Design and Growth of Visible-Blind and Solar-Blind III-N APDs on Sapphire Substrates

GaN-based visible-blind and AlGaN-based solar-blind avalanche photodiodes (APDs) have been grown and fabricated on sapphire substrates. The GaN p-i-n APDs show low dark current with high gain. The AlGaN layers for the Al_0.55Ga_0.45N-based APDs are grown using a newly developed pulsed metalorganic chemical vapor deposition (MOCVD) process, and the material characterization results show excellent material quality. The spectral responsivity of the devices show a bandpass characteristic with cutoffs in the ultraviolet (UV) visible-blind and solar-blind spectrum for GaN- and Al_0.55Ga_0.45N-based APDs, respectively.     

Nearly Perfect Electrical Activation Efficiencies from Silicon-Implanted Al<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Ga<Subscript>1−<Emphasis Type="Italic">x</Emphasis></Subscript>N with High Aluminum Mole Fraction

Electrical activation studies of Al _x Ga_1−x N (x = 0.45 and 0.51) implanted with Si for n-type conductivity have been made as a function of ion dose and anneal temperature. Silicon ions were implanted at 200 keV with doses ranging from 1 × 10¹⁴ cm⁻² to 1 × 10¹⁵ cm⁻² at room temperature. The samples were subsequently annealed from 1150°C to 1350°C for 20 min in a nitrogen environment. Nearly 100% electrical activation efficiency was successfully obtained for the Si-implanted Al_0.45Ga_0.55N samples after annealing at 1350°C for doses of 1 × 10¹⁴ cm⁻² and 5 × 10¹⁴ cm⁻² and at 1200°C for a dose of 1 × 10¹⁵ cm⁻², and for the Al_0.51Ga_0.49N implanted with silicon doses of 1 × 10¹⁴ cm⁻² and 5 × 10¹⁴ cm⁻² after annealing at 1300°C. The highest room-temperature mobility obtained was 61 cm²/V s and 55 cm²/V s for the low-dose implanted Al_0.45Ga_0.55N and Al_0.51Ga_0.49N, respectively, after annealing at 1350°C for 20 min. These results show unprecedented activation efficiencies for Al _x Ga_1−x N with high Al mole fractions and provide suitable annealing conditions for Al _x Ga_1−x N-based device applications.     

Structural and Carrier Dynamics of GaN and AlGaN-Based Double Heterostructures in the UV Region

Aluminum gallium nitride-based double heterostructures with two different active layer widths have been grown on GaN templates by metalorganic chemical vapor deposition. Crystalline quality has been investigated using high-resolution x-ray diffraction analysis, and screw, edge, as well as total dislocation densities in the GaN epilayer have been calculated. The dislocation density of GaN has been found to be on the order of 10⁸ cm^?2. The nominal Al composition and in-plane strain ε _xx for the AlGaN layer grown on the GaN layer have been measured by asymmetric reciprocal-space mapping. Surface properties and cross-sectional views of the samples have been analyzed using atomic force microscopy (AFM) and field-emission scanning electron microscopy (FESEM), respectively. Room-temperature time-resolved photoluminescence and photoluminescence measurements have been performed on Al_0.18Ga_0.82N/Al_0.45Ga_0.55N double heterostructures and the GaN template. The interface recombination velocity (S) of AlGaN-based double heterostructures has been calculated using carrier decay time measurement, increasing from 8.7 × 10³ cm/s to 13.4 × 10³ cm/s with varying active layer thickness.     

Evolution of Threading Dislocation Density and Stress in GaN Films Grown on (111) Si Substrates by Metalorganic Chemical Vapor Deposition

We have studied the evolution of threading dislocations (TDs), stress, and cracking of GaN films grown on (111) Si substrates using a variety of buffer layers including thin AlN, compositionally graded Al _x Ga_1-x N (0 ≤ x ≤ 1), and AlN/Al _y Ga_1-y N/Al _x Ga_1-x N (0 ≤ x ≤ 1, y = 0 and 0.25) multilayer buffers. We find a reduction in TD density in GaN films grown on graded Al _x Ga_1-x N buffer layers, in comparison with those grown directly on a thin AlN buffer layer. Threading dislocation bending and annihilation occurs in the region in the graded Al _x Ga_1-x N grown under a compressive stress, which leads to a decrease of TD density in the overgrown GaN films. In addition, growing a thin AlN/Al _y Ga_1-y N bilayer prior to growing the compositionally graded Al _x Ga_1-x N buffer layer significantly reduces the initial TD density in the Al _x Ga_1-x N buffer layer, which subsequently further reduces the TD density in the overgrown GaN film. In-situ stress measurements reveal a delayed compressive-to-tensile stress transition for GaN films grown on graded Al _x Ga_1-x N buffer layers or multilayer buffers, in comparison to the film grown on a thin AlN buffer layer, which subsequently reduces the crack densities in the films.     

