Multi-Functional and Stretchable Thermoelectric Bi2Te3 Fabric for Strain,Pressure, and Temperature-Sensing

Fiber-based electronics are essential components for human-friendly wearable devices due to their flexibility, stretchability, and wearing comfort. Many thermoelectric (TE) fabrics are investigated with diverse materials and manufacturing methods to meet these potential demands. Despite such advancements, applying inorganic TE materials to stretchable platforms remains challenging, constraining their broad adoption in wearable electronics. Herein, a multi-functional and stretchable bismuth telluride (Bi₂Te₃) TE fabric is fabricated by in situ reduction to optimize the formation of Bi₂Te₃ nanoparticles (NPs) inside and outside of cotton fabric. Due to the high durability of Bi₂Te₃ NP networks, the Bi₂Te₃ TE fabric exhibits excellent electrical reliability under 10,000 cycles of both stretching and compression. Interestingly, intrinsic negative piezoresistance of Bi₂Te₃ NPs under lateral strain is found, which is caused by the band gap change. Furthermore, the TE unit achieves a power factor of 25.77 µWm⁻¹K⁻² with electrical conductivity of 36.7 Scm⁻¹ and a Seebeck coefficient of −83.79 µVK⁻¹ at room temperature. The Bi₂Te₃ TE fabric is applied to a system that can detect both normal pressure and temperature difference. Balance weight and a finger put on top of the 3 × 3 Bi₂Te₃ fabric assembly are differentiated through the sensing system in real time.     

Thermoelectric Characteristics of <Emphasis Type="Italic">p</Emphasis>-Type (Bi,Sb)<Subscript>2</Subscript>Te<Subscript>3</Subscript>/(Pb,Sn)Te Functional Gradient Materials with Variation of the Segment Ratio

The p-type (Bi,Sb)₂Te₃/(Pb,Sn)Te functional gradient materials (FGMs) were fabricated by hot-pressing mechanically alloyed (Bi_0.2Sb_0.8)₂Te₃ and 0.5 at.% Na₂Te-doped (Pb_0.7Sn_0.3)Te powders together at 500°C for 1 h in vacuum. Segment ratios of (Bi,Sb)₂Te₃ to (Pb,Sn)Te were varied as 3:1, 1.3:1, and 1:1.6. A reaction layer of about 350-μm thickness was formed at the (Bi,Sb)₂Te₃/(Pb,Sn)Te FGM interface. Under temperature differences larger than 340°C applied across a specimen, superior figures of merit were predicted for the (Bi,Sb)₂Te₃/(Pb,Sn)Te FGMs to those of (Bi_0.2Sb_0.8)₂Te₃ and (Pb_0.7Sn_0.3)Te. With a temperature difference of 320°C applied across a specimen, the (Bi,Sb)₂Te₃/(Pb,Sn)Te FGMs with segment ratios of 3:1 and 1.3:1 exhibited the maximum output powers of 72.1 mW and 72.6 mW, respectively, larger than the 63.9 mW of (Bi_0.2Sb_0.8)₂Te₃ and the 26 mW of 0.5 at.% Na₂Te-doped (Pb_0.7Sn_0.3)Te.     

Hierarchical Architectural Structures Induce High Performance in n-Type GeTe-Based Thermoelectrics

Compatible p- and n-type materials are necessary for high-performance GeTe thermoelectric modules, where the n-type counterparts are in urgent need. Here, it is reported that the p-type GeTe can be tuned into n-type by decreasing the formation energy of Te vacancies via AgBiTe₂ alloying. AgBiTe₂ alloying induces Ag₂Te precipitates and tunes the carrier concentration close to the optimal level, leading to a high-power factor of 6.2 µW cm⁻¹ K⁻² at 423 K. Particularly, the observed hierarchical architectural structures, including phase boundaries, nano-precipitates, and point defects, contribute an ultralow lattice thermal conductivity of 0.39 W m⁻¹ K⁻¹ at 423 K. Correspondingly, an increased ZT of 0.5 at 423 K is observed in n-type (GeTe)_0.45(AgBiTe₂)_0.55. Furthermore, a single-leg module demonstrates a maximum η of 6.6% at the temperature range from 300 to 500 K. This study indicates that AgBiTe₂ alloying can successfully turn GeTe into n-type with simultaneously optimized thermoelectric performance.     

