Synthesis of epoxy resins from alcohol‐liquefied wood and the mechanical properties of the cured resins

New wood‐based epoxy resins were synthesized from alcohol‐liquefied wood. Wood was first liquefied by the reaction with polyethylene glycol and glycerin. The alcohol‐liquefied wood with plenty of hydroxyl groups were precursors for synthesizing the wood‐based epoxy resins. Namely, the alcoholic OH groups of the liquefied wood reacted with epichlorohydrin under alkali condition with a phase transfer catalyst, so that the epoxy groups were put in the liquefied wood. The wood‐based epoxy resins and the alcohol‐based epoxy resins as reference materials were cured with polyamide amine. The glass transition temperature (Tg), the tensile strength, and the modulus of elasticity of the wood‐based epoxy resin were higher than those of the alcohol‐based epoxy resin. Also, the shear adhesive strength of the wood‐based epoxy resin to steel plates was higher than those of the alcohol‐based epoxy resins, which was equivalent to the level of petroleum‐based bisphenol‐A type epoxy resins. The higher Tg of the wood‐based epoxy resin than that of the alcohol‐based epoxy resin is one of the evidences that the wood‐derived molecules were chemically incorporated into the network structures. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Adhesive and thermal characteristics of maleimide-functional novolac resins

A novel, addition-curable maleimide-functional novolac phenolic resin was evaluated for adhesive properties such as lap shear strength and T-peel strength using aluminium adherends, when thermally self-cured and cocured with epoxy resins. The adhesive properties of the self-cured resin, although inferior at ambient temperature, improved at high temperature and were found to depend on the cure conditions. When cocured with epoxy resin, the adhesive properties improved significantly and showed a strong dependence on the nature of the epoxy resin used, on the stoichiometry of the reactants, on the concentration of imide groups in the phenolic resin, and on the extent of polymerization of the maleimide groups. Optimum adhesive properties were obtained for novolac resins with a moderate concentration of maleimide groups, taken on a 1 : 1 hydroxyl–epoxy stoichiometry with a novolac epoxy resin. In comparison to the conventional novolac, the imide–novolac contributed to improved adhesion and better adhesive property retention at higher temperature when cured with the novolac–epoxy resin. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 695–705, 1999     

Bonding properties of epoxy resins containing two mesogenic groups

Liquid‐crystalline epoxy resins, with introduced aliphatic chains between two mesogenic groups, were synthesized and their adhesive bonding properties were compared to those of the bisphenol‐A–type epoxy resin and the liquid‐crystalline epoxy resin, previously reported. The bonding strength of the former resin system was higher than that of the two later systems. We suggest that the high bonding strength of the twin mesogenic epoxy resins, cured with an aromatic amine, was attributable to the large plastic deformation of the adhesive layer in the fracturing process. We also investigated the effects of the aliphatic chain length in the twin mesogenic epoxy resin on their dynamic mechanical and bonding properties. The bonding strength of the cured twin mesogenic epoxy resins increased with an increase in the aliphatic chain length. We suggest that the high bonding strength of the system introduced by the long aliphatic chain was attributable to the large plastic deformation of the adhesive layer because of the higher network mobility. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 3721–3729, 2004     

Heterocyclic‐based epoxy‐terminated structural adhesive. II. Curing,adhesive strength,and thermal stability

We studied the curing behavior of heterocyclic‐based epoxy‐terminated resins using diaminodiphenyl ether, diaminodiphenyl sulfone, benzophenone tetracarboxylicdianhydride, and the commercial hardener of Ciba‐Geigy's two‐pack Araldite as curing agents. The adhesive strength of the adhesives was measured by various ASTM methods such as lap‐shear, peel, and cohesive tests on metal–metal, wood–wood, and wood–metal interfaces. All of these results were compared with those of an epoxy resin prepared from bisphenol‐A and epichlorohydrin resin with an epoxy equivalent value of 0.519. The thermal stability of both the virgin resin and its cured form was also studied by thermogravimetric analysis. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 3520–3526, 2002     

Effect of Phenol/Formaldehyde Stoichiometry on the Modification of Epoxy Resin Using Epoxidized Novolacs

