A leakage reduction methodology for distributed MTCMOS

Multithreshold CMOS (MTCMOS) circuits reduce standby leakage power with low delay overhead. Most MTCMOS designs cut off the power to large blocks of logic using large sleep transistors. Locally distributing sleep devices has remained less popular even though it has several advantages described in this paper. However, locally placed sleep devices are only feasible if sneak leakage currents are prevented. This paper makes two contributions to leakage reduction. First, we examine the causes of sneak leakage paths and propose a design methodology that enables local insertion of sleep devices for sequential and combinational circuits. A set of design rules allows designers to prevent most sneak leakage paths. A fabricated 0.13-/spl mu/m, dual V/sub T/ test chip employs our methodology to implement a low-power FPGA architecture with gate-level sleep FETs and over 8/spl times/ measured standby current reduction. Second, we describe the implementation and benefits of local sleep regions in our design and examine the interfacing issues for this technique. Local sleep regions reduce leakage in unused circuit components at a local level while the surrounding circuits remain active. Measured results show that local sleep regions reduce leakage in active configurable logic blocks (CLBs) on our chip by up to 2.2/spl times/ (measured) based on configuration.     

Dual-threshold voltage techniques for low-power digital circuits

Scaling and power reduction trends in future technologies will cause subthreshold leakage currents to become an increasingly large component of total power dissipation. This paper presents several dual-threshold voltage techniques for reducing standby power dissipation while still maintaining high performance in static and dynamic combinational logic blocks. MTCMOS sleep transistor sizing issues are addressed, and a hierarchical sizing methodology based on mutual exclusive discharge patterns is presented. A dual-V_t domino logic style that provides the performance equivalent of a purely low-V _t design with the standby leakage characteristic of a purely high-V_t implementation is also proposed     

A 0.5-V 25-MHz 1-mW 256-kb MTCMOS/SOI SRAM for solar-power-operated portable personal digital equipment - sure write operation by using step-down negatively overdriven bitline scheme

Multithreshold-voltage CMOS (MTCMOS) technology has a great advantage in that it provides high-speed operation with low supply voltages of less than 1 V. A logic gate with low-V/sub th/ MOSFETs has a high operating speed, while a low-leakage power switch with a high-V/sub th/ MOSFET eliminates the off-leakage current during sleep time. By using MTCMOS circuits and silicon-on-insulator (SOI) devices, the authors have developed a 256-kb SRAM for solar-power-operated digital equipment. A double-threshold-voltage MOSFET (DTMOS) is adopted for the power switch to further reduce the off leakage. As regards the SRAM core design, we consider a hybrid configuration consisting of high-V/sub th/ and low-V/sub th/ MOSFETs (that is, multi-V/sub th/ CMOS). A new memory cell with a separate read-data path provides a larger readout current without degrading the static noise margin. A negatively overdriven bitline scheme guarantees sure write operation at ultralow supply voltages close to 0.5 V. In addition, a charge-transfer amplifier integrated with a selector and data latches for intrabus circuitry are installed to enhance the operating speed and/or reduce power dissipation. A 32K-word /spl times/ 8-bit SRAM chip, fabricated with the 0.35-/spl mu/m multi-V/sub th/ CMOS/SOI process, has successfully operated at 25 MHz under typical conditions with 0.5-V (SRAM core) and 1-V (I/O buffers) power supplies. The power dissipation during sleep time is less than 0.4 /spl mu/W and that for 25-MHz operation is 1 mW, excluding that of the I/O buffers.     

Device-Aware Yield-Centric Dual-Vt Design Under Parameter Variations in Nanoscale Technologies

Dual-V_t design technique has proven to be extremely effective in reducing subthreshold leakage in both active and standby mode of operation of a circuit in submicrometer technologies. However, aggressive scaling of technology results in different leakage components (subthreshold, gate and junction tunneling) to become significant portion of total power dissipation in CMOS circuits. High-V_t devices are expected to have high junction tunneling current (due to stronger halo doping) compared to low-V_t devices, which in the worst case can increase the total leakage in dual-V_t design. Moreover, process parameter variations (and in turn V_t variations) are expected to be significantly high in sub-50-nm technology regime, which can severely affect the yield. In this paper, we propose a device aware simultaneous sizing and dual-V_t design methodology that considers each component of leakage and the impact of process variation (on both delay and leakage power) to minimize the total leakage while ensuring a target yield. Our results show that conventional dual-V_t design can overestimate leakage savings by 36% while incurring 17% average yield loss in 50-nm predictive technology. The proposed scheme results in 10%-20% extra leakage power savings compared to conventional dual-V_t design, while ensuring target yield. This paper also shows that nonscalability of the present way of realizing high-V_t devices results in negligible power savings beyond 25-nm technology. Hence, different dual-V_t process options, such as metal gate work function engineering, are required to realize high-performance and low-leakage dual-V_t designs in future technologies.     

