Asynchronous transfer mode switching LSI chips with 10-Gb/s serialI/O ports

LSI chips were developed that fit on a switching fabric using chip-to-chip optical interconnections; they have 10-Gb/s serial input and output ports, which facilitates the layout of optically interfaced switching element modules. A test switching module composed of these chips was operated at 10.2 Gb/s without bit errors. Ultrahigh-speed switching LSI chips have been developed for a future asynchronous transfer mode (ATM) switching system with an over-Tb/s capacity. Their serial input and output ports facilitate chip-to-chip optical interconnection. Cell-dropper and crosspoint-router LSI chips, composing the core of the switching element, were fabricated by using GaAs LSI technology. A test switching module composed of these chips was operated at 10.2 Gb/s without bit errors     

High-output-power polarization-insensitive semiconductor optical amplifier

A high-output-power 1550 nm polarization-insensitive semiconductor optical amplifier (SOA) was developed for use as a compact in-line optical amplifier. A very thin tensile-strained bulk structure was used for the active layer and active width-tapered spot-size converters (SSCs) were integrated on both input and output sides. The SOA module exhibited a high saturation output power of +17 dBm together with a low noise figure of 7 dB, large gain of 19 dB, and low polarization sensitivity of 0.2 dB for optical signals of 1550 nm wavelength. For the amplification of optical signals modulated at 10 Gb/s in the nonreturn-to-zero (NRZ) format, a good eye pattern without waveform distortion due to the pattern effect was obtained at an average output power of up to +12 dBm. Additionally, good amplification characteristics were demonstrated for the signal wavelength range corresponding to the C-band.     

Packaging technology for 40-Gb/s optical receiver module with anMU-connector interface

A compact 40-Gb/s optical receiver module with an MU-connector interface has been developed. Its packaging has three main technical features. (1) Coplanar waveguide (CPW) patterns of the waveguide photodiode (WG-PD) and of the preamplifier IC in the facing area of the flip-chip structure are optimized for impedance matching. (2) A film carrier is used to connect the preamplifier IC to an electrical coaxial connector for electrical signal output. (3) An MU-connector is used as the optical interface to reduce the module size. Optimum design enabled a module size of 14.0 mm wide, 40.4 mm long, and 9.65 mm high. Measurements showed a 3-dB down bandwidth of the optical/electrical response of at least 50 GHz and a clear open eye pattern for a 40-Gb/s nonreturn-to-zero (NRZ) signal input. This optical receiver module is suitable for large-capacity communication network systems     

140Mb/s混合集成光发射机

研制了一种混合集成140Mb/s单模半导体激光器发射机。该发射机由高速缓冲整形放大、LD驱动功能模块、LDAPC——LD自动功率控制功能模块、LDATC——LD自动温度控制功能模块,LD保护及寿命,信号终断告警功能模块和调顶功能模块所构成。发射机调制出纤光功率为-6dBm～-3dBm、消光比≤10％,在0～45℃范围内光功率变化在±1dB以内。该发射机和本所同时研制的混合集成光接收机配套,构成了目前140Mb/sPCM数字光端机的全新产品。     

Compact and 10-Gb/s $times$ 12-Channel Optical Transmitter for Optical Interconnection With High Heat-Dissipation Capability Using Alumina Substrates

A compact 10-Gb/s $times$ 12-channel optical transmitter was developed for very short-reach optical interconnections. The 10-Gb/s/ch operations were achieved without employing the heat pipes or heat sinks typically required to keep vertical-cavity surface-emitting lasers at a low temperature under 85 $^{circ}$C. Alumina ceramic substrates with high heat dissipation capability are incorporated in order to maintain the low temperature operation. The optical transmitter is designed to be as compact as a standard mechanically transferable (MT) optical connector. To enhance usability, the transmitter can be directly connected with the MT-type optical connector with guide pins assembled in the alumina substrate. The compactness and usability of the optical module is effective in intrabox and interbox optical interconnections.      

