超纳米金刚石薄膜场发射特性的研究

超纳米金刚石(UNCD)是一种全新的纳米材料，具有许多独特性能。介绍了Si微尖和微尖阵列阴极沉积超纳米金刚石薄膜的工艺及其场发射特性。研究发现，适当的成核工艺和微波等离子体化学气相沉积工艺可在Si微尖上沉积一层光滑敷形的金刚石薄膜；沉积后阴极的电压-电流特性、发射电流的稳定性以及工作在氧气环境下的发射特性都获得明显提高。讨论了超纳米晶金刚石薄膜阴极的发射机理。     

钼尖场致发射阵列阴极的性能研究

利用微细加工技术和双向薄膜沉积技术对钼尖场发射阵列阴极的工艺进行了较为细致的研究，并在专用的真空系统中对所得阵列阴极的发射性能进行了测试，得到了一定的场致发射电流密度值。测试中采用数据采集系统监测栅极电压、阳极电压、阳极电流和栅极电流，测量了阴极阵列的发射稳定性和发射噪声。对发射的失效机理进行了实验研究和分析，认为发射失效的主要原因在于栅极和基底之间的漏电，尖锥和棚极孔间的暗电流，电极间的放电和放气，以及环境真空度和尖锥的均匀性等。所得结果以进一步开展有射频器件和显示器件方面的应用研究打下了一定基础。     

场发射阵列发射性能下降机制分析

场发射阵列（FEA）发射性能的下降是场发射显示（FED）研究中普遍遇到的一个问题，研究FEA发射性能下降的机制对于推进FED进展具有重要意义。阴极氧化、溅射损伤和离子注入是目前提出的三种解释。对这三种解释进行了进一步的分析和讨论，认为目前的实验工作还不足以充分说明哪种机制在FEA发射性能下降中占据主导地位，并提出了进一步的实验研究的方向和内容。     

La-Mo阴极发射性能及机理研究

研究了实用型La-Mo电子管的发射性能,并采用热力学计算、原位XPS等方法对La-Mo阴极中La的价态进行了研究,探讨了该阴极的发射机理。实验结果表明,实用型FU6051 La-Mo电子管的阴极饱和脉冲电流密度为同型号钍钨管的2.32倍,而所需加热功率仅为钍钨阴极的47%。高温下La2O3可以被Mo2C还原成单质La。在阴极工作过程中,还原得到的La覆盖在Mo基体表面,降低了基体Mo的逸出功,促进了阴极的发射。     

利用激光沉积研究镧钼阴极表面发射机制

为了研究镧钼阴极表面发射机制,采用专为研究阴极设计的与俄歇能谱仪相连的脉冲激光沉积装置制备薄膜阴极.通过测量阴极发射性能和原位分析表面成分(原子数分数),研究了阴极表面元素镧La和氧O变化对阴极发射性能的影响.实验发现随着阴极表面镧膜变薄,阴极发射性能逐渐减弱;阴极发射性能与表面元素La,O 的含量有关,表面层中La/O越高,阴极的发射性能越好.结果表明,传统的单原子层理论无法解释镧钼阴极的发射机制;超额镧在镧钼阴极的发射中起到了关键作用.     

基于InOx纳米岛／C的栅控薄膜电子发射阴极

介绍了基于InOx纳米岛／C的栅控薄膜电子发射阴极,并对其制备工艺和发射性能进行讨论。引入射频溅射的ZnO作为通道层,并在其上沉积InOx纳米岛以及无定型碳薄膜层。InOx纳米岛状结构引入了InOx／C复合活性层的不均匀性;在栅极以及源漏极电压的作用下,当有足够的传导电流通过InOx／C复合层时,通过电流热效应作用,复合层的某些导电通道被烧断,形成电子发射区域。本结构可以通过栅极电压来控制传导电流的有无,从而控制阴极电子发射的有无。     

