Al—Li合金中缺陷和电子密度的正电子寿命谱

在深低温到室温不同温度下，测量了不同时效状态的Ａｌ-Ｌｉ-Ｃｕ-Ｍｇ-Ｚｒ合金和含Ｚｎ、Ａｇ或Ｓｃ的合金的正电子寿命谱。分析表明：峰值时效使热空位大量回复并使基体电子密度提高。在深低温下，空位主要以单空位形式存在且随温度升高而激活并运动复合成多空位。Ｚｎ和Ａｇ对空位的运动有束缚作用，Ｓｃ有助于空位的运动。样品在低温下基体电子密度升高，对合金低温强度产生重要影响。     

Corrosion of aluminum alloys containing lithium

Aluminum alloys containing lithium exhibit high strength, high elastic modulus, and low density. These alloys contain a metastable, coherent δ′ (Al₃Li) phase which forms by homogeneous decomposition of the solid solution. Efforts are made to improve the ductility by alloying and heat treatment. In this work the corrosion behavior of AlLi, AlLiMn, AlLiZr, AlLiMg, and AlLiCu alloys was investigated as a function of composition and aging and correlated with the microstructure. The tests were made in a 3.5% NaCl solution, and included potential, potentiodynamic and potentiostatic measurements, and weight loss determinations. The results show that aging to peak hardness had little effect on the corrosion resistance. Overaging of the AlLi, AlLiMn, and AlLiZr alloys generally increased the susceptibility to corrosion, which has been attributed to the formation of the stable (AlLi) phase. Mg-containing alloys showed less severe effect of overaging because of the formation of the Al₃MgLi phase which tied up some of the lithium. In the Cu-containing alloy the supersaturation with lithium was low and overaging did not affect the corrosion resistance.     

Al-Cu-Li-xMg合金时效初期微结构演变的Monte Carlo模拟

采用基于Multi-States Ising Model的Monte Carlo算法,模拟研究了Al-Cu-Li-xMg合金时效初期微观结构的演变过程,结果表明:时效早期,在Al-1.2Cu-5.7Li合金中微结构的主要形态是Li原子团簇、Li-Cu原子对和空位团簇,且空位团簇的出现多出现在Li原子团簇附近,形成共生形态;而Al-1.2Cu-5.7Li-xMg合金中,出现明显的Cu-Clusters,而Li原子的偏聚过程则受到抑制,且空位团簇的形态也发生了变化,多与Cu-Mg原子团簇形成共生形态;微量Mg的作用是通过Mg/Li原子间存在强烈的相互作用调整Li原子团簇的偏聚形态,导致大量被Li原子Clustering过程锁定的Cu原子和空位被置换出来,进而影响Li、Cu原子团簇的形态和空位的分布形态,并影响随后的析出相分布形态.     

Effects of Cd and Sn on double-peak age-hardening behaviors of Al-Si-Cu-Mg cast alloys

The effects of trace elements Cd and Sn on precipitation process of Al-Si-Cu-Mg cast alloys were investigated in the present research.It is shown that the addition of Cd and Sn not only increases remarkably the aging peak hardness and reduces the time to reach aging peak,but also eliminates the double-aging-peak phenomenon which appears in Al-Si-Cu-Mg alloys.In Al-Si-Cu-Mg alloys the first aging peak corresponds to GP zones(especially GPⅡ) ,and the second one is caused by metastable phases.The obvious time interval of transition from GPⅡ to metastable phases associates with the double-aging-peak phenomenon.The results of DSC and TEM show that Cd/Sn elements suppress the formation of GPⅠzone,stimulate the formation of θ",θ' and θ phases,and then shorten remarkably the temperature intervals of each exothermic peak.Because the transition interval between GPⅡzone and metastable phases is shortened by Cd/Sn in Al-Si-Cu-Mg cast alloys,θ' phase coexists with θ" phase in matrix of ageing peak condition,which causes effective hardening on the alloys,and at the same time,eliminates the double-aging-peak phenomenon.     

