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1.
磁流变变间隙动压平坦化加工利用工件的轴向低频振动使磁流变液产生挤压强化效应,可以有效提高加工效果并使光电晶片快速获得纳米级表面粗糙度。通过旋转式测力仪试验研究不同变间隙参数对磁流变变间隙动压平坦化加工过程中抛光正压力的影响规律,结果表明,在工件轴向低频振动作用下,抛光正压力形成脉冲正值和负值周期性的动态变化过程;将工件轴向低频振动过程分解为下压过程与拉升过程,下压速度和拉升速度对动态抛光力有不同的响应特性;随着最小加工间隙的减小抛光正压力会急剧增大;设置最小加工间隙停留时间观察抛光正压力变化,可以发现在工件最小加工间隙停留期间抛光力从峰值逐渐衰减并趋于平稳;挤压振动幅值对抛光正压力影响较小。建立了磁流变变间隙动压平坦化加工材料去除模型,弄清了在动态压力作用下,磨料更新及其附加运动机制,研究了磁流变变间隙动压平坦化加工过程中磨料颗粒对工件表面柔性划擦和微量去除的作用机理,为磁流变变间隙动压平坦化加工的工艺优化提供了理论依据。  相似文献   

2.
阐述了磁流变抛光原理,依据Preston方程分析了影响磁流变抛光效果的因素,根据实际加工的工件特点,对Preston方程进行了修正;在自制的磁流变抛光实验机上进行抛光加工试验,结果表明,采用修正的磁流变抛光材料去除方程,可以有效控制工件的抛光质量、提高抛光效率。  相似文献   

3.
针对现有磁流变抛光技术的加工精度难以提高,加工过程中抛光热不容易控制等问题,对磁流变抛光工艺,以及抗磁性材料工件在抛光过程中的工作间隙的磁通量密度进行了研究。对永磁体抛光刀具刀尖表面模型,以及铜合金工件表面之间的关系和模型进行了归纳,提出了一种基于永磁体的抗磁性材料磁流变抛光方法;利用Maxwell对抛光装置工作间隙磁通密度进行了仿真,并进行了相关试验。研究结果表明:基于磁流变抛光液,利用永磁体组成的抛光刀具对抗磁性材料工件进行加工,工件表面质量有了明显提高,实现了纳米级别的加工精度。  相似文献   

4.
为研究磁流变抛光表面粗糙度与工艺参数之间的关系,本文建立数学模型并进行了求解验证。通过分析磁流变抛光技术的原理以及磁流变抛光过程中的材料去除机理,结合Preston方程建立磁流变抛光力学模型。分析工件表面受到的正压力,依据磁流变抛光机理对氧化锆陶瓷工件理论模型的流体动压力和磁场产生的磁化压力进行求解分析,具体化磁流变抛光的力学模型,解得正压力。对磁流变抛光的表面粗糙度进行建模,依据单颗磨料的材料去除作用模型建立磁流变抛光的表面粗糙度数学模型,分析抛光过程中影响表面粗糙度的具体因素,并通过MATLAB软件对方程进行仿真求解,得到磁场强度和磨料粒径对表面粗糙度的影响规律。结果表明,表面粗糙度和工件的压入深度存在一阶线性关系;当磨料粒径固定不变时,表面粗糙度随着磁场强度的增大而增大;当磁场强度固定不变时,表面粗糙度值与磨料粒径之间呈现正比关系。通过实验证明了模型和仿真结果的准确性,仿真分析得到的磁场强度与磨料粒径的关系,磁场强度与表面粗糙度之间的关系与实验一致,确定的磁场强度合理范围为0.4T左右,磨料粒径在2.5μm左右。  相似文献   

5.
集群磁流变平面抛光加工硬脆材料可以高效率获得纳米/亚纳米级表面粗糙度,其中集群磁流变效应抛光垫对加工表面的作用力(抛光力)是材料去除的关键因素,搭建了集群磁流变平面抛光三向测力平台,对模拟的集群磁流变抛光加工过程抛光力(切向力F_t和法向力F_n)进行了系统试验研究。结果表明,2'单晶硅片试验条件下集群磁流变平面抛光切向力Ft最大达到32.25 N、法向力Fn最大达到62.35 N、F_t/F_n值为0.46~0.77;对抛光力影响最大的工艺参数是磁场强度和加工间隙,其次是羰基铁粉与磨料质量分数、磁流变液流量、抛光盘转速,工件摆幅与速率影响最小。集群磁流变平面抛光力大小以及Ft/Fn值随着工件材料硬度的增大而增大,具有低正压力高剪切力特征,有利于提高硬脆材料的超光滑平坦化抛光加工效果。  相似文献   