ABSTRACT

Unmodified epoxy resins based on bisphenol A exhibit brittleness and low elongation after cure. This article reports the results of a study for improving the properties of epoxy resin by blending with suitable thermosets. Hybrid polymer networks of diglycidyl ether of bisphenol A (DGEBA) resin with epoxidized phenolic novolac resins (EPN) containing phenol and formaldehyde in different stoichiometric ratios were prepared by physical blending. The modified epoxy resins were found to exhibit improved mechanical and thermal properties compared to the neat resin. DGEBA resins containing 2.5 to 20 wt% of epoxidized novolac resins (EPN) prepared in various stoichiometric ratios (1:0.6, 1:0.7, 1:08, and 1:0.9) between phenol and formaldehyde were cured using a room temperature amine hardener. The cured samples were tested for mechanical properties such as tensile strength, modulus, elongation, and energy absorption at break. All the EPNs are seen to improve tensile strength, elongation, and energy absorption at break of the resin. The blend of DGEBA with 10 wt% of EPN-3 (1:0.8) exhibits maximum improvement in strength, elongation, and energy absorption. EPN loading above 10 wt% is found to lower these properties in a manner similar to the behavior of any filler material. The property profiles of epoxy–EPN blends imply a toughening action by epoxidized novolac resins and the extent of modification is found to depend on the molar ratio between phenol and formaldehyde in the novolac.     

Effect of phenolic resin structure on the bonding properties of nitrile rubber-based adhesives

Three phenolic resins were used to study the effect of resin structure and its percentage content on the bonding properties of nitrile rubber-based adhesives. The phenolic resins studied are derived from phenol, resorcinol and para-t-butyl phenol, and are of novalac type. These resins were characterized by infra-red and thermal studies. Several formulations were prepared by varying the phenolic resin/nitrile rubber ratio and these formulations were tested for viscosity and bonding properties. At a given resin-to-rubber ratio, the viscosity for resorcinol-formaldehyde resin was higher than phenol-formaldehyde resin followed by para-t-butyl phenol-formaldehyde resin. The peel strength of nitrile rubber-based adhesive prepared from resorcinol-formaldehyde resin was higher than adhesives that from para-t-butyl phenol-formaldehyde resin followed by phenol-formaldehyde resin. The lap shear strength of nitrile rubber-based adhesive containing para-t-butyl phenol-formaldehyde resin was higher than of adhesives containing the other two resins. The trend observed in peel strength could be explained on the basis of hydrogen bonding between hydroxyl groups of phenolic resin (adhesive) and hydroxyl groups of the starch-coated canvas cloth (adherend), whereas the trend observed in lap shear strength could be explained on the basis of extent of linearity in the resin structure.     

Versatile bio-based epoxy resin: From banana waste to applied materials

Bio-based epoxy resin is a promising candidate for petroleum-based resins due to its abundant reserves and low-cost products, which mainly use polyphenolic composites as precursors. Liquefied banana pseudo stem (LBPS), a highly active compound obtained by liquefaction with 7.5% of sulfuric acid as catalyst at 160°C, was used to synthesize bio-based epoxy resin. FTIR and SEM demonstrated the synthetic process of LBPS-based epoxy resin (LBPSER) from waste banana pseudo stem (BPS). Mechanical test, reagent resistance, dynamic mechanical analysis, and thermogravimetric analysis were utilized to evaluate the mechanical and chemical properties of LBPSER. With polyamide (PA) as hardener, LBPSER-PA adhesive exhibited an optimum shear strength that is comparable with that of commercial diglycidyl ether of bisphenol A (DGEBA), corresponding to 11.86 vs 11.89 MPa. Interestingly, the shear strength of this adhesive curing at 40°C could get 9.52 MPa for wood materials. The adhesive also performed excellent resistance to organic agents, adverse acidic, and alkaline environments. Notably, as the content of LBPSER in adhesive increased, an increase of glass transition temperature could be verified from 42 to 100°C. The LBPSER-PA adhesive presented good thermal and physicochemical performances, thereby suggesting the potential of utilizing liquefied product from BPS as alternative to toxic bisphenol A in synthesizing bio-based epoxy resin. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 47135.     