Enhanced radiative recombination in AlGaN quantum wells grown by molecular-beam epitaxy

Dependences of the intensity of cathodoluminescence in multiple Al_0.55Ga_0.45N/Al_0.45Ga_0.55N quantum wells grown by molecular-beam epitaxy on the growth conditions are studied. An increase (by almost two orders of magnitude) in the intensity of the cathodoluminescence peak with an energy of 4.45 eV is observed as the quantum-well layer grows in the conditions of deep depletion with respect to ammonia. In this case, a tendency towards the mode of three-dimensional growth can be inferred from the pattern of diffraction of high-energy electrons; this effect is interpreted using a model of formation of AlGaN quantum dots.     

AlxGa1−xN/GaN/AlN heterostructures grown on Si(1 1 1) substrates by MBE for MSM UV photodetector applications

Al_xGa_1−xN/GaN/AlN heterostructures on silicon (Si) substrate was developed by nitrogen plasma-assisted molecular beam epitaxy (MBE) and their properties were investigated by scanning electron microscopy (SEM), electron dispersive X-ray (EDX), atomic force microscopy (AFM), high resolution X-ray diffraction (XRD), Raman spectroscopy and Hall effect measurements. High purity gallium (7N) and aluminum (6N5) were used in the Knudsen cells. High purity nitrogen with 7N purity was supplied to radio frequency (RF) source to generate reactive nitrogen species. The nitrogen pressure and a discharge power were kept at 1.5×10⁻⁵ Torr and 300 W, respectively. From SEM measurements, the surface morphology of samples presented 2- and 3-dimensional growth modes. The EDX measurements showed that there were no foreign elements in the grown samples. The HR-XRD measurement has confirmed that the Al_xGa_1−xN/GaN/AlN heterostructures samples were epitaxially grown on Si substrate. All the dominant E₂ phonon modes were found in Raman spectra results. Lastly, Al_xGa_1−xN/GaN/AlN heterostructures based metal–semiconductor–metal (MSM) UV photodetectors were fabricated and the electrical characteristics of the devices were investigated by using current–voltage (I–V) and photo-conductivity measurements. The devices presented good I–V and photoconductivity characteristics.     

Acceptor and donor doping of AlxGa1−xN thin film alloys grown on 6H-SiC(0001) substrates via metalorganic vapor phase epitaxy

Thin films of Si-doped Al_xGa_1−xN (0.03≤x≤0.58) having smooth surfaces and strong near-band edge cathodoluminescence were deposited at 0.35–0.5 μm/h on on-axis 6H-SiC(0001) substrates at 1100°C using a 0.1 μm AlN buffer layer for electrical isolation. Alloy films having the compositions of Al_0.08Ga_0.92N and Al_0.48Ga_0.52N exhibited mobilities of 110 and 14 cm²/V·s at carrier concentrations of 9.6×10¹⁸ and 5.0×10¹⁷ cm⁻³, respectively. This marked change was due primarily to charge scattering as a result of the increasing Al concentration in these random alloys. Comparably doped GaN films grown under similar conditions had mobilities between 170 and ∼350 cm²/V·s. Acceptor doping of Al_xGa_1−xN for x≤0.13 was achieved for films deposited at 1100°C. No correlation between the O concentration and p-type electrical behavior was observed.     

MOCVD Growth of InN on Si(111) with Various Buffer Layers

We report the growth of InN by metalorganic chemical vapor deposition on Si(111) substrates. It was found that the sharpest InN(002) x-ray diffraction peak could be achieved from the sample prepared on a complex buffer layer that consists of a low-temperature AlN, a graded Al _x Ga_1−x N (x = 1 → 0), and a high-temperature GaN. The resultant mobility of 275 cm²/V s thus obtained was 75% larger than that of the InN prepared on a single LT-AlN buffer layer only.     