Achieving Superior Thermoelectric Performance in Ge4Se3Te via Symmetry Manipulation with I–V–VI2 Alloying

Although orthorhombic GeSe is predicted to have an ultrahigh figure of merit, ZT ≈ 2.5, up to now, the highest experimental value is ≈0.2 due to the low carrier concentration (n_H ≈ 10¹⁸ cm⁻³). Improving symmetry is an effective approach for enhancing the ZT of GeSe-based materials. With Te-alloying, Ge₄Se₃Te displays the two-dimensional hexagonal structure and high n_H ≈ 1.23 × 10²¹ cm⁻³. Interestingly, Ge₄Se₃Te transformed from the hexagonal into the rhombohedral phase with only ≈2% I–V–VI₂-alloying (I = Li, Na, K, Cu, Ag; V = Sb, Bi; VI = Se, Te). According to the calculated results of Ge_0.82Ag_0.09Bi_0.09Se_0.614Te_0.386 single-crystal grown via AgBiTe₂-alloying, it exhibits a higher valley degeneracy than the hexagonal Ge₄Se₃Te. For instance, AgBiTe₂-alloying induces a strong band convergence and band inversion effect, resulting in a significantly enhanced Seebeck coefficient and power factor with a similar n_H from 17 µV K⁻¹ and 0.63 µW cm⁻¹ K⁻² for pristine Ge₄Se₃Te to 124 µV K⁻¹ and 5.97 µW cm⁻¹ K⁻² for 12%AgBiTe₂-alloyed sample, respectively. Moreover, the sharply reduced phonon velocity, nano-domain wall structure, and strong anharmonicity lead to low lattice thermal conductivity. As a result, a record-high average ZT ≈0.95 over 323–773 K with an excellent ZT ≈ 1.30 is achieved at 723 K.     

Characterizations of solid-state microwave-synthesized Sb2Te3-based alloys with various compositions of bismuth in Bi2xSb2(1−x)Te3

In this article, thermoelectric (TE) materials based on p-type Sb₂Te₃ samples and dispersed with x amounts of Bi (x=0.0, 0.2, 0.4, 0.6, 0.8, and 1.0) in the form Bi_2xSb_2(1−x)Te₃ were synthesized via a standard solid-state microwave route. The microstructure of the ingots was characterized by field emission scanning electron microscopy. As-synthesized ingots were formed by the assembly of micro-sheet grains. The phase composition of the powders was characterized by X-ray diffraction, revealing a rhombohedral structure. The influence of variations in Bi content (x) on the TE properties of the resulting alloy was studied in the temperature range of 303 K to 523 K. Increases in x caused a decrease in hole concentration and electrical conductivity and an increase in Seebeck coefficient. A maximum power factor of 4.96 mW/mK² was obtained at about 373 K for a Bi_2xSb_2(1−x)Te₃ sample with x=0.2.     

Thermoelectric Properties of (Pb,Sn,Ge)Te-Based Alloys

The search for alternative energy sources is presently at the forefront of␣applied research. In this context, thermoelectricity for direct energy conversion from thermal to electrical energy plays an important role. This␣paper is␣concerned with the development of highly efficient p-type [(PbTe)(SnTe)(Bi₂Te₃)] _x (GeTe)_1−x alloys for thermoelectric applications using spark plasma sintering (SPS). Varying the carrier concentration of GeTe was achieved by alloying of PbTe, SnTe, and/or Bi₂Te₃. The rhombohedral to cubic phase transition temperature, T _c, was found to be sensitive to the degree of alloying. Highest power factor values (P ≤ 33 μW/cm K²) were obtained for (GeTe)_0.95(Bi₂Te₃)_0.05 composition.     

