径方向为负的张应变,ZnTe/Si（211）样品的测量结果则存在较大差异。由于Si衬底在高温脱氧的过程中产生了表面曲率半径方向为正的塑性形变,在一定程度上降低了外延ZnTe后异质结构的弯曲程度,减小了热失配应变。     

Understanding the Evolution of CdTe Buffer Layer Surfaces on ZnTe/Si(211) and GaAs(211)B During Cyclic Annealing

We present the results of a detailed study of the changes that occur on CdTe buffer layer surfaces grown on ZnTe/Si(211) and GaAs(211)B during the routine thermal cyclic annealing (TCA) process. Observations indicate that CdTe buffer layer surfaces are Te saturated when the TCA is performed under Te overpressure. In the absence of Te flux during the TCA step, the CdTe surface loses CdTe congruently and the typical CdTe nanowires show the presence of nodules on their surfaces. The observed changes in reflection high-energy electron diffraction patterns during TCA are explained in terms of surface chemistry and topography observations. Overall, the Te overpressure is necessary to maintain a smoother and pristine surface to continue the molecular beam epitaxy (MBE) growth.     

Molecular beam epitaxial growth of Cd<Subscript>1−y</Subscript>Zn<Subscript>y</Subscript>Se<Subscript>x</Subscript>Te<Subscript>1−x</Subscript> on Si(211)

We report on the first successful growth of the quaternary alloy Cd_1−yZn_ySe_xTe_1−x(211) on 3-in. Si(211) substrates using molecular beam epitaxy (MBE). The growth of CdZnSeTe was performed using a compound CdTe effusion source, a compound ZnTe source, and an elemental Se effusion source. The alloy compositions (x and y) of the Cd_1−yZn_ySe_xTe_1−x quaternary compound were controlled through the Se/CdTe and ZnTe/CdTe flux ratios, respectively. Our results indicated that the surface morphology of CdZnSeTe improves as the Zn concentration decreases, which fits well with our previous observation that the surface morphology of CdZnTe/Si is poorer than that of CdSeTe/Si. Although the x-ray full-width at half-maximums (FWHMs) of CdZnSeTe/Si with 4% of Zn + Se remain relatively constant regardless of the individual Zn and Se concentrations, etched-pit density (EPD) measurements exhibit a higher dislocation count on CdZnSeTe/Si layers with about 2% Zn and Se incorporated. The enhancement of threading dislocations in these alloys might be due to an alloy disorder effect between ZnSe and CdTe phases. Our results indicate that the CdZnSeTe/Si quaternary material with low Zn or low Se concentration (less than 1.5%) while maintaining 4% total Zn + Se concentration can be used as lattice-matching composite substrates for long-wavelength infrared (LWIR) HgCdTe as an alternative for CdZnTe/Si or CdSeTe/Si.     

Metalorganic Vapor-Phase Epitaxial Growth of (211)B CdTe on (211) Si Using Ge Interfacial Layer

We have achieved metalorganic vapor-phase epitaxial growth of (211)B CdTe on Si without the requirement of a pregrowth high-temperature oxide desorption step. This was achieved by growing a thin Ge film on the starting (211) Si substrates. To get (211)B CdTe orientation, the Ge surface was exposed to As prior to the start of CdTe growth. A thin ZnTe interlayer between Ge and CdTe has been shown to improve the CdTe surface morphology.     

Recent Results on Growth of (211)B CdTe on (211)Si with Intermediate Ge and ZnTe Buffer Layers by Metalorganic Vapor-Phase Epitaxy

We report on the investigation of epitaxial cadmium telluride grown by metalorganic vapor-phase epitaxy (MOVPE) on (211)Si, with particular emphasis on studying the effect of changing the reactor parameters and thermal annealing conditions on the epilayer quality. The CdTe films were characterized by scanning electron microscopy (SEM), atomic force microscopy (AFM), and x-ray diffraction (XRD). The best CdTe films were observed when the Te/Cd precursor partial pressure ratio was close to 3.1. It was also observed that, though annealing improved the crystal quality, a slight increase in surface roughness was observed. Similar attempts were made to improve the growth conditions of ZnTe intermediate buffer layer, which showed similar trends with changes in precursor flows.     

The growth and characterization of (211) and (133) Oriented (Hg,Cd)Te epilayers (211)B GaAs by organometallic vapor phase epitaxy

The growth of CdTe buffer layers on (211)B GaAs substrates by organometallic vapor phase epitaxy (OMVPE) was studied, and it was found that, depending on the growth conditions, either the (211) or (133) epitaxial orientation could be formed. In some cases, an epilayer showing a mixed (211) and (133) orientation was also observed. The influence of several growth parameters on the orientation of the CdTe layer was investigated, and it was found that the Te/Cd ratio, together with the growth temperature, have the most significant effect in determining the epilayer orientation. From these results, it was then possible to select nominally optimized growth conditions for CdTe buffer layers of both orientations. (Hg,Cd)Te layers of the same orientations could then be grown and characterized. Although double crystal x-ray diffraction measurements indicated a somewhat better crystalline perfection in the (133) (Hg,Cd)Te layers, these layers showed a poor surface morphology compared to the (211) orientation. Measurement of etch pit densities also indicated defect densities to be typically half an order of magnitude higher in the (133) orientation. Diodes were formed by ion implantation in both orientations and significantly better results were obtained on the (211) (Hg,Cd)Te layers.     