Effect of Si doping on the photoluminescence properties of AlGaInP/GaInP multiple quantum wells

The influence of Si doping on the photoluminescence (PL) properties of (Al_0.3Ga_0.7)_0.5In_0.5P/Ga_0.5In_0.5P multiple-quantum-wells (MQWs) was studied. For the samples without p-type layers, the PL peak wavelength from (Al_0.3Ga_0.7)_0.5In_0.5P/Ga_0.5In_0.5P MQWs did not vary when Si was doped in MQWs, the PL peak intensity did not change obviously and the PL FWHM broadened. We consider that Si doping results in worse interface quality of (Al_0.3Ga_0.7)_0.5In_0.5P/Ga_0.5In_0.5P MQWs. However, for the full light-emitting diode (LED) structure samples, the PL intensity of MQWs obviously increased when Si was doped in MQWs. The PL intensity from MQWs with Si-doped barriers was about 13 times stronger than that of undoped MQWs. The PL intensity from MQWs with Si-doped barriers and wells was strong as 28 times as that of undoped MQWs. The reasons are discussed.     

Electrical Activation Studies of Silicon-Implanted Al<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Ga<Subscript>1−<Emphasis Type="Italic">x</Emphasis></Subscript>N with Aluminum Mole Fraction of 11% to 51%

Electrical activation studies of Si-implanted Al _x Ga_1−x N with an Al mole fraction of 11% to 51% have been carried out as a function of ion dose and annealing temperature. The Al _x Ga_1−x N samples were implanted at room temperature with Si ions at 200 keV in doses ranging from 1 × 10¹⁴ cm⁻² to 1 × 10¹⁵ cm⁻², and subsequently annealed from 1100°C to 1350°C for 20 min in a nitrogen environment. The maximum electrical activation efficiencies for the Al _x Ga_1−x N samples with an Al mole fraction less than 40% were obtained for samples implanted with the highest Si dose of 1 × 10¹⁵ cm⁻². On the other hand, for the Al _x Ga_1−x N samples with an Al mole fraction more than 40%, nearly perfect activation efficiencies of 99% and 100% were obtained for the samples implanted with the lowest Si dose of 1 × 10¹⁴ cm⁻². The mobility of the Si-implanted Al _x Ga_1−x N samples increased with increasing annealing temperature in spite of the increased number of ionized donors and thus increased impurity scattering, indicating that a greater amount of lattice damage is being repaired with each successive increase in annealing temperature. These results provide suitable annealing conditions for Si-implanted Al _x Ga_1−x N-based devices with an Al mole fraction from 11% to 51%.     

Metal-Semiconductor Nanoheterostructures with an AlGaN Quantum Well and In Situ Formed Surface Al Nanoislands

We report on fabrication and studies of composite heterostuctures consisting of an Al_0.55Ga_0.45N/A_l0.8Ga_0.2N quantum well and surface Al nanoislands, grown by plasma-assisted molecularbeam epitaxy on c-sapphire substrates. The influence of a substrate temperature varied between 320 and 700ºC on the size and density of the deposited Al nanoislands is evaluated. The effect of Al nanoislands on decay kinetics of the quantum well middle-ultraviolet photoluminescence has been investigated by time resolved photoluminescence. The samples with the maximum density of Al nanoislands of 10⁸ cm^–2 and lateral dimensions in the range of 100–500 nm demonstrated shortening of the photoluminescence lifetime, induced by interaction of the emitting quantum well and the plasmonic metal particles.

     

Electrical and optical characterization studies of lower dose Si-implanted AlxGa1−xN

Electrical and optical activation studies of lower dose Si-implanted Al_xGa_1?xN (x=0.14 and 0.24) have been made systematically as a function of ion dose and anneal temperature. Silicon ions were implanted at 200 keV with doses ranging from 1×10¹³ cm^?2 to 1×10¹⁴ cm^?2 at room temperature. The samples were proximity cap annealed from 1,100°C to 1,350°C with a 500-Å-thick AlN cap in a nitrogen environment. Nearly 100% electrical activation efficiency was obtained for Al_0.24Ga_0.76N implanted with a dose of 1 × 10¹⁴ cm^?2 after annealing at an optimum temperature around 1,300°C, whereas for lower dose (≤5×10¹³ cm^?2) implanted Al_0.24Ga_0.76N samples, the electrical activation efficiencies continue to increase with anneal temperature up through 1,350°C. Seventy-six percent electrical activation efficiency was obtained for Al_0.14Ga_0.86N implanted with a dose of 1 × 10¹⁴ cm^?2 at an optimum anneal temperature of around 1,250°C. The highest mobilities obtained were 89 cm²/Vs and 76 cm²/Vs for the Al_0.14Ga_0.86N and Al_0.24Ga_0.76N, respectively. Consistent with the electrical results, the photoluminescence (PL) intensity of the donor-bound exciton peak increases as the anneal temperature increases from 1,100°C to 1,250°C, indicating an increased implantation damage recovery with anneal temperature.     

