Preparation of poly(1,4‐cyclohexylenedimethylene phthalate)s and their use as modifiers for aromatic diamine‐cured epoxy resin

Poly(1,4‐cyclohexylenedimethylene phthalate) s, prepared by the reaction of phthalic anhydride and 1,4‐cyclohexane dimethanol (35/65 or 73/27 mol % cis/trans or trans alone), have been used to improve the toughness of bisphenol‐A diglycidyl ether epoxy resin cured with 4,4′‐diaminodiphenyl sulfone. The aromatic polyesters include poly(cis/trans‐1,4‐cyclohexylenedimethylene phthalate) (PCP) based on a commercial cyclohexanedimethanol, poly(trans‐1,4‐cyclohexylenedimethylene phthalate) (trans‐PCP) and poly(cis/trans‐1,4‐cyclohexylenedimethylene phthalate) (cis‐rich PCP) prepared from a cis‐rich diol. The polyesters used were soluble in the epoxy resin without solvents and were effective as modifiers for toughening the cured epoxy resin. For example, the inclusion of 20 wt% of PCP (MW 6400 g mol⁻¹) led to an 80% increase in the fracture toughness (K_IC) of the cured resin with no loss of mechanical and thermal properties. The toughening mechanism is discussed in terms of morphological and dynamic viscoelastic behaviours of the modified epoxy resin system. © 2000 Society of Chemical Industry     

Thermal and mechanical properties of poly(urethane‐imide)/epoxy/silica hybrids

Improving properties of polyurethane (PU) elastomers have drawn much attention. To extend the properties of the modified PU composite, here a new method via the reaction of poly(urethane‐imide) diacid (PUI) and silane‐modified epoxy resin (diglycidyl ether of bisphenol A) was developed to prepare crosslinked poly (urethane‐ imide)/epoxy/silica (PUI/epoxy/SiO₂) hybrids with enhanced thermal stability. PUI was synthesized from the reaction of trimellitic anhydride with isocyanate‐terminated PU prepolymer, which was prepared from reaction of polytetramethylene ether glycol and 4,4′‐diphenylmethane diisocyanate. Thermal and mechanical properties of the PUI/epoxy/SiO₂ hybrids were investigated to study the effect of incorporating in situ SiO₂ from silane‐modified epoxy resin. All experimental data indicated that the properties of PUI/epoxy/SiO₂ hybrids, such as thermal stability, mechanical properties, were improved due to the existence of epoxy resin and SiO₂. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Biodegradable blends of high molecular weight poly(ethylene oxide) with poly(3‐hydroxypropionic acid) and poly(3‐hydroxybutyric acid): a miscibility study by DSC,DMTA and NMR spectroscopy

The miscibility of high molecular weight poly(ethylene oxide) blends with poly(3‐hydroxypropionic acid) and poly(3‐hydroxybutyric acid) (P(3HB)) has been investigated by differential scanning calorimetry (DSC), dynamic mechanical thermal analysis (DMTA) and high‐resolution solid state ¹³C nuclear magnetic resonance (NMR). The DSC thermal behaviour of the blends revealed that the binary blends of poly(ethylene oxide)/poly(3‐hydroxypropionic acid) (OP blends) were miscible over the whole composition range while the miscibility of poly(ethylene oxide)/poly(3‐hydroxybutyric acid) blends (OB blends) was dependent on the blend composition. OB blends were found to be partly miscible at the middle P(3HB) contents (25 %, 50 %) and miscible at other P(3HB) contents (10 %, 75 % and 90 %). Single‐phase behaviour for OP blends and phase separation behaviour for OB blends were observed from DMTA. The results from NMR spectroscopy revealed that the two components in the OP50 blend were intimately mixed on a scale of about 35 nm, while the domain sizes in the OB blend with a P(3HB) content of 50 % were larger than about 32 nm. © 2000 Society of Chemical Industry     

Modification of cyanate ester resin by poly(ethylene phthalate) and related copolyesters