925Ag75Cu和925Ag40Cu35Zn合金在人造汗液和H2S气氛中的腐蚀与变色行为

采用静态腐蚀、XRD、SEM、EDS和XPS,研究了250℃时效4h和70%冷变形+200℃时效4h两种硬化状态下的925Ag75Cu与925Ag40Cu35Zn合金在37℃人造汗液和室温H2S气氛中的腐蚀与变色行为。结果表明,这两种925银合金在37℃人造汗液中的腐蚀变色是由Cl-和OH-离子引起的,但925Ag40Cu35Zn合金的变色过程明显比925Ag75Cu合金缓慢,腐蚀过程中产生的白色AgCl和灰黑色Ag2O难以在其表面沉积而形成灰黑色腐蚀膜。这两种925银合金在室温H2S气氛中的腐蚀变色是由S2-引起的,但925Ag40Cu35Zn合金的腐蚀变色过程明显比925Ag75Cu合金缓慢,这是由于腐蚀过程中白色ZnS最先形成,从而延缓了灰黑色Ag2S和黑色Cu2S的形成。     

Interfacial reactions of Sn–Zn–Ag–Cu alloy on soldered Al/Cu and Al/Al joints

This work shows the effect on the soldering process of the addition of Ag and Cu to Sn–Zn alloys. Soldering of Al/Cu and Al/Al joints was performed for a time of 3?min, at a temperature of 250°C, with the use of flux. Aging was carried out at 170°C for Al/Cu and Al/Al joints for 1 and 10 days. During the aging process, intermetallic layers grew at the interface of the Al/Cu joint at the Cu substrate. Intermetallic layers were not observed during wetting of Al/Al joints. On the contrary, dissolution of the Al substrate and migration of Al-rich particles into the bulk of the solder were observed. The experiment was designed to demonstrate the effect of Ag and Cu addition on the dissolution of Al substrate during the soldering and aging processes. In the solder alloys, small precipitates of AgZn₃ and Cu₅Zn₈ were observed.     

Zn含量对Ag925CuZn合金显微组织和硬度的影响

研究了Zn含量对Ag925CuZn合金显微组织和硬度的影响.结果表明:Zn显著抑制Ag925CuZn合金铸态组织中孔洞的形成,且在中间退火过程中使其晶粒粗化,在时效过程中形成具有与基体α-Ag成分、结构相同的浮凸状组织.同时,高Zn含量降低Ag925CuZn合金的固溶态硬度和时效态硬度;对于低Zn含量Ag925CuZn合金,固溶退火后合理的时效温度为200～250℃,冷变形后合理的时效温度为150～200℃.     

引线框架材料Cu-Ni-Si系合金的发展

概述了引线框架用Cu-Ni-Si合金的研究现状。介绍了Cu-Ni-Si合金中Ni、Si元素的含量及其质量比对Cu-Ni-Si合金性能的影响,合金化特点,时效过程中的组织转变及热处理工艺和Zn、P、Ag、Cr、Al、稀土等微量元素对Cu-Ni-Si合金硬度、电导率等性能的影响。     

Au-Ti足金的强化机理研究

采用拉伸试验、硬度测试和光学显微分析等手段研究了Au-Ti足金的强化机理。结果表明，Au-Ti足金的强化方式主要是细晶强化、加工硬化和时效强化，且其力学性能优于标准的Au917饰品用金合金Au917Ag55Cu28，Au917Ag32Cu51。并且，Au-Ti足金的冷加工性能优于千足金，这是由于其固溶态硬度、强度高，延性好。     

Cd对铸造Al-Si-Cu-Mg合金时效过程的影响

合金元素Cd的添加促进了铸造Al-Si-Cu-Mg合金的时效过程，提高了合金的峰时效硬度，加快了合金的硬化速度．当加入0．27％Cd时，合金的强度提高了20％；但加入量继续增大，强度反而降低．SEM，DSC和TEM分析显示，Cd加快了亚稳相的析出，较早地形成了细小而密集的亚稳相；同时，较大的富Cd相、少量稳定相和过剩硅相质点的均匀析出，对合金起到了第二相强化的作用．在这两类析出相的共同作用下，合金获得了高的峰时效强度．但当合金中Cd的含量超过0．27％时，会形成一些富Cd的多元相和纯Cd质点，这些相的出现导致了合金机械性能的下降．     

Room temperature aging behavior of Ti-Nb-Mo-based superelastic alloys

The effect of room temperature (RT) aging on the superelasticity of Ti-Nb-Mo-based superelastic alloys is investigated. The results show that annealing at relatively low temperatures such as 973 K after severe cold rolling results in poor resistance to the effect of RT aging. The transformation stress increases considerably due to the formation of an isothermal ω phase at RT. Addition of Sn is partially effective in suppressing the RT aging effect in the specimens annealed at 973 K. The RT aging effect is suppressed by increasing the annealing temperature, due to the annihilation of lattice defects or non-equilibrium vacancies introduced during cold rolling, which are responsible for accelerating the diffusion process, however, superelasticity is reduced by annealing at higher temperatures, due to a decrease in the critical stress for slip deformation (σ_CSS). The specimen annealed at 1173 K followed by aging at 773 K exhibits stable superelasticity with a high resistance to the effect of RT aging. Annealing at 1173 K causes the annihilation of lattice defects or non-equilibrium vacancies, while aging at 773 K induces precipitation of the α phase, which in turn causes an increase in σ_CSS, and further enhances the resistance to the RT aging effect by enriching the matrix with β-stabilizing elements.     