Synthesis and cure kinetics of liquefied wood/phenol/formaldehyde resins

Wood liquefaction was conducted at a 2/1 phenol/wood ratio in two different reactors: (1) an atmospheric three‐necked flask reactor and (2) a sealed Parr reactor. The liquefied wood mixture (liquefied wood, unreacted phenol, and wood residue) was further condensed with formaldehyde under acidic conditions to synthesize two novolac‐type liquefied wood/phenol/formaldehyde (LWPF) resins: LWPF1 (the atmospheric reactor) and LWPF2 (the sealed reactor). The LWPF1 resin had a higher solid content and higher molecular weight than the LWPF2 resin. The cure kinetic mechanisms of the LWPF resins were investigated with dynamic and isothermal differential scanning calorimetry (DSC). The isothermal DSC data indicated that the cure reactions of both resins followed an autocatalytic mechanism. The activation energies of the liquefied wood resins were close to that of a reported lignin–phenol–formaldehyde resin but were higher than that of a typical phenol formaldehyde resin. The two liquefied wood resins followed similar cure kinetics; however, the LWPF1 resin had a higher activation energy for rate constant k₁ and a lower activation energy for rate constant k₂ than LWPF2. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Adhesive and flame resistance behavior of poly(arylene ether phosphine oxide) (PEPO) and PEPO‐modified epoxy resins

Poly(arylene ether phosphine oxide) (PEPO) with controlled molecular weights and amine end‐groups was synthesized, and used as an adhesive, a coating material for adherend or a modifier for diglycidyl ether of bisphenol A (DGEBA)‐based epoxy resins. Closely related poly(arylene ether sulfone) and commercial polyethersulfone, Udel® P‐1700, were also utilized for comparison purposes. Adhesive behavior was measured via single lap shear samples as a function of coated polymer type, test temperature (R.T. and 100°C), and aging condition in boiling distilled water or 5% salt water. Flame resistance of PEPO and PEPO‐modified epoxy resin was evaluated by TGA and a flame test. PEPO exhibited better adhesive properties than PES or Udel® P‐1700. PEPO coating on an Al adherend markedly improved adhesive property of PES and Udel® even at 100°C, and after aging study failure mode changed from adhesive to cohesive with the PEPO. Aminophenyl terminated PEPO‐modified epoxy resins also exhibited highly improved adhesive behavior and flame resistance, compared to control samples. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 80: 1198–1205, 2001     

Synthesis and properties of fluorinated biphenyl‐type epoxy resin

A novel fluorinated biphenyl‐type epoxy resin (FBE) was synthesized by epoxidation of a fluorinated biphenyl‐type phenolic resin, which was prepared by the condensation of 3‐trifluoromethylphenol and 4,4′‐bismethoxymethylbiphenyl catalyzed in the presence of strong Lewis acid. Resin blends mixed by FBE with phenolic resin as curing agent showed low melt viscosity (1.3–2.5 Pa s) at 120–122°C. Experimental results indicated that the cured fluorinated epoxy resins possess good thermal stability with 5% weight loss under 409–415°C, high glass‐transition temperature of 139–151°C (determined by dynamic mechanical analysis), and outstanding mechanical properties with flexural strength of 117–121 MPa as well as tensile strength of 71–72 MPa. The thermally cured fluorinated biphenyl‐type epoxy resin also showed good electrical insulation properties with volume resistivity of 0.5–0.8 × 10¹⁷ Ω cm and surface resistivity of 0.8–4.6 × 10¹⁶ Ω. The measured dielectric constants at 1 MHz were in the range of 3.8–4.1 and the measured dielectric dissipation factors (tan δ) were in the range of 3.6–3.8 × 10^?3. It was found that the fluorinated epoxy resins have improved dielectric properties, lower moisture adsorption, as well as better flame‐retardant properties compared with the corresponding commercial biphenyl‐type epoxy resins. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Resol‐type phenolic resin from liquefied phenolated wood and its application to phenolic foam