Aromatic polyesters were prepared and used to improve the brittleness of the cyanate ester resin. The aromatic polyesters include poly(ethylene phthalate) (PEP) and poly(ethylene phthalate‐co‐1,4‐phenylene phthalate). The polyesters were effective modifiers for improving the brittleness of the cyanate ester resin. For example, inclusion of 20 wt % PEP (MW 19,800) led to a 120% increase in the fracture toughness (K_IC) with retention in flexural properties and a slight loss of the glass transition temperature compared to the mechanical and thermal properties of the unmodified cured cyanate ester resin. The microstructures of the modified resins were examined by scanning electron microscopy and dynamic viscoelastic analysis. The thermal stability of the modified resins was lower than that of the unmodified resin as determined by thermogravimetric analysis. The water absorptivity of the modified resin increased significantly, compared to that of the unmodified cured cyanate ester resin. The toughening mechanism was discussed in terms of the morphological and dynamic viscoelastic behaviors of the modified cyanate ester resin system. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 76: 208–219, 2000     

Toughening of cycloaliphatic epoxy resins by poly(ethylene phthalate) and related copolyesters

Poly(ethylene phthalate) (PEP) and poly(ethylene phthalate–co‐ethylene terephthalate) were used to improve the brittleness of the cycloaliphatic epoxy resin 3,4‐epoxycyclohexylmethyl 3,4‐epoxycyclohexane carboxylate (Celoxide 2021?), cured with methyl hexahydrophthalic anhydride. The aromatic polyesters used were soluble in the epoxy resin without solvents and effective as modifiers for toughening the cured epoxy resin. For example, the inclusion of 20 wt % PEP (MW, 7400) led to a 130% increase in the fracture toughness (K_IC) of the cured resin with no loss of mechanical and thermal properties. The toughening mechanism is discussed in terms of the morphological and dynamic viscoelastic behaviors of the modified epoxy resin system. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 388–399, 2002; DOI 10.1002/app.10363     

Miscibility and mechanical properties of tetrafunctional epoxy resin/phenolphthalein poly(ether ether ketone) blends

Phenolphthalein poly(ether ether ketone) (PEK‐C) was found to be miscible with uncured tetraglycidyl 4,4′‐diaminodiphenylmethane (TGDDM), which is a type of tetrafunctional epoxy resin (ER), as shown by the existence of a single glass transition temperature (T_g) within the whole composition range. The miscibility between PEK‐C and TGDDM is considered to be due mainly to entropy contribution. Furthermore, blends of PEK‐C and TGDDM cured with 4,4′‐diaminodiphenylmethane (DDM) were studied using dynamic mechanical analysis (DMA), Fourier‐transform infrared (FTIR) spectroscopy, and scanning electron microscopy (SEM). DMA studies show that the DDM‐cured TGDDM/PEK‐C blends have only one T_g. SEM observation also confirmed that the blends were homogeneous. FTIR studies showed that the curing reaction is incomplete due to the high viscosity of PEK‐C. As the PEK‐C content increased, the tensile properties of the blends decreased slightly and the fracture toughness factor also showed a slight decreasing tendency, presumably due to the reduced crosslink density of the epoxy network. SEM observation of the fracture surfaces of fracture toughness test specimens showed the brittle nature of the fracture for the pure ER and its blends with PEK‐C. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 79: 598–607, 2001     

Synthesis,characterization, and evaluation of carboxyl‐terminated poly(ethylene glycol) adipate‐modified epoxy networks: Effect of molecular weight

A series of carboxyl‐terminated poly(ethylene glycol) adipate (CTPEGA) was synthesized by polycondensation of poly(ethylene glycol) (PEG) of various molecular weights (“2000,” “4000,” “6000,” “8000,” “10,000” g/mol) and adipic acid. CTPEGA was incorporated into the epoxy by a prereaction method. The CTPEGA and modified epoxy samples were thoroughly characterized by Fourier transform infrared spectroscopy, ¹H NMR spectroscopy, differential scanning calorimetry, and gel permeation chromatography. The effects of molecular weight of CTPEGA on thermomechanical and viscoelastic properties of the modified epoxy networks were investigated. Maximum improvement in impact strength was found for the epoxy network modified with CTPEGA containing PEG of molecular weight 2000 g/mol. With further increase in molecular weight of CTPEGA, the impact strength of the modified network decreases. However, in case of higher molecular weight CTPEGA, the improvement in toughness was achieved without any reduction in T_g due to the complete phase separation. The results were explained in terms of morphology studied by scanning electron microscopy. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 1723–1730, 2007     

