锆钛酸铅陶瓷在力电耦合场下疲劳性能的评价

小样品力学性能试验方法(Modified Small Punch Tests, 简称MSP)是评价陶瓷材料力学性能的一种有效方法. 采用改进型多场耦合小冲压(MSP)试验法评价了Pb(Zr,Ti)O₃陶瓷(PZT)在力电耦合和纯力场下的疲劳性能. 通过对比在纯力场和力电耦合下的力学性能可以看出: 与纯力场下相比, PZT陶瓷在力电耦合下的断裂强度会降低. 在力场和电场的同时作用下, 疲劳寿命显著缩短, 压电陶瓷材料内部易出现沿晶断裂.     

功能梯度铁电铁磁复合材料弯曲模态下的磁电效应

基于磁致伸缩相与压电相的本构方程,应用弹性力学的方法,建立了功能梯度铁电铁磁复合材料弯曲模态下的磁电耦合静态力学模型。假设铁电和铁磁材料的物理参数均为沿厚度方向的线性或指数函数,分析计算了由PZT作为铁电材料和CoFe2O4作为铁磁材料的双层复合材料的磁电效应。结果表明,在弯曲模态下,磁电电压系数出现两个峰值。负梯度的铁电(或铁磁)材料提高磁电效应,正梯度的铁电(或铁磁)材料降低磁电效应。同号梯度的铁电铁磁材料对磁电效应的影响更大。     

硅基三元系PMnN-PZT铁电薄膜制备与研究

利用磁控溅射方法在单晶Si基底上沉积三元系铁电薄膜6%PMnN-94%PZT(6%Pb(Mn1/3,Nb2/3)O3-94%Pb(Zr0.52,Ti0.48)O3),采用淬火方法对薄膜进行处理,以促进薄膜钙钛矿结构形成。同时,在相同条件下制备非掺杂PZT(52/48)薄膜以对比薄膜掺杂效果。运用X射线衍射(XRD)技术分析薄膜晶向及晶体结构,运用Sawyer Tower电路测试薄膜铁电性能,运用激光测振仪测试薄膜的压电系数。实验结果表明,所沉积薄膜为多晶钙钛矿结构铁电薄膜,薄膜铁电剩余极化Pr=23.7μC/cm2,饱和极化Ps=40μC/cm2,矫顽场电压2Ec=139kV/cm,横向压电系数e11=-13.2C/m2,薄膜的铁电及压电性能优良。     

多场耦合下铁电薄膜非线性行为的畴变模型

铁电薄膜在外加力场,电场和温度场的作用下表现出明显的非线性,为了更好的描述这种现象,本文提出了一个热-电-力耦合场铁电薄膜下的畴变模型。该模型基于细观力学模型,认为电畴自由能的改变提供电畴翻转的动力,且180°电畴翻转由两步90°翻转构成。在本构关系中加入了铁电薄膜制备过程中产生的残余应变项,以区别于块体铁电材料,通过该模型计算出了铁电薄膜在不同外场下的响应,结果与实验和其他模型的结果较为符合。     

以TiO_2为缓冲层在GaN上外延生长PZT铁电薄膜

采用脉冲激光沉积技术在(0001)取向的GaN基片上以TiO2为缓冲层外延生长了PZT(111)单晶薄膜。X射线衍射分析表明PZT(111)衍射峰的摇摆曲线半高宽为0.4°,说明薄膜结晶性能良好。PZT薄膜疲劳特性测试结果表明,在经过107次翻转后PZT薄膜的剩余极化强度开始出现下降。P-E电滞回线和I-V测试表明PZT薄膜矫顽场(2Ec)为350 kV/cm,剩余极化(2Pr)约为96μC/cm2,在1 V电压下薄膜的漏电流密度为1.5×10-7A/cm2。以上性能测试结果表明,在半导体GaN上外延生长的PZT铁电薄膜性能基本满足铁电随机存储器的需要。     

MEMS变形镜用PZT厚膜致动器阵列的制备及性能表征

提出了一种基于锆钛酸铅(PZT)压电厚膜致动器阵列驱动的MEMS微变形镜,建立了该微变形镜的结构模型,分析了其结构中各层厚度对其性能的影响.PZT压电厚膜是通过基于PZT压电陶瓷体材料的湿法刻蚀技术制备的,刻蚀液为1BHF2HCl4NH4 Cl4H2O.以数字锁相方法测试了压电厚膜的介电性能,在100 kHz以下时,其介电常数和介质损耗分别优于2400和3%.利用悬臂梁方法测试了压电厚膜的也.横向压电系数,约为-250 pm/V.制备了4×4阵列的压电致动器阵列.采用激光多普勒测试压电致动器的电压位移曲线,在100 V的电压驱动下致动器的变形量大约为2.2/μm;测试了致动器的频率响应,其谐振频率高于100 kHz;致动器刚度大,带负载能力强.     