Thermoelectric Performance Enhancement in BiSbTe Alloy by Microstructure Modulation via Cyclic Spark Plasma Sintering with Liquid Phase

The widespread application of thermoelectric (TE) technology demands high-performance materials, which has stimulated unceasing efforts devoted to the performance enhancement of Bi₂Te₃-based commercialized thermoelectric materials. This study highlights the importance of the synthesis process for high-performance achievement and demonstrates that the enhancement of the thermoelectric performance of (Bi,Sb)₂Te₃ can be achieved by applying cyclic spark plasma sintering to Bi_xSb_2–xTe₃-Te above its eutectic temperature. This facile process results in a unique microstructure characterized by the growth of grains and plentiful nanostructures. The enlarged grains lead to high charge carrier mobility that boosts the power factor. The abundant dislocations originating from the plastic deformation during cyclic liquid phase sintering and the pinning effect by the Sb-rich nano-precipitates result in low lattice thermal conductivity. Therefore, a high ZT value of over 1.46 is achieved, which is 50% higher than conventionally spark-plasma-sintered (Bi,Sb)₂Te₃. The proposed cyclic spark plasma liquid phase sintering process for TE performance enhancement is validated by the representative (Bi,Sb)₂Te₃ thermoelectric alloy and is applicable for other telluride-based materials.     

Synthesis of samarium telluride thin films by successive ionic layer adsorption and reaction (SILAR) method for supercapacitor application

The present paper deals with synthesis of samarium telluride (Sm₂Te₃) thin films using simple and low cost successive ionic layer adsorption and reaction (SILAR) method for supercapacitor application. The Sm₂Te₃ thin films are characterized by X-ray diffraction (XRD) for structural determination, energy dispersive analysis of X-ray (EDAX) for elemental composition, field emission scanning electron microscopy (FE-SEM) for surface morphological study and contact angle measurement for wettability study. The Sm₂Te₃ exhibits orthorhombic crystal structure with cloud like surface morphology. The film surface showed lyophilic behavior with contact angle of 5.7° for propylene carbonate (PC). Further, electrochemical measurements are carried out in LiClO₄–PC electrolyte using cyclic voltammetry (CV), galvanostatic charge discharge and electrochemical impedance spectroscopy (EIS) techniques. The Sm₂Te₃ film showed maximum specific capacitance and energy density of 144 F g⁻¹ and 10 W h kg⁻¹ respectively. The EIS study showed negligible change in resistive parameters after 1000 electrochemical cycles.     

Achieving Ultrahigh Electron Mobility in PdSe2 Field-Effect Transistors via Semimetal Antimony as Contacts

Even though atomically thin 2D semiconductors have shown great potential for next-generation electronics, the low carrier mobility caused by poor metal–semiconductor contacts and the inherently high density of impurity scatterings remains a critical issue. Herein, high-mobility field-effect transistors (FETs) by introducing few-layer PdSe₂ flakes as channels is achieved, via directly depositing semimetal antimony (Sb) as drain–source electrodes. The formation of clean and defect-free van der Waals (vdW) stackings at the Sb–PdSe₂ heterointerfaces boosts the room temperature transport characteristics, including low contact resistance down to 0.55 kΩ µm, high on-current density reaching 96 µA µm⁻¹, and high electron mobility of 383 cm² V⁻¹ s⁻¹. Furthermore, metal–insulator transition (MIT) is observed in the PdSe₂ FETs with and without hexagonal boron nitride (h–BN) as buffer layers. However, the layered h–BN/PdSe₂ vdW stacking eliminates the interference of interfacial disorders, and thus the corresponding device exhibits a lower MIT crossing point, larger mobility exponent of γ ∼ 1.73, significantly decreased hopping parameter of T₀, and ultrahigh electron mobility of 2,184 cm² V⁻¹ s⁻¹ at 10 K. These findings are expected to be significant for developing high mobility 2D-based quantum devices.     

Three-Stage Thin-Film Superlattice Thermoelectric Multistage Microcoolers with a Δ<Emphasis Type="Italic">T</Emphasis><Subscript>max</Subscript> of 102 K

Thin-film Bi₂Te₃- and Sb₂Te₃-based superlattice (SL) thermoelectric (TE) devices are an enabling technology for high-power and low-temperature applications, which include low-noise amplifier cooling, electronics hot-spot cooling, radio frequency (RF) amplifier thermal management, and direct sensor cooling. Bulk TE devices, which can pump heat loads on the order of 10 W/cm², are not suitable in these applications due to their large size and low heat pumping capacity. Recently, we have demonstrated an external maximum temperature difference, ΔT _max, as high as 58 K in an SL thin-film p–n couple. This state-of-the-art couple exhibited a cold-side minimum temperature, T _cmin, of −30.9°C. We regularly attain ΔT _max values in excess of 53 K, in spite of the many significant electrical and thermal parasitics that are unique to thin-film devices. These measurements do not use any complex thermal management at the heat sink to remove the heat flux from the TE device’s hot side. We describe here multistage SL cooling technologies currently being developed at RTI that can provide useful microcooling cold-side temperatures of 200 K. This effort includes a three-stage module employing independently powered stages which produced a ΔT _max of 101.6 K with a T _cmin of −75°C, as well as a novel two-wire three-stage SL cascade which demonstrated a T _cmin of −46°C and a ΔT _max of nearly 74 K. These RTI modules are only 2.5 mm thick, significantly thinner than a similar commercial three-stage module (5.3 mm thick) that produces a ΔT _max of 96 K. In addition, TE coolers fabricated from these thin-film SL materials perform significantly better than the extrapolated performance of similar thickness bulk alloy materials.     