Curing of diglycidyl ether of bisphenol‐A epoxy resin using a poly(aryl ether ketone) bearing pendant carboxyl groups as macromolecular curing agent

BACKGROUND: Reactive thermoplastics have received increasing attention in the field of epoxy resin toughening. This paper presents the first report of using a novel polyaryletherketone bearing one pendant carboxyl group per repeat unit to cure the diglycidyl ether of bisphenol‐A epoxy resin (DGEBA). The curing reactions of DGEBA/PEK‐L mixtures of various molar ratios and with different catalysts were investigated by means of dynamic differential scanning calorimetry and Fourier transform infrared (FTIR) spectroscopy methods. RESULTS: FTIR results for the DGEBA/PEK‐L system before curing and after curing at 135 °C for different times demonstrated that the carboxyl groups of PEK‐L were indeed involved in the curing reaction to form a crosslinked network, as evidenced by the marked decreased peak intensities of the carboxyl group at 1705 cm^?1 and the epoxy group at 915 cm^?1 as well as the newly emerged strong absorptions of ester bonds at 1721 cm^?1 and hydroxyl groups at 3447 cm^?1. Curing kinetic analysis showed that the value of the activation energy (E_a) was the highest at the beginning of curing, followed by a decrease with increasing conversion (α), which was attributed to the autocatalytic effect of hydroxyls generated in the curing reaction. CONCLUSION: The pendant carboxyl groups in PEK‐L can react with epoxy groups of DGEBA during thermal curing, and covalently participate in the crosslinking network. PEK‐L is thus expected to significantly improve the fracture toughness of DGEBA epoxy resin. Copyright © 2009 Society of Chemical Industry     

Synthesis of bismaleimide resin containing the poly(ethylene glycol) side chain: Curing behavior and thermal properties

Two maleimido end‐capped poly(ethylene glycol) (m‐PEG) of different molecular weights were synthesized and blended at various proportions with bismaleimide resin (4,4′‐bismaleimido diphenylmethane) (BDM). The curing behavior and the thermal properties of the m‐PEG/BDM blends were studied and presented here. It was found that the addition of m‐PEG enhanced the processability of the BDM resin significantly. The processing window of the BDM resin was increased from approximately 20 to 80°C. The addition of m‐PEG modified resins, however, resulted not only in the reduction in the thermal stability of the blended BDM resin but also elevation of the coefficients of thermal expansion. The changes in thermal/mechanical properties of the blends were found to be proportional to the amounts of m‐PEG incorporated. It was observed that the curing behavior, and thermal and mechanical properties, of the blends were independent of the molecular weight of the PEG segment. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 85: 2935–2945, 2002     

New thermosetting resin from poly(p‐vinylphenol) based benzoxazine and epoxy resin

Poly(p‐vinylphenol) (VP) based benzoxazine was prepared from VP, formaline, and aniline. The curing behavior of the benzoxazine with the epoxy resin and the properties of the cured resin were investigated. Consequently, the curing reaction did not proceed at low temperatures, but it proceeded rapidly at higher temperatures without a curing accelerator. The reaction induction time or cure time of the molten mixture from VP based benzoxazine and epoxy resin was found to decrease, compared with those from conventional bisphenol A based benzoxazine and epoxy resin. The curing reaction rate of VP based benzoxazine and epoxy resin increased more than that of conventional bisphenol A based benzoxazine and epoxy resin. The properties of the cured resin from neat resins and from reinforced resins with fused silica were evaluated. The cured resins from VP based benzoxazine and epoxy resin showed good heat resistance, mechanical properties, electrical insulation, and water resistance compared to the cured resin from VP and epoxy resin using imidazole as the catalyst. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 79: 555–565, 2001     

Synthesis and characterization of poly(pyridylurea) and poly(pyridylthiourea), potentially semiconducting polymers

