Synthesis of a novel epoxy resin containing pyrene moiety and thermal properties of its cured polymer with phenol novolac

A new epoxy resin containing the pyrene moiety in the backbone (3) was synthesized and confirmed by gel permeation chromatography and field‐desorption mass spectroscopy and infrared spectroscopy. In addition, to evaluate the influence of the pyrene moiety on the structure, epoxy resins having an anthrylene moiety (5) and having a phenylene moiety (7) were synthesized. The cured polymer obtained through the curing reaction between 3 and phenol novolac was used for making a comparison of its thermal properties with those obtained from 5, 7, and bisphenol‐A (4,4′‐isopropylidenediphenyl)‐type epoxy resin (Bis‐EA). The cured polymer obtained from 3 showed a higher glass transition temperature, lower coefficient of linear thermal expansion, lower moisture absorption, and markedly higher anaerobic char yield at 700°C of 37.6 wt %, which might be attributed to the higher aromaticity of 3 containing the pyrene moiety. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 75: 528–535, 2000     

Synthesis,characterization, and properties of a novel epoxy resin containing both binaphthyl and biphenyl moieties

A new epoxy resin containing both binaphthyl and biphenyl moieties in the skeleton (BLBPE) was synthesized and confirmed by electrospray ionization mass spectroscopy, ¹H‐nuclear magnetic resonance spectroscopy, and infrared spectroscopy. To evaluate the combined influence of two moieties, one epoxy resin containing binaphthyl moiety and another containing biphenyl moiety were also synthesized, and a commercial biphenyl‐type epoxy resin (CER3000L) was introduced. Thermal properties of their cured polymers with phenol p‐xylene resins were characterized by differential scanning calorimetry, dynamic mechanical, and thermogravimetric analyses. The cured polymer obtained from BLBPE showed remarkably higher glass transition temperature and lower moisture absorption, as well as comprehensively excellent thermal stability. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

A simple imide compound as a curing agent for epoxy resin. I. Synthesis and properties

A simple imide compound, 4‐amino‐phthalimide (APH), was synthesized as a curing agent for epoxy resin. APH was prepared from the hydration of 4‐nitro‐phthalimide, which was prepared from the nitration of phthalimide. The chemical structure of APH was verified by IR and ¹H‐NMR spectra. The thermal properties and dielectric constant (ε) of a phosphorus‐containing novolac epoxy resin cured by APH were determined and compared with those of epoxy resins cured by either 4,4′‐diamino diphenyl methane (DDM) or 4,4′‐diamino diphenyl sulfone (DDS). The results indicate that the epoxy resin cured by APH showed better thermal stability and a lower ε than the polymer cured by either DDM or DDS. This was due to the introduction of the imide group of APH into the polymer structure. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Synthesis and properties of novel 4,4′‐biphenylene‐bridged flame‐retardant cyanate ester resin

The bisphenol‐containing 4,4′‐biphenylene moiety was prepared by the reaction of 4,4′‐bis(methoxymethyl) biphenyl with phenol in the presence of p‐toluenesulfonic acid. The bisphenol was end‐capped with the cyanate moiety by reacting with cyanogen chloride and triethylamine in dichloromethane. Their structures were confirmed by Fourier transform infrared spectroscopy, ¹H‐NMR, and elemental analysis. Thermal behaviors of cured resin were studied by differential scanning calorimetry, dynamic mechanical analysis, and TGA. The flame retardancy of cured resin was evaluated by limiting oxygen index (LOI) and vertical burning test (UL‐94 test). Because of the incorporation of rigid 4,4′‐biphenylene moiety, the cyanate ester (CE) resin shows good thermal stability (T_g is 256°C, the 5% degradation temperature is 442°C, and char yield at 800°C is 64.4%). The LOI value of the CE resin is 42.5, and the UL‐94 rating reaches V‐0. Moreover, the CE resin shows excellent dielectric property (dielectric constant, 2.94 at 1 GHz and loss dissipation factor, 0.0037 at 1 GHz) and water resistance (1.08% immersed at boiling water for 100 h). © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Synthesis of a bifunctional epoxy monomer containing anthracene moiety and properties of its cured polymer with phenol novolac