P(VDF-TrFE)铁电膜微观铁电压电特性研究

借助原子力显微镜优异的空间分辨能力和微观压电铁电测定技术,研究了不同结晶P(VDF-TrFE)铁电膜的微观铁电压电特性.研究表明,非晶态微观蝴蝶洄线的铁电开关过程平缓,矫顽场分布较广且场值较高;与之相比高结晶度薄膜微观蝴蝶洄线呈现陡峭而迅速的铁电开关现象,矫顽场单值且较低.微观压电性的实验表明非晶态压电系数约为-0.15(A)/V,低于晶态的压电系数-0.30(A)/V.     

改进溶胶-凝胶法制备PZT5O/5O铁电薄膜

采用改进的溶胶-凝胶法在Pt/Ti/SiO2/Si衬底上制备了PZT50/50铁电薄膜，用X射线衍射表征了薄膜的物相，用原子力显微镜（AFM）表征薄膜的微观形貌，用RT-66A测量了薄膜的铁电特性，获得了具有优良的铁电性能的晶粒尺寸为100nm的PZT50/50铁电薄膜，在20V电压下，Pr=31.83uC/cm^2。     

Sol-Gel法硅基铁电薄膜研究

介绍了用溶胶 凝胶方法制备Pb(Zr0 .53Ti0 .4 7)O3(PZT)铁电薄膜的工艺流程。以硝酸锆、醋酸铅和钛酸四丁酯为原料 ,在 90 0℃ ,30min退火条件下制备了硅基PZT铁电薄膜。实验分析结果显示 ,PZT铁电薄膜的晶化很完善。研究了PZT铁电薄膜与硅之间的界面及其对铁电薄膜品质的影响。并在此基础上实现了制备PZT铁电薄膜的低温改进工艺。     

掺锡氧化铟基底上锆钛酸铅铁电薄膜的制备与表征

用溶胶-凝胶工艺在掺锡氧化铟导电氧化物基底上制备了锆钛酸铅（PZT）铁电薄膜．采用快速热处理工艺改进铁电薄膜的晶格取向，用X射线衍射仪分析了薄膜的结晶取向，分别基于Al／PZT／ITO，1TO／PZT／1TO电容结构利用Sawyer-Tower电路原理测试了薄膜的铁电性能．结果表明，在磁控溅射法生长的1TO表面能够制备出具有钙钛矿结构的（110）取向的PZT铁电薄膜，所得薄膜的相对介电常数达到1000，剩余极化强度Pr达到和Pt基底上接近的15．2uc／cm^2，矫顽场强Ec达到70．8kV/cm．并且利用TF Analyzer 2000铁电分析仪测试了PZT铁电薄膜的疲劳特性，发现ITO底电极上PZT薄膜经过108次反转后，剩余极化强度仅下降15％．研究表明：磁控溅射法制备的掺锡氧化铟透明导电薄膜ITO可以作为铁电薄膜的上下电极．     

提高压电微探针表面信息读取电荷灵敏度的方法

分析了基于原子力显微镜（AFM）探针阵列的超高密度信息存储中压电方式读取纳米数据坑的电荷灵敏度,从探针结构设计的角度指出通过改连上电极钝化层的设计可以使电荷灵敏度提高约50％;在读取电路中引入直流偏置电压,通过提高锆钛酸铅（PZT）薄膜的等效横向压电系数d31进一步提高电荷灵敏度．利用硅片悬臂梁上溶胶-凝胶法制备的PZT薄膜,基于正压电效应实验验证了施加直流偏置电压对d31的提高作用．直流偏压从0V增加到10V时,等效横向压电系数d31从-48pC／N提高到-120pC／N．     

Corona poling of highly (001)/(100)-oriented lead zirconate titanate thin films

Corona poling is an interesting non-contact poling process for ferroelectric materials which, has in the past, been extensively applied to ferroelectric polymers, but not to other types of ferroelectric materials. Here, it has been investigated as an alternative technique to the conventional direct-contact poling of ferroelectric thin films.