Tailoring Interfacial Charge Transfer for Optimizing Thermoelectric Performances of MnTe-Sb2Te3 Superlattice-Like Films

Interfacial charge transfer has a vital role in tailoring the thermoelectric performance of superlattices (SLs), which, however, is rarely clarified by experiments. Herein, based on epitaxially grown p-type (MnTe)_x(Sb₂Te₃)_y superlattice-like films, synergistically optimized thermoelectric parameters of carrier density, carrier mobility, and Seebeck coefficient are achieved by introducing interfacial charge transfer, in which effects of hole injection, modulation doping, and energy filtering are involved. Carrier transport measurements and angle-resolved photoemission spectroscopy (ARPES) characterizations reveal a strong hole injection from the MnTe layer to the Sb₂Te₃ layer in the SLs, originating from the work function difference between MnTe and Sb₂Te₃. By reducing the thickness of MnTe less than one monolayer, all electronic transport parameters are synergistically optimized in the quantum-dots (MnTe)_x(Sb₂Te₃)₁₂ superlattice-like films, leading to much improved thermoelectric power factors (PFs). The (MnTe)_0.1(Sb₂Te₃)₁₂ obtains the highest room-temperature PF of 2.50 mWm⁻¹K⁻², while the (MnTe)_0.25(Sb₂Te₃)₁₂ possesses the highest PF of 2.79 mWm⁻¹K⁻² at 381 K, remarkably superior to the values acquired in binary MnTe and Sb₂Te₃ films. This research provides valuable guidance on understanding and rationally tailoring the interfacial charge transfer of thermoelectric SLs to further enhance thermoelectric performances.     

Effect of Heat Treatment on the Thermoelectric Properties of Bismuth–Antimony–Telluride Prepared by Mechanical Deformation and Mechanical Alloying

In this work, p-type 20%Bi₂Te₃–80%Sb₂Te₃ bulk thermoelectric (TE) materials were prepared by mechanical deformation (MD) of pre-melted ingot and by mechanical alloying (MA) of elemental Bi, Sb, and Te granules followed by cold-pressing. The dependence on annealing time of changes of microstructure and TE properties of the prepared samples, including Seebeck coefficient, electrical resistivity, thermal conductivity, and figure-of-merit, was investigated. For both samples, saturation of the Seebeck coefficient and electrical resistivity were observed after annealing for 1 h at 380°C. It is suggested that energy stored in samples prepared by both MA and MD facilitated their recrystallization within short annealing times. The 20%Bi₂Te₃–80%Sb₂Te₃ sample prepared by MA followed by heat treatment had higher a Seebeck coefficient and electrical resistivity than specimens fabricated by MD. Maximum figures-of-merit of 3.00 × 10^?3/K and 2.85 × 10^?3/K were achieved for samples prepared by MA and MD, respectively.     

Natural Microstructure and Thermoelectric Performance of (GeTe)80(AgySb2?yTe3?y)20

Thermoelectric (TE) materials (GeTe)₈₀(Ag _y Sb_2−y Te_3−y )₂₀ (y = 0.6, 0.8, 1.0, 1.2, and 1.4) were prepared, and their TE properties and microstructure studied in this work. Due to their relatively low thermal conductivity and proper carrier concentration, high ZT values were obtained for all samples except for y = 1.4. Using transmission electron microscopy, twins, antiphase domains, and low-angle grain boundaries were observed throughout the sample with y = 1.2. Nanoscale regions with double atomic spacing were detected. These regions and the matrix were coherent without obvious mismatch. The relationship between high ZT values and microstructure is discussed.     