A new type of epoxy resin containing anthracene moiety in the backbone was synthesized and was confirmed by elemental analysis, infrared spectroscopy, and ¹H nuclear magnetic resonance spectroscopy. Thermal properties of its cured polymer with phenol novolac were examined by thermomechanical, dynamic mechanical, and thermogravimetric analyses. The cured polymer with phenol novolac showed higher glass transition temperature (T_g), lower thermal expansion, lower moisture absorption, and higher anaerobic char yield at 700°C than a cured polymer having a phenylene group in place of anthracene moiety. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 72: 953–959, 1999     

Synthesis and thermal stability of a novel cycloaliphatic epoxy resin system

A novel cycloaliphatic epoxy resin was synthesized from dicyclopentadiene, ethylene glycol, and nadic anhydride. The chemical structures of the resultant epoxy resin and its precursor were characterized with Fourier transform infrared spectroscopy, ¹H‐NMR, and mass spectrographic analyses. The thermal stability of the cured polymer was investigated with differential scanning calorimetry and thermogravimetric analysis. Compared with the thermal stability of the commercial cycloaliphatic epoxy resin 3,4‐epoxy cyclohexyl methyl‐3′,4′‐epoxy cyclohexyl carboxylate, a higher thermal stability for the cured polymer of the novel epoxy resin was observed. The results imply that the novel cycloaliphatic epoxy resin has good potential applications in electronic encapsulation. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

The synthesis and properties of new epoxy resin containing phosphorus and nitrogen groups for flame retardancy

A new type of epoxy resin, which contained phosphorus oxide and nitrogen groups in the main chain, was synthesized. The structure of the new type of epoxy resin was confirmed by infrared (IR) spectroscopy, ¹H nuclear magnetic resonance (¹H‐NMR), and ¹³C‐NMR spectroscopic techniques. In addition, compositions of the new synthesized epoxy resin (TGDMO) with three curing agents, for example, bis(3‐aminophenyl) methylphosphine oxide (BAMP), 4,4′‐diaminodiphenylmethane (DDM), and 4,4′‐diaminodiphenylsulfone (DDS), were used for making a comparison of its curing reactivity, heat, and flame retardancy with that of Epon 828 and DEN 438. The reactivities were measured by differential scanning calorimetry (DSC). Through the evaluation of thermal gravimetric analysis (TGA), those polymers which were obtained through the curing reactions between the new epoxy resin and three curing agents (BAMP, DDM, and DDS) also demonstrated excellent thermal properties as well as a high char yield. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 74: 413–421, 1999     

The synthesis and properties of tetrafunctional epoxy resins

N,N,N′,N′-tetraglycidyl-4,4′-diaminodiphenylalkane epoxy resins with alkyl substituents on the methylene carbon were synthesized and characterized. The thermal and dynamic mechanical properties of these resins when cured with diaminodiphenylsulfone were compared with those of the cured unsubstituted epoxy resin. Although the resins have similar structures, the cured resin from the unsubstituted epoxy has the higher polymer decomposition temperature and glass transition temperature. The substituted epoxy resins have higher dynamic Young's moduli and loss moduli.     

Combined pyrolysis and radiochemical gas chromatography for studying the thermal degradation of epoxy resins and polyimides. I. The degradation of epoxy resins in nitrogen between 400°C and 700°C

The thermal degradation of a bisphenol A-based epoxy resin (EP 274) cured with 4,4′-diaminodiphenyl methane (DDM) and with phthalic anhydride (PA) was studied using a radiochemical pyrolysis gas chromatography technique. Conclusive evidence for some of the degradation mechanisms of these resins was obtained by pyrolyzing samples containing various ¹⁴C-labelled groups and analyzing the products using this method.     