Contact-poling and corona poling techniques were applied to highly (001)/(100) oriented lead zirconate titanate thin films of composition 52% Zr, 48% Ti (PZT52/48). Different poling voltages and durations were used to pole the samples, and the effects on the piezoelectric coefficients e_31,f and d_33,f were explored. From the magnitudes of piezoelectric coefficients and suppression of e_31,f relative to d_33,f, it was concluded that corona poling is a more suitable technique for poling PZT52/48 thin films than direct poling, since piezoelectric coefficients were higher and sample damage was less for corona poling when compared with contact-poling.     

Effects of preferred orientation on the piezoelectric properties of Pt/Pb(Zr0.3Ti0.7)O3/Pt thin films grown by sol–gel process

Tetragonal lead zirconate titanate (PZT) films with different orientations and 200 nm film thicknesses were prepared on platinized silicon substrates. Types of substrate and control of thermal processes, such as layer-by-layer and one-crystallization heat treatments, result in highly (111) or (100)-oriented PZT films. The piezoelectric, dielectric, and ferroelectric properties of polycrystalline PZT films have been investigated as a function of preferred orientation. The property difference between (111) and (100)-oriented films appears to be induced by the effect of ferroelastic domain existence (90° domain in tetragonal composition). From a modified phenomenological equation, the higher electrostrictive coefficient value of 5.6 × 10⁻² m⁴/C² for (100)-oriented PZT may be responsible for the larger piezoelectric coefficients in (100)-oriented polycrystalline PZT films of 44 pm/V in comparison to (111)-oriented PZT films with about 3.1 × 10⁻² m⁴/C² of Q ₃₃ and 40 pm/V of d _33,f . It was also observed that two (100)-oriented films prepared by different heat treatments showed different values in piezoelectric, dielectric, and ferroelectric properties even though only (100) orientation was characterized for both cases. This process-induced difference may also play an important role in determining both intrinsic and extrinsic contribution to the properties, even though these parameters seem to be more responsible for extrinsic components, such as domain wall motion.     

溅射工艺参数对PZT铁电薄膜相变过程的影响

采用射频磁控溅射工艺,在（１１１）Ｐｔ／Ｔｉ／ＳｉＯ２／Ｓｉ衬底上用ＰＺＴ（５３／４７）陶瓷靶制备铁电薄膜。用快速光热退火炉对原位沉积的薄膜进行ＲＴＡ处理。     

Deflection of wafers and cantilevers with Pt/LNO/PZT/LNO/Pt/Ti/SiO2 multilayered structure

The present paper describes a Pt/LNO/PZT/LNO/Pt/Ti/SiO₂ multilayers deposited on 4-inch Si wafers. We have evaluated the variation of the deflection of the Si wafers with deposition of each of the thin films. The deposition of the multilayers has resulted in downward deflection (center is higher than edge) of the Si wafers. The multilayers have been also deposited onto SOI wafers and fabricated into piezoelectric micro cantilevers through MEMS bulk micromachining. The micro cantilevers have shown the upward deflection. We have characterized the ferroelectric and piezoelectric properties of the PZT thin films through electrical tests of the micro cantilevers. The dielectric constant, saturation polarization, remanent polarization and coercive field were measured to be 1050, 31.3 μC/cm², 9.1 μC/cm² and 21 kV/cm, respectively. The transverse piezoelectric constant, d₃₁, was measured to be − 110 pm/V from the DC response of the micro cantilevers.     

Preparation of (001)-oriented Pb(Zr,Ti)O3 thin films and their piezoelectric applications

Preparation of (001)-oriented Pb(Zr,Ti)O(3) (PZT) thin films and their applications to a sensor and actuators were investigated. These thin films, which have a composition close to the morphotropic phase boundary, were epitaxially grown on (100)MgO single-crystal substrates by RF magnetron sputtering. These (001)-oriented PZT thin films could be obtained on various kinds of substrates, such as glass and Si, by introducing (100)-oriented MgO buffer layers. In addition, the (001) oriented PZT thin films could be obtained on Si substrates without buffer layers by optimizing the sputtering conditions. All of these thin films showed excellent piezoelectric properties without the need for poling treatment. The PZT thin films on the MgO substrates had a high piezoelectric coefficient, d(31), of -100 pm/V, and an extremely low relative dielectric constant, epsilon(r), of 240. The PZT thin films on Si substrate had a very high d(31) of -150 pm/V and an epsilon(r) = 700. These PZT thin films were applied to an angular rate sensor with a tuning fork in a car navigation system, to a dual-stage actuator for positioning the magnetic head of a high-density hard disk drive, and to an actuator for an inkjet printer head for industrial on-demand printers.     