Poly(pyridylureas) and poly(pyridylthioureas) were synthesized by reacting 2,6‐diaminopyridine with phosgene and thiophosgene, respectively, using THF and pyridine as solvent. The synthesized polymers were characterized by IR‐spectroscopy, elemental analysis, and X‐ray photoelectron spectroscopy. Thermal stability of the polymers was determined by thermal degradation between 35°C and 700°C. The 50% weight loss of polypyridylureas was above 400°C while for the polypyridylthioureas it was above 450°C. Undoped poly(pyridylureas) and poly(pyridylthioureas) behave as semiconductors, σ = 10^?9 (Ω cm)^?1. After doping with I₂ and SbF₅, the electrical conductivity increases several orders of magnitude, σ = 10^?7(Ω cm)^?1. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007     

Modification of bismaleimide resin by poly(propylene phthalate), poly(butylene phthalate) and related (co)polyesters

Aromatic polyesters were prepared and used to decrease the brittleness of the bismaleimide resin composed of 4,4′-bismaleimidediphenyl methane (BMI) and o,o′-diallyl bisphenol A (DBA) (Matrimid 5292 resin). The aromatic polyesters included poly(propylene phthalate) (PPP), poly(2,2-dimethylpropylene phthalate) (PDPP), poly(butylene phthalate) (PBP) and poly(butylene phthalate-co-butylene terephthalate) (50mol% terephthalate unit) (PBPT). The polyesters were effective modifiers for decreasing the brittleness of the bismaleimide resin. For example, inclusion of 20wt% PPP (MW 18700) led to 50% increase in the fracture toughness (K_IC) with retention of flexural properties and a slight loss of the glass transition temperature, compared with the mechanical and thermal properties of the unmodified cured bismaleimide resin. Micro-structures of the modified resins were examined by scanning electron microscopy and dynamic viscoelastic analysis. The thermal stability of the modified resins was slightly lower than that of the unmodified resin as determined by thermogravimetric analysis. The toughening mechanism is discussed in terms of the morphological and dynamic viscoelastic behaviour of the modified bismaleimide resin system. © 1998 SCI.     

Improved processability and performance of biomedical devices with poly(lactic acid)/poly(ethylene glycol) blends

To improve the processability of micropolymer‐based devices used for biomedical applications, poly(lactic acid) (PLA) was melt‐blended with poly(ethylene glycol)s (PEGs) of different molecular weights (MWs; weight‐average MWs = 200, 800, 2000, and 4000; these PEGS are referred to as PEG200, PEG800, PEG2000, and PEG4000, respectively, in this article). The thermal properties, mechanical properties, and rheological properties of the PLA and the PLA–PEG blends were investigated. The tensile samples’ morphologies showed that the low‐MW PEGs filled molds well. The rheological properties confirmed that the low‐MW PEGs decreased the complex viscosity, and improved the processability. With decreasing PEG MW, the PLA glass‐transition temperature decreased. The nanoindenter data show that the addition of PEG decreased the modulus and hardness of PLA. The morphologies of the tensile samples showed that with increasing PEG MW, the thicknesses of the core layers increased gradually. The elongation at break was improved by approximately 247% with the addition of PEG200. Such methods can produce easily processed biological materials for producing biomedical products. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 45194.     

Preparation and properties of poly(ether‐ester‐amide)/poly(acrylonitrile‐co‐butadiene‐co‐styrene) antistatic blends

A novel antistatic agent poly(ether‐ester‐amide) (PEEA) based on caprolactam, polyethylene glycol, and 6‐aminocaproic acid was successfully synthesized by melting polycondensation. The structure, thermal properties, and antistatic ability of the copolymer were characterized by Fourier transform infrared spectroscopy, differential scanning calorimetry, thermogravimetric analyses, and ZC36 megohmmeter. Test results show that PEEA is a block copolymer with a melting point of 217°C and a thermal decomposition temperature of 409°C, together with a surface resistivity of 10⁸ Ω/sq. Antistatic poly(acrylonitrile‐co‐butadiene‐co‐styrene) (ABS) materials were prepared by blending different content of PEEA to ABS resin. The antistatic performances, morphology, and mechanical properties were investigated. It is indicated that the surface resistivity of PEEA/ABS blends decrease with the increasing PEEA content, and the excellent antistatic performance is obtained when the antistatic agent is up to 10–15%. The antistatic performance is hardly influenced by water‐washing and relative humidity, and a permanent antistatic performance is available. The antistatic mechanism is investigated. The compatibility of the blends was studied by scanning electron microscopy images. The ladder distribution of antistatic agent is formed, and a rich phase of antistatic agent can be found in the surface layer. The elongations at break of the blend are improved with the increasing antistatic agent; the tensile strength and the notched impact strength kept almost the same. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011.     