微合金化Al-4.0Cu-0.3Mg合金时效初期微结构演变的计算机模拟

采用Monte-Carlo方法模拟了时效初期Al-4.0Cu-0.3Mg-(0.4Ag)-(0.2Sc)合金的原子分布.研究结果表明:在时效过程中含微量钪的Al-Cu-Mg合金中镁原子逐步向钪原子周围偏聚,而铜原子并没有向钪原子周围聚集的倾向,时效初期出现了大量的Mg/Sc原子团簇及Mg/Sc/空位复合体;微量钪的存在促进了镁原子团簇化,但抑制了铜原子的团簇化;而含微量银的合金中镁原子向银原子周围偏聚的倾向比铜原子大得多,时效初期出现了大量的Ag/Mg原子团;"Sc/空位"机制是微量钪影响Al-Cu-Mg合金时效初期原子分布与形态的关键所在.     

非等温时效对一种铝锂合金力学性能与微观组织的影响

比较研究了一种Mg、Ag、Zn多元复合微合金化铝锂合金等温T8时效及非等温(降温)T8时效时的微观组织与力学性能。结果表明,该铝锂合金主要时效强化相为T1相(Al_2Cu Li),同时还存在θ相(Al_2Cu)及δ相(Al_3Li)的补充强化作用。相比于等温T8时效而言,降温T8时效可在不降低延伸率的同时,提高铝锂合金的强度。另外,降温T8时效时T1相析出及生长速度较慢,而且峰时效时θ相及δ相含量较高,补充强化作用更大。     

相场法模拟Cu-Ag合金时效过程中组织演变

基于相场方法,模拟研究了Cu-20和40 at%Ag合金在等温时效过程中相分解与微观组织的演变.系统自由能中耦合了体化学能、浓度梯度能和共格错配应变能,化学自由能是直接利用相图热力学数据计算得到的,因此,计算的微结构变化与真实合金系统是相对应的.通过模拟,获得了合金的形态和浓度分布随时间、温度和组分的变化规律.模拟结果表明,对称合金(Cu-40at%Ag)分解和粗化的速度均高于相应的非对称合金,其相分离的早期阶段形成规则的、相互连接的微观形态.在Cu-20at% Ag合金中,沉淀相Ag经历了调幅分解和粗化过程,其形态呈立方状,沿[110]方向排列.     

Influence of Cryorolling on the Precipitation of Cu–Ni–Si Alloys: An In Situ X-ray Diffraction Study

The effect of cryorolling on the precipitation process of deformed Cu–Ni–Si alloys was investigated through in situ synchrotron X-ray diffraction technique. The results demonstrate that the precipitation process is significantly accelerated by cryorolling. Cryorolling produces higher dislocation density, which provides more heterogeneous nucleation sites for Ni2 Si precipitates, hence promotes precipitation. In the early stage of aging, the enhanced nucleation of precipitates accelerates the depletion of supersaturation, and finer precipitates are obtained. In addition, recrystallization is promoted as a result of high stored energy in the cryorolled Cu–Ni–Si alloys, which facilitates the formation of discontinuous precipitation in the late stage of aging.     

Cu/Li Ratio on the Microstructure Evolution and Corrosion Behaviors of Al–xCu–yLi–Mg Alloys

The microstructure evolution and the corrosion feature of Al–x Cu– y Li–Mg alloys( x : y = 0.44, 1.65 and 4.2) were systematically investigated under the same artificial aging conditions. The relationships between types of precipitates and mechanical performance, as well as electrochemical behaviors, were discussed. Our results show that different types of precipitates can be obtained in alloys with different Cu/Li mass ratios, which significantly influences the mechanical performance of the alloys and substantial corrosion behaviors. Specifically, the analogous corrosion evolution in the aging Al– x Cu– y Li–Mg alloys was first ascertained to be derived from the growth mechanism of the precipitates at the grain boundary(GB). Moreover, a small number of GB precipitates can be obtained in the aged alloy with the lowest Cu/Li mass ratio, thereby resulting in the largest intergranular corrosion resistance. A higher proportion of the GB T_1 phase in the continuous precipitates induces higher corrosion sensitivity in alloy with a high Cu/Li mass ratio.     

