铁电薄膜底电极La0.5Sr0.5CoO3的结构及电性能研究

采用溶胶-凝胶(Sol-Gel)法在Si衬底上沉积一层La0.5Sr0.5CoO3(LSCO)薄膜底电极,并在不同的退火温度下表征薄膜的各种性质.X线衍射表明在550～750℃退火温度下制备的LSCO薄膜呈(110)取向的钙钛矿结构;谢乐公式估算薄膜的晶粒尺寸为25～50 nm.扫描电子显微镜(SEM)观察结果显示:薄膜表面平整,结构致密.运用四探针法测量薄膜的体电阻,结果表明,750℃退火温度后渗氧处理可获得电阻率较低的La0.5Sr0.5 CoO3薄膜.     

不同衬底温度生长的La_(0.5)Sr_(0.5)CoO_3薄膜椭圆偏振光谱研究

采用脉冲激光沉积法(PLD)在不同Si(100)衬底温度下制备了La_(0.5)Sr_(0.5)CoO_3(LSCO)导电金属氧化物薄膜.X射线衍射(XRD)分析表明,随着衬底温度升高LSCO薄膜的结晶质量增加,在650℃和700℃下制备的薄膜是具有单一钙钛矿结构的多晶薄膜.通过椭圆偏振光谱仪测量了400～1100nm波长范围内该导电金属氧化物薄膜的光学性质,采用双Lorentz振子色散关系及三相结构模型(Air/LSCO/Si)拟合获得了薄膜的光学常数.结果表明,薄膜的折射率随着衬底温度的升高而减小,然而在可见-近红外波长范围内消光系数随着衬底温度的升高而增大.这主要与薄膜的晶化质量和导电性能有密切的关系.     

化学溶液法制备PbZr0.5Ti0.5O3／La0.5Sr0.5CoO3铁电多层薄膜的结构和光学性质研究

采用金属有机化学液相沉积法在Si衬底上制备了La0.Sr0.5CoO3(LSCO)导电金属氧化物薄膜，采用溶胶－凝胶法在LSCO导电金属氧化物薄膜上沉积了PbZr0.5Ti0.5O3（PZT）铁电薄膜，X－射线测量结果表明在700℃的退火温度下制备的PZT／LSCO铁电多层薄膜呈（110）取向的钙钛矿结构，谢乐公式估算铁电薄膜的晶粒尺寸为50－80nm，原子力显微镜观察结果显示：薄膜表面平整，均方根粗糙度（RMS）小于5nm，用拉曼光谱测量表明PZT薄膜呈拉曼活性，椭圆偏振光谱仪用来表征薄膜在400－1700nm波长范围的光学性质，用洛仑兹模型来描述PZT和LSCO薄膜的光学性质，获得PZT和LSCO薄膜的折射率，消光系数等光学常数谱。     

CeO_2缓冲层对蓝宝石基Ba_(0.6)Sr_(0.4)TiO_3薄膜结构和介电性能的影响

利用磁控溅射法制备Ce O_2缓冲层,通过脉冲激光沉积法制备Ba_(0.6)Sr_(0.4)TiO_3(BST)薄膜,在Al_2O_3(11—02)蓝宝石基片上构架了Pt/BST/Ce O_2/Al_2O_3和Pt/BST/Al_2O_3叉指电容器,对比研究了Ce O_2缓冲层对BST薄膜结构和叉指电容器介电性能的影响。通过X射线衍射仪、原子力显微镜和LCR表分别对叉指电容器的结构、表面形貌和介电性能进行了表征。实验发现,直接沉积在蓝宝石上的BST薄膜为多晶结构,生长在Ce O_2缓冲层上的BST为(001)取向的高质量外延薄膜。生长在Ce O_2缓冲层上的BST薄膜相对于没有缓冲层的BST薄膜具有更小的晶粒和均方根粗糙度。在40 V偏置电压下,Pt/BST/Al_2O_3和Pt/BST/Ce O_2/Al_2O_3叉指电容器的调谐率分别是13.2%和25.8%;最小介电损耗为0.021和0.014。结果表明Ce O_2缓冲层对生长在蓝宝石基片上的BST薄膜结构和介电性能具有重要影响。     

