某型导弹飞行控制组件动态测试研究

在某型导弹飞行控制组件测试中,介绍了飞行控制组件采用的几种测试技术,提出了使用动态测试技术进行测试的方法,并对飞行控制组件动态测试的实现方法进行了介绍。在静态测试所用的飞行控制组件专用测试设备基础上,增加加速度激励注入和角速度激励注入模块,通过飞行控制组件预留接口注入激励信号,实现了飞行控制组件的加速度和角速度的高精度定量输出,优化了飞行控制组件测试手段,为全面检测飞行控制组件的软硬件系统奠定了基础。     

LCoS光引擎成像测试实验方法及结果分析

为了掌握LCoS光引擎各组件的实际工作情况,了解实际装配过程中的误差对成像质量的影响,文章介绍了一种通过在光学平台上搭建系统光路来进行LCoS光引擎成像测试的实验方法,并对测试实验的结果做出了详细的分析。     

LCoS光引擎成像测试实验方法及结果分析

光引擎是硅基液晶（LCoS）投影显示系统的核心部件。为了掌握LCoS光引擎各组件的实际工作情况,了解实际装配过程中的误差对成像质量的影响,以被广泛使用的三片式ColorQuadTM结构LCoS光引擎为例,介绍了一种通过在光学平台上搭建系统光路来进行LCoS光引擎成像测试的实验方法。先进行光源模组、分光合光、投影成像这三...     

螺纹式射频同轴电缆组件的测试工艺改进

在加工螺纹式射频同轴电缆组件过程中,需要对每根组件进行多次测试,测试时间占用了大部分批次生产时间,测试时间的缩短对提高螺纹式射频同轴电缆组件的生产效率具有重要的意义。受插拔式连接器的启发,对螺纹式连接器进行了改装,将连接组件连接器和测试仪器的转接器中的一端螺纹磨平。通过取消连接器与转接器的螺纹拧紧和拆卸的动作使测试时间平均缩短了70%,目前已在部分研制课题中得到试用。     

收发组件测试技术研究

针对有源相控阵雷达系统研制生产中大量的收发组件测试工作,提出了一种改进的收发组件的测试方法.针对不同的应用需求,分别介绍了典型的收发组件测试系统及改进型的测试系统.在改进型测试系统中,采用了一种基于单片杌的核心控制板对收发组件的电源和工作时序进行保护.并提出了一种基于核心控制板的收发组件测试系统组建方案,该测试系统方案自动化程度高、通用性强并对测试过程具有完善保护.该方案组建的测试系统,具有测试效率高、人工操作少及组建成本低等优点.     

基于实时参数的光伏组件发电特性测试系统北大核心CSCD

光伏组件发电特性对优化光伏发电系统的发电效率具有重要意义。常见的光伏组件发电特性由理论仿真得到,其与实际应用有一定差距。采用光照传感器、温度传感器采集环境参数,采用电流计、电压计检测光生电流、反向截止电流、开路电压等参数,建立了光伏组件发电特性计算模型,实现了光伏组件的发电特性精确测试,得到不同环境参数下输出电压-输出电流、输出功率-输出电压的发电特性曲线。仿真和工程测试证明,基于上述特性曲线的光伏发电系统在进行最大功率控制时能够取得较好的效果,与理论值的误差小于1%。     

EL测试在光伏太阳能电池检测中的应用

为了满足客户对太阳能电池组件性能的更高要求,通过对电池片的EL测试,从来料方面进行把关,通过对层压敷设件和组件的EL测试,能够合理的控制由于工艺参数设置不当和人为因素引起的组件不良缺陷,从而能够将问题消灭在组件出厂之前,保证组件质量。同时,通过分析EL图像,也有助于完善和改进电池片以及组件的生产工艺,对太阳能电池的生产有重要指导意义。     

耦合及激光焊接工艺对光组件跟踪误差的影响

为了缩小光组件的跟踪误差的范围,以保持光组件在高低温工作状态下输出功率稳定性,对耦合和激光焊接工艺进行了研究。通过对光组件关键工艺参数开展大量对比优化试验,深入分析了耦合离焦量、焊接能量、焊点个数对光组件跟踪误差的影响,得到优化后工艺参数：耦合离焦量为26μm,单脉冲焊接能量为3 J,焊点为12点均分。采用优化后的工艺参数进行了100支器件小批制作和测试,结果表明,光组件的跟踪误差能从±1.5 dB缩小到±1.3 dB。     