全密封超薄碳纳米管玻璃平板字符显示器件制造工艺的初步探讨

利用自制的场助热丝化学气相沉积设备，在不锈钢电极的部分选取表面上，摸索出了直接生长碳纳米管（CNT’s）勿须涂敷催化剂的新方法。利用得到的高定向多壁碳纳米管薄膜，研究出一种制造大面积实用碳纳米管阵列场发射（CNT’s／FEA）阴极的新方法。经真空条件下的发射特性测量及SEM等检测手段肯定了这种CNT’s／FEA阴极的实用性。从工艺流程角度出发，初步探讨了静态工作制式下，采用碳纳米管做电极后，实现一种全密封超薄碳纳米管玻璃真空字符（或图像）显示器件的可能性。10多只封离管共显示过3种类型的字型（图像），全部管厚仅为2．7mm。实验结果不仅提供了一种碳纳米管阴极在玻璃真空平板型器件内应用的方法，也摸索出了一条实现小尺寸双色（或多色）字符（图像）静态（或动态）显示的廉价、节能途径。     

电泳工艺制备阵列场发射阴极及其性能的研究

碳纳米管是理想的场发射冷阴极材料,阴极的图形阵列化是实现碳纳米管场发射显示器动态全彩视频显示的核心.三极管结构能够更好地进行矩阵寻址显示图像,且与常规的驱动电路相兼容,降低整体平板显示器件的制作成本.从实验出发,探索利用简单的电泳工艺制备图形化碳基薄膜阴极,采用与阴极成同一水平面的栅极的三极管结构,并对电泳的实验参数进行优化以提高阴极电压电流特性和发射的均匀性等问题,为场发射器件的制造提供优良的工艺基础.研究机械球磨和稀释悬浊液浓度对碳纳米管沉积均匀性的影响.实验结果表明稀薄的悬浊液的条件下可以在玻璃的银浆导电层上沉积较薄而均匀的碳纳米管膜,与丝网印刷工艺制备的阴极相比,均匀性更好,厚度更容易控制,具有更好的发射均匀性.测试图形化的阵列碳纳米阴极的三极管结构的场发射特性,发现当阳极电压保持在600 V,栅极电压接近500 V时,阳极电流能达到2.6 mA/cm2.荧光粉发光均匀,相比二极管结构具有更低的阈值电压,在亮度、均匀性和稳定性方面都有显著的优势.     

场致发射阵阴极述评

要求工作在10安/厘米~2或更大电流密度下的阴极,具有长寿命、瞬时起动、环境温度工作和小电压调制的能力,这导致场致发射阵阴极(FEA′S)的研制。场致发射阵阴极是排列在绝缘的提拉栅网(extractor grid)内距微孔约1微米处的微型点状锥形发射体阵列。由于加在提拉极上的正电压小(100伏～200伏),邻近空间产生的电场梯度大,加上点状尖端作用的增强,导致了场致发射。由于应用了薄膜精密制造工艺和晶体生长工艺,10~6～10~7个电子枪/厘米~2阵列目前已在三个实验室用不同的制造工艺研制。两个实验室的试验达到10～20安/厘米~2的电流密度。随着技术的进展,已设计出电流密度提高一个数量级的场致发射阵阴极。     

脉冲激光沉积技术制备的钪型阴极的发射性能

为提高阴极的发射性能以满足新型器件的需求,该文利用脉冲激光沉积技术制备了一种覆W+BaO- Sc2O3-SrO薄膜的浸渍扩散阴极。实验测得了该阴极在不同温度下的伏安特性曲线,并探讨了发射机制。结果表明,在1100C工作温度下,该阴极的零场发射电流密度达到305.5 A/cm2;阴极表面形成的Ba-Sc-Sr-O活性层是阴极获得高发射性能的主要原因。文章还利用半导体模型解释了该阴极的非正常肖特基效应。     

Effect of diamond-like carbon coating on the emissioncharacteristics of molybdenum field emitter arrays

We have studied the electron emission characteristics of Mo field emitter arrays (FEAs) using a diamond-like carbon (DLC) film deposited by a layer-by-layer technique using plasma enhanced chemical vapor deposition. The turn-on voltage was lowered from 55 to 30 V by a 20 nm thick hydrogen-free DLC coating and maximum emission current was increased from 166 to 831 μA. Also the gate voltage required to get the anode current of 0.1 (μA/emitter) decreases from 77 to 48 V. Furthermore, the emission current from DLC coated Mo FEAs is more stable than that of noncoated Mo FEAs     