Phosphorus‐containing epoxy resin for an electronic application

A phosphorus‐containing epoxy resin, 6‐H‐dibenz[c,e][1,2] oxaphosphorin‐6‐[2,5‐bis(oxiranylmethoxy)phenyl]‐6‐oxide (DOPO epoxy resin), was synthesized and cured with phenolic novolac (Ph Nov), 4,4′‐diaminodiphenylsulfone (DDS), or dicyandiamide (DICY). The reactivity of these three curing agents toward DOPO epoxy resin was found in the order of DICY > DDS > Ph Nov. Thermal stability and the weight loss behavior of the cured polymers were studied by TGA. The phosphorus‐containing epoxy resin showed lower weight loss temperature and higher char yield than that of bisphenol‐A based epoxy resin. The high char yields and limiting oxygen index (LOI) values as well as excellent UL‐94 vertical burn test results of DOPO epoxy resin indicated the flame‐retardant effectiveness of phosphorus‐containing epoxy resins. The DOPO epoxy resin was investigated as a reactive flame‐retardant additive in an electronic encapsulation application. Owing to the rigid structure of DOPO and the pendant P group, the resulting phosphorus‐containing encapsulant exhibited better flame retardancy, higher glass transition temperature, and thermal stability than the regular encapsulant containing a brominated epoxy resin. High LOI value and UL‐94 V‐0 rating could be achieved with a phosphorus content of as low as 1.03% (comparable to bromine content of 7.24%) in the cured epoxy, and no fume and toxic gas emission were observed. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 353–361, 1999     

Novel adamantane‐containing epoxy resin

A novel adamantane‐containing epoxy resin diglycidyl ether of bisphenol‐adamantane (DGEBAda) was successfully synthesized from 1,3‐bis(4‐hydroxyphenyl)adamantane by a one‐step method. The proposed structure of the epoxy resin was confirmed with Fourier transform infrared, ¹H‐NMR, gel permeation chromatography, and epoxy equivalent weight titration. The synthesized adamantane‐containing epoxy resin was cured with 4,4′‐diaminodiphenyl sulfone (DDS) and dicyandiamide (DICY). The thermal properties of the DDS‐cured epoxy were investigated with differential scanning calorimetry and thermogravimetric analysis (TGA). The dielectric properties of the DICY‐cured epoxy were determined from its dielectric spectrum. The obtained results were compared with those of commercially available diglycidyl ether of bisphenol A (DGEBA), a tetramethyl biphenol (TMBP)/epoxy system, and some other associated epoxy resins. According to the measured values, the glass‐transition temperature of the DGEBAda/DDS system (223°C) was higher than that of the DGEBA/DDS system and close to that of the TMBP/DDS system. TGA results showed that the DGEBAda/DDS system had a higher char yield (25.02%) and integral procedure decomposition temperature (850.7°C); however, the 5 wt % degradation temperature was lower than that of DDS‐cured DGEBA and TMBP. Moreover, DGEBAda/DDS had reduced moisture absorption and lower dielectric properties. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Synthesis and Characterization of Epoxy-Containing Schiff-Base and Phenylthiourea Groups for Improved Thermal Conductivity

Three new diglycidyl monomers bearing phenylthiourea and azomethine groups were synthesized using 4,4′-diaminodiphenyl ether, 4,4′-diaminodiphenylmethane, and 4,4′-diaminodiphenyl sulphone as starting materials. The monomers were characterized through IR and ¹H-NMR spectroscopic analysis. The monomers were blended with epoxy based trickle impregnation resin (Dobeckot 605) and cured. The cured resins were subjected to TGA and DSC analysis. Presence of 3% by weight of the diglycidyl monomers bearing thiourea and azomethine groups in the cured blends did not alter the thermal stability but increased the thermal conductivity. The thermal conductivity of the cured blends were approximately 1.9 times higher than that of epoxy-based trickle impregnation resin and comparable with the epoxy-based resin filled with 20% inorganic fillers.     

Synthesis and properties of novel phosphorus‐containing bismaleimide/epoxy resins

A novel soluble phosphorus‐containing bismaleimide (BMI) monomer, bis(3‐maleimidophenyl)phenylphosphine oxide (BMIPO), was synthesized by the imidization of bis(3‐aminophenyl) phenylphosphine oxide, in which its structural characterization was identified with ¹H‐NMR, ¹³C‐NMR, and Fourier transform infrared spectra. The BMIPO resin, with five‐membered imide rings and high phenyl density, was an excellent flame retardant with a high glass‐transition temperature (T_g), onset decomposition temperature, and limited oxygen index. In phosphorus‐containing BMI/epoxy/4,4′‐methylene dianiline (DDM)‐cured resins, homogeneous products were obtained from all proportions without phase separation. Because of the higher reactivity of BMIPO/DDM relative to that of 4,4′‐bismaleimidodiphenylmethane (BMIM)/DDM, the increase in the BMIPO/BMIM ratio in this blending resin increased the recrosslinking hazards of the postcuring stage and so lowered the T_g value and thermal stability. The thermal stability of the BMI/epoxy‐cured system was lower than that of the epoxy‐cured system because of the introduction of a phosphide group into BMIPO, whereas for the T_g value and flame retardancy, the former was significantly higher than the latter: the higher the BMIPO content in the blend, the higher the flame retardancy. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 2080–2089, 2002; DOI 10.1002/app.10607     

