LED大屏蔽显示驱动模块的一体化设计

介绍一种新型的LED大屏幕显示驱动模块，该模块采用多色LED发光短阵块，专用集成电路AMT9094和表面贴电子器件集为一体的设计，既可以非常方便地组成适应各种需求的大型室内LED显示屏，又能满足高质量LED大屏蔽显示系统规模生产的需要。     

LED显示屏在多画面显示监看系统中应用的可行性

通过分析液晶显示屏、等离子屏在多画面显示监看系统中的缺点,以及LED显示屏的优势,得出LED显示屏在多画面显示监看系统中更加适用。     

无线信息传送在LED显示屏系统中的应用

为了实现LED显示屏信息的无线传输，我公司在设计中将GPRS模块嵌入到LED显示屏的控制系统中，通过GPRS作为空中接口来实现LED显示系统的无线传送数据。本设计主要分两部分来实现，GPRS模块的无线信息传送在显示屏上的应用：通过短信方式（SMS）实现LED显示系统信息的无线传送：GPRS终端作为客户端通过INTERNET网络与服务器以UDP协议进行LED显示屏信息的无线通讯以及GPRS终端的远程控制。本文将详细描述系统的实现。     

LED显示屏在医院排队叫号系统中的应用

随着LED显示技术的逐渐成熟，LED显示屏在很多领域得到了广泛的应用，本文所要讨论的是LED显示屏在医院排队叫号系统中的应用，并根据我实验室自主开发的排队叫号系统，介绍了系统的基本功能、原理、流程和系统结构。     

基于FPGA的立体LED显示驱动器的设计

将LED显示屏的特点和自由立体显示的视觉效果相结合,采用特殊的LED立体显示屏,利用片上系统(SoC)和可编程片上系统(SoPC)的设计方法,提出立体LED显示屏控制系统的完整设计方案.在LED时序发生器的设计中利用直接内存存取(DMA)传输技术,生成队画面数据,用改进型的D/T转换技术控制所有像素点的亮度.结果表明,本设计借用了立体液晶显示的解决方法,在LED显示屏上实现了自由立体显示,保证了屏幕的刷新速率,同时还降低了立体真彩显示系统的复杂性.该设计方案能够保证画面有效实时显示,具有较强的实用性.     

基于多扫描线LED显示屏的数据组织方法探讨

在对市场上现有大多数LED显示屏控制电路剖析的基础上,得到以多扫描线为工作平台的LED显示屏数据组织新方法。利用这种方法设计的LED显示屏控制系统可最大限度地保证多扫描线显示系统显示数据的高速输出,同时这种采用多扫描线显示系统的数据组织方法还能够应用于各种基于多扫描线的大型显示系统。     

多媒体协处理器SM501在全彩LED显示屏脱机播放系统的应用

设计了一种基于嵌入式系统的全彩LED显示屏脱机播放系统,可支持高分辨率全彩LED显示屏的脱机播放.针对典型嵌入式系统在显示性能方面的瓶颈,提出了使用多媒体协处理器SM501增强显示性能的嵌入式系统方案,在软件上设计了SM501硬件加速底层显示接口以提高显示性能,并利用SM501提供的显示加速功能优化了视频播放.该系统较好地解决了目前国内LED显示屏脱机控制卡局限于支持单色或者伪彩LED,分辨率低、不能播放高质量视频的现状.     

基于双面光栅的LED三维立体显示系统的研制

LED显示屏已被广泛应用于户外大型显示,将3D显示技术应用到LED显示上已经成为LED显示的新的热点和方向。针对LED显示屏上各个LED显示单元之间上下左右出现倾斜、歪曲,表面出现凹凸不平等现象,导致传统的光栅很难精确对齐、3D串扰很大的问题,提出了一种新型的双面光栅。其中,后光栅用于保证组成LED显示屏的每个LED子像素的发光中心点在水平和垂直方向保持一致,前光栅则用于立体分光。同时,还设计了LED三维立体显示系统,以ARM作为视频控制系统,FPGA实现3D像素预处理和显示屏控制,通过在LED屏前放置双面光栅,系统最终可以实现较好的3D显示效果。     

LED显示屏系统功能的探讨

LED显示屏是一种可直接播放电视、录像、VCD等视频信号及显示文字、图像的公众信息显示屏。随着信息产业的发展，显示屏近年来发展迅猛。主要阐述了LED显示屏的系统原理，并针对其常用技术进行了分析和论述。     

LED显示屏灰度控制系统在Nios Ⅱ中的实现

介绍了LED显示屏灰度的显示方法,着重于显示屏设计中驱动控制方式的若干算法参数。根据这些算法参数,从系统的角度提出LED显示屏灰度控制完整算法,给出基于Cycloneii芯片的NiosII系统的设计框图,并得到在QuartusⅡ中的仿真结果。     

用于柔性显示屏的驱动芯片连接技术

轻、薄、坚固、可弯曲的显示屏成为平板显示技术未来发展的重要方向，为了实现基于塑料衬底的柔性显示屏，驱动芯片的可靠组装连接成为关键。文章分析了现有的各种芯片组装技术的特点．同时基于柔性显示发展需求，提出了多种驱动芯片连接技术方案，并对各方案进行了比较。     

Development of a mathematical model for thermal-compression bonding of the COG packaging process using NCA

In this decade, many new techniques have been introduced into the integrated circuit (IC) packaging industry. Packaging technology used in liquid crystal displays (LCDs) has requirements related to critical issues such as high density interconnects, thinner packaging size, and environmental safety. Driver IC chips are directly attached to LCD panels using flip chip technology with adhesives in the so called chip on glass (COG) packaging processes. To investigate the dependence of the bonding force on the bump deformation during packaging, this study established a mathematical model to analyze COG packaging processes with non-conductive adhesives (NCAs). The plastic deformation of the bumps and the NCA flow between the chip and substrate are taken into account in this model. With this model, the contact resistance and the gap height after bonding can be estimated for different bonding force.     

