A computerized signal acquisition system for the quantitative evaluation of EBIC and CL data in a SEM

Electron beam-induced current (EBIC) and cathodoluminescence (CL) are widely used methods to obtain information about recombination properties of semiconducting materials and their defects on a micrometer length scale. In this article a computerized SEM (scanning electron microscope) setup is described, which enables us to perform simultaneous measurements of several signals and automatic temperature-dependent measurements. As examples for the performance of this system we present results obtained by simultaneous EBIC/CL experiments, allowing a reconstruction of the defect geometry. In a second example, the temperature dependence of the EBIC contrast is analyzed, introducing the method of EBIC spectroscopy.     

GaP LPE半导体材料的扫描电子显微镜研究

本文论述了用扫描电子显微镜研究GaP LPE半导体材料,二次电子像用于分析样品的表面形貌,电子束感生电流像(EBIC)用于显示p-n结的位置,定量EBIC用以确定少子扩散长度和表面复合速度等重要参量。     

Observation of dislocations and microplasma sites in semiconductors by direct correlations of STEBIC,STEM and ELS

A high voltage electron microscope, equipped with scanning transmission (STEM) attachment, electron beam induced conductivity (EBIC) facilities, and electron energy loss spectrometer (ELS), has been used to investigate semiconductor devices. The capability of STEM to produce, simultaneously or sequentially, conductive and transmission images of the same specimen region, which can also be ELS analysed, is exploited in order to establish direct and unambiguous correlations between EBIC and STEM images of defective regions (dislocations and microplasma sites) in silicon devices. The results obtained are discussed in terms of correlations, resolution, contrast, and radiation damage; in addition, a comparison is made between this method and the other correlation methods based on EBIC/SEM (scanning electron microscope) and TEM (transmission electron microscope).     

Advanced semiconductor diagnosis by multidimensional electron-beam-induced current technique

We present advanced semiconductor diagnosis by using electron-beam-induced current (EBIC) technique. By varying the parameters such as temperature, accelerating voltage (V(acc)), bias voltage, and stressing time, it is possible to extend EBIC application from conventional defect characterization to advanced device diagnosis. As an electron beam can excite a certain volume even beneath the surface passive layer, EBIC can be effectively employed to diagnose complicated devices with hybrid structure. Three topics were selected to demonstrate EBIC applications. First, the recombination activities of grain boundaries and their interaction with Fe impurity in photovoltaic multicrystalline Si (mc-Si) are clarified by temperature-dependent EBIC. Second, the detection of dislocations between strained-Si and SiGe virtual substrate are shown to overcome the limitation of depletion region. Third, the observation of leakage sites in high-k gate dielectric is demonstrated for the characterization of advanced hybrid device structures.     

Direct assessment of recombination noise in semiconductors using electron beam-induced conductivity

The level of internal noise of the transistors, diodes, and other semiconductor components limits the successful design of any low noise electronic system. All types of noise, namely, Johnson, 1/f, and so forth, are generated due to activity of crystalline defects such as vacancies, dislocations, and others. The intensity of the electron scattering and recombination processes, inflicted by defects (traps), controls the level of noise. Dependent on the dynamic operation condition of semiconductor devices, such as external biases and level of current injection, the traps will generate certain type and level of noise. Material growth or device processing technologies could introduce all kind of defects. Therefore, characterization of the semiconductor wafer in the early stages of processing (at least before packaging) could help to predict the level of noise due to the type and density of defects present on the wafer. Sorting out bad semiconductor chips could save money and effort in the radio frequency design of low-noise circuits. This current study focuses on 1/f noise modeling, which involves most powerful generators of noise and linear defects, named dislocations. The study also examines the possibility of assessing this noise by quantitative electron beam-induced conductivity (EBIC) measurements. These defects could be found in the bulk as well as at the epitaxial interfaces of a semiconductor device. The nanoscale size of these defects makes the scanning electron beam an instrument of choice for the proposed study. Conventional EBIC produces images of the defects, where contrast is proportional to the recombination rate at the site of a defect. Since contrast is measured as a fraction of one percent, the relative nature of contract value precludes quantitative measurements of the recombination rate, thus making quantitative assessment of 1/f noise impossible. In our model, using the Boltzman continuity equation, the recombination-generation processes per unit of length of a dislocation was defined for two operational conditions of EBIC, namely, for low and high intensity of an electron beam. The experimental technique of the quantitative measurement of carrier recombination (Mil'shtein 2001) consists of taking two EBIC scans along the selected defect at two different beam intensities, digitally subtracting the first scan from the second one and normalizing the result to the size of the electron range. The value of the recombination rate, extracted from the model, could then be used to predict the level of 1/f noise in the tested semiconductor sample.     