A liquefied wood‐based resol resin was prepared with excellent yield by a reaction of liquefied wood and formaldehyde under alkaline conditions. The effects of various reaction parameters on the extent of the yield of the resol resin, unreacted phenol content, and viscosity were investigated. Milder resol resinification conditions were required as compared to those used in conventional methods. The liquefied wood‐based resol resin was successfully applied to produce phenolic foam using appropriate combinations of foaming agents. Diisopropyl ether with a relatively higher boiling temperature was suitable for the foaming of liquefied wood‐based resol resin. Hydrochloric acid and poly(ethylene ether) of sorbitan monopalmitate were used as a catalyst and a surfactant, respectively. The obtained foams showed satisfactory densities and compressive properties, comparable to those of foams obtained from conventional resol resin. Foams with low density were obtained by the blending of liquefied wood‐based resol resin and conventional resol resin. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 468–472, 2002; DOI 10.1002/app.10018     

Elastomer modification of epoxy based film adhesives: adhesive and mechanical properties

Three approaches were employed to improve the flow and sandwich bonding properties of a nylon-carrier supported film adhesive based on carboxyl terminated butadiene acrylonitrile (CTBN)-modified novolac epoxy resin. These included the addition of a commercial acrylate flow modifier, replacement of novolac epoxy partly with solid diglycidyl ether of bisphenol A (DGEBA) resins, and replacement of CTBN partly with an epoxy functional acrylate terpolymer (EPOBAN). Adhesive properties such as lap shear strength (LSS), T-peel strength (TPS) and flatwise tensile strength (FTS) on honeycomb core bonded sandwich specimens were evaluated using aluminium adherends. The addition of the flow modifier in low concentrations enhanced the flexibility of the system and resulted in a marginal increase in LSS, TPS and FTS. Replacing novolac epoxy partly with solid DGEBA resulted in a less brittle system with enhanced LSS and TPS, but with reduced FTS due to the decreased flow characteristics. A substantial increase in FTS was observed when CTBN was partly replaced with EPOBAN. The introduction of EPOBAN resulted in good flow and fillet properties and the optimum FTS was obtained for the composition based on 25/75 CTBN/EPOBAN ratio. Mechanical properties of selected systems were also studied in addition to adhesive properties.     

Evaluation of block shear properties of selected extreme‐pH structural adhesives by short‐term exposure test

Nine structural adhesives with varying pH were selected to examine the effect of adhesive pH on wood–adhesive bond quality. The adhesives evaluated included four highly alkaline phenol–formaldehyde, one intermediate pH phenol–resorcinol–formaldehyde, two acidic melamine–urea–formaldehyde, and two acidic melamine–formaldehyde resins. Block shear specimens were prepared using Douglas‐fir and black spruce wood. The adhesive performance was evaluated by measuring the shear properties (strength and wood failure) of the specimens tested at the dry and vacuum–pressure–redry (VPD) conditions. Adhesive pH, test condition, and wood species showed significant effects on shear properties. The different adhesives performed differently at the dry and VPD conditions. The high‐pH adhesives (phenol–formaldehyde and phenol–resorcinol–formaldehyde) showed similar high wood failures at both test conditions and performed better than the low‐pH adhesives (melamine–formaldehyde and melamine–urea–formaldehyde), especially after the VPD conditioning. The low‐pH adhesives showed high wood failure at the dry condition, but wood failure decreased significantly after VPD conditioning for both species, indicating that the low‐pH adhesives were less durable than the high‐pH adhesives. High‐pH adhesives did not have a negative impact on the strength of the bonded specimens. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Preparation and properties of heat and ultraviolet‐induced bonding and debonding epoxy/epoxy acrylate adhesives