Al和Li含量不同的时效态Mg-Gd-Zn-Zr-Ag合金的组织和力学性能

研究了铝和锂元素含量不同的Mg-12Gd-1Zn-0.5Zr-0.5Ag(质量分数,%)合金经T6热处理后的组织演变和力学性能。结果表明,T6热处理后,有新的Mg3Gd颗粒从Mg-12Gd-1Zn-0.5Zr-0.5Ag合金中析出,且Mg-12Gd-4Al-3Li-1Zn-0.5Zr-0.5Ag和Mg-12Gd-6Al-5Li-1Zn-0.5Zr-0.5Ag合金中的大多数Al2Li3相变得更细小,分布更均匀。时效态Mg-12Gd-4Al-3Li-1Zn-0.5Zr-0.5Ag和Mg-12Gd-6Al-5Li-1Zn-0.5Zr-0.5Ag合金中的晶粒尺寸和c/a比值相比时效态Mg-12Gd-1Zn-0.5Zr-0.5Ag合金有显著的减小,这有利于提高抗拉强度和塑性。时效态Mg-12Gd-6Al-5Li-1Zn-0.5Zr-0.5Ag合金具有最佳的抗拉强度、弹性模量和塑性匹配,其抗拉强度为210 MPa,弹性模量为50.7 GPa,延性率为24.8%。     

Ti-xCr-yCu钛基材料的制备及组织性能研究

研究了Al-Cu-Li-(0.35Mg)-(0.2In)合金的拉伸性能、时效析出相类型及其分布。T6峰时效时,Al-Cu-Li合金的时效析出相为T1(Al2CuLi)和?? (Al2Cu)相。添加0.2%In时,T6态时效早期形成许多方块状的立方相Al5Cu6Li2,且随时间延长其尺寸保持稳定;同时,可促进? ?相析出;相应合金的时效响应加速,强度提高。同时添加In和Mg可抑制Al5Cu6Li2相析出,但促进T1相析出。In和Mg的复合微合金化效果小于2050铝锂合金中Ag和Mg的复合微合金化效果,因而In+Mg复合微合金化铝锂合金T6态强度低于Ag+Mg复合微合金化的2050铝锂合金。T8态时效时,时效前预变形产生的位错抑制了In元素单独添加和In+Mg复合添加的微合金化效果。     

Solute–vacancy binding in aluminum

Previous efforts to understand solute–vacancy binding in aluminum alloys have been hampered by a scarcity of reliable, quantitative experimental measurements. Here, we report a large database of solute–vacancy binding energies determined from first-principles density functional calculations. The calculated binding energies agree well with accurate measurements where available, and provide an accurate predictor of solute–vacancy binding in other systems. We find: (i) some common solutes in commercial Al alloys (e.g., Cu and Mg) possess either very weak (Cu), or even repulsive (Mg), binding energies. Hence, we assert that some previously reported large binding energies for these solutes are erroneous. (ii) Large binding energies are found for Sn, Cd and In, confirming the proposed mechanism for the reduced natural aging in Al–Cu alloys containing microalloying additions of these solutes. (iii) In addition, we predict that similar reduction in natural aging should occur with additions of Si, Ge and Au. (iv) Even larger binding energies are found for other solutes (e.g., Pb, Bi, Sr, Ba), but these solutes possess essentially no solubility in Al. (v) We have explored the physical effects controlling solute–vacancy binding in Al. We find that there is a strong correlation between binding energy and solute size, with larger solute atoms possessing a stronger binding with vacancies. (vi) Most transition-metal 3d solutes do not bind strongly with vacancies, and some are even energetically strongly repelled from vacancies, particularly for the early 3d solutes, Ti and V.     

The effect of creep aging on localized corrosion resistance of AA2060 alloy

The influence of creep aging at varied stresses on the localized corrosion behavior of AA2060 has been studied in this paper. Samples were subjected to stress free aging (SFA) and creep aging (CA) under two stress levels, after which tensile tests and intergranular corrosion (IGC) tests were carried out. The corrosion morphology and depth were examined using optical microscope. Compared with SFA, CA can enhance the mechanical properties and increase the IGC resistance of Al–Cu–Li alloy but high-stress CA would intensify the intragranular corrosion penetration in the first 25 hr of aging time. The microstructure observation results show that dislocations introduced by CA provide favorable nucleation sites for T1 precipitates in the grain and impede the growth of T1 precipitates at grain boundary. Therefore, the potential difference between the grain interior and grain boundary can be reduced compared to that for the SFA. The mechanism by which CA affects the corrosion resistance of Al–Cu–Li alloys, as is essential to understand and optimize the creep aging process, has been proposed by considering the effect of creep-deformation-induced dislocations.