Enhanced Thermoelectric Performance in GeTe by Synergy of Midgap state and Band Convergence

The good co-existence of midgap state and valence band degeneracy is realized in Bi-alloyed GeTe through the In-Cd codoping to play different but complementary roles in the valence band structure modification. In doping induces midgap state and results in a considerably improved Seebeck coefficient near room temperature, while Cd doping significantly increases the Seebeck coefficient in the mid-high temperature region by promoting the valence band convergence. The synergistic effects obviously increase the density of state effective mass from 1.39 to 2.65 m₀, and the corresponding carrier mobility still reaches 34.3 cm² V⁻¹ s⁻¹ at room temperature. Moreover, the Bi-In-Cd co-alloying introduces various phonon scattering centers including nanoprecipitates and strain field fluctuations and suppresses the lattice thermal conductivity to a rather low value of 0.56 W m⁻¹ K⁻¹ at 600 K. As a result, the Ge_0.89Bi_0.06In_0.01Cd_0.04Te sample obtains excellent thermoelectric properties of zT_max ≈2.12 at 650 K and zT_avg ≈1.43 between 300 and 773 K. This study illustrates that the thermoelectric performance of GeTe can be optimized in a wide temperature range through the synergy of midgap state and valence band convergence.     

Measurement of Local Peltier Constant at a Microcontact

Our novel apparatus measures the local Peltier constant at a thermoelectric material microregion. A narrow metal needle probe contacts a sample mounted into a small adiabatic vacuum chamber with a pressure of about 10⁻⁴ Pa. A␣stepping-motor-type nano-actuator controls the probe’s contact pressure. We measured DC and AC I–V characteristics at the microcontact to determine thermoelectric properties. We measured I–V characteristics between the probe and a commercial (Bi,Sb)₂Te₃ surface. Measured values of local Peltier constants are of the same order as the bulk Peltier constant π: ca. 55 mV. They increase with increased contact resistance, suggesting that contact size affects thermoelectricity.     

Sequential Evaporation of Bi-Te Thin Films with Controllable Composition and Their Thermoelectric Transport Properties

We report a simplified sequential evaporation route that can deposit compositionally controllable Bi-Te thermoelectric (TE) thin films without the need for a highly controlled facility. Te and Bi granules were used as starting materials, with their ratio being adjusted to obtain Bi-Te films with different compositions and thicknesses. The as-evaporated and annealed films were subjected to structural and morphological analysis, and their transport properties were measured. X-Ray diffraction data revealed multiple phases for most films. Energy-dispersive x-ray spectroscopy showed that the film composition was Te-enriched due to the large vapor pressure difference of Te and Bi. A Bi₂Te₃ single phase was obtained in the annealed films, having nominal composition of BiTe_1.2. The existence of impurity phases, such as Bi₄Te₃ or elemental Te, was found in all the as-evaporated films and in the annealed films with other nominal Te/Bi ratios, which degraded the TE properties of the films by increasing their electrical conductivity and reducing their Seebeck coefficient. A pure Bi₂Te₃ film with nominal Te/Bi ratio of 1.2 exhibited a maximum power factor of 7.9 × 10^?4 W m^?1 K² after annealing at 200°C. This work demonstrated a simple, undemanding, reliable method to deposit Bi-Te-based TE thin films that can be utilized to fabricate low-cost TE microgenerators.     

A Self-Healing Volume Variation Three-Dimensional Continuous Bulk Porous Bismuth for Ultrafast Sodium Storage

Bismuth (Bi) has attracted considerable attention as promising anode material for sodium-ion batteries (NIBs) owing to its suitable reaction potential and high volumetric capacity density (3750 mA h cm⁻³). However, the large volumetric expansion during cycling causes severe structural degradation and fast capacity decay. Herein, by rational design, a self-healing nanostructure 3D continuous bulk porous bismuth (3DPBi) is prepared via facile liquid phase reduction reaction. The 3D interconnected Bi nanoligaments provide unblocked electronic circuits and short ion diffusion path. Meanwhile, the bicontinuous nanoporous network can realize self-healing the huge volume variation as confirmed by in situ and ex situ transmission electron microscopy observations. When used as the anode for NIBs, the 3DPBi delivers unprecedented rate capability (high capacity retention of 95.6% at an ultrahigh current density of 60 A g⁻¹ with respect to 1 A g⁻¹) and long-cycle life (high capacity of 378 mA h g⁻¹ remained after 3000 cycles at 10 A g⁻¹). In addition, the full cell of Na₃V₂(PO₄)₃|3DPBi delivers stable cycling performance and high gravimetric energy density (116 Wh kg⁻¹), demonstrating its potential in practical application.     