A 1-V high-speed MTCMOS circuit scheme for power-down applicationcircuits

This paper proposes a new multithreshold-voltage CMOS circuit (MTCMOS) concept aimed at achieving high-speed, ultralow-power large-scale integrators (LSI's) for battery-driven portable equipment. The “balloon” circuit scheme based on this concept preserves data during the power-down period in which the power supply to the circuit is cut off in order to reduce the standby power. Low-power, high-speed performance is achieved by the small preserving circuit which can be separated from the critical path of the logic circuit. This preserving circuit is not only three times faster than a conventional MTCMOS one, but it consumes half the power and takes up half the area. Using this scheme for an LSI chip, 20-MHz operation at 1.0 V and only a few nA standby current was achieved with 0.5-μm CMOS technology. Moreover, this scheme is effective for high speed and low-power operation in quarter-micrometer and finer devices     

1-V power supply high-speed digital circuit technology withmultithreshold-voltage CMOS

1-V power supply high-speed low-power digital circuit technology with 0.5-μm multithreshold-voltage CMOS (MTCMOS) is proposed. This technology features both low-threshold voltage and high-threshold voltage MOSFET's in a single LSI. The low-threshold voltage MOSFET's enhance speed performance at a low supply voltage of 1 V or less, while the high-threshold voltage MOSFET's suppress the stand-by leakage current during the sleep period. This technology has brought about logic gate characteristics of a 1.7-ns propagation delay time and 0.3-μW/MHz/gate power dissipation with a standard load. In addition, an MTCMOS standard cell library has been developed so that conventional CAD tools can be used to lay out low-voltage LSI's. To demonstrate MTCMOS's effectiveness, a PLL LSI based on standard cells was designed as a carrying vehicle. 18-MHz operation at 1 V was achieved using a 0.5-μm CMOS process     

A 1-V, 10-MHz, 3.5-mW, 1-Mb MTCMOS SRAM: with charge-recyclinginput/output buffers

This paper presents a high-speed and low-power SRAM for portable equipment, which is operated by a single battery cell of around 1 V. Its memory cells are made up of high-threshold-voltage (high-V_th) MOSFETs in order to suppress the power dissipation due to large subthreshold leakage currents. For designing peripheral circuitry, we use SRAM's special feature that input signals of each logic gate during the standby time can be predicted. Low-V_th MOSFETs are assigned for the critical paths of memory-cell access. The leakage current in each logic gate is reduced by high-V_th MOSFETs, which are cut off during standby. The high-V_th, MOSFET in one logic gate can be shared with another logic gate in order to enlarge effective channel width. To shorten the readout time, a step-down boosted-wordline scheme suitable for current-sense readout and a new half-swing bidirectional double-rail bus are used. The data-writing time is halved by means of a pulse-reset wordline architecture. To reduce the power dissipation, a 32-divided memory array structure is employed with a new redundant address-decoding scheme. Also, data transition detectors and a charge-recycling technique are employed for reducing the power dissipation of data-I/O buffers. A 64-K-words×16-bits SRAM test chip, which was fabricated with a 0.5-μm multithreshold voltage CMOS (MTCMOS) process, has demonstrated a 75-ns address access time at a 1-V power supply. The power dissipation during standby is 1.2 μW, and that at a 10-MHz read operation with the modified checkerboard test pattern is 3.9 mW for 30-pF loads     