Study on mobility enhancement in MOVPE-grown AlGaN/AlN/GaN HEMT structures using a thin AlN interfacial layer

Al_0.26Ga_0.74N/AlN/GaN high-electron-mobility transistor (HEMT) structures with AlN interfacial layers of various thicknesses were grown on 100-mm-diameter sapphire substrates by metalorganic vapor phase epitaxy, and their structural and electrical properties were characterized. A sample with an optimum AlN layer thickness of 1.0 nm showed a highly enhanced Hall mobility (μ_Hall) of 1770 cm²/Vs with a low sheet resistance (ρ_s) of 365 Ω/sq. (2DEG density n_s = 1.0 × 10¹³/cm²) at room temperature compared with those of a sample without the AlN interfacial layer (μ_Hall = 1287 cm²/Vs, ρ_s = 539 Ω/sq., and n_s = 0.9 × 10¹³/cm²). Electron transport properties in AlGaN/AlN/GaN structures were theoretically studied, and the calculated results indicated that the insertion of an AlN layer into the AlGaN/GaN heterointerface can significantly enhance the 2DEG mobility due to the reduction of alloy disorder scattering. HEMTs were successfully fabricated and characterized. It was confirmed that AlGaN/AlN/GaN HEMTs with the optimum AlN layer thickness show superior DC properties compared with conventional AlGaN/GaN HEMTs.     

High-quality n-type aluminum gallium nitride thin films grown by interrupted deposition and in-situ thermal annealing

High quality Si-doped n-Al_0.6Ga_0.4N thin films were grown on sapphire substrates by molecular beam epitaxy (MBE) by interrupted deposition and subsequent in-situ thermal annealing (IDTA). High-resolution X-ray diffraction, scanning electron microscope, atomic force microscope, photoluminescence and Hall-effect measurements were carried out to characterize the structural, electrical and optical properties. The results showed that the full width at half-maximum of the Si-doped Al_0.6Ga_0.4N (0002) was as low as 160 arcsec. The threading dislocation density decreases two orders of magnitude to 6×110⁷ cm⁻² by using the IDTA technology. The carrier density and mobility reached at 1.1×10¹⁹ cm⁻³ and 4.8 cm²/V s, respectively. Si still acted as a shallow donor even for the heavily doped Al_0.6Ga_0.4N.     

Impact of strain relaxation of AlmGa1−mN layer on 2-DEG sheet charge density and current voltage characteristics of lattice mismatched AlmGa1−mN/GaN HEMTs

An accurate charge control model to investigate the effect of aluminum composition, strain relaxation, thickness and doping of the Al_mGa_1−mN barrier layer on the piezoelectric and spontaneous polarization induced 2-DEG sheet charge density, threshold voltage and output characteristics of partially relaxed Al_mGa_1−mN/GaN HEMTs is proposed. The strain relaxation of the barrier imposes an upper limit on the maximum 2-DEG density achievable in high Al content structures and is critical in determining the performance of lattice mismatched Al_mGa_1−mN/GaN HEMTs. The model incorporates the effects of field dependent mobility, parasitic source/drain resistance and velocity saturation to evaluate the output characteristics of Al_mGa_1−mN/GaN HEMTs. Close proximity with published results confirms the validity of the proposed model.     

Effect of AlInGaN barrier layers with various TMGa flows on optoelectronic characteristics of near UV light-emitting diodes grown by atmospheric pressure metalorganic vapor phase epitaxy

Near ultraviolet light-emitting diodes (LEDs) with quaternary AlInGaN quantum barriers (QBs) are grown by atmospheric pressure metalorganic vapor phase epitaxy. The indium mole fraction of AlInGaN QB could be enhanced as we increased the TMG flow rate. Both the wavelength shift in EL spectra and forward voltage at 20 mA current injection were reduced by using AlInGaN QB. Under 100 mA current injection, the LED output power with Al_0.089In_0.035Ga_0.876N QB can be enhanced by 15.9%, compared to LED with GaN QB. It should be attributed to a reduction of lattice mismatch induced polarization mismatch in the active layer.     

