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1.
This paper describes a single-chip RF transceiver LSI for 2.4-GHz-band Gaussian frequency shift-keying applications, such as Bluetooth. This chip uses a 0.18-/spl mu/m bulk CMOS process for lower current consumption. The LSI consists of almost all the required RF and IF building blocks: a transmit/receive antenna switch, a power amplifier, a low noise amplifier, an image rejection mixer, channel-selection filters, a limiter, a received signal strength indicator, a frequency discriminator, a voltage controlled oscillator, and a phase-locked loop synthesizer. The bandpass filter for channel selection was difficult to achieve since it operates at a low supply voltage. However, because large interference is roughly rejected at the output of the image rejection mixer and a wide-input-range bandpass filter with an optimized input bias is realized, the transceiver can operate at a supply voltage of 1.8 V. In the IF section, we adopted a circuit design using the minimum number of passive elements, resistors and capacitors, for a lower chip area of 10.2 mm/sup 2/.  相似文献   

2.
This paper describes a 1-V operation Bluetooth RF transceiver in 0.2-/spl mu/m CMOS SOI. The transceiver integrates a radio-frequency transmit/receive switch, an image-reject mixer, a quadrature demodulator, g/sub m/-C filters, an LC-tank voltage-controlled oscillator, a phase-locked loop synthesizer, and a power amplifier. The phase shifter in the quadrature demodulator is tuned dynamically to track the carrier-frequency drift allowed in the Bluetooth specification. The g/sub m/ cell in the filters uses depletion-mode pMOS transistors. In order to achieve 1-V operation, LC-tuned-folded and transistor-current-source-folded circuits are used in the RF and IF building blocks, respectively. In order to minimize power consumption, the current flowing through the circuit is optimally shared between the folded stages. A tuning circuit for the g/sub m/-C filters and a bias generation circuit ensure stable transceiver performance. The transceiver shows -77-dBm sensitivity at 0.1% bit error rate and consumes 33 and 53 mW from 1 V in the transmit and receive modes, respectively.  相似文献   

3.
This paper describes a new transmitter architecture suitable for wideband GMSK modulation. The technique uses direct modulation of ΔΣ frequency discriminator (ΔΣFD)-based synthesizer to produce the modulated RF signal without any up-conversion. Digital equalization is used to extend the modulation data rate far beyond the synthesizer closed-loop BW. A prototype 1.9-GHz GSM transmitter was constructed consisting of a ΔΣFD-based synthesizer and a digital transmit filter. The synthesizer consists of an 0.8-μm BiCMOS ΔΣFD chip, a digital signal processor FPGA, and an off-chip D/A converter, filter, and VCO. Measured results, using 271-kbit/s GSM modulation, demonstrate data rates well in excess of the 30-kHz synthesizer closed-loop BW are possible with digital equalization. Without modulation, the synthesizer exhibits a -76-dBc spurious noise level and a close-in phase noise of -74 dBc/Hz  相似文献   

4.
采用0.18μmRF CMOS工艺结合EPC C1G2协议和ETSI规范要求,实现了一种应用于CMOS超高频射频识别阅读器中的低噪声ΔΣ小数频率综合器。基于三位三阶误差反馈型ΔΣ解调器,采用系数重配技术,有效提高频率综合器中频段噪声性能;关键电路VCO的设计过程中采用低压差调压器技术为VCO提供稳定偏压,提高了VCO相位噪声性能。多电源供电模式下全芯片偏置电流为9.6mA,测得在中心频率频偏200kHz、1MHz处,相处噪声分别为-108dBc/Hz和-129.8dBc/Hz。  相似文献   

5.
Recent trends in the integration of entire systems on-chip have spurred the development of homodyne radios as alternatives to the more mature yet harder to integrate superheterodyne architectures. This paper presents a monolithic device that integrates all of the functions necessary to implement a multiband homodyne global system for mobile telecommunications (GSM) radio except for the power amplifier (PA) and radio frequency (RF) passives. The single BiCMOS chip includes a quad-band direct conversion receiver that down converts RF to quadrature analog baseband. The front-end circuitry is followed by a low-DC-offset, high-dynamic-range, analog I/Q baseband chain. The transmit section is comprised of a quad-band up-conversion transmit phase-locked loop (PLL) including on chip transmit voltage-controlled oscillators (VCOs). The stringent GSM receive band phase noise specifications are met without the use of surface acoustic wave filters. A single /spl Sigma//spl Delta/ fractional-N synthesizer locking a fully integrated ultrahigh frequency VCO generates the system local oscillator signal.  相似文献   