Silicide application on gated single-crystal, polycrystalline andamorphous silicon FEAs. I. Mo silicide

In order to improve both the level and the stability of electron field emission, the tip surface of silicon field emitters have been coated with a molybdenum layer of thickness 25 nm through the gate opening and annealed rapidly at 1000°C in inert gas ambient. The gate voltages of single-crystal silicon (c-Si), polycrystalline silicon (poly-Si) and amorphous silicon (a-Si) field emitter arrays (FEAs) required to obtain anode current of 10 nA per tip are 90 V, 69 V, and 84 V, respectively. In the case of the silicide emitters based on c-Si, poly-Si and a-Si, these gate voltages are 76 V, 63 V, and 69 V, respectively. Compared with c-Si, poly Si and a-Si field emitters, the application of Mo silicide on the same silicon field emitters exhibited 9.6 times, 2.1 times, and 4.2 times higher maximum emission current, and 6.1 times, 3.7 times, and 3.1 times lower current fluctuation, respectively. Moreover, the emission currents of the silicide FEAs depending on vacuum level are almost same in the range of 10^-9~10^-6 torr. This result shows that silicide is robust in terms of anode current degradation due to the absorption of air molecules     

Deposition and characterization of molybdenum thin films using dc-plasma magnetron sputtering

Molebdenum (Mo) thin films were deposited on well-cleaned soda-lime glass substrates using DC-plasma magnetron sputtering. In the design of experiment deposition was optimized for maximum beneficial characteristics by monitoring effect of process variables such as deposition power (100–200 W). Their electrical, structural and morphological properties were analyzed to study the effect of these variables. The electrical resistivity of Mo thin films could be reduced by increasing deposition power. Within the range of analyzed deposition power, Mo thin films showed a mono crystalline nature and the crystallites were found to have an orientation along [110] direction. The surface morphology of thin films showed that a highly dense micro structure has been obtained. The surface roughness of films increased with deposition power. The adhesion of Mo thin films could be improved by increasing the deposition power. Atomic force microscopy was used for the topographical study of the films and to determine the roughness of the films. X-ray diffractrometer and scanning electron microscopy analysis were used to investigate the crystallinity and surface morphology of the films. Hall effect measurement system was used to find resistivity, carrier mobility and carrier density of deposited films. The adhesion test was performed using scotch hatch tape adhesion test. Mo thin films prepared at deposition power of 200 W, substrate temperature of 23°C and Ar pressure of 0.0123 mbar exhibited a mono crystalline structure with an orientation along (110) direction, thickness of ～550 nm and electrical resistivity value of 0.57 × 10^?4 Ω cm.     

Surface morphology and I-V characteristics of single-crystal,polycrystalline, and amorphous silicon FEA's

This letter reports the surface morphology and current-voltage (I-V) characteristics of single-crystal silicon (c-Si), polycrystalline silicon (poly-Si), and amorphous silicon (a-Si) field emitter arrays (FEAs). As-deposited a-Si film has a smoother surface than poly-Si film. The surface morphology of the a-Si remains smooth even after phosphorus doping and oxidation at 950°C to be improved in emission characteristics, i.e., smaller anode current deviation among arrays smaller gate current, and higher failure voltage than those of poly-Si FEAs. Such improved characteristics can be explained by the smooth surface morphology which is kept during doping and oxidation. The surface roughness and emission characteristics of a-Si FEAs are comparable to those of c-Si FEAs     

Microstructure of Cu(x)Mo6S8 Chevrel phase thin films on R-plane sapphire

Cu(x)Mo6S8 Chevrel phase thin films epitaxially grown on R-plane sapphire substrates have been studied using field emission scanning electron microscopy (FE-SEM) and high-resolution transmission electron microscopy (HREM). For samples grown in optimal conditions, the SEM images evidence oriented grains of about 100 nm average size; the HREM images of cross-section samples allow to deduce the local epitaxial relations between the substrates and films. HREM also evidences two grain families, previously deduced from X-ray and reflection high-energy electron diffraction studies. No defects have been observed in the films; a higher molybdenum content in the films results in Mo-precipitation at the film-substrate interface.     