Ba0.6Sr0.4TiO3薄膜的耐压特性研究

采用射频磁控溅射法制备了Ba0.6Sr0.4TiO3(BST)薄膜,研究了基片、退火温度及膜厚对薄膜耐压特性的影响。结果显示,铝酸镧(LaAlO3)基片上制备的BST薄膜表面较平整,有较好的耐压;随着退火温度从750℃提高到850℃,BST薄膜晶粒长大,电击穿概率有所增加,750℃是一个较合理的退火温度。在优化的工艺条件下,BST薄膜耐压可达125V/μm。     

C轴取向ZnO压电薄膜的制备

本文扼要叙述用直流溅射法制备具有较高电阻,C轴取向好的ZnO压电薄膜的方法.沉积条件为:溅射电流密度J=1.2—1.5毫安/厘米~2,溅射气压P=6×10~(-2)—1×10~(-1)毛,基片温度Ts=160—280℃,沉积速率V=0.1—0.4微米/小时,得到的薄膜洁净透明,分散度α<6°,偏离度M≤3°,电阻率ρv=105—10~7欧-厘米,粒度300—500埃.并探索了温度,基片位置,气体组分对薄膜性能的影响.     

La0.5Sr0.5CoO3的化学溶液淀积法制备与表征及其应用

采用化学溶液淀积法制备了具有纯钙钛矿结构和良好导电性能的La_(0.5)Sr_(0.5)CoO_3(LSCO)薄膜。LSCO的电阻率随着退火温度的升高、退火时间的增长和厚度增加而减小。650°C退火可以得到7mΩ·cm的电阻率。分别在LSCO和Pt衬底上制备了Bi_4Ti_3O_(12)(BTO)薄膜,分析结果表明,使用LSCO衬底对BTO的析晶有影响,击穿电压、铁电特性均有较大改善。     

玻璃基LSCO/PZT/LSCO电容器的制备和铁电性能

采用磁控溅射法制备La0.5Sr0.5CoO3(LSCO)薄膜、sol-gel法制备Pb(Zr0.4Ti0.6)O3(PZT)薄膜,在玻璃和Ti-Al/Si衬底上构架了LSCO/PZT/LSCO电容器,研究了衬底对LSCO/PZT/LSCO电容器结构和铁电性能的影响。研究发现:虽然生长在两种衬底上的PZT薄膜均为钙钛矿结构多晶薄膜,但是,生长在玻璃衬底上的LSCO/PZT/LSCO电容器具有更好的铁电性能。玻璃基LSCO/PZT/LSCO电容器的剩余极化强度(Pr)为28×10–6C/cm2,矫顽电压(Vc)为0.96V;而硅基LSCO/PZT/LSCO电容器的Pr为25×10–6C/cm2,Vc为1.05V。     

(Ba0.5Sr0.5)TiO3/LaNiO3异质薄膜的介电调谐特性

用脉冲激光沉积工艺制备Ba0.5Sr0.5TiO3(简称BST)薄膜和Ba0.5Sr0.5TiO3/LaNiO3(简称BST/LNO)薄膜。在650℃原位退火10 min,获得了(100)和(110)择优取向生长的BST和BST/LNO薄膜,薄膜晶粒呈柱状结构,BST薄膜和BST/LNO异质结构薄膜的晶粒尺寸分别为150~200 nm和50~80 nm。在室温和1 MHz条件下,BST薄膜和BST/LNO异质结构薄膜的相对介电常数和介电调谐率分别达811和58.9%、986和60.1%;用LNO作底电极,可增益介电常数和介电调谐率。     

不同择优取向的ZnO薄膜的制备

采用射频磁控溅射法在载玻片上制备了不同择优取向的ZnO薄膜。结果表明,溅射功率在100~380 W范围内制备的ZnO薄膜呈(101)择优取向性,当功率上升至550 W时,薄膜则为(100)取向;基片温度升高有利于(002)面的生长,当基片温度为250℃时,在溅射功率为200 W时即可制得(002)面择优取向的薄膜。热处理温度的提高有助于(100)和(101)面的择优取向,而对(002)面的取向不利。同时,该文对ZnO薄膜不同择优取向生长的机制进行了探讨。     