6.
This paper concerns the design consideration, fabrication process, and performance results for an ultra-broadband, low-voltage, low-power, BiCMOS-based transceiver chip for cellular-satellite-LAN wireless communication networks. The transceiver chip incorporates an RF amplifier, a Gilbert down-mixer, and an IF amplifier in the receive path, and an IF amplifier, a Gilbert up-mixer, and an RF amplifier in the transmit path. For an RF frequency in the 1-10 GHz band and an IF frequency in the 100-1000 MHz band, the developed transceiver chip consumes less than 60 mW at 2 V, to yield a downconversion gain of 40 dB at 1 GHz and 10 dB at 10 GHz and an upconversion gain of 42 dB at 1 GHz and 11 dB at 10 GHz. To avoid possible start-up problems caused during “stand-by” to “enable” mode transition, a simple switching technique is employed for enabling either the receive or the transmit path, by changing the value of a reference voltage applied to both the down- and the up-mixers. While the developed transceiver chip exhibits the best performance for a dc supply voltage of 2 V, it shows a graceful degradation for a ±0.15 V voltage deviation. The transceiver's chip size is 1.04 mm×1.04 mm  相似文献   

7.
A fully integrated CMOS transceiver tuned to 2.4 GHz consumes 46 mA in receive mode and 47 mA in transmit mode from a 2.7-V supply. It includes all the receive and transmit building blocks, such as frequency synthesizer, voltage-controlled oscillator (VCO), power amplifier, and demodulator. The receiver uses a low-IF architecture for higher level of integration and lower power consumption. It achieves a sensitivity of -82 dBm at 0.1% BER, and a third-order input intercept point (IIP3) of -7 dBm. The direct-conversion transmitter delivers a GFSK modulated spectrum at a nominal output power of 4 dBm. The on-chip voltage controlled oscillator has a close-in phase-noise of -120 dBc/Hz at 3-MHz offset  相似文献   

8.
A fully integrated dual-mode CMOS transceiver tuned to 2.4 GHz consumes 65 mA in receive mode and 78 mA in transmit mode from a 3-V supply. The radio includes all the receive and transmit building blocks, such as frequency synthesizer, voltage-controlled oscillator (VCO), and power amplifier, and is intended for use in 802.11b and Bluetooth applications. The Bluetooth receiver uses a low-IF architecture for higher level of integration and lower power consumption, while the 802.11b receiver is direct conversion. The receiver achieves a typical sensitivity of -88 dBm at 11 Mb/s for 802.11b, and -83 dBm for Bluetooth mode. The receiver minimum IIP3 is -8 dBm. Both transmitters use a direct-conversion architecture, and deliver a nominal output power of 0 dBm, with a power range of 20 dB in 2-dB steps.  相似文献   

9.
A read-channel chip set for rewritable 3.5 in 230 Mbytes magneto-optical disk drives (MOD) is presented. The front-end chip includes an automatic gain control (AGC) circuit, a programmable six-pole two-zero equiripple filter/equalizer, a DC restore circuit, and pulse detectors. The back-end contains a frequency synthesizer phase-locked loop (PLL) and a data separator PLL with 3:1 operating range to support a constant density recording with 8-24 Mb/s data rate (or code rate of 16 to 48 Mb/s) in (2, 7) run-length limited (RLL) encoding format. The architecture of the chip provides high degree of programmability through a serial microprocessor interface, fast switching (<1 μs) between sector mark and data detector modes, and four levels of power management in a 1.5 μm 4 GHz BiCMOS process. With a nominal power supply of 5 V, the chip set dissipates 600 mW during normal operation and 1 mW during sleep mode  相似文献   

10.
系统地介绍了一种低杂散、低相位噪声、快速捷变频频率合成器的实现途径。提出了使用TMS320VC5409高速DSP作为控制电路,由DDS芯片AD9858构成宽带、低相噪、低功耗数字频率合成器的方案。详细阐述了AD公司最新的内部时钟可达1GHz的高性能DDS芯片AD9858的主要性能及其在快速捷变频频率合成器设计中的应用方法。给出了具体的超宽带应用电路和最终的测试结果,并对如何提高DDS频谱纯度进行了探讨。该数字频率合成器通过编程可方便地实现单点频、线性调频和调相功能,经过实际应用达到了比较满意的效果。  相似文献   