6.
集群磁流变变间隙动压平坦化加工试验研究   总被引:3,自引:1,他引:2  
为了提高光电晶片集群磁流变平坦化加工效果,提出集群磁流变变间隙动压平坦化加工方法,探究各工艺参数对加工效果的影响规律。以蓝宝石晶片为研究对象开展了集群磁流变变间隙动压平坦化加工和集群磁流变抛光对比试验,通过检测加工表面粗糙度、材料去除率,观测加工表面形貌、集群磁流变抛光垫中磁链串受动态挤压前后形态变化,研究挤压幅值、工件盘转速、挤压频率以及最小加工间隙等工艺参数对加工效果的影响规律。试验结果表明:集群磁流变平坦化加工在施加工件轴向微幅低频振动后,集群磁流变抛光垫中形成的磁链串更粗壮,不但使其沿工件的径向流动实现磨粒动态更新、促使加工界面内有效磨粒数增多,而且在工件与抛光盘之间的加工间隙产生动态抛光压力、使磨粒与加工表面划擦过程柔和微量化,形成了提高材料去除效率、降低加工表面粗糙度的机制。对于2英寸蓝宝石晶电(1英寸=2.54 cm)集群磁流变变间隙动压平坦化加工与集群磁流变抛光加工效果相比,材料去除率提高19.5%,表面粗糙度降低了42.96%,在挤压振动频率1 Hz、最小加工间隙1 mm、挤压幅值0.5 mm、工件盘转速500 r/min的工艺参数下进行抛光可获得表面粗糙度为Ra0.45 nm的超光滑表面,材料去除率达到3.28 nm/min。证明了集群磁流变变间隙动压平坦化加工方法可行有效。  相似文献   

7.
针对传统加工技术存在表面损伤、加工效率低的问题,将极具前景的面接触式超精密磁流变抛光技术应用到3C制造业中。对圆柱型永磁体磁流变抛光头在加工过程中的抛光垫的形貌进行了研究分析,发现圆柱型永磁体磁流变抛光头在加工过程中存在一种"环状效应",利用"环状效应"对圆柱型永磁体磁流变抛光头进行了结构设计,并对其进行了设计理念分析;对圆柱型永磁体抛光头在6061的铝合金工件上进行了单因素抛光实验,通过实验获得了最优参数。研究结果表明:该圆柱型永磁体磁流变抛光头能够实现环状加工区域的高效光滑平坦化加工,工件表面粗糙度达到52 nm,材料去除率达9.1μm/min,大大提高了磁流变抛光的效率,为面形精度在微米级的超光滑平面的制造提供了一种高效的加工方法。  相似文献   

8.
由磁流变抛光材料去除机理出发,阐述了磁流变抛光去除函数传递的工艺流程特点,明确抛光过程中对抛光轮与工件位置关系恒定的工艺要求。在此基础上,针对设计的磁流变抛光头结构,结合抛光轮轮廓外形与整个抛光头结构特征点计算法,对可加工曲面工件曲率半径和曲面角度范围及其影响因素进行了分析,给出了整个工艺过程中带动测头升降的气缸分别在加工位置和测量位置所需的行程及计算方法,并指出测头设计安装原则。结论可用于异形结构工具曲面加工设备的分析与设计。  相似文献   

9.
提出了一种光学抛光的新方法——超声波磁流变复合抛光。介绍了该抛光方法的基本原理和实验装置,进行了超声波磁流变复合抛光实验,采用轮廓仪实测了光学玻璃超声波磁流变抛光材料去除轮廓曲线。通过该项工艺实验,研究了五种工艺参数(磁场强度、超声振幅、抛光工具头与工件的间隙、抛光工具头转速、工件转速)对光学玻璃材料去除率的影响。在一定实验条件下,获得的材料去除率为0.139 μm/min,并获得了超声波磁流变复合抛光工艺参数与材料去除率的关系曲线,得出了光学玻璃超声波磁流变复合抛光的材料去除规律。  相似文献   

10.
为实现磷化铟高质量表面的绿色加工,使用动态磁场集群磁流变抛光对单晶磷化铟进行正交抛光实验,研究各工艺参数(抛光盘转速、工件转速、磁极转速和偏摆速度)对抛光速率及抛光表面粗糙度的影响。利用回归分析法建立反映材料去除率及表面粗糙度与抛光工艺参数关系的回归方程。结果显示:在抛光工艺参数中,工件转速对材料去除率影响最大,偏摆速度影响最小;对表面粗糙度影响最大的是抛光盘转速,磁极转速影响最小;在优化工艺参数(抛光盘转速40 r/min、工件转速500 r/min、磁极转速30 r/min、偏摆速度200 mm/min)下对单晶磷化铟抛光3 h后,表面粗糙度由Ra33 nm降至Ra 0.35 nm,材料去除率为2.5 μm/h,表明采用动态集群磁流变抛光的方法加工单晶磷化铟,可以得到高质量加工表面;建立的材料去除率及表面粗糙度回归模型,拟合优度判定系数分别为0.984 2和0.937,表明利用回归分析法建立的磷化铟磁流变抛光的材料去除率及表面粗糙度回归模型,能够有效地预测磷化铟集群磁流变抛光效果。  相似文献   

11.
磁流变抛光的确定量加工模型与影响因素   总被引:1,自引:0,他引:1  
根据抛光区内的受力分析,建立了磁流变超精密抛光的确定量加工模型,并通过工艺实验予以证明。研究了磁流液在磁场作用下的成核特点,分析了各工艺参数对磁流变抛光的材料去除率及表面粗糙度的影响规律。  相似文献   

12.

