溅射气压和偏置磁场对FeSiCoB薄膜应力阻抗性能的影响

利用磁控溅射,通过溅射过程中施加一横向静磁场,并在真空中退火的方法在玻璃基片上制备了FeCoSiB薄膜.当偏置磁场从4800 A/m增加到9600 A/m时,薄膜的应力阻抗从0.5%提高到1.65%.在2 Pa溅射气压和9600 A/m的偏置场下,获得了1.65%的阻抗相对变化.     

用于高灵敏微磁传感器的LMO膜制备与分析

采用溶胶凝胶法制备了LaMnOx(LMO)薄膜,系统研究了不同烧结温度、纵向直流磁场后退火和生长膜层数对LMO薄膜的巨磁阻抗效应的影响。结果表明,烧结温度、膜的层数以及纵向磁场后退火处理均有效提高了LMO的巨磁阻抗比,其中纵向直流磁场后退火处理提高薄膜阻抗比效果最显著,经过10Oe、400℃恒温1h磁场后退火处理后,在频率5MHz、100Oe外磁场下其磁阻抗比达15.8%,相比未后处理样品磁阻抗比提高了一倍,其对应的磁场灵敏度为0.16%/Oe。同时,实验发现磁场后退火不仅影响薄膜的巨磁阻抗比,也会改变阻抗比极大值所对应的激励频率,这一现象目前仍在探究中。     

弯曲形FeSiB/Cu/FeSiB多层膜的应力阻抗效应

用磁控溅射法制备弯曲形FeSiB/Cu/FeSiB多层膜,在1~40MHz范围内研究FeSiB膜和Cu膜厚度对多层膜结构应力阻抗效应的影响。结果表明:多层膜的应力阻抗效应随着其形变位移的增加近似线性增加,在自由端变形1mm、电流频率5MHz时,应力阻抗效应达–17.3%,在新型力敏传感器方面具有广阔的应用前景。     

FeZrBNb单层膜的巨磁阻抗效应

用高频溅射法制备了FeZrBNb合金薄膜,研究了制备条件、制备工艺对薄膜样品巨磁阻抗效应的影响.结果表明,增大薄膜的厚度可以提高样品的阻抗比,13 MHz下,厚度为10.8 μm的薄膜样品的最大纵向阻抗比为2.5％;在制备过程中加磁场可以在薄膜中感生出磁各向异性场,进而提高薄膜的阻抗比.同时,退火可以提高材料的软磁特性,增强薄膜的巨磁阻抗效应,对薄膜进行退火处理后,薄膜的纵向和横向阻抗比分别提高到1.7％和1.5％.     

曲折型三明治结构FeNi/Cu/FeNi多层膜巨磁阻抗效应研究

采用微机电系统(MEMS)技术在玻璃基片上制备了曲折型三明治结构FeNi/Cu/FeNi多层膜,在电流频率1～40 MHz范围内研究了FeNi/Cu/FeNi多层膜的巨磁阻抗(GMI)效应,并分别通过改变FeNi薄膜的宽度、厚度和Cu薄膜的宽度,研究了尺寸对巨磁阻抗效应的影响,当磁场Ha施加在薄膜的纵轴时,巨磁阻抗变化...     

内应力对玻璃包覆钴基非晶丝巨磁阻抗的影响

通过测量玻璃包覆钴基非晶丝、去除玻璃包覆层非晶丝和经直流焦耳热退火后玻璃包覆非晶丝的磁阻抗值,研究了玻璃包覆层和直流退火对玻璃包覆钴基非晶丝内应力及巨磁阻抗效应的影响。结果表明:通过处理,玻璃包覆非晶丝的GMI最大值更容易在弱磁场出现;随着淬火残余内应力的改变,导致样品壳内畴的体积增加,引起应力感生横向各向异性,从而增强GMI效应;其中经90mA直流退火的样品GMI峰值最大可达144%。     

张应力退火对玻璃包覆钴基非晶丝GMI影响

采用张应力–焦耳热方式对玻璃包覆钴基非晶丝进行退火,测量其退火后的磁滞回线和磁阻抗值,研究张应力退火对玻璃包覆钴基非晶丝静磁性能和巨磁阻抗(GMI)效应的影响。结果表明:通过处理,其各向异性场降低,其中经140MPa张应力退火的样品GMI峰值最大可达80%,所对应的磁场强度降至60A/m。随着玻璃包覆钴基非晶丝内应力的改变,导致样品壳内畴的体积增加,引起应力感生横向各向异性,从而影响GMI效应。     