11.
A single-chip 2.4-GHz CMOS radio transceiver with integrated baseband processing according to the IEEE 802.15.4 standard is presented. The transceiver consumes 14.7 mA in receive mode and 15.7 mA in transmit mode. The receiver uses a low-IF topology for high sensitivity and low power consumption, and achieves -101 dBm sensitivity for 1% packet error rate. The transmitter topology is based on a PLL direct-modulation scheme. Optimizations of architecture and circuit design level in order to reduce the transceiver power consumption are described. Special attention is paid to the RF front-end design which consumes 2.4mA in receive mode and features bidirectional RF pins. The 5.77 mm2 chip is implemented in a standard 0.18-mum CMOS technology. The transmitter delivers +3 dBm into the 100-Omega differential antenna port  相似文献   

12.
This paper presents a fully integrated 0.18-/spl mu/m CMOS Bluetooth transceiver. The chip consumes 33 mA in receive mode and 25 mA in transmit mode from a 3-V system supply. The receiver uses a low-IF (3-MHz) architecture, and the transmitter uses a direct modulation with ROM-based Gaussian low-pass filter and I/Q direct digital frequency synthesizer for high level of integration and low power consumption. A new frequency shift keying demodulator based on a delay-locked loop with a digital frequency offset canceller is proposed. The demodulator operates without harmonic distortion, handles up to /spl plusmn/160-kHz frequency offset, and consumes only 2 mA from a 1.8-V supply. The receiver dynamic range is from -78 dBm to -16 dBm at 0.1% bit-error rate, and the transmitter delivers a maximum of 0 dBm with 20-dB digital power control capability.  相似文献   

13.
This paper presents a 900 MHz zero‐IF RF transceiver for IEEE 802.15.4g Smart Utility Networks OFDM systems. The proposed RF transceiver comprises an RF front end, a Tx baseband analog circuit, an Rx baseband analog circuit, and a ΔΣ fractional‐N frequency synthesizer. In the RF front end, re‐use of a matching network reduces the chip size of the RF transceiver. Since a T/Rx switch is implemented only at the input of the low‐noise amplifier, the driver amplifier can deliver its output power to an antenna without any signal loss; thus, leading to a low dc power consumption. The proposed current‐driven passive mixer in Rx and voltage‐mode passive mixer in Tx can mitigate the IQ crosstalk problem, while maintaining 50% duty‐cycle in local oscillator clocks. The overall Rx‐baseband circuits can provide a voltage gain of 70 dB with a 1 dB gain control step. The proposed RF transceiver is implemented in a 0.18 μm CMOS technology and consumes 37 mA in Tx mode and 38 mA in Rx mode from a 1.8 V supply voltage. The fabricated chip shows a Tx average power of ?2 dBm, a sensitivity level of ?103 dBm at 100 Kbps with , an Rx input P1dB of ?11 dBm, and an Rx input IP3 of ?2.3 dBm.  相似文献   

14.
结合EPC global C1 G2协议和ETSI规范要求,讨论了频率综合器噪声性能需求,并设计实现了用于单片CMOS UHF RFID阅读器中的低噪声三阶电荷泵锁相环频率综合器.在关键模块LC VCO的设计中,采用对称LC滤波器和LDO 调节器提高VCO相位噪声性能.电路采用IBM 0.18 μm CMOS RF工艺实现,测得频率综合器在中心频率频偏200 kHz和1 MHz处相位噪声分别为-109.13 dBc/Hz和-127.02 dBc/Hz.  相似文献   

15.
A 2.7-V RF transceiver IC is intended for small, low-cost global system for mobile communications (GSM) handsets. This chip includes a quadrature modulator (QMOD) and an offset phase locked loop (OPLL) in the transmit path and a dual IF receiver that consists of a low noise amplifier (LNA) with an active-bias circuit, two Gilbert-cell mixers, a programmable gain linear amplifier (PGA), and a quadrature demodulator (QDEM). The IC also contains frequency dividers with a very high frequency voltage controlled oscillator (VHF-VCO) to simplify the receiver design. The system evaluation results are the phase error of 2.7° r.m.s. and the noise transmitted in the GSM receiving band of -163 dBc/Hz for transmitters and the reference sensitivity of -105 dBm for receivers. Power-control functions are provided for independent transmit and receive operation. The IC is implemented by using bipolar technology with fT=15 GHz, r'bb=150 Ω, and 0.6-μm features  相似文献   