Preparation and curing kinetics of bisphenol A type novolac epoxy resins

A bisphenol A type novolac resin (Bis‐ANR) was synthesized from bisphenol A and formaldehyde; the resulting novolac was epoxidized to generate a bisphenol A type novolac epoxy resin (Bis‐ANER). The chemical structures of Bis‐ANR and Bis‐ANER were confirmed by ¹H‐NMR spectroscopy and IR spectroscopy; the molecular weights and molecular weight distributions were determined by gel permeation chromatography. In addition, the curing process of Bis‐ANER with 4,4′‐diaminodiphenyl sulfone was studied in both dynamic and isothermal modes with differential scanning calorimetry. The dynamic curing kinetic analysis was evaluated with both the Kissinger and Flynn–Wall–Ozawa methods, and the curing activation energy values were obtained. The isothermal curing reaction exhibited autocatalytic behavior, and the curing kinetics were described with the Kamal kinetics model, which accounted for both the autocatalytic and diffusion‐control effects. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 99: 858–868, 2006     

Synthesis, characterization, and properties of novel novolac epoxy resin containing naphthalene moiety

A series of novel novolac epoxy resins containing naphthalene moiety with different molecular weights were synthesized via condensation of bisphenol A and 1-naphthaldehyde, followed by epoxidation with epichlorohydrin. The chemical structure of the naphthalene epoxy thus obtained was characterized using FTIR, ¹H NMR spectra and GPC analyses. The naphthalene epoxy was cured with 4,4′-diaminodiphenyl sulfone (DDS) and the cured products were characterized with thermogravimetric analysis, dynamic mechanical analysis, and X-ray diffraction. Compared with the diglycidyl ether of bisphenol A (DGEBA), the cured naphthalene epoxy resin showed remarkably higher glass transition temperatures (T_gs), enhanced thermal stability and better moisture resistance. When the molar ratio of 1-naphthaldehyde to bisphenol A was 0.67, the optimal thermal resistance was observed.     

Synthesis of polysiloxane‐type multifunctional flame retardant and its application in epoxy systems

Polymethyl(3‐glycidyloxypropyl)siloxane (PMGS) was synthesized as a flame‐retardant additive, which were cocured with diglycidyl ether of bisphenol‐A (DGEBA) using 4,4′‐diaminodiphenylsulfone as a curing agent. The structure of PMGS was confirmed through Fourier transform infrared and ¹H‐NMR spectra. The cured products were characterized with dynamic mechanical thermal analysis, thermogravimetric analysis, and oxygen index analyzer. With PMGS incorporated, the cured epoxy resin showed better thermal stability, higher limited oxygen index, and higher char yield. At moderate loading of PMGS, the storage modulus and glass transition temperature of the cured epoxy resin based on neat DGEBA were obviously improved. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Synthesis,characterization, and properties of multifunctional naphthalene-containing epoxy resins cured with cyanate ester

Multifunctional naphthalene-containing epoxy resins derived from 2,7-dihydroxylnaphthalene were synthesized and the intermediates were characterized by Fourier transform infrared spectroscopy, elemental analysis, and mass spectrometry. The cured products from naphthalene-containing epoxy resin and the dicyanate ester of bisphenol A (DCBA) exhibited a better T_g and a lower coefficient of thermal expansion than those of the commercial epoxy system. The glass transition temperature, thermal stability, and moisture absorption were found to increase with the epoxy functionality when naphthalene-containing epoxy resins were cured with DCBA. Thermogravimetric analyses revealed that the DCBA-cured system had a better thermal stability than that of the 4,4′-diaminodiphenylsulfone (DDS)-cured system. The addition of a metallic catalyst into the epoxy resin/cyanate ester system not only facilitated the cyclotrimerization of the cyanate ester but also the polyetherification of the epoxy resin. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 1611–1622, 1999     