Techniques for Leakage Energy Reduction in Deep Submicrometer Cache Memories

The techniques known in literature for the design of SRAM structures with low standby leakage typically exploit an additional operation mode, named the sleep mode or the standby mode. In this paper, existing low leakage SRAM structures are analyzed by several SPEC2000 benchmarks. As expected, the examined SRAM architectures have static power consumption lower than the conventional 6-T SRAM cell. However, the additional activities performed to enter and to exit the sleep mode also lead to higher dynamic energy. Our study demonstrates that, due to this, the overall energy consumption achieved by the known low-leakage techniques is greater than the conventional approach. In the second part of this paper, a novel low-leakage SRAM cell is presented. The proposed structure establishes when to enter and to exit the sleep mode, on the basis of the data stored in it, without introducing time and energy penalties with respect to the conventional 6-T cell. The new SRAM structure was realized using the UMC 0.18-mum, 1.8-V, and the ST 90-nm 1-V CMOS technologies. Tests performed with a set of SPEC2000 benchmarks have shown that the proposed approach is actually energy efficient     

Leakage Power Characteristics of Dynamic Circuits in Nanometer CMOS Technologies

Temperature-dependent subthreshold and gate-oxide leakage power characteristics of domino logic circuits under the influence of process parameter variations are evaluated in this paper. Preferred input vectors and node voltage states that minimize the total leakage power consumption are identified at the lower and upper extremes of a typical die temperature spectrum. New low-leakage circuit design guidelines are presented based on the results. Significantly increased gate dielectric tunneling current, as described in this paper, dramatically changes the leakage power characteristics of dynamic circuits in deeply scaled nanometer CMOS technologies. Contrary to the previously published techniques, a charged dynamic-node voltage state with low inputs is preferred for reducing the total leakage power consumption in the most widely used types of single- and dual-threshold voltage domino gates, particularly at low die temperatures. Furthermore, leakage power savings provided by the dual-threshold voltage domino logic circuit techniques based on input gating are all together reduced due to the significance of gate dielectric tunneling in sub-45-nm CMOS technologies.     

Pass transistor with dual threshold voltage domino logic design using standby switch for reduced subthreshold leakage current

Dual threshold voltages domino design methodology utilizes low threshold voltages for all transistors that can switch during the evaluate mode and utilizes high threshold voltages for all transistors that can switch during the precharge modes. We employed standby switch can strongly turn off all of the high threshold voltage transistors which enhances the effectiveness of a dual threshold voltage CMOS technology to reduce the subthreshold leakage current. Subthreshold leakage currents are especially important in burst mode type integrated circuits where the majority of the time for system is in an idle mode. The standby switch allowed a domino system enters and leaves a low leakage standby mode within a single clock cycle. In addition, we combined domino dynamic circuits style with pass transistor XNOR and CMOS NAND gates to realize logic 1 output during its precharge phase, but not affects circuits operation in its evaluation and standby phase. The first stage NAND gates output logic 1 can guarantee the second stage computation its correct logic function when system is in a cascaded operation mode. The processing required for dual threshold voltage circuit configuration is to provide an extra threshold voltage involves only an additional implant processing step, but performs lower dynamic power consumption, lower delay and high fan-out, high switching frequencies circuits characteristics. SPICE simulation for our proposed circuits were made using a 0.18 µm CMOS process from TSMC, with 10 fF capacitive loads in all output nodes, using the parameters for typical process corner at 25 °C, the simulation results demonstrated that our designed 8-bit carry look-ahead adders reduced chip area, power consumption and propagation delay time more than 40%, 45% and around 20%, respectively. Wafer based our design were fabricated and measured, the measured data were listed and compared with simulation data and prior works. SPICE simulation also manifested lower sensitivity of our design to power supply, temperature, capacitive load and process variations than the dynamic CMOS technologies.     

A 0.5-V MTCMOS/SIMOX logic gate

This paper proposes a multithreshold CMOS (MTCMOS) circuit that uses SIMOX process technology. This MTCMOS/SIMOX circuit combines fully depleted low-threshold CMOS logic gates and partially depleted high-threshold power-switch transistors. The low-threshold CMOS gates have a large noise margin for fluctuations in operating temperature in addition to high-speed operation at the low supply voltage of 0.5 V. The high-threshold power-switch transistor in which the body is connected to the gate through the reverse-diode makes it possible to obtain large channel conductance in the active mode without any increase of the leakage current in the sleep mode. The effectiveness of the MTCMOS/SIMOX circuit is confirmed by an evaluation of a gate-chain test element group (TEG) and an experimental 0.5-V, 40-MHz, 16-b ALU, which were designed and fabricated with 0.25-μm MTCMOS/SIMOX technology     