Enhanced fracture toughness of epoxy resins with novel amine‐terminated poly(arylene ether sulfone)–carboxylic‐terminated butadiene‐acrylonitrile–poly(arylene ether sulfone) triblock copolymers

Amine‐terminated poly(arylene ether sulfone)–carboxylic‐terminated butadiene‐acrylonitrile–poly(arylene ether sulfone) (PES‐CTBN‐PES) triblock copolymers with controlled molecular weights of 15,000 (15K) or 20,000 (20K) g/mol were synthesized from amine‐terminated PES oligomer and commercial CTBN rubber (CTBN 1300x13). The copolymers were utilized to modify a diglycidyl ether of bisphenol A epoxy resin by varying the loading from 5 to 40 wt %. The epoxy resins were cured with 4,4′‐diaminodiphenylsulfone and subjected to tests for thermal properties, plane strain fracture toughness (K_IC), flexural properties, and solvent resistance measurements. The fracture surfaces were analyzed with SEM to elucidate the toughening mechanism. The properties of copolymer‐toughened epoxy resins were compared to those of samples modified by PES/CTBN blends, PES oligomer, or CTBN. The PES‐CTBN‐PES copolymer (20K) showed a K_IC of 2.33 MPa m^0.5 at 40 wt % loading while maintaining good flexural properties and chemical resistance. However, the epoxy resin modified with a CTBN/8K PES blend (2:1) exhibited lower K_IC (1.82 MPa m^0.5), lower flexural properties, and poorer thermal properties and solvent resistance compared to the 20K PES‐CTBN‐PES copolymer‐toughened samples. The high fracture toughness with the PES‐CTBN‐PES copolymer is believed to be due to the ductile fracture of the continuous PES‐rich phases, as well as the cavitation of the rubber‐rich phases. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 1556–1565, 2002; DOI 10.1002/app.10390     

Preparation of novel soluble poly(ester imide)s containing a trimellitimide moiety and their use as modifiers for aromatic diamine‐cured epoxy resin

Poly(ester imide)s, prepared by the reaction of phthalic anhydride, N‐(4‐carboxyphenyl) trimellitimide and 1,2‐ethanediol, were used to improve the toughness of bisphenol‐A diglycidyl ether epoxy resin cured with 4,4′‐diaminodiphenyl sulfone (DDS). The poly(ester imide)s include poly(ethylene phthalate‐co‐ethylene N‐(1,4‐phenylene) trimellitimide dicarboxylate)s (PESIs) having 10, 20 and 30 mol% trimellitimide (TI) units, respectively. PESIs having 10 and 20 mol% TI units were effective as modifiers for toughening the cured epoxy resin. For example, the inclusion of 20 wt% of PESI (20 mol% TI unit, M _W 19300 g mol^?1) led to a 55% increase in the fracture toughness (K_IC) of the cured resin (with an increase in flexural strength and modulus) and the modified resin had a particulate morphology. PESI having 30 mol% TI units was not effective because of degradation of the modifier by DDS. The toughening mechanism is discussed in terms of morphological and dynamic viscoelastic behaviour of the modified epoxy resin system. © 2001 Society of Chemical Industry     

Phenol novolac/poly(4- hydroxyphenylmaleimide) blend hardeners for DGEBA-type epoxy resin

Phenol novolac/poly (4-hydroxyphenylmaleimide) (PHPMI) blends were used as an epoxy resin hardener. The curing behavior of the above system and the thermal and mechanical properties of the cured epoxy resin were studied. It was not necessary to use a curing accelerator for this system, because PHPMI caused acceleration of the curing reaction. The curing mechanism of this system was investigated by using model compounds. Test pieces from the neat resins and the glass fiber reinforced resins were evaluated in terms of thermal and mechanical properties, respectively. It was found that heat resistance and mechanical properties were improved by increasing the amount of PHPMI in the hardener.     