Structural and Electrical Characters of Ba0.6Sr0.4TiO3/La0.5Sr0.5CoO3 Thin Films by Plus Laser Deposition

Epitaxial Ba0.6Sr0.4TiO3 (BST) thin films were deposited on LaAlO3 (LAO) substrates with the conductive metallic oxide La0.5Sr0.5CoO3 (LSCO) film as a bottom electrode by pulsed laser deposition (PLD). X-ray diffraction ~2 and Ф scan showed that the epitaxial relationship of BST/LSCO/LAO was [001] BST//[001] LSCO//[001] LAO. The atomic force microscope (AFM) revealed a smooth and crack-free surface of BST films on LSCO-coated LAO substrate with the average grain size of 120 nm and the RMS of 1.564 nm for BST films. Pt/BST/LSCO capacitor was fabricated to perform CapacitanceVoltage measurement indicating good insulating characteristics. For epitaxial BST film, the dielectric constant and dielectric loss were determined as 471 and 0.03, respectively. The tunabilty was 79.59% and the leakage current was 2.6310-7 A/cm2 under an applied filed of 200 kV/cm. Furthermore, it was found that epitaxial BST (60/40) films demonstrate well-behaved ferroelectric properties with the remnate polarization of 6.085 C/cm2 and the coercive field of 72 kV/cm. The different electric properties from bulk BST (60/40) materials with intrinsic paraelectric characteristic are attributed to the interface effects.     

Structural and Electrical Characters of Ba0.6Sro.4TiO3/La0.5Sr0.5CoO3 Thin Films by Plus Laser Deposition

Epitaxial Ba0.6Sr0.4TiO3 (BST) thin films were deposited on LaAlO3 (LAO) substrates with the conductive metallic oxide La0.5Sr0.5CoO3 (LSCO) film as a bottom electrode by pulsed laser deposition (PLD). Xray relationship of BST/LSCO/LAO was [001] BST//[001]LSCO//[001] LAO. The atomic force microscope (AFM)revealed a smooth and crackfree surface of BST films on LSCOcoated LAO substrate with the average grain size of 120 nm and the RMS of 1.564 nm for BST films.Pt/BST/LSCO capacitor was fabricated to perform CapacitanceVoltage measurement indicating good insulating characteristics. For epitaxial BST film, the dielectric constant and dielectric loss were determined as 471 and 0.03, respectively. The tunabilty was 79.59% and the leakage current was 2.63×107 A/crm2 under an applied filed of 200 kV/cm. Furthermore, it was found that epitaxial BST (60/40) films demonstrate wellbehaved ferroelectric properties with the remnate polarization of 6.085 μC/cm2 and the coercive field of 72 kV/cm. The different electric properties from bulk BST (60/40)materials with intrinsic paraelectric characteristic are attributed to the interface effects.     

钛酸锶钡/铋锌铌多层复合薄膜的制备及性能

采用溶胶一凝胶法在Pt/Ti/SiO2/Si衬底上制备了钛酸锶钡/铋锌铌多层复合薄膜样品.研究了不同退火温度下多层复合薄膜的结构、微观形貌及介电性能.结果表明:在退火温度高于700℃时,所得复合薄膜中会出现立方焦绿石结构的铋锌铌和钙钛矿结构的钛酸锶钡.750℃退火处理得到的多层复合薄膜,表面致密,无裂纹,其相对介电常数...     

Integration of high dielectric Ba0.5Sr0.5TiO3 films into amorphous TaSiN barrier layer structures

The high-k dielectric material (Ba,Sr)TiO₃ has been intensively investigated for possible applications in dynamic random access memory circuits. During the BST deposition process in O₂ ambient, typically at 650°C, the diffusion of oxygen through the bottom electrode into the poly Si plug must be prevented. Amorphous TaSiN films are excellent candidates as oxygen barrier layers. Ba_0.5Sr_0.5TiO₃ (BST) films with thickness of 100 nm were deposited on the electrode structure SiO₂/TaSiN/Pt. The sol–gel method was used to grow the BST films. The barrier effect for oxygen diffusion is studied in TaSiN layers with thickness of 50 nm, which were deposited by a reactive sputter process. X-ray photoemission spectroscopy results confirm that this amorphous material is a suitable barrier against oxygen diffusion at 650°C. The BST films, deposited at 650°C and post-annealed at 650°C show a dielectric constant of 100 at 100 kHz and a dissipation factor of less than 5%.     