多晶硅光伏组件功率测试偏差分析

随着石化资源的日益枯竭,太阳能作为可再生清洁能源其可持续发展的前景日益广阔。在《能源发展战略行动计划2014-2020》中,我国的非化石能源比重要达到15%,而目前非化石能源的比重不到10%。太阳能作为清洁的新能源之一,在未来能源行业仍大有可为。目前世界主流的光伏组件有多晶硅光伏组件、单晶硅组件以及薄膜组件。本文对多晶硅光伏组件功率测试结果偏差进行了简单的分析,对比各实验室对同一组件的功率测试结果,找出测试结果偏差的原因,为光伏电站投资提供参考。     

高频多端口组件与平衡式组件测试

多端口组件测试与一般双端口组件测试略有不同,除信号路径增加外,另需特别考虑测试架构的设定。平衡式组件的测试概念则与一般同轴或单端(coaxil,single ended)组件有很大不同,且需测量的参数也增加。本文将介绍多端口及平衡式组件的特性测量参数概念、方法,以简单的方向性耦合器及BALUN为测试例子,让读者能对高频多端口组件与平衡式组件测试有基本的认识。     

A Computerized Klinger Cavity Mode Conversion Test Set

A mode conversion test set utilizing the klinger cavity technique has been developed for characterizing circular waveguide components in the millimeter waveguide region. The test set incorporates a precision linear displacement optical encoder and a specially designed controller which interfaces the test set to a Hewlett-Packard 2100 series computer. Control commands of a stored computer program are used by the operator for data acquisition and analysis. Experimental results show this system has high measurement accuracy and sensitivity while maintaining an uncomplicated measurement process.     

An Experimental Telecommunications Test Bed

Although the computer and telecommunications industries have traditionally represented two very different cultures, recent advances in circuit and system technology have blurred many of their past distinctions. A digital system test bed environment has been implemented that not only supports but encourages the use of terminal, switching, and processing capabilities for both computing and communicating. One of our major goals was to provide a test bed environment for conducting telecommunications terminal (teleterminal) experiments in the context of work, school, home, and play. Model scenarios for each environment are briefly described. Physically, the experimental environment is a blend of model shop and commercial systems and components. Adaptability and versatility have been given higher priority than manufacturability. The testing of concepts is deemed more relevant than the testing of components. The resulting environment does not model all of the application areas but has provided a wealth of illustrative data and insights that are described in companion papers.     

Extending a DWDM Optical Network Test System to 12 Gbps x4 Channels

A “Development Platform” for prototyping new multi-GHz ATE has recently been introduced (Keezer et al. 2009). The first application was a multi-channel test system for characterizing an optical network switch operating at 2.5 Gbps per channel (Keezer et al. 2009, 2010). Nine transmitter channels (TX) and nine receivers (RX) were used to test the Dense Wavelength Division Multiplexing (DWDM) switching network. This present paper incorporates elements from the prototype designs into full-feature test modules targeting applications between 2.5 Gbps and 24.0 Gbps per channel. Specifically, the optical test system is extended for burst-mode 12 Gbps DWDM packets (more than 4-times the rate of the original system). Using 8 TX channels, an aggregate data rate of 96 Gbps is achieved. Alternatively, some modules can be configured to double the channel-count (up to 18) while operating at the lower 2.5 Gbps rate (45 Gbps aggregate rate). Lower rates permit use of lower-cost optical components. Two new modules are described with testability features such as: (1) support for “loopback” testing of DUT output-to-inputs, (2) DC electrical tests, (3) 2-to-1 multiplexing up to 24 Gbps, (4) ATE self-test/calibration loopback paths. Recently multiple Development Platforms have been constructed that can operate either independently or synchronized using very low-jitter (~1 ps RMS) clock distribution paths.     