Lock-in technique applied to cathodoluminescence of biomedical specimens in the SEM

Very low signals or disturbances by unwanted, foreign signals often lead to a restriction in the application of the cathodoluminescence (CL) method in the scanning electron microscope (SEM). This is even true if one uses an optimal CL detection system. We, therefore, introduced the lock-in-amplification technique, which has proved very successful in investigations of semiconductor materials into the biomedical field. After attaching the lock-in system to our SEM which has a special CL equipment, we found that this technique could remove the disturbance caused by the light emitted from the heated filament, which can be reflected into the CL detector. Specimens on polished Al-stubs or on Au-coated glass slides could be imaged with improved contrast. The same was true if we measured the wavelengths of the CL. A general improvement of the signal-to-noise ratio in all specimens could not be detected. However, the beam current could often be reduced when using the lock-in technique without a decrease in the quality of the CL image. A disadvantage of the commercially available lock-in amplifier is that pictures need a longer exposure time than without lock-in amplification.     

The effect of electron range on electron beam induced current collection and a simple method to extract an electron range for any generation function

The effect of electron range on electron beam induced current (EBIC) is demonstrated and the problem of the choice of the optimal electron ranges to use with simple uniform and point generation function models is resolved by proposing a method to extract an electron range-energy relationship (ERER). The results show that the use of these extracted electron ranges remove the previous disagreement between the EBIC curves computed with simple forms of generation model and those based on a more realistic generation model. The impact of these extracted electron ranges on the extraction of diffusion length, surface recombination velocity and EBIC contrast of defects is discussed. It is also demonstrated that, for the case of uniform generation, the computed EBIC current is independent of the assumed shape of the generation volume.     

High-resolution scanning near-field EBIC microscopy: application to the characterisation of a shallow ion implanted p+-n silicon junction

High-resolution electron beam induced current (EBIC) analyses were carried out on a shallow ion implanted p⁺–n silicon junction in a scanning electron microscope (SEM) and a scanning probe microscope (SPM) hybrid system. With this scanning near-field EBIC microscope, a sample can be conventionally imaged by SEM, its local topography investigated by SPM and high-resolution EBIC image simultaneously obtained. It is shown that the EBIC imaging capabilities of this combined instrument allows the study of p–n junctions with a resolution of about 20 nm.     

The interpretation of EBIC images using Monte Carlo simulations

Charge collection microscopy, usually known by the acronym EBIC (Electron Beam Induced Current) imaging, is a powerful technique for the observation and characterization of semiconductor materials and devices in the scanning electron microscope. Quantitative interpretation of EBIC images is often difficult because of the problem of accurately representing the electron-beam interaction with the semiconductor. This paper uses a Monte Carlo technique to simulate the electron-beam interaction, and it is shown that this permits simple analytical point-source solutions to be generalized to fully represent the experimental situation of an extended, non-uniform, carrier source. The model is demonstrated by application to EBIC imaging in the Schottky barrier geometry.     

Multiscale iterative voting for differential analysis of stress response for 2D and 3D cell culture models

Focused ion beam-scanning electron microscope (FIB-SEM) tomography is a powerful application in obtaining three-dimensional (3D) information. The FIB creates a cross section and subsequently removes thin slices. The SEM takes images using secondary or backscattered electrons, or maps every slice using X-rays and/or electron backscatter diffraction patterns. The objective of this study is to assess the possibilities of combining FIB-SEM tomography with cathodoluminescence (CL) imaging. The intensity of CL emission is related to variations in defect or impurity concentrations. A potential problem with FIB-SEM CL tomography is that ion milling may change the defect state of the material and the CL emission. In addition the conventional tilted sample geometry used in FIB-SEM tomography is not compatible with conventional CL detectors. Here we examine the influence of the FIB on CL emission in natural diamond and the feasibility of FIB-SEM CL tomography. A systematic investigation establishes that the ion beam influences CL emission of diamond, with a dependency on both the ion beam and electron beam acceleration voltage. CL emission in natural diamond is enhanced particularly at low ion beam and electron beam voltages. This enhancement of the CL emission can be partly explained by an increase in surface defects induced by ion milling. CL emission enhancement could be used to improve the CL image quality. To conduct FIB-SEM CL tomography, a recently developed novel specimen geometry is adopted to enable sequential ion milling and CL imaging on an untilted sample. We show that CL imaging can be manually combined with FIB-SEM tomography with a modified protocol for 3D microstructure reconstruction. In principle, automated FIB-SEM CL tomography should be feasible, provided that dedicated CL detectors are developed that allow subsequent milling and CL imaging without manual intervention, as the current CL detector needs to be manually retracted before a slice can be milled. Due to the required high electron beam acceleration voltage for CL emission, the resolution for FIB-SEM CL tomography is currently limited to several hundreds of nm in XY and up to 650 nm in Z for diamonds. Opaque materials are likely to have an improved Z resolution, as CL emission generated deeper in the material is not able to escape from it.     