Interplay between Structural and Thermoelectric Properties in Epitaxial Sb2+xTe3 Alloys

In recent years strain engineering is proposed in chalcogenide superlattices (SLs) to shape in particular the switching functionality for phase change memory applications. This is possible in Sb₂Te₃/GeTe heterostructures leveraging on the peculiar behavior of Sb₂Te₃, in between covalently bonded and weakly bonded materials. In the present study, the structural and thermoelectric (TE) properties of epitaxial Sb_2+xTe₃ films are shown, as they represent an intriguing option to expand the horizon of strain engineering in such SLs. Samples with composition between Sb₂Te₃ and Sb₄Te₃ are prepared by molecular beam epitaxy. A combination of X‐ray diffraction and Raman spectroscopy, together with dedicated simulations, allows unveiling the structural characteristics of the alloys. A consistent evaluation of the structural disorder characterizing the material is drawn as well as the presence of both Sb₂ and Sb₄ slabs is detected. A strong link exists among structural and TE properties, the latter having implications also in phase change SLs. A further improvement of the TE performances may be achieved by accurately engineering the intrinsic disorder. The possibility to tune the strain in designed Sb_2+xTe₃/GeTe SLs by controlling at the nanoscale the 2D character of the Sb_2+xTe₃ alloys is envisioned.     

Effect of Ag photo-doping on structural,optical and phase change properties of GeTe chalcogenide films

This paper reports the effect of Ag photo-doping on optical, electrical and structural properties of GeTe:Ag thin films. The absence of sharp diffraction peak confirms the amorphous nature of as-deposited and photo-doped films. The decrease in reflectance of GeTe:Ag bilayer films with photo-doping reaction time has been observed. The RAMAN spectrum showed the characteristic Raman bands for GeTe₄ (127 cm⁻¹), long chain interactions of Te–Te chains (145 cm⁻¹) and a broad peak for Ge–Ge vibrations (275 cm⁻¹) without appreciable change in their position/shape with photodoped Ag concentration. The electrical resistivity measurement shows that photo-doping of Ag led to sharp amorphous-crystalline phase transition along with an increase in transition temperature and resistivity value in both amorphous as well as crystalline state. The annealing of photo-doped GeTe:Ag samples showed an enhancement in the crystallinity of GeTe phase without any segregation of Ag phases in annealed samples. The preferential formation of GeTe (200) phase upon crystallization has been observed for GeTe:Ag films. Different optical parameters have been calculated for photo-doped and annealed samples and are discussed in conjunction with the modification of network structure of GeTe with inclusion of photo-doped Ag content.     

Inkjet Printing Flexible Thermoelectric Devices Using Metal Chalcogenide Nanowires

Development of flexible thermoelectric devices offers exciting opportunities for wearable applications in consumer electronics, healthcare, human–machine interface, etc. Despite the increased interests and efforts in nanotechnology-enabled flexible thermoelectrics, translating the superior properties of thermoelectric materials from nanoscale to macroscale and reducing the manufacturing costs at the device level remain a major challenge. Here, an economic and scalable inkjet printing method is reported to fabricate high-performance flexible thermoelectric devices. A general templated-directed chemical transformation process is employed to synthesize several types of 1D metal chalcogenide nanowires (e.g., Ag₂Te, Cu₇Te₄, and Bi₂Te_2.7Se_0.3). These nanowires are made into inks suitable for inkjet printing by dispersing them in ethanol without any additives. As a showcase for thermoelectric applications, fully inkjet-printed Ag₂Te-based flexible films and devices are prepared. The printed films exhibit a power factor of 493.8 µW m⁻¹ K⁻² at 400 K and the printed devices demonstrate a maximum power density of 0.9 µW cm⁻² K⁻², both of which are significantly higher than those reported in state-of-the-art inkjet-printed thermoelectrics. The protocols of metal chalcogenide ink formulations, as well as printing are general and extendable to a wider range of material systems, suggesting the great potential of this printing platform for scalable manufacturing of next-generation, high-performance flexible thermoelectric devices.