Heat and ultraviolet (UV)‐induced bonding and debonding (BDB) adhesives were designed and prepared through blending an epoxy resin, diglycidyl ether of bisphenol A (DGEBA) with an epoxy acrylate resin, bisphenol‐A epoxy acrylate resin (BEA). The variation of the chemical structure of DGEBA and BEA in the sequential heat‐ and UV‐curing processes was characterized by Fourier transform infrared spectroscopy (FTIR). The FTIR results indicate that DGEBA and BEA successfully took part in both the heat‐curing and UV‐curing processes. The effects of the mass ratio of BEA to DGEBA, amount of heat‐curing agent, type of diluents, and UV irradiation time on the BDB properties of BDB adhesive were systematically investigated. The results show that the bonding strength increases with the decrease of the mass ratio of BEA to DGEBA and with the increase of the amount of heat‐curing agent in a certain range. The debonding strength decreases with the increase of the mass ratio of BEA to DGEBA. The mass ratio of BEA to DGEBA was set at 10 to ensure the ratio of the bonding strength to debonding strength greater than 10 times. The debonding strength of BDB adhesives also depends on the UV irradiation time, decreasing with the increase of UV irradiation time in a certain range. Based on the FTIR results and the dependence of the bonding and deboning strengths on the reaction conditions, a possible BDB mechanism of BDB adhesive was proposed. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46435.     

Carboxyl‐terminated butadiene acrylonitrile rubber/epoxy polymer alloys as damping adhesives and energy absorbable resins

Carboxyl‐terminated butadiene acrylonitrile (CTBN) liquid rubber/epoxy (diglycidyl ether of bisphenol‐A: DGEBA) / diamino diphenyl methane (DDM) resins, in which CTBN was 60 wt % as the major component, were formulated to evaluate the damping and adhesive properties. In cases where acrylonitrile (AN) was 10～18 mol % as copolymerization ratio in CTBN, the blend resins showed micro‐phase separated morphologies with rubber‐rich continuous phases and epoxy‐rich dispersed phases. The composite loss factors (η) for steel laminates, which consisted of two steel plates with a resin layer in between, depended highly on the environmental temperature and the resonant frequencies. On the other hand, in the case where AN was 26 mol % in CTBN, the cured resin did not show clear micro‐phase separation, which means the components achieve good compatibility in nano‐scale. This polymer alloy had a broad glass‐transition temperature range, which resulted in the high loss factor (η > 0.1) for the steel laminates and excellent energy absorbability as the bulk resin in a broad temperature range. Also the resin indicated high adhesive strengths to aluminum substrates under both shear and peel stress modes. The high adhesive strengths of the CTBN/epoxy polymer alloy originated in the high strength and the high strain energy to failure of the bulk resin. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Effects of the surface state of plastics on adhesive strength in electroless plating

Adhesive resins with high adhesive strength and high heat resistance have been studied in developing a novel iron-core printed circuit board with high mechanical strength and high heat radiation capability. A reticular pattern formed on the surface of an adhesive resin composed of nitrile rubber, phenolic resin and epoxy resin. It caused blisters in the plating or reduced the heat resistance of the printed board. This pattern was formed as a result of phase separation of epoxy resin or phenolic resin from the nitrile rubber. Using a high-molecular-weight epoxy resin led to high adhesive strength and high heat resistance, without phase separation. The relationships between the composition of adhesive resins and their characteristics were discussed on the basis of the state of their surface after being roughened by chemical etching. © 1996 John Wiley & Sons, Inc.     

Properties of compression‐molded plates made from wood powders impregnated with liquefied wood‐based novolak‐type phenol‐formaldehyde resins

Novolak‐type phenol‐formaldehyde (PF) resins with solution form were prepared by reacting phenol‐liquefied Cryptomeria japonica (Japanese cedar) wood with formalin in the presence of methanol. Wood powders of Albizzia falcate (Malacca albizzia) impregnated with these resins were air dried followed by an oven‐dried at 60°C. DSC analysis showed the PF resin existing in wood powders could be melted, and could be cured if hexamine was mixed and heated at high temperature. Compression‐molded plates made with PF resin impregnated woods had a high degree of curing reaction. However, compression‐molded plates hot‐pressed at 180°C for 8 min or 200°C for 5 min had better internal bonding strength and dimensional stability than others. Premixing hexamine with PF resin and impregnating into wood powders simultaneously could enhance the reactivity of PF resin, but it was not useful for improving the properties of compression‐molded plates. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

The synthesis and characterization of a novel phosphorus–nitrogen containing flame retardant and its application in epoxy resins