ULSI Cu互连CoSiN扩散阻挡薄膜的研究

CoSiN薄膜可以作为超大规模集成电路Cu布线互连材料使用。利用磁控溅射技术制备了CoSiN/Cu/CoSiN/SiO2/Si薄膜,利用四探针测试仪、薄膜测厚仪、原子力显微镜、X射线光电子能谱仪等来检测多层膜电阻率、薄膜厚度、表面形貌、元素含量及价态等。考察亚45 nm级工艺条件下CoSiN薄膜对Cu的扩散阻挡性能。实验结果表明,在氩气气氛条件下经500℃,30 min热退火处理后多层膜的电阻率和成分没有发生明显变化,CoSiN薄膜能够保持良好的铜扩散阻挡性能;经600℃,30 min热退火处理后,Cu大量出现在表面,CoSiN薄膜对Cu失去扩散阻挡性能。     

退火处理对Cu、CuNi薄膜及其热电偶电性能的影响

采用磁控溅射法在单晶硅片基底上制备多个Cu薄膜和CuNi薄膜,对其进行退火处理,分析不同退火温度对薄膜电阻率的影响。结果显示,随着退火温度的升高,两种薄膜的电阻率逐渐减小,且Cu薄膜的电阻率变化较CuNi薄膜更为明显。在镀有SiO2绝缘膜的硅片基底上制备T型(Cu/CuNi)薄膜热电偶,并进行退火处理,对退火前后的热电偶进行静态标定。实验数据表明,T型薄膜热电偶经过退火处理后,灵敏度由退火前38.35μV/℃增大到44.10μV/℃。     

FeCuNbCrSiB薄膜的制备及其巨磁阻抗效应研究

采用磁控溅射方法,在玻璃基片上制备了非晶的Fe73.5Cu1Nb3Cr0.5Si13B9薄膜及三明治结构M/C/M(M为Fe73.5Cu1Nb3Cr0.5Si13B9;C为Cu)的多层膜。在频率(1~40)MHz下,研究了薄膜材料的巨磁阻抗(GMI)效应随外加磁场的变化关系。结果表明:单层膜的GMI效应较小,只有4.4%;而三明治结构多层膜的GMI效应,比单层膜有较大幅度的提高,在5MHz、120Oe下,纵向和横向GMI效应分别达–17.4%和–20.7%。薄膜材料的纵向GMI效应随外加磁场变化呈现先增后减,而横向GMI效应随外加磁场的增加而单调递减,其变化规律与薄膜的易轴取向有很大关系。     

The effect of O<Subscript>2</Subscript> ambient annealing on the microstructure of Cu(Mg) in the form of a Cu(Mg)/SiO<Subscript>2</Subscript>/Si multilayer

The effect of annealing in an O₂ ambient on Cu(Mg)/SiO₂/Si multilayer films was investigated. As-deposited Cu(Mg)/SiO₂/Si multilayer samples with film thicknesses in the 1,000–3,000 ? range were annealed for 30 min in oxygen ambients at pressures ranging from vacuum to 100 mtorr. The results showed that annealing in an 8-mtorr O₂ ambient significantly decreased the electrical resistivity of a 1,000 ? sample from 10.5 μΩ-cm to 3.7 μΩ-cm. Annealing in the O₂ ambient enhanced Mg diffusion to the surface in comparison to vacuum annealing. Furthermore, O₂ ambient annealing leads to excessive grain growth. However, the effect of O₂ ambient annealing on resistivity is less when the thickness of the film increases.     

Properties of ZnO/Cu/ZnO multilayer films deposited by simultaneous RF and DC magnetron sputtering at different substrate temperatures

ZnO/Cu/ZnO transparent conductive multilayer films are prepared by simultaneous RF sputtering of ZnO and DC sputtering of Cu. The properties of the multilayer films are studied at different substrate temperatures. Sheet resistance of the multilayer film decreased initially with increase of substrate temperature and increased further with increase of substrate temperature beyond 100 °C. However, transmittance of the multilayer film increased with increase of substrate temperature. Good transparent conductive film of sheet resistance 9.3 Ω/sq and transmittance of 85% was found at a substrate temperature of 100 °C. The performance of the multilayer film was evaluated using a figure of merit. The observed property of the multilayer film is suitable for the application of transparent conductive electrodes.     

不同调制周期Cu/TaN多层膜的微结构与表面形貌

采用磁控溅射方法在Si(111)基底上沉积不同调制周期的Cu/TaN多层膜,用X射线衍射仪(XRD)与原子力显微镜(AFM)表征薄膜微结构与表面形貌,研究了不同调制周期L薄膜的微结构与表面形貌.结果表明:不同L的TaN调制层均为非晶结构,多晶Cu调制层的晶粒取向组成随着L改变而变化; Cu调制层的表面粗糙度Rrms.大于TaN调制层的Rrms;与Cu单层膜相比,最外层为Cu调制层的Cu/TaN多层膜的Rrms较小;与TaN单层膜相比,最外层为TaN调制层的Cu/TaN多层膜的/Rrms较大;随着L增加,多层膜与对应的单层膜之间的兄Rrms差值逐渐减小.     