A 100-Gb/s throughput ATM switch MCM with a 320-channel paralleloptical I/O interface

For an ATM switch system, we have developed a 100-Gb/s input/output (I/O) throughput optical I/O interface ATM switch multichip module (MCM) that has 320-ch optical I/O ports. This MCM is fabricated using ceramic (MCM-C) technology and very-small highly-parallel O/E and E/O optical converters. It uses 0.25-μm complementary metal oxide semiconductors (CMOS) ATM switch large scale integrations (LSIs) and has a total I/O throughput of up to 160 Gb/s. A prototype module with total I/O throughput of 100 Gb/s has been partially assembled using eight optical I/O interface blocks, each composed of a 40-ch O/E converter and a 40-ch E/O converter; the data rate per channel is from dc to 700 Mb/s. Using this module we developed an optical I/O interface ATM switch system and confirmed the operation of the optical interface     

Single mode fiber MT-RJ SFF transceiver module using opticalsubassembly with a new shielded silicon optical bench

Demand for a compact cost reduced optical transceiver has arisen. Small form factor (SFF) optical transceivers are expected to meet this demand. A new concept optical module based on V-grooved silicon optical bench (SiOB) technology, that enables a passive alignment of optical fibers and optical devices is expected to reduce the cost. MT-RJ SFF optical transceivers require this new packaging technique because the distance between input and output optical axes is shorter than conventional transceivers. However, crosstalk between a transmitter and a receiver is a big issue to be solved because the distance between optical axes of the laser diode (LD) and the photo diode (PD) is only 0.75 mm. It is difficult to reduce the crosstalk in a SiOB because large electromagnetic coupling exists due to the conductivity of a silicon substrate. A newly developed, low crosstalk optical subassembly (OSA) with a single mode fiber MT-RJ receptacle and the SFF transceiver module are reported. We have analyzed a mechanism of electrical crosstalk in a SiOB and developed a shield structure to reduce it. The crosstalk in the OSA with shielded SiOB was reduced over 20 dB compared to the unshielded SiOB     

A compact coaxial-type optical transceiver module using ahalf-transmittance photodiode for TCM optical access networks

A compact coaxial-type optical transceiver module has been developed without using a conventional 3 dB optical coupler. This transceiver is composed of a newly designed half-transmittance photodiode (HT-PD) and a 1.3-μm-MQW-LD. An HT-PD is used both as a photodetector and as a window for LD light. Fiber output power of 1.15 mW at the drive current of 26 mA and responsivity of 0.48 A/W at the reverse-voltage of 5 V were obtained. Temperature dependence of responsivity is also reported     

High-Performance and Low-Cost 40-Gb/s CWDM Optical Modules

High-performance and low-cost 40-Gb/s optical modules using four different wavelength uncooled 10-Gb/s distributed-feedback (DFB) lasers are proposed and demonstrated. The 40-Gb/s optical module was integrated with coarse wavelength division multiplexing (CWDM) thin-film filters which enabled four 10-Gb/s transmission channels output through a single fiber. The 10-Gb/s DFB laser was packaged by commercialized low-cost coaxial TO-Can technology. The results of the 40-Gb/s optical module showed that the output optical power was above ${-}1$ dBm per channel and the system power budget was 12 dB. The transmission distance with a single-mode fiber reached more than 30 km at a bit-error-rate of $10^{{-}9}$. Compared with conventional 40-Gb/s optical modules, the module is easy to fabricate and is low cost. This proposed high-performance 40-Gb/s CWDM optical module demonstrates not only the feasibility of a 30 km transmission, but also shows the low-cost possibility of ensuring the application of WDM-passive optical network fiber-to-the-home systems.      

A DIL-type miniature optical transceiver module using an InGaAsPhalf-transmittance photodiode for TCM optical access networks

A compact DIL-type miniature optical transceiver module has been developed without using a conventional 3 dB optical coupler. This transceiver is composed of a newly designed InGaAsP half-transmittance photodiode (HT-PD) and a 1.3-μm multiquantum-well laser diode (MQW-LD). An HT-PD is used both as a photodetector and as a window for laser diode (LD) light. Fiber output power of 0 dBm at the drive current of 33.8 mA and responsivity of 0.58 A/W at the reverse-voltage of 2 V were obtained. The fundamental characteristics of the HT-PD are studied and discussed     