Preparation of (001)-oriented Pb(Zr,Ti)O/sub 3/ thin films and their piezoelectric applications

Preparation of (001)-oriented Pb(Zr,Ti)O₃ (PZT) thin films and their applications to a sensor and actuators were investigated. These thin films, which have a composition close to the morphotropic phase boundary, were epitaxially grown on (100)MgO single-crystal substrates by RF magnetron sputtering. These (001)-oriented PZT thin films could be obtained on various kinds of substrates, such as glass and Si, by introducing (100)-oriented MgO buffer layers. In addition, the (001)-oriented PZT thin films could be obtained on Si substrates without buffer layers by optimizing the sputtering conditions. All of these thin films showed excellent piezoelectric properties without the need for poling treatment. The PZT thin films on the MgO substrates had a high piezoelectric coefficient, d₃₁, of -100 pm/V, and an extremely low relative dielectric constant, epsiv_r, of 240. The PZT thin films on Si substrate had a very high d₃₁ of -150 pm/V and an epsiv_r = 700. These PZT thin films were applied to an angular rate sensor with a tuning fork in a car navigation system, to a dual-stage actuator for positioning the magnetic head of a high-density hard disk drive, and to an actuator for an inkjet printer head for industrial on-demand printers.     

Highly polarized single-c-domain single-crystal Pb(Mn,Nb)O(3)-PZT thin films

In-plane unstrained single-c-domain/single-crystal thin films of PZT-based ternary ferroelectric perovskite, ξPb(Mn,Nb)O3-(1 - ξ)PZT, were grown on SrRuO(3)/Pt/MgO substrates using magnetron sputtering followed by quenching. The sputtered unstrained thin films exhibit unique ferroelectric properties: high coercive field, Ec > 180 kV/cm, large remanent polarization, P(r) = 100 μC/cm(2), small relative dielectric constants, ε* = 100 to 150, high Curie temperature, Tc = ~600 °C, and bulk-like large transverse piezoelectric constants, e31,f = -12.0 C/m(2) for PZT(48/52) at ξ = 0.06. The unstrained thin films are an ideal structure to extract the bulk ferroelectric properties. Their micro-structures and ferroelectric properties are discussed in relation to the potential applications for piezoelectric MEMS.     

PZT铁电薄、厚膜及其制备技术研究进展

铁电薄、厚膜材料具有良好的铁电、压电、热释电、电光及非线性光学特性,在微电子学、光电子学、集成光学和微电子机械系统等领域有许多重要的应用.近年来,随着铁电薄、厚膜制备技术的发展,PZT厚膜材料及厚膜器件成为科学工作者研究的热点.介绍了PZT铁电薄、厚膜材料与器件的研究进展以及PZT铁电薄、厚膜制备技术及几种典型的PZT铁电薄、厚膜材料制备技术的特点,并指出了目前存在的一些问题和未来的发展方向.     

Dynamics of ferroelastic domains in ferroelectric thin films

Dynamics of domain interfaces in a broad range of functional thin-film materials is an area of great current interest. In ferroelectric thin films, a significantly enhanced piezoelectric response should be observed if non-180 degrees domain walls were to switch under electric field excitation. However, in continuous thin films they are clamped by the substrate, and therefore their contribution to the piezoelectric response is limited. In this paper we show that when the ferroelectric layer is patterned into discrete islands using a focused ion beam, the clamping effect is significantly reduced, thereby facilitating the movement of ferroelastic walls. Piezo-response scanning force microscopy images of such islands in PbZr0.2Ti0.8O3 thin films clearly point out that the 90 degrees domain walls can move. Capacitors 1 microm2 show a doubling of the remanent polarization at voltages higher than approximately 15 V, associated with 90 degrees domain switching, coupled with a d33 piezoelectric coefficient of approximately 250 pm V-1 at remanence, which is approximately three times the predicted value of 87 pm V-1 for a single domain single crystal.