Evaluation of Surface Cleaning of Si(211) for Molecular-Beam Epitaxy Deposition of Infrared Detectors

We report an assessment of the reproducibility of the HF cleaning process and As passivation prior to the nucleation of ZnTe on the Si(211) surface using temperature desorption spectroscopy, ion scattering spectroscopy, and electron spectroscopy. Observations suggest full H coverage of the Si(211) surface with mostly monohydride and small amounts of dihydride states, and that F is uniformly distributed across the top layer as a physisorbed species. Variations in major contaminants are observed across the Si surface and at the CdTe-ZnTe/Si interface. Defects act as getters for impurities present on the Si surface, and some are buried under the CdTe/ZnTe heterostructure. Overall, the data show evidence of localized concentration of major impurities around defects, supporting the hypothesis of a physical model explaining the electrical activation of defects in long-wave infrared (LWIR) HgCdTe/CdTe/Si devices.     

Lattice Relaxation and Dislocation Reduction in MBE CdTe(211)B/Ge(211)

We have used x-ray diffraction to assess the thickness dependence of strain in molecular-beam epitaxial (MBE) CdTe(211)/Ge(211). For 25-nm-thick layers, we find tensile stress of 100 MPa and in-plane strain of ~1.5 × 10⁻³. This stress relaxes during growth and becomes zero beyond 1 μm. We use the Dunn and Koch formula to estimate the threading dislocation density from the full-width at half-maximum of the (224) rocking curve. We then estimate the annihilation radius of MBE-grown CdTe(211)B/Ge(211) to be ~10 nm. Our layers have etch pit densities between 5 × 10⁷ cm⁻² and 5 × 10⁶ cm⁻² for a thickness of 10 μm. The lowest densities were obtained by periodic annealing epitaxy. We discuss mechanisms for the saturation of the dislocation density.     

Determination of Critical Thickness for Epitaxial ZnTe Layers Grown by Molecular Beam Epitaxy on (211)B and (100) GaSb Substrates

Cross-section electron micrographs, cathodoluminescence images, and confocal photoluminescence (cPL) images have been acquired for ZnTe layers deposited to various thicknesses on GaSb substrates with (211)B and (100) orientations. The critical thickness of ZnTe on GaSb is predicted to range between 115 nm and 329 nm, depending on the theoretical approach chosen. For ZnTe layers grown on (211)B GaSb with thickness exceeding 150 nm, dark spots and lines are present in all images. We associate these with dislocations generated at the ZnTe/GaSb interface. The discrepancy between this thickness value and a critical thickness value (350 nm to 375 nm) obtained for the (211)B orientation in a previous study is related to the distinction between the onset of misfit dislocations and the onset of significant plastic deformation. The former requires a direct imaging technique, as strain-related measurements such as x-ray diffraction do not have the resolution to detect the effects of small numbers of dislocations. For ZnTe layers on (100) GaSb, x-ray diffraction measurements indicate an abrupt change characteristic of dislocation multiplication at a thickness value in the range from 250 nm to 275 nm. High-resolution electron micrographs of the ZnTe/GaSb interface indicate that deoxidation using atomic hydrogen produces GaSb surfaces suitable for ZnTe epitaxy. cPL images of a 1.2-μm-thick lattice-matched ZnTe_0.99Se _0.01 layer grown on a 150-nm-thick ZnTe buffer layer on a (211)B GaSb substrate yield a threading dislocation density of ～7 × 10⁴ cm^?2.     

Selective-Area Epitaxy of CdTe on CdTe/ZnTe/Si(211) Through a Nanopatterned Silicon Nitride Mask

We report here the use of molecular beam epitaxy (MBE) to achieve selective-area epitaxy (SAE) and coalescence of CdTe on nanopatterned substrates with 0.5-μm-pitch arrays of CdTe/ZnTe/Si(211) seeding areas, exposed through a silicon nitride mask. The nanopatterned substrate surface morphology, crystallinity, and chemical composition were characterized by scanning electron microscopy (SEM), x-ray diffraction (XRD), and x-ray photoelectron spectroscopy (XPS) both before and after exposure to CdTe flux by MBE. We find a seven times wider (422) CdTe XRD rocking curve full-width at half-maximum (FWHM) for our patterned samples, when directly compared with unpatterned samples with identical growth and pregrowth conditions. We also observe that electron beam-induced carbon deposits can serve as a mask material for SAE of CdTe by MBE. Finally, we point to possible further improvements in patterned sample architectures of the future, for use in CdTe films on Si.     