（英）一种基于新型自组装微带-波导过渡的D波段通信发射机模块

展示了一种基于新型自组装微带-波导过渡的D波段（110-170GHz）发射机模块。过渡结构的仿真平均插入损耗为0.6 dB,回波损耗于带内基本优于10 dB。基于该过渡结构以及阻性混频器和倍频器芯片,设计了一种D波段发射机模块。该发射机模块工作于110-153 GHz,峰值输出功率于150 GHz可达-4.6 dBm,3-dB带宽为145.8-159.3 GHz。使用该模块进行了64-QAM高阶无线通信测试,测试传输速率为3 Gb/s,验证了模块封装方案的实用性。     

Demultiplexing of 168-Gb/s data pulses with a hybrid-integratedsymmetric Mach-Zehnder all-optical switch

We have developed a hybrid-integrated symmetric Mach-Zehnder all-optical switch and evaluated the demultiplexing of 168-Gb/s data pulses at a repetition rate of 10 GHz with this switch. A compact, stable device was realized by assembling semiconductor optical amplifiers as nonlinear waveguides on a planar lightwave circuit in a self-aligned manner. A 6.0-ps switching window needed for 168-Gb/s demultiplexing was provided by the push-pull operation of the symmetric Mach-Zehnder all-optical switch. Demultiplexed signal light showed a high extinction ratio of better than 18 dB. Error-free demultiplexing with a bit error rate of 10^-11 was achieved     

Packaging for a 40-channel parallel optical interconnection modulewith an over-25-Gbit/s throughput

NTT is currently working on developing a high-throughput interconnection module that is both compact and cost effective. The technology being developed is called “parallel inter-board optical interconnection technology”, or “ParaBIT”. The ParaBIT module that has been developed is the first step; it is a front-end module with 40 channels, a throughput of over 25 Gbit/s, and a transmission distance of over 100 m along multimode fibers. One major feature of this module is the use of vertical-cavity surface-emitting laser (VCSEL) arrays as very cost-effective light sources. These arrays enable the same packaging structure to be used for both the transmitter and receiver. To achieve super-multichannel performance, high-density multiport bare-fiber (BF) connectors were developed for the module's optical interface. Unlike conventional optical connectors, these BF connectors do not need a ferrule or spring. This ensures physical contact with an excellent insertion loss (less than 0.1 dB per channel). A polymeric optical waveguide film with a 45° mirror for coupling to the VCSEL and photo-diode (PD) arrays by passive optical alignment was also developed. To facilitate coupling between the VCSEL/PD array chips and the waveguide, a packaging technique was developed to align and die bond the optical array chips on a substrate. This technique is called transferred multichip bonding (TMB); it can be used to mount optical array chips on a substrate with a positioning error of only several micrometers. These packaging techniques enabled ultra-parallel interconnections to be achieved in prototype ParaBIT modules     

WDM-PON module using a planar lightwave circuit with a coated WDM filter

We have presented a new configuration of a planar lightwave circuit (PLC) module coated directly with a filter which divides 1310/1550-nm wavelength bands for a wavelength-division-multiplexing passive optical network module in order to improve the conventional insertion process of thin film filter into the narrow trench located at the Y-junction of a PLC platform. The broadly tapered output facet width of a V-shaped waveguide was designed to be 12 /spl mu/m to minimize the reflected loss. The receiver module integrated with a PIN-photodiode on a silicon optical bench was fabricated. Data transmission of 2.5-Gb/s was demonstrated with clear eye diagrams.     

SiGe-HBT-based 54-gb/s 4:1 multiplexer IC with full-rate clock for serial communication systems

A 4:1 multiplexer (MUX) IC for 40 Gb/s and above operations in optical fiber link systems has been developed. The ICs are based on 122-GHz-f/sub T/ 0.2-/spl mu/m self-aligned selective-epitaxial-growth SiGe HBT technology. To reduce output jitter caused by clock duty distortion, a master-slave delayed flip-flop (MS-DFF) with full-rate clock for data retiming is used at the final stage of the MUX IC. In the timing design of the critical circuit for full-rate clocking, robust timing design that has a wide timing margin between data and clock at the MS-DFF was achieved. Measurements using on-wafer probes showed that the MUX attained 54-Gb/s operation with an output voltage-swing of 400 mVpp. The output rms jitter generated by the MUX was 0.91 ps and tr/tf (10%-90%) was 11.4/11.3 ps at a data rate of 50 Gb/s. Power consumption of the IC was 2.95 W at a power supply of -4.8 V. Error-free operation (<10/sup -12/) in back-to-back configuration of the MUX and a 1:4 DEMUX IC module at a data rate of 45 Gb/s was confirmed. We therefore concluded that the MUX IC can be applied for transmitter functions in optical-fiber-link systems at a data rate of 40 Gb/s and higher for forward error correction.     