Low temperature epitaxial growth of Si0.5Ge0.5 alloy layer on Si (100) by ion beam assisted deposition

The first results were reported on low temperature epitaxial growth of Si_0.5Ge_0.5 alloy layer on Si (100) by ion beam assisted deposition. Nucleation and the growth of Si_0.5Ge_0.5 alloy layer had been investigated by atomic force microscopy and reflection high energy electron diffraction analysis. The Si_0.5Ge_0.5 alloy layer nucleated on Si (100) via Stranski-Krastanov (SK) mode. The Ar ion bombard-ment improved crystallinity and prolonged layer-by-layer stage of the SK mode. The epitaxial temperature was 200°C lower than 550-600°C in molecular beam epitaxy. In order to explain the mechanism of low temperature epitaxial growth E_Ar (energy transferred to growing film by bombarding Ar ion, eV/atom) value was experimentally calculated. In conclusion, the ion bombardment induced dissociation of three-dimensional islands and enhanced the surface diffusion. The variation of tetragonal strain and its effect on electron mobility were taken into consideration. Electron mobility increased with tetragonal strain as a result of band split.     

溅射工艺参数对BST薄膜介电常数的影响

采用射频磁控溅射法在ITO玻璃基片上制备了约700nm的Ba0.5Sr0.5Ti03(BST)薄膜。研究了溅射功率、气压、ψ[O2/(Ar+O2)]比和基片温度对εr的影响,获得各种溅射条件下的薄膜的εr为250~310。提出了较优的工艺,即本底真空1.5×10–3Pa、靶基距6.2cm、功率300W、气压1.8Pa、ψ[O2/(Ar+O2)]为30%和衬底温度500℃,并研究了薄膜的晶相、组成和形貌。     

Thermo-Sensitive Ba0.64Sr0.36TiO3 Thin Film Capacitors for Dielectric Type Uncooled Infrared Sensors

Ba_0.64Sr_0.36TiO₃ (BST) thin films are prepared on Pt/Ti/SiO₂/Si₃N₄/SiO₂/Si substrates by a sol-gel method. Thermo-sensitive BST thin film capacitors with a Metal-Ferroelectrics-Metal (M-F(BST)-M) structure are fabricated as the active elements of dielectric type uncooled infrared sensors. XRD are employed to analyze the crystallographic structures of the films. AFM observations reveal a smooth and dense surface of the films with an average grain size of about 35 nm. Rapid temperature annealing (RTA) process is a very efficient way to improve crystallization quality. The preferable annealing temperature is 800°C for 1 min. The butterfly shaped C-V curves of the capacitors indicate the films have a ferroelectric nature. The dielectric constant and dielectric loss of the films at 100 kHz are 450 and 0.038, respectively. At 25°C, where the thermo-sensitive capacitors work, the temperature coefficient of dielectric constant (TCD) is about 5.9 %/°C. These results indicate that the capacitors with sol-gel derived BST thin films are promising to develop dielectric type uncooled infrared sensors.     

Investigations on low temperature mo-cvd growth of GaAs

The growth conditions for the deposition at low temperatures of epitaxial layers of GaAs on (100) GaAs crystals using TMG and arsine are studied in detail. The films are grown at atmospheric pressure in a vertical reactor in which the arsine is fed in through the rf heated susceptor for precracking. The growth temperature was varied between 680°C and 450°C. In the whole temperature range epitaxial growth was obtained. The growth rate at temperatures below 600°C depends on the AsH₃ flow, suggesting that the availibility of As vapor species, not AsH₃ limits epitaxial growth in this temperature range. For a constant AsH₃ /TMG ratio of 8 the growth rate decreases by exp (-E/kT) with an activation energy of E = 1.5 eV. Growth rates as low as 0.5 um/h have been achieved. Unintentionally doped layers show semi-insulating behaviour at growth temperatures below 500° C, similar to the behaviour seen from MBE layers. However, n-type layers with reasonable mobilities can be grown in the low temperature range (450 ° C) using H₂ Se as the doping gas.