Quantum Dot Photonic Crystal Light Sources

The control and manipulation of light on a planar IC similar to that achieved for electrons in semiconductor chips on submicrometer and nanometerscales is an area of very active research today. While electronic device miniaturization is close to reaching its maximum possible potential, photonic devices have unique properties that have yet to be exploited. With increasing advances in nanofabrication techniques and the understanding of optical properties of semiconductors, several optical devices such as lasers, detectors, interferometers,and waveguides have been constantly shrinking in size. We have achieved very high speed integrated optical devices at 10-100-/spl mu/m length scales. However, there is a need to further reduce the size of devices to make them competitive in size and cost to existing electronic devices and to utilize their potential and unique properties in a wide range of applications ranging from communications, displays to sensors. Photonic crystals have emerged as one of the best potential candidates that can achieve the goal of compact miniaturized photonic chips. In this paper, we describe the current efforts and advances made in the photonic crystal microcavity light sources and their future prospects.     

Healing of voids in the aluminum metallization of integratedcircuit chips

A thermal treatment for healing voids in the aluminum metallization of integrated circuit (IC) chips has been discovered. The aluminum metallization is alloyed with nominally 1 wt.% of silicon. This discovery arose from efforts to cause further growth of preexisting voids in IC RAMs intended for long-term unattended spacecraft applications. The experimental effort was intended to cause further void propagation for the purpose of establishing a time/temperature propagation relationship, but it resulted instead in a healing of the voids. The thermal treatment consisted of heating IC chips with voids in the aluminum/silicon metallization to temperatures in excess of 200°C, followed by quick immersion into liquid nitrogen. The thermal treatment is described, and a theory based on silicon solubility and migration in aluminum is advanced to explain both the formation and the healing of voids in the aluminum metallization of IC chips     

基于旁路分析的集成电路芯片硬件木马检测

针对密码芯片中硬件木马电路检测的困难性,介绍了根据芯片旁路信息进行硬件木马检测的思想．在形式化定义基于旁路分析的硬件木马检测问题的基础上,分析了含硬件木马与不含硬件木马的密码芯片对应旁路信号在主成份分析结果上的差异,并以此对FPGA实现的含硬件木马的DES密码原型芯片进行了检测实验,实验结果表明了基于旁路信号主成份分析在密码芯片硬件木马检测中的效果．     

Net Congestion Elimination for Datapaths by Placement Refinement

The datapath chip is a special species of IC chips.Datapath circuits are widely used incomputer systems and communication systems as a data processor.Because there existmore constraints,the layout of datapaths is much complexer than ...     

Net Congestion Elimination for Datapaths by Placement Refinement

The layout of datapaths is much complexer than that of a normal IC chips, because more constraints must be considered. A novel method for eliminating the net congestion of datapath chips is presented. The main idea is to modify the placement locally according to the global routing result. The problem is abstracted to a nonlinear programming problem and could be transformed to a convex one. Experimental results demonstrate that the method can eliminate the net congestion of datapath chips effectively     

微系统集成大面积智能化衬底技术研究

智能化衬底技术既是集成微系统的载体,也是微系统集成的手段。采用真空盒吸片技术开发了一种实用的智能化衬底技术工艺方法。真空盒吸片技术解决了芯片的初始定位（对准装片）及芯片位置和共平面性的保持,确保了可用 Ｉ Ｃ工艺完成芯片间的互联。并使工艺的加工面积不受限制,且可达圆片尺度。因此,该智能化衬底技术工艺方法具有很强的实用性和很好的可靠性。     

Introducing dependency into IC yield models

Many models have been proposed to explain the distribution of point defects on integrated circuit (IC) chips. The most popular of these models are based on distributions derived from the Poisson distribution for describing the number of defects expected on a chip. These models do not inherently allow for dependence between the number of defects expected on two adjacent chips. This paper introduces a model for generating an IC defect distribution that allows for dependence in the number of defects on chips that are near one another. Simulations are done to compare the new dependent model to a previously proposed independent model. These simulations with the new model show defective chips clustered near each other on the water. This clustering property has been observed on real wafers. Methods of parameter and yield estimation in the dependent model are discussed.     

Defect detection of IC wafer based on two-dimension wavelet transform

Defect detection of integrated circuit (IC) wafer based on two-dimension wavelet transform (2-D DWT) is presented in this paper. By utilizing the characteristics many of the same chips in a wafer, three images with defects located in the same position and different chips are obtained. The defect images contain the standard image without any defects. 2-D DWT presented in the paper can extract the standard image from the three defect images. The algorithm complexity of the method is close to that of 2-D DWT. After obtaining the standard image, the speed and accuracy of defects detection can be greatly enhanced using the detection method presented in the paper. Using the image gray-scale matching technology, impact of illumination on IC defect detection is solved. Experiments demonstrate that 2-D DWT is fast and accurate to defects detection in an IC image, and the method has high robustness for illumination.