A novel, halogen‐free, phosphorus–nitrogen containing flame retardant 2[4‐(2,4,6‐Tris{4‐[(5,5‐dimethyl‐2‐oxo‐2λ⁵‐[1,3,2]dioxaphosphinan‐2‐yl)hydroxymethyl]phenoxy}‐(1,3,5)‐triazine (TNTP) was successfully synthesized in a three‐step process, and characterized by FTIR, NMR spectroscopy, mass spectra, and elemental analysis. A series of modified DGEBA epoxy resin with different loadings of TNTP were prepared and cured by 4,4‐diaminodiphenylsulfone (DDS). Thermal gravimetric analysis and vertical burning test (UL‐94) were used to evaluate the flame retardancy of TNTP on DGEBA epoxy resin. The results showed that TNTP had a great impact on flame retardancy. All modified thermosets by using TNTP exhibited higher T_g than pure DGEBA/DDS. The loading of TNTP at only 5.0 wt % could result in satisfied flame retardancy (UL‐94, V‐0) together with high char residue (27.3%) at 700°C. The addition of TNTP could dramatically enhance the flame retardancy of DGEBA epoxy resins, which was further confirmed by the analysis of the char residues by scanning electron microscopy and FTIR. Furthermore, no obviously negative effect was found on the Izod impact strength and flexural property of DGEBA epoxy resins when TNTP loading limited in 5.0 wt %. DGEBA/DDS containing 2.5 wt % TNTP could enhance Izod impact strength from 10.47 to 10.94 kJ m^?2, and showed no appreciable effect on the flexural property (85.20 MPa) comparing with pure DGEBA/DDS (87.03 MPa). Results indicated that TNTP as a phosphorus–nitrogen synergistic intumescent flame retardant could be used for DGEBA epoxy resin. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 41079.     

水相中合成木质素环氧树脂及其在木材胶黏剂中的应用

以木质素为原料,在水相中合成一种适用于木材胶黏剂的木质素环氧树脂。为了考察木质素环氧化反应条件对木质素环氧树脂的羟基和环氧基的影响,以及对胶合板的胶合强度的影响,采用FT-IR和31PNMR对木质素环氧树脂结构进行表征,并用TG和DTG对木质素环氧树脂的热稳定性进行分析。结果表明,环氧化反应主要发生在酚羟基上,在反应过程中,相比环氧氯丙烷,NaOH的加入量对木质素环氧树脂结构和胶合板的胶合强度影响更大。随NaOH加入量增加,木质素环氧树脂中环氧基团逐渐增多,胶合板的胶合强度呈现先升高、后降低的趋势。当木质素的羟基与NaOH摩尔比为1:1时,由木质素环氧树脂制得的胶合板胶合强度达到最大,湿强度达1.61 MPa,超过国家标准II类板的要求(≥0.7 MPa)。采用扫描电镜研究了黏接机理,发现环氧化程度提高时,固化后的木质素环氧树脂的结构更加稳定且致密,导致胶合板的胶合强度也提高。但过高的环氧化程度会增大胶黏剂的粒径,导致胶黏剂与木板不能形成更好的机械互锁结构,从而降低胶合板的胶合强度。还进一步简化了木质素环氧树脂木材胶黏剂的合成工艺,使环氧化反应后的体系无需处理即可直接应用于木材胶黏剂,减少了胶合板生产工艺流程。此外,经过30天的储存期,胶黏剂黏合强度没有明显下降。通过与商业脲醛树脂木材胶黏剂对比,其黏接强度可以达到商业脲醛树脂的水平。     

Preparation and Application of a New Curing Agent for Epoxy Resin

A new curing agent based on palmitoleic acid methyl ester modified amine (PAMEA) for epoxy resin was synthesized and characterized. Diglycidyl ether of bisphenol A (DGEBA) epoxy resins cured with different content of PAMEA along with diethylenetriamine (DETA) were prepared. The mechanical properties, dynamic mechanical properties, thermal properties, and morphology were investigated. The results indicated that the PAMEA curing agent can improve the impact strength of the cured epoxy resins considerably in comparison with the DETA curing agent, while the modulus and strength of the cured resin can also be improved slightly. When the PAMEA/epoxy resin weight ratio is 30/100, the comprehensive mechanical properties of the cured epoxy resin are optimal; at the same time, the crosslinking density and glass transition temperature of the cured epoxy resin are maximal.