Fiber-pigtail-detachable plastic MiniDIL transmitter module with a tool-free optical connector

A fiber-pigtail-detachable plastic MiniDIL transmitter module using a tool-free optical connector and applicable to the OC 3 and OC 12 in the SONET/SDH standards has been developed as a cost-reducing solution. The newly developed optical connector works without a special tool to connect and disconnect it from the module. Transmitter fiber output of more than 0.4 mW, insertion loss of less than 0.3 dB, return loss of more than 55 dB, and a repeatability of more than 30 times were achieved.     

A 60-GHz point-to-multipoint millimeter-wave fiber-radio communication system

A 60-GHz point-to-multipoint wireless access link with data rate of 156 Mb/s incorporating 60-GHz transceiver modules and full-duplex fiber-optic millimeter-wave transmission is developed for short-range applications such as indoor wireless local area networks and intelligent transport systems. For compact system configuration, a small-size millimeter-wave transceiver module with planar antennas is developed. The transceiver module is based on broadband planar integration and packaging of millimeter-wave circuits. The RF output power is +10 dBm and the measured 3-dB antenna beamwidth is 30/spl deg/. The total size of the developed 60-GHz transceiver module, except input and output connectors, is 50 mm /spl times/ 75 mm /spl times/ 35 mm. A point-to-point full duplex fiber-optic configuration is extended to the scheme with multiple access points (APs) by using a tree coupler and a dense wavelength division multiplexing multiplexer. The AP has a simple configuration without frequency conversion. The bit error rate and packet error rate performances of the 60-GHz fiber-radio access link are evaluated. Furthermore, the effect of the extension to the scheme with multiple APs is investigated.     

A 1.3/1.55-μm wavelength-division multiplexing optical moduleusing a planar lightwave circuit for full duplex operation

We developed a hybrid integrated optical module for 1.3/1.55-μm wavelength-division multiplexing (WDM) full-duplex operation. The optical circuit was designed to suppress the optical and electrical crosstalk using a wavelength division multiplexing filter, and an optical crosstalk of -43 dB and an electrical crosstalk of -105 dB were achieved with a separation between the transmitter laser diode and the receiver photodiode of more than 9 mm. We used the optical circuit design to fabricate an optical module with a bare chip preamplifier in a package. This module exhibited a full duplex operation of 156 Mbit/s with a minimum sensitivity of -35.2 dBm at a bit error rate of 10^-10     

Uncooled mini-DIL module for 980-nm pump lasers

The importance of lower cost while maintaining high performance of erbium-doped fiber amplifiers (EDFAs) is growing with increased bandwidth demand. The uncooled 980-nm miniature dual-inline (Mini-DIL) pump laser is attractive for compact EDFA designs because it offers the advantages of lower cost, smaller footprint, minimal heat generation, and reduced electrical power consumption. In this paper, we report a low-cost uncooled Mini-DIL module designed for 980-nm pump lasers. A three-dimensional finite element analysis model effectively predicts module thermal and stress performance. Experimental results of module power and coupling efficiency stability over assembly processes are presented. A minimum optical output power of 150 mW is achieved in a group of 10 devices across a temperature range of 0/spl deg/C to 70/spl deg/C at a drive current of 350 mA with a 1.5-mm raised ridge InGaAs/AlGaAs single quantum well laser chip.     

High-density digital free-space photonic switches using micro-beam optical interconnections

We describe a compact free-space photonic-switching module that uses micro-beam optical interconnections based on stacked planar optics and exciton absorption reflection switch (EARS) arrays. The switching module has two-dimensional fiber array pigtails and a two-stage, 16-input, 16-output structure (four sets of 4/spl times/4 switches). The microbeam optical interconnections can provide a compact switching module (approximately 30/spl times/90/spl times/22 mm [60 cc]). A relay lens array inserted between stages eliminates beam spreading in the switch and decreases the coupling loss and crosstalk of interconnections. Two-stage switching at a data transmission rate of 4 Mbit/s is demonstrated.