Electron Beam-Induced Current (EBIC) in solution-processed solar cells

Electron Beam-Induced Current (EBIC) measurements were used to produce 2D maps for investigating the homogeneity of solar cells. These maps are acquired by scanning the electron beam of a scanning electron microscope over a small area and using a programmable sample stage to move the solar cell under the scan area. The electron beam generates electron-hole pairs in the solar cell much like light does in normal solar cell operation. Solution-processed solar cells where the active layer consisted of purely inorganic or purely organic materials were measured. Since the electron beam irreversibly damages organic material, it was important to ensure that the measurements were made before the materials were altered.     

Characterization of defects in semiconductors by combined application of SEM(EBIC) and SDLTS*

Besides the characterization of the geometrical structure of defects in semiconductors by TEM the estimation of their electrical activity is of importance. SEM(EBIC) and SDLTS (scanning deep level transient spectroscopy) are especially suitable for this purpose; they allow the inspection of electronic properties with a spatial resolution in the micron-range. On the one hand, SEM(EBIC) yields information on the recombination efficiency of defects in the crystal volume adjacent to a pn junction or a Schottky barrier; on the other hand, SDLTS enables the detection to be carried out of the distribution and the energetic levels of deep level defects lying in the space charge region. Accordingly, the combined application of these techniques is very promising for investigating physical processes implying an inhomogeneous incorporation of deep level defects in semiconductor crystals. In comparison to the widely used SEM(EBIC) technique SDLTS has only rarely been applied, a fact that is due to the high detection sensitivity necessary for measuring capacity transients. The application of a highly sensitive (10^—6 pF) micro-computer-controlled SDLTS system in combination with a conventional EBIC system allows a reliable inspection of semiconductor materials and devices, based on A₃B₅ compounds and on silicon. A typical application of the above technique is the investigation of the impurity distribution around extended crystal defects, like dislocations and precipitates, to study their gettering activity.     

Scanning microscopies of indented MgO crystals

The combination of scanning electron microscopy (SEM) and scanning optical microscopy (SOM), including a computer-controlled signal detection system, is promising in the study of a variety of materials, especially such alkaline-earth oxides with a rock salt structure, such as MgO. Among the SEM modes of this technique used to investigate deformed zones in indented MgO single crystals are: secondary electrons (SE), cathodoluminescence (CL) (total, pointal, color), electron beam-induced current (EBIC), electron beam-induced voltage (EBIV), as well as both polarized and transmitted light modes in SOM. The present experiments were designed to clarify the correlation between the optical, luminescent, electrical, and plastic properties of deformed MgO. An attempt has been made to explain the results in terms of dislocations created during deformation.     

A study of electron beam-induced conductivity in resists.

The charging of polymeric resist materials during electron beam irradiation leads to significant problems during imaging and lithography processes. Charging occurs because of charge deposition in the polymer and charge generation/trapping due to formation of electron-hole pairs in the dielectric. The presence of such charge also results in the phenomena of electron beam-induced conductivity (EBIC). Electron beam-induced conductivity data have been obtained for three commercial e-beam resists under a variety of dose rate and temperature conditions. From the observed values of induced conductivity under varying conditions significant information about the generation of electron-hole pair and the transport of charge in the resist can be obtained. Three electron beam resists, EBR900, ZEP7000, and PBS are examined by an external bias method. The difference in resist chemistry is considered to play the role in the initial state EBIC behaviors among three resists even though the way that it affects the behaviors is not clear. A comparison of the power consumption comparison is proposed as a measure to give a preliminary estimate of the carrier concentration and carrier drift velocity differences among the resists. A simple single trap model with constant activation energy is proposed and provides good agreement with experiment.     

Electron-beam-induced current decay measurements in electron probe instruments using a multichannel analyzer

A simple method for decay measurements of the charge collection mode (commonly referred to as electron-beam-induced current or EBIC) of an electron probe instrument is presented. The decay, which occurs at continuous electron irradiation, should be distinguished from a decay measurement due to the electron beam blanking. This method could be applied to other modes of an electron probe instrument, e.g., cathodoluminescence, in studying electron-beam-sensitive semiconductors. An example of the decay of the EBIC signal in a hydrogenated amorphous silicon device is presented.     