1-V 100-MHz embedded SRAM techniques for battery-operatedMTCMOS/SIMOX ASICs

Multithreshold-voltage CMOS (MTCMOS) has a great advantage of lowering physical threshold voltages without increasing the power dissipation due to large subthreshold leakage currents. This paper presents the embedded SRAM techniques for high-speed low-power MTCMOS/SIMOX application-specified integrated circuits (ASICs) that are operated with a single battery cell of around 1 V. In order to increase SRAM operating frequency, a pseudo-two stage pipeline architecture is proposed. The address decoder using a pass-transistor-type NAND gate and a segmented power switch presents a short clocked wordline selection time. The large bitline delay in read operations is greatly shortened with a new memory cell using extra low-V_th nMOSs. The small readout signal from memory cells is detected with a high-speed MTCMOS sense amplifier, in which a pMOS bitline selector is merged. The wasted power dissipation in writing data is reduced to zero with a self-timed writing action. A 8 K-words×16-bits SRAM test chip, fabricated with a 0.35-μm MTCMOS/SIMOX process (shortened effective channel length of 0.17 μm is available), has demonstrated a 100-MHz operation under the worst power-supply condition of 1 V. At a typical 1.2 V, the power dissipation during the standby time is 0.2-μW and that of a 100-MHz operation with a checkerboard test pattern is 14 mW for single fan-in loads     

New configuration memory cells for FPGA in nano-scaled CMOS technology

In nano-scaled CMOS technology, the reduction of soft error rate and leakage current are the most important challenges in designing Field Programmable Gate Arrays (FPGA). To overcome these challenges, based on the observations that most configuration bit-streams of FPGA are zeros across different designs and that configuration memory cells are not directly involved with signal propagation delays in FPGA, this paper presents three new low-leakage and hardened configuration memory cells for nano-scaled CMOS technology. These cells are completely hardened when zeros are stored in the cells and cannot flip from particle strikes at the sensitive cell nodes. These cells retain their data with leakage currents and positive feedback without a refresh cycle. Simulation results show that the proposed cells are working correctly during their configuration and idle cycles and that our cells have a lower soft error rate and leakage current in 22-nm as well as in 65-nm technologies.     

Supply Switching With Ground Collapse: Simultaneous Control of Subthreshold and Gate Leakage Current in Nanometer-Scale CMOS Circuits

Power gating has been widely used to reduce subthreshold leakage. However, the efficiency of power gating degrades very fast with technology scaling, which we demonstrate by experiment. This is due to the gate leakage of circuits specific to power gating, such as storage elements and output interface circuits with a data-retention capability. A new scheme called supply switching with ground collapse is proposed to control both gate and subthreshold leakage in nanometer-scale CMOS circuits. Compared to power gating, the leakage is cut by a factor of 6.3 with 65-nm and 8.6 with 45-nm technology. Various issues in implementing the proposed scheme using standard-cell elements are addressed, from register transfer level to layout. These include the choice of standby supply voltage with circuits that support it, a power network architecture for designs based on standard-cell elements, a current switch design methodology, several circuit elements specific to the proposed scheme, and the design flow that encompasses all the components. The proposed design flow is demonstrated on a commercial design with 90-nm technology, and the leakage saving by a factor of 32 is observed with 3% and 6% of increase in area and wirelength, respectively.     

SRAM静态低功耗设计

在标准的Fabless CMOS工艺线上,由于没有对静态存储器生产进行过专门的工艺优化,在有大规模SRAM嵌入设计的ASIC与SoC电路中,静态电流较大。文章讨论了静态存储器单元静态漏电模式,采用了国内某标准CMOS工艺线提供的0.25μm SPICE模型,使用HSPICE软件对六管静态存储器单元的静态漏电进行了模拟,介绍了一种高可靠、基于0．25μm标准CMOS工艺的低功耗静态存储器设计的解决方案,适用于要求低待机功耗的标准静态存储器、嵌入式静态存储器电路设计。     

A forward body-biased low-leakage SRAM cache: device, circuit and architecture considerations