多层四面体非晶碳膜的热稳定性

为了获得具有一定厚度的四面体非晶碳薄膜,利用过滤阴极真空电弧(FCVA)沉积技术,通过交替改变衬底偏压的方法制备了多层四面体非晶碳(ta?鄄C)薄膜。多层膜由富sp2子膜层Ai与富sp3子膜层Bi交替组成(i=1,2,3),各子膜层厚度比dAi/dBi约为1.0,总的膜厚约为1 m。根据Stoney公式计算多层膜的各子膜层压应力呈交替起伏变化。多层四面体非晶碳膜在500 ℃以下的真空退火处理后,可见光Raman谱表明,多层膜的富sp3杂化结构基本保持不变,纳米压痕测量的薄膜硬度与杨氏模量略微增加,纳米划擦实验表明,多层膜具有优良的耐磨性与附着性。因此,多层ta?鄄C膜具有优良的力学性能和热稳定性,是一种优异的航空航天用光学元件的表面保护膜。     

High Frequency Resonance Features of Giant Magnetoresistance Multilayers

High frequency resonance technique was applied to study of magnetic multilayer Co/Cu films possess the giant magnetoresistance. The results of the ferromagnetic resonance study in 60GHz-80GHz and 1OGHz bands revealed low temperature changes of g-factor after annealing and a very small value of high frequency saturation magnetization. An abrupt change of the specimen impedance was registered in low field low field range for 10GHz. The static magnetic characteristics as hysteresis and magnetoresistance loops were obtained at room temperature for the planar orientation of external magnetic field.     

基于柔性衬底的磁声表面波谐振器

针对在柔性衬底上制备非晶软磁薄膜的技术难题,该文研究并制作了一种基于柔性聚酰亚胺(PI)衬底的磁声表面波(MSAW)谐振器。通过在柔性PI衬底上溅射沉积了非晶FeCoSiB磁致伸缩薄膜和ScAlN压电薄膜,光刻制备了叉指电极,并形成IDT/ScAlN/FeCoSiB/PI层状结构,成功获得了柔性MSAW谐振器。采用X线衍射(XRD)和原子力显微镜(AFM)分析了薄膜的结构和表面形貌及利用振动样品磁强计(VSM)和短路微带线法测试了FeCoSiB薄膜的静态磁性和高频磁谱特性,最后在探针台上利用矢量网络分析仪对器件进行测试,并与COMSOL仿真结果进行对比。实验结果表明,该MSAW器件有两个谐振峰,其中瑞利波出现在28.32 MHz,兰姆波出现在93.69 MHz。     

Fabrication of CNTs/Cu composite thin films for interconnects application

Carbon nanotubes/copper (CNTs/Cu) composite thin films were fabricated by combined electrophoresis and electroplating techniques. Electrical properties and structure of both CNTs/Cu thin films and the reference pure Cu thin films were investigated after annealing at different temperatures. The sheet electrical resistance of CNTs/Cu films decreases faster than that of pure Cu films with increase of annealing temperature. The grain size of CNTs/Cu film becomes much larger than that of pure Cu film at the same annealing temperature. The peak relative intensity of Cu (1 1 1) plane in CNTs/Cu film was stronger than that of pure Cu film. CNTs/Cu composite thin films, with better electrical properties than that of conventional pure Cu thin films, have been fabricated by electrophoresis and electroplating deposition techniques.     

Improvements of resonance characteristics due to thermal annealing of Bragg reflectors in ZnO-based FBAR devices

The effects of thermal annealing of W/SiO/sub 2/ multilayer Bragg reflectors on the resonance characteristics of ZnO-based film bulk acoustic resonator (FBAR) devices are presented for the first time. The resonance characteristics could be significantly improved due to thermal annealing. FBAR devices with Bragg reflectors annealed at 400/spl deg/C/30 min show excellent resonance characteristics in terms of return loss and Q-factor.     

应力对厚30 nm的FeCoSiB薄膜影响的微磁模拟

从微磁学理论出发,建立了单轴应力作用下的等效模型;利用美国国家标准技术协会(NIST)开发的微磁学软件OOMMF,从理论上研究应力对厚30nm的FeCoSiB非晶磁弹性薄膜图形化单元磁畴、剩磁、矫顽力等磁性特性的影响。结果表明,FeCoSiB非晶磁弹性薄膜的磁矩分布随应力的变化明显不同;当应力于外磁场方向平行时,薄膜单元的矫顽力和剩磁随张应力的增加而线性增加,随着压应力的增加而线性减小。