Growth Studies on Quaternary AlInGaN Layers for HEMT Application

Quaternary barrier layers for GaN-based high-electron-mobility transistors (HEMT) have recently been a focus of interest because of the possible lattice-matched growth to GaN. This results in a reduction of strain-related defects, while having the option of adjusting the bandgap separately. A further benefit of the quaternary approach is the possibility to achieve high polarization and high carrier mobility simultaneously. This may improve the performance of such devices beyond what is possible with ternary barrier layers. In this work, we report on growth and characterization of Al _x In _y Ga_1−x−y N barrier layers within the range of 16% to 56% Al, 2% to 45% In, and 20% to 82% Ga deposited on conventional GaN buffer layers on sapphire. We present an effective way to change the composition of quaternary layers and discuss the influence of tensile and compressive strain on structural and electrical properties. From high-resolution x-ray diffraction (HRXRD), Rutherford backscattering spectroscopy (RBS), and wavelength-dispersive x-ray spectroscopy (WDX), we determined the compositions and strain states of the AlInGaN layers. The bandgaps (E _g) were obtained by spectroscopic ellipsometry (SE). Hall and van der Pauw measurements on thin heterostructure layers yielded high mobilities in excess of 1550 cm²/V s and 5350 cm²/V s at room temperature and 77 K, respectively.     

Digitally Alloyed Modulated Precursor Flow Epitaxial Growth of Ternary AlGaN with Binary AlN and GaN Sub-Layers and Observation of Compositional Inhomogeneity

We report the growth of ternary aluminum gallium nitride (AlGaN) layers on AlN/sapphire template/substrates by digitally alloyed modulated precursor flow epitaxial growth (DA-MPEG), which combined an MPEG AlN sub-layer with a conventional metalorganic chemical vapor deposition (MOCVD)-grown GaN sub-layer. The overall composition in DA-MPEG Al _x Ga_1−x N was controlled by adjustment of the growth time (i.e., the thickness) of the GaN sub-layer. As the GaN sub-layer growth time increased, the Al composition in AlGaN decreased to 50%, but the surface morphology of the AlGaN layer became rough, and a three-dimensional structure with islands appeared for the DA-MPEG AlGaN with relatively thick GaN sub-layers, possibly resulting from the Ga adatom surface migration behavior and/or the strain built up from lattice mismatch between AlN and GaN sub-layers with increasing GaN sub-layer growth time. Through strain analysis by high-resolution x-ray diffraction, reciprocal space mapping, and scanning transmission electron microscopy, it was found that there was compositional inhomogeneity in the DA-MPEG AlGaN with AlN and GaN binary sub-layers for the case of the layer with relatively thick GaN sub-layers.     

The effect of built-in electric field in GaN/AlGaN quantum wells with high AIN mole fraction

Spontaneous and piezoelectric polarization in hexagonal GaN/AlGaN heterostructures give rise to large built-in electric fields. The effect of the builtin electric field in GaN/Al_xGa_1−xN quantum wells was investigated for x=0.2 to 0.8 by photoluminescence studies. The quantum well structures were grown by molecular beam epitaxy on (0001) sapphire substrates. Cross-sectional transmission electron microscopy performed on the samples revealed abrupt interfaces and uniform layer thicknesses. The low temperature (4 K) photoluminescence peaks were progressively red-shifted due to the quantum confined Stark effect depending on the AlN mole fraction in the barriers and the thickness of the GaN quantum well. Our results verify the existence of very large built-in electric fields of up to 5 MV/cm in GaN/Al_0.8Ga_0.2N quantum wells.     

Effects of high doping on the bandgap bowing for AlxGa1−xN

This paper gives the composition dependence of the bandgap energy for highly doped n-type Al_xGa_1−xN. We report results of the bowing parameter obtained using a random simulation. Three groups of Al_xGa_1−xN semiconductors were considered and which are distinguishable by their non degenerate or degenerate character in the doping density (10¹⁷?N_D?10²⁰ cm⁻³). A striking feature is the large discrepancy of the bandgap bowing (−2.02?b?2.94 eV), as was demonstrated from our calculations. This suggests that high doping may be a possible cause able to induce the large range of bowing parameters reported for Al_xGa_1−xN alloys.