楼宇通用布线系统光纤链路及其构件的性能和测试

从楼宇通用布线系统光纤链路以及构件的性能和测试角度,对当前相关国内外标准的技术内容及其差异和支撑性标准的情况进行了简要介绍,旨在探讨在当前不同的相关标准同时并存的情况下,如何恰当地选用合适的标准及对这些楼宇通用布线系统光纤链路的性能进行恰当的评估。     

智能化生产测试解决方案实现下一代智能化光网络

在网络发展过程中，元器件生产厂商在推动技术发展的同时需要不断降低成本，这是在当前市场中保持竞争优势的唯一方式。影响光器件成本结构的一个重要因素是测试成本，它最多可以占到光器件成本的40％。安捷伦光通信测试解决方案体现了光纤技术的发展，数量日益增多的各种元器件要求通用的光器件测试解决方案。光器件测试解决方案必须面对的新的挑战是强力支持元器件生产中降低成本的目标。智能测试解决方案对下一代生产车间的主要贡献在于现生产环境自动化、降低测试成本、同时增强光通信测试精确、快速、可靠测量的优势。     

分布式光纤传感技术在蜗壳模型试验中的应用

分布式光纤传感器与传统应变片和光纤光栅传感器相比,具有分布式测量的显著特点,成为传感器领域的研究热点。随着技术的进步,基于瑞利散射的光频域反射技术(OFDR)得到了迅速的发展。该文介绍了OFDR的测量原理,并将分布式光纤传感器应用于蜗壳模型试验中。为检验蜗壳充水后的变形规律,检查蜗壳和混凝土的整体安全性和设计的合理性,对蜗壳试验过程中外围混凝土应变进行监测。通过分布式光纤传感器在每级水压加载下产生的应变,获得蜗壳模型外部变形以及裂缝发展的情况。实验结果表明,分布式光纤传感器能够真实地反应结构物的应变分布,及时准确地监测蜗壳模型在加压作用下混凝土变形及开裂情况,对结构的损伤进行识别。     

A Novel Test Strategy for Fine Pitch Wafer-Level Packaged Devices

This paper describes an innovative test strategy comprising a compliant elastomer mesh for testing fine pitch wafer-level package (WLP) devices. The test probe, hardware, and sample preparation processes are detailed. The components of the test hardware socket such as the SMA connectors, coplanar transmission lines on the PCB, via, off-chip interconnect, and elastomer mesh probe have been modeled. A complete system-level model, with off-chip interconnects on the WLP device pads, has been developed. The measurement and model demonstrate that the prototype test socket performs at 5 GHz with an insertion loss of about 3 dB. WLP device with Bed-of-Nail interconnects are characterized. Functional test features of the system are also addressed.     

Real-Time Adaptive Test Algorithm Including Test Escape Estimation Method

This work aims to reduce the test time per chip, but affect the quality of the products only as little as possible compared to the conventional semiconductor test. For that purpose, a simulation software has been developed that performs adaptive test simulations based on real data and test results of conventional production testing. Products has been analyzed and both the potential for test time savings and the resulting loss of quality are determined. Finally, it is shown that by the intelligent omission of tests, compared to conventional testing procedures, test time reduction of up to 50 % can be achieved. In contrast, there are only few defective components that are not detected by the adaptive test procedure and which reduced the quality of products. In best case, the fraction of test escapes was under 40 ppm. To handle the potential risk of test escapes this paper also introduces a statistical estimation method.     

三维集成电路测试进展

从小柳光正教授1978年堆叠的两只MOS电容DRAM的三维结构出发,到2010年半导体业界提出了Cu-TSV工艺方法,演进出一部三维集成微纳电子学。本文梳理近6年内的3D-IC测试的一次文献,重点分析了键合前测试、键合中测试和键合后测试。尝试从不同的角度,例如内建自测试、探头技术、串扰、短路与开路检测,以及基于成本优化的温升与应力检测,讨论3D-IC测试所遇到的难题及其解决方法。未来的3D-IC测试技术看好小组数超微探针技术、DfX技术和自适应测试,测试的优化方向必将考虑"成本与功耗折中权重下的良率"新模型。     

下一代光传输系统中超高速ADC芯片性能测试方法

针对下一代光传输系统对模数转换器（ADC）高采样率、大带宽的要求,提出一种针对该类ADC动态性能的测试方法.通过分析光传输系统中ADC芯片的特点,解决了采样时钟无法直接测量,输出数据难以捕获,分辨率不易统计,插损非线性导致带宽测量偏差等问题,并将该方法应用于光传输、雷达、卫星等高数据率场景所用超高速ADC芯片的评测中.测试结果表明,该方法解决了最高采样率70GSPS带宽16GHz的超高速ADC测试的关键问题,基本满足下一代400Gbps光传输系统对ADC动态性能测试的要求.