Observation of current-density filamentation in multilayer structures by EBIC measurements

The total current-voltage characteristics of the p⁺-n⁺-p-n^? and n⁺-p-n-p^? diodes under investigation show branches of negative differential resistance. Accompanied by the appearance of negative differential resistance is a filamentation of current-density and electric-field distribution. Electron beam-induced current (EBIC) measurements were used to examine the properties of filamentation from the point of view of self-organized pattern formation. Besides the detection of the spatial distribution of the electric field, EBIC measurements give information on current-density filamentation. Furthermore, the perturbation by the electron beam gives information on the dynamic behavior of the filamentary structure.     

Investigation of the electronic effects of dislocations by stem

A variety of signals is available on a modern analytical STEM which provide information on the electronic structure of crystal defects. This information is complementary to the high resolution spatial information available from the microdiffraction signal or from high resolution lattice images. The signals of interest are the electron energy loss spectrum, the X-ray spectrum, the cathodoluminescence signal and EBIC. Images using these signals can be directly compared with the transmission image which is simultaneously available. These techniques will be discussed and their sensitivity to defects compared. Examples will be shown of dislocations in diamond and semiconductors and defects in MgO single crystals.     

The remote electron beam-induced current analysis of grain boundaries in semiconducting and semi-insulating materials

When no charge collecting p-n junction or Schottky barrier is present in the specimen, but two contacts are applied, conductive mode scanning electron microscope (SEM) observations known as remote electron beam-induced current (REBIC) can be made. It was described as "remote" EBIC because the contacts to the specimen can lie at macroscopic distances from the beam impact point. In recent years, REBIC has been found to be useful not only for studies of grain boundaries in semiconducting silicon and germanium, but also in semi-insulating materials such as the wider bandgap II-VI compounds and electroceramic materials like varistor ZnO and positive temperature coefficient resistor (PTCR) BaTiO3. The principles of this method are outlined. Accounts are given of the five forms of charge collection and resistive contrast that appear at grain boundaries (GBs) in REBIC micrographs. These are (1) terraced contrast due to high resistivity boundary layers, (2) peak and trough (PAT) contrast due to charge on the boundary, (3) reversible contrast seen only under external voltage bias due to the beta-conductive effect in a low conductivity boundary layer, (4) dark contrast due to enhanced recombination, and (5) bright contrast apparently due to reduced recombination. For comparison, the results of the extensive EBIC studies of GBs in Si and Ge are first outlined and then the results of recent REBIC grain boundary studies in both semiconducting and semi-insulating materials are reviewed.     

Low-voltage cross-sectional EBIC for characterisation of GaN-based light emitting devices

Electron beam induced current (EBIC) characterisation can provide detailed information on the influence of crystalline defects on the diffusion and recombination of minority carriers in semiconductors. New developments are required for GaN light emitting devices, which need a cross-sectional approach to provide access to their complex multi-layered structures. A sample preparation approach based on low-voltage Ar ion milling is proposed here and shown to produce a flat cross-section with very limited surface recombination, which enables low-voltage high resolution EBIC characterisation. Dark defects are observed in EBIC images and correlation with cathodoluminescence images identify them as threading dislocations. Emphasis is placed on one-dimensional quantification which is used to show that junction delineation with very good spatial resolution can be achieved, revealing significant roughening of this GaN p-n junction. Furthermore, longer minority carrier diffusion lengths along the c-axis are found at dislocation sites, in both p-GaN and the multi-quantum well (MQW) region. This is attributed to gettering of point defects at threading dislocations in p-GaN and higher escape rate from quantum wells at dislocation sites in the MQW region, respectively. These developments show considerable promise for the use of low-voltage cross-sectional EBIC in the characterisation of point and extended defects in GaN-based devices and it is suggested that this technique will be particularly useful for degradation analysis.     

Minority carrier lifetime mapping in the SEM

A method is described for obtaining two-dimensional distributions of minority carrier lifetimes in semiconductor materials for optoelectronic applications. The novel features of the system are: on line analogue calculation of the lifetime from the decay of the cathodoluminescence signal after switching off the SEM electron beam; simultaneous computerized mapping of the signals obtained in this manner in the scanning electron microscope. Typically, it permits establishing a map of 1 mm² with 512 times 512 data points in 10 min for lifetimes down to 3 ns.