Synthesis of epoxy‐functionalized hyperbranched poly(phenylene oxide) and its modification of cyanate ester resin

High curing temperature is the key drawback of present heat resistant thermosetting resins. A novel epoxy‐functionalized hyperbranched poly(phenylene oxide), coded as eHBPPO, was synthesized, and used to modify 2,2′‐bis (4‐cyanatophenyl) isopropylidene (CE). Compared with CE, CE/eHBPPO system has significantly decreased curing temperature owing to the different curing mechanism. Based on this results, cured CE/eHBPPO resins without postcuring process, and cured CE resin postcured at 230°C were prepared, their dynamic mechanical and dielectric properties were systematically investigated. Results show that cured CE/eHBPPO resins not only have excellent stability in dielectric properties over a wide frequency range (1–10⁹Hz), but also show attractively lower dielectric constant and loss than CE resin. In addition, cured CE/eHBPPO resins also have high glass transition temperature and storage moduli in glassy state. These attractive integrated performance of CE/eHBPPO suggest a new method to develop high performance resins. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Toughening of bismaleimide resin by modification with poly(ethylene phthalate) and poly(ethylene phthalate-co-ethylene isophthalate)

Aromatic polyesters were prepared and used to improve the brittleness of the bismaleimide resin composed of 4,4′-bismaleimidediphenyl methane and o,o′-diallyl bisphenol A. The aromatic polyesters contain poly(ethylene phthalate) (PEP) and poly(ethylene phthalate-co-ethylene isophthalate) (10 mol % isophthalate unit) (PEPI). PEP and PEPI were effective modifiers for improving the brittleness of the bismaleimide resin. The most suitable composition for the modification of the bismaleimide was inclusion of 20 wt % PEP (MW 18,200), which led to an 80% increase in the fracture toughness with retention of flexural properties and a slight decrease in the glass transition temperature, compared with the mechanical and thermal properties of the unmodified cured bismaleimide resin (Matrimid resin). Microstructures of the modified resins were examined by scanning electron microscopy and dynamic viscoelastic analysis. The thermal stability of the modified resin was slightly lower than that of the unmodified resin by thermogravimetric analysis. The toughening mechanism is discussed in terms of the morphological and dynamic viscoelastic behavior of the modified bismaleimide resin system. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 65: 1349–1357, 1997     

Studies on isotactic poly(phenyl glycidyl ether)‐modified epoxy resins. II. Toughening of epoxy resins

A semicrystalline polymer, isotactic poly(phenyl glycidyl ether) (i‐PPGE) was used as a modifier for epoxy resin; 1,8‐Diamino‐p‐methane (MNDA) and 4,4′‐Diamino diphenyl sulfone (DDS) were used as curing agents. In the MNDA‐cured resins, the dispersed phase were spherical particles with diameters in the range of 0.5–1.0 μm when the resin was blended with 5 phr i‐PPGE. In the DDS‐cured resins, the particle size distribution of the dispersed phase was much wider. The difference was traced back to the reactivity of the curing agent and the different regimes used for curing. Through dynamic mechanical analysis, it was found that in the MNDA‐cured systems, i‐PPGE had a lower crystallinity than in the DDS‐cured system. In spite of the remarkable difference in the morphology and microstructure of the modified resins cured with these two curing agents, the toughening effects of i‐PPGE were similar for these resins. The critical stress intensity factor (K_IC) was increased by 54% and 53%, respectively, for the resins cured by DDS and by MNDA, blending with 5 phr of the toughner. i‐PPGE was comparable with the classical toughners carboxyl‐terminated butadiene‐acrylonitrile copolymers in effectiveness of toughening the epoxy resin. An advantage of i‐PPGE was that the modulus and the glass‐transition temperature of the resin were less affected. However, this modifier caused the flexural strength to decrease somewhat. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 1223–1232, 2002; DOI 10.1002/app.10445