This paper presents a forward body-biasing (FBB) technique for active and standby leakage power reduction in cache memories. Unlike previous low-leakage SRAM approaches, we include device level optimization into the design. We utilize super high Vt (threshold voltage) devices to suppress the cache leakage power, while dynamically FBB only the selected SRAM cells for fast operation. In order to build a super high Vt device, the two-dimensional (2-D) halo doping profile was optimized considering various nanoscale leakage mechanisms. The transition latency and energy overhead associated with FBB was minimized by waking up the SRAM cells ahead of the access and exploiting the general cache access pattern. The combined device-circuit-architecture level techniques offer 64% total leakage reduction and 7.3% improvement in bit line delay compared to a previous state-of-the-art low-leakage SRAM technique. Static noise margin of the proposed SRAM cell is comparable to conventional SRAM cells.     

Critical evaluation of SOI design guidelines

Design guidelines for static and domino silicon-on-insulator (SOI) CMOS circuits are evaluated. Restructuring the logic to eliminate gates with large fan-ins is almost as beneficial for SOI as for bulk-silicon. Most published design fixes for eliminating parasitic bipolar induced upset are shown to aggravate the charge sharing problem. A new and improved predischarge method for enhancing the noise tolerance of SOI domino circuits is thus proposed . The topic of multiple output domino logic in SOI technology is addressed for the first time. Multiple output domino logic is shown to be more prone to bipolar leakage induced upset than regular domino. Many of the design practices used to alleviate bipolar leakage in regular domino are no longer valid due to the multiple output domino logic's inherent design requirements. A novel SOI-specific multiple output domino logic, particularly suitable for adder designs, is introduced to minimize the bipolar leakage risk.     

An MTCMOS technology for low-power physical design

Multi-threshold CMOS (MTCMOS) technology is an effective sub-threshold leakage power reduction method in CMOS circuits, which satisfies high-performance and low-power design requirements. The optimization of virtual supply network plays an important role in MTCMOS low-power design. Existing low-power works are mainly on gate level, without any optimization on physical design level, which can lead to a large amount of virtual supply networks. Merging the objective of virtual networks minimization into physical design, this paper presents (1) a low-power-driven physical design flow; (2) a novel low-power placement to simultaneously place standard cells and sleep transistors; and (3) the sleep transistor relocation technique to further reduce the virtual supply networks. Experimental results are promising for both achieving up to 28.15% savings for virtual supply networks and well controlling the increase of signal nets.     

INDEP approach for leakage reduction in nanoscale CMOS circuits

Complementary metal oxide semiconductor (CMOS) technology scaling for improving speed and functionality turns leakage power one of the major concerns for nanoscale circuits design. The minimization of leakage power is a rising challenge for the design of the existing and future nanoscale CMOS circuits. This paper presents a novel, input-dependent, transistor-level, low leakage and reliable INput DEPendent (INDEP) approach for nanoscale CMOS circuits. INDEP approach is based on Boolean logic calculations for the input signals of the extra inserted transistors within the logic circuit. The gate terminals of extra inserted transistors depend on the primary input combinations of the logic circuits. The appropriate selection of input gate voltages of INDEP transistors are reducing the leakage current efficiently along with rail to rail output voltage swing. The important characteristic of INDEP approach is that it works well in both active as well as standby modes of the circuits. This approach overcomes the limitations created by the prevalent current leakage reduction techniques. The simulation results indicate that INDEP approach mitigates 41.6% and 35% leakage power for 1-bit full adder and ISCAS-85 c17 benchmark circuit, respectively, at 32 nm bulk CMOS technology node.     

A low leakage SRAM macro with replica cell biasing scheme

For mobile applications of SRAMs, there is a need to reduce standby current leakages while keeping memory cell data. For this purpose, we propose a replica cell biasing scheme which controls the cell bias voltage by self-tuning using replica cells. This scheme minimizes the cell leakage regardless of the process fluctuations and the environmental conditions. In addition, leakage reduction in row decoder circuits is also desirable, because standby current leakages in peripheral circuits are dominated by row decoders. We also propose a row decoder circuit which can reduce both the off-leakage and the gate-leakage in the row decoders. We fabricated a 90-nm 512-Kb low-leakage SRAM macro to verify the proposed leakage reduction techniques. With these techniques, 88% reduction of the standby leakage in the sleep mode and 40% reduction of the leakage compared with the conventional diode clamp scheme are realized.