Growth of high quality CdTe and ZnTe on Si substrates using organometallic vapor phase epitaxy

Epitaxial (100) CdTe and ZnTe layers with high crystalline quality have been grown on Si substrates by atmospheric pressure organometallic vapor phase epitaxy (OMVPE). A thin Ge interfacial layer grown at low temperature was used as a buffer layer prior to ZnTe and CdTe growth. The layers were characterized by Nomarski optical microscopy and double crystal x-ray diffraction. Double crystal rocking curves with full width at half maximum of about 110 and 250 arc-sec have been obtained for a 7 μm thick ZnTe layer and a 4 μm thick CdTe layer, respectively. The results presented demonstrate a novel method ofin-situ Si cleaning step without a high temperature deoxidation process to grow high quality CdTe and ZnTe on Si in a single OMVPE reactor.     

Direct growth of high-quality thick CdTe epilayers on Si (211) substrates by metalorganic vapor phase epitaxy for nuclear radiation detection and imaging

Direct growth of high-quality, thick CdTe (211) epilayers, with thickness up to 100 μm, on Si (211) substrates in a vertical metalorganic vapor phase epitaxy system is reported. In order to obtain homo-orientation growth on Si substrates, pretreatment of the substrates was carried out in a separate chamber by annealing them together with pieces of GaAs at 800–900°C in a hydrogen environment. Grown epilayers had very good substrate adhesion. The full-width at half-maximum (FWHM) value of the x-ray double-crystal rocking curve from the CdTe (422) reflection decreased rapidly with increasing layer thickness and remained between 140–200 arcsec for layers >18 μm. Photoluminescence measurement at 4.2 K showed high-intensity, bound excitonic emission and very small defect-related deep emissions, indicating the high crystalline quality of the grown layers. Furthermore, a CdTe/n⁺-Si heterojunction diode was fabricated that exhibited clear rectifying behavior.     

偏转角(211)Si基CdTe复合衬底研究

晶面偏角是提高(211) Si基CdTe复合衬底质量的方法之一。通过对偏转角Si基CdTe复合衬底分子束外延工艺的研究,发现2°和3°偏转角(211)Si基CdTe复合衬底在晶体质量方面优于标准(211)Si基CdTe复合衬底,是未来提高Si基CdTe复合衬底质量的新方向。     

Characterization of PbSnSe/CdTe/Si (211) Epilayers Grown by Molecular Beam Epitaxy

Narrow-bandgap PbSnSe has received much attention as a promising alternative material for mid- and long-wavelength high performance of infrared detection at relatively high operating temperatures owing to the weak composition dependence of its bandgap, which can intrinsically result in better uniformity. Additionally, it possesses a high dielectric constant that is anticipated to be much more tolerant to defects. In addition, its growth by molecular beam epitaxy (MBE) can be easily accomplished in comparison with HgCdTe and many III–V quantum well and superlattice materials. However, overcoming the high lattice and thermal mismatches between PbSnSe and CdTe/Si substrates and improving the crystalline quality of PbSnSe grown on CdTe/Si substrates are challenges that require further study. Additionally, interdiffusion between CdTe and PbSnSe can take place and lead to nonuniform distributions of elements in PbSnSe. Epitaxial crystal PbSnSe alloy films were grown by MBE and were investigated by scanning and high-resolution transmission electron microscopy (STEM/HRTEM). Etch pit density (EPD) measurements were done to determine the density of threading defects in the films. EPD measurements on PbSnSe surfaces gave values in the mid-10⁶ cm⁻² range. The dislocations exposed as etch pits were found to accumulate and form small-angle grain boundaries lined up along the () direction, which is the intersection line between (100) and (211) growth planes.     

Selective Growth of CdTe on Si(211): First-Principle Calculations

The adsorption of CdTe layers on clean and As-passivated Si(211) substrates has been simulated by first-principle calculations in this study. Based on the simulation results, we theoretically show the important roles of the As₄ passivation during the epitaxial growth. Arsenic can saturate part of the dangling bonds and weaken the surface states. The partial passivation finally induces the B-face polarity selection automatically. This conclusion can provide further explanations for the successful growth of large area high-quality CdTe(211)B layers on the Si(211) substrates.     

Impurity Gettering in (112)B HgCdTe/CdTe/Alternate Substrates

The crystalline structure and impurity profiles of HgCdTe/CdTe/alternate substrate (AS; Si and GaAs are possibilities) and CdTe/AS were analyzed by secondary-ion mass spectrometry, atomic force microscopy, etch pit density analysis, and scanning transmission electron microscopy. Impurities (Li, Na, and K) were shown to getter in as-grown CdTe/Si epilayers at in situ Te-stabilized thermal anneal (~500°C) interfaces. In HgCdTe/CdTe/Si epilayers, indium accumulation was observed at Te-stabilized thermal anneal interfaces. Impurity accumulation was measured at HgCdTe/CdTe and CdTe/ZnTe interfaces. Processing anneals were found to nearly eliminate the gettering effect at the in situ Te-stabilized thermal anneal interfaces. Impurities were found to redistribute to the front HgCdTe/CdTe/Si surface and p–n junction interfaces during annealing steps. We also investigated altering the in situ Te-stabilized thermal anneal process to enhance the gettering effect.