Silicide application on gated single-crystal, polycrystalline andamorphous silicon FEAs. II. Co silicide

For pt. I see ibid., vol.48, no.1, p.149-54 (Jan. 2001). For enhancement and stabilization of electron emission, Co silicides were formed from Co, Co/Ti and Ti/Co layers on silicon FEAs. Since Ti prevents oxygen adsorption on the Co film during silicidation, uniform and smooth Co silicide layers can be obtained by depositing Co first and then Ti on silicon tips, followed by rapid annealing. Among Co silicide FEAs, Co silicide formed from Ti/Co bi-layers shows the lowest leakage current, the highest failure voltage over 152 V and the largest anode current over 1 mA at the gate voltage of 150 V. Compared with silicon field emitters, the silicide FEAs formed from Ti/Co layers exhibited a significant improvement in maximum emission current, emission current fluctuation and stability, and failure voltage     

A formation of cobalt silicide on silicon field emitter arrays byelectrical stress

A novel process utilizing electrical stress is proposed for the formation of Co silicide on single crystal silicon (c-Si) FEAs to improve the field emission characteristics. Co silicide FEAs formed by electrical stress (ES) exhibited a significant improvement in turn-on voltage and emission current compared with c-Si FEAs. The improvement mainly comes from the lower effective work function of Co silicide and less blunting of tips during silicidation by electrical stress in an ultra high vacuum (UHV) environment less than 10^-8 torr     

Characterization and antibacterial capabilities of nanocrystalline CdS thin films prepared by chemical bath deposition

Antibacterial capabilities of nanocrystalline cadmium sulfide (CdS) thin films have been developed against Gram-positive and Gram-negative bacteria in dark and sunlight at 60 °C. For this purpose, a strain of Gram-positive Staphylococcus aureus, and two strains of Gram-negative bacteria (Pseudomonas aeruginosa, and Escherichia coli) were used. The nanocrystalline CdS thin films have been prepared using a chemical bath deposition (CBD) method at different thicknesses (50, 80 and 100 nm). The different deposition parameters including the speed of rotation of substrate, temperature of chemical bath, pH of solution and time of the deposition were optimized. The Polyvinylpyrrollidone (PVP) was successfully used as capping agent in order to stop the agglomeration in the CdS thin films. It was found that, CdS thin films have remarkable antibacterial activity in dark and sunlight and it could be applied as antimicrobial agent in medical field. In order to confirm the crystalline structure of CdS thin films, the polycrystalline nature of the deposited CdS thin films with hexagonal structure was obtained. Furthermore, the structural parameters including lattice parameters, cell volume, the space group, average grain size, dislocation density and the strain have been calculated. The topography and surface roughness of the CdS thin films have been studied before and after the bacteriostatic effect using Scanning Electron Microscopy (SEM). Furthermore, the compositions of nanocrystalline CdS thin films have been evaluated using Energy Dispersive X-ray emission (EDX) and a Transmission Electron Microscope (TEM). Based on the optical measurements in the range of 300–2500 nm, the band gap energy of the prepared CdS thin films was found to be 2.4 eV.     

薄膜型平栅极FED背光源的制备及性能研究

利用磁控溅射和光刻技术在玻璃基底上制备薄膜型平栅极场发射阴极阵列,采用电泳工艺将碳纳米管(CNTs)发射材料转移到薄膜型平栅结构的阴极电极表面,借助光学显微镜和扫描电镜观测薄膜型平栅极场发射阴极阵列。利用Ansys软件模拟阴栅间距对阴极表面电场分布的影响,优化其结构参数,对其场发射特性进行了讨论。实验结果表明,CNTs能均匀地分散在平栅型结构的阴极表面,当电场强度为2.4 V/μm时,器件发射电流密度达到1.8 mA/cm2,亮度达3 000cd/m2,均匀性为90%,能稳定发射28 h,且具有较好的栅控作用。该薄膜型平栅极背光源技术简单、成本低,为将来制备新一代大面积场发射背光源提供了可行性方案。