Synthesis,thermal properties,and flame retardance of the epoxy‐silsesquioxane hybrid resins

Epoxy/silsesquioxane‐OH (EP‐SDOH, ED) hybrid resins were prepared from cyclohexyl‐disilanol silsesquioxane (SDOH) and diglycidyl ether of bisphenol A via the reaction between silanol and the oxirane group, with the cobalt naphthanate as a catalyst. It was found that incorporation of SDOH allows the reaction between oxirane ring and Si? OH, and the silsesquioxane cage structure can be the main chain or as the side chain of the hybrid resin. The EP‐SDOH hybrid resins with various SDOH contents were cured by 4,4′‐diaminodiphenylsulphone, and the curing reaction was investigated by differential scanning calorimetry. The curing characteristics of EP‐SDOH hybrids had been observed to be influenced by the content of SDOH in the hybrid. The differential scanning calorimetry thermograms indicated that the EP‐SDOH hybrid exhibited a higher initial temperature, peak temperature, as well as final temperature than those of the pure epoxy resin when cured by the same curing agent 4,4′‐diaminodiphenylsulphone. The curing kinetic parameters were calculated by using the Ozawa method and the results indicated that EP‐SDOH hybrids possess the same curing mechanism as the pure epoxy resin. The properties of the cured EP‐SDOH hybrid resins such as the glass transition temperature (T_g), dynamic mechanical analysis, thermal stability, as well as the flame retardance were also investigated, and the results showed that introducing silsesquioxane‐OH unit into epoxy resin successfully modified the local structure, made the chain stiffness, restrict the chain mobility, and eventually improved thermal stability and flame retardance of epoxy resin. POLYM. ENG. SCI., 47:225–234, 2007. © 2007 Society of Plastics Engineers.     

Polydimethylsiloxane containing isocyanate group-modified epoxy resin: Curing,characterization, and properties

A synthesized polydimethylsiloxane containing an isocyanate group was used to improve the flexibility and to reduce the internal stress of epoxy resin cured with MDA (4,4′-methylene dianiline). The effect of polysiloxane content on the curing kinetics of a novolac-type epoxy modified with an isocyanate group was investigated. It was found that the modified epoxy resin showed significant improvement in impact strength. The polysiloxane containing isocyanate groups effectively depressed the internal stress of cured epoxy resins by reducing the flexural modulus and the coefficient of thermal expansion, while the glass transition temperature was increased. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 2739–2747, 1999     

Toughening of epoxy resin by functional‐terminated polyurethanes and/or semicrystalline polymer powders

Hydroxyl‐, amine‐, and anhydride‐terminated polyurethane (PU) prepolymers, which were synthesized from polyether [poly(tetramethylene glycol)] diol, 4,4′‐diphenylmethane diisocyanate, and a coupling agent, bisphenol‐A (Bis‐A), 4,4′‐diaminodiphenyl sulphone (DDS), or benzophenonetetracarboxylic dianhydride, were used to modify the toughness of Bis‐A diglycidyl ether epoxy resin cured with DDS. Besides the crystalline polymers, poly(butylene terephthalate) (PBT) and poly(hexamethylene adipamide) (nylon 6,6), with particle sizes under 40 μm were employed to further enhance the toughness of PU‐modified epoxy at a low particle content. As shown by the experimental results, the modified resin displayed a significant improvement in fracture energy and also its interfacial shear strength with polyaramid fiber. The hydroxyl‐terminated PU was the most effective among the three prepolymers. The toughening mechanism is discussed based on the morphological and the dynamic mechanical behavior of the modified epoxy resin. Fractography of the specimen observed by the scanning electron microscopy revealed that the modified resin had a two‐phase structure. The fracture properties of PBT‐particle‐filled epoxy were better than those of nylon 6,6‐particle‐filled epoxy. Nevertheless, the toughening effect of these crystalline polymer particles was much less efficient than that of PU modification. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 2903–2912, 2001