16.
We present a single-chip fully compliant Bluetooth radio fabricated in a digital 130-nm CMOS process. The transceiver is architectured from the ground up to be compatible with digital deep-submicron CMOS processes and be readily integrated with a digital baseband and application processor. The conventional RF frequency synthesizer architecture, based on the voltage-controlled oscillator and the phase/frequency detector and charge-pump combination, has been replaced with a digitally controlled oscillator and a time-to-digital converter, respectively. The transmitter architecture takes advantage of the wideband frequency modulation capability of the all-digital phase-locked loop with built-in automatic compensation to ensure modulation accuracy. The receiver employs a discrete-time architecture in which the RF signal is directly sampled and processed using analog and digital signal processing techniques. The complete chip also integrates power management functions and a digital baseband processor. Application of the presented ideas has resulted in significant area and power savings while producing structures that are amenable to migration to more advanced deep-submicron processes, as they become available. The entire IC occupies 10 mm/sup 2/ and consumes 28 mA during transmit and 41 mA during receive at 1.5-V supply.  相似文献   

17.
We report on an InAlAs/InGaAs HBT Gilbert cell double-balanced mixer which upconverts a 3 GHz IF signal to an RF frequency of 5-12 GHz. The mixer cell achieves a conversion loss of between 0.8 dB and 2.6 dB from 5 to 12 GHz. The LO-RF and IF-RF isolations are better than 30 dB at an LO drive of +5 dBm across the RF band. A pre-distortion circuit is used to increase the linear input power range of the LO port to above +5 dBm. Discrete amplifiers designed for the IF and RF frequency ports make up the complete upconverter architecture which achieves a conversion gain of 40 dB for an RF output bandwidth of 10 GHz. The upconverter chip set fabricated with InAlAs/InGaAs HBT's demonstrates the widest gain-bandwidth performance of a Gilbert cell based upconverter compared to previous GaAs and InP HBT or Si-bipolar IC's  相似文献   

18.
A novel circuit architecture for high performance of high-order subharmonic (SH) mixers is proposed in this paper. According to the specified harmonic mixing order, one or more mixer diodes sub-arrays and corresponding power divider as well as phase shift network for RF and LO signals are arranged in the circuit. This proposed SH mixer circuit has improved conversion loss, wide dynamic range and high port isolation for high-order SH mixers. By phase cancellation of idle frequencies, the proposed SH mixer circuit can eliminate complicated design procedure of idle frequency circuits; by phase cancellation of leakage LO power to RF and IF port, and leakage RF power to LO port, the mixer circuit can get high port isolation in LO-IF/RF and RF-LO. The increased antiparallel diode pairs in each sub-array will also lead to well performance by lowering effective series resistance. The proposed SH mixer circuit can be easily realized with power divider and phase shift network for RF and LO signals.  相似文献   

19.
A BiCMOS circuit for serial data communication is presented. The chip has phase-locked loops for transmit frequency synthesis and receive clock recovery, serial-to-parallel and parallel-to-serial converters, and encode and decode functions. Since this is a mixed-analog/digital design, and the transmitter and receiver operate asynchronously, many techniques are used to decrease noise coupling. A 1.2 μm BiCMOS process allows operation at speeds of 300 MHz along with this high level of system integration, and the chip consumes less than 1 W from a single 5 V supply  相似文献   

20.
A 200 MHz quadrature direct digital frequency synthesizer/complex mixer (QDDFSM) chip is presented. The chip synthesizes 12 b sine and cosine waveforms with a spectral purity of -84.3 dBc. The frequency resolution is 0.047 Hz with a corresponding switching speed of 5 ns and a tuning latency of 14 clock cycles. The chip is also capable of frequency, phase, and quadrature amplitude modulation. These modulation capabilities operate up to the maximum clocking frequency. The chip provides the capability of parallel operation of multiple chips with throughputs up to 800 MHz. The 0.8 μm triple level metal N-well CMOS chip has a complexity of 52000 transistors with a core area of 2.6×6.1 mm2. Power dissipation is 2 W at 200 MHz and 5 V  相似文献   

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