Magnetorheological finishing (MRF) is a computer-controlled deterministic polishing technique that is widely used in the production of high-quality optics. In order to overcome the defects of existing MRF processes that are unable to achieve concave surfaces with small radius of curvature, a configuration method of a novel structured MRF machine tool using small ball-end permanent-magnet polishing head is proposed in this paper. The preliminary design focuses on the structural configuration of the machine, which includes the machine body, motion units and accessory equipment, and so on. Structural deformation and fabrication accuracy of the machine are analyzed theoretically, in which the reasonable structure sizes, manufacturing errors and assembly errors of main structural components are given for configuration optimization. Based on the theoretical analysis, a four-axes linkage MRF machine tool is developed. Preliminary experiments of spot polishing are carried out and the results indicate that the proposed MRF process can achieve stable polishing area which meets requirement of deterministic polishing. A typical small-bore complex component is polished on the developed device and fine surface quality is obtained with sphericity of the finished spherical surfaces 1.3 µm and surface roughness Ra less than 0.018 µm.

  相似文献   

13.
A new precision finishing process called magnetorheological abrasive flow finishing (MRAFF), which is basically a combination of abrasive flow machining (AFM) and magnetorheological finishing (MRF), has been developed for nano-finishing of parts even with complicated geometry for a wide range of industrial applications. In this paper microstructure of the mixture of magnetic and abrasive particles in magnetorheological polishing fluid (MRPF) has been proposed, and normal force on the abrasive particles is calculated from the applied magnetic field. A model for the prediction of material removal and surface roughness achieved has also been presented. And, finally theoretical results are compared with the experimental data available in the literature, and they are found to agree well.  相似文献   

14.
Advanced nanofinishing is an important process in manufacturing technologies due to its direct influence on optical quality, bearing performance, corrosion resistivity, bio-medical compatibility and micro-fluidics attributes. Chemo-mechanical magnetorheological finishing (CMMRF) process, one of the advanced nanofinishing process, was developed by combining essential aspects of chemo-mechanical polishing (CMP) process and magnetorheological finishing (MRF) process for surface finishing of engineering materials. The CMMRF process was experimentally analyzed on silicon and copper alloy to generate surface roughness of the order of few angstroms and few nanometers respectively. However, the process needs theoretical exploration towards better understanding, process optimization and result prediction. Hence, an attempt has been made for theoretical study of CMMRF process to analyze the effects of MR fluid under various process parameters. The present theoretical work is split as per following two sub-activities to simplify intricacy of the work.1) FEA-CFD simulation to analyze magnetism, polishing pad formation and polishing pressure during the CMMRF process. The simulation results are used to conduct experiments on aluminium alloy.2) A mathematical model has been developed to predict material removal as well as surface roughness during the CMMRF process. Model validation is conducted by comparing finite element simulation results with the experiments on aluminium alloy.The theoretical results show good agreement with the experimental data and the same has been discussed in this paper.  相似文献   

15.
The macro-structure of chemical-vapor-deposited (CVD) zinc sulfide (ZnS) substrates is characterized by cone-like structures that start growing at the early stages of deposition. As deposition progresses, these cones grow larger and reach centimeter size in height and millimeter size in width. It is challenging to polish out these features from the top layer, particularly for the magnetorheological finishing (MRF) process. A conventional MR fluid tends to leave submillimeter surface artifacts on the finished surface, which is a direct result of the cone-like structure.Here we describe the MRF process of polishing four CVD ZnS substrates, manufactured by four different vendors, with conventional MR fluid at pH 10 and zirconia-coated-CI (carbonyl iron) MR fluids at pH 4, 5, and 6. We report on the surface–texture evolution of the substrates as they were MRF polished with the different fluids. We show that performances of the zirconia-coated-CI MR fluid at pH 4 are significantly higher than that of the same fluid at pH levels of 5 and 6 and moderately higher than that of a conventional MR fluid at pH 10. An improvement in surface–texture variability from part to part was also observed with the pH 4 MR fluid.  相似文献   

16.
磁流变斜轴抛光及其路径控制   总被引:2,自引:0,他引:2  
为解决磁流变抛光较小曲率半径(φ8 mm以下)非球面光学零件困难和抛光效率不高等问题,以四轴超精密机床为平台,开发出一种基于磁场辅助的磁流变斜轴抛光工艺,采用微小磁性工具头斜轴抛光方式,通过X轴、Y轴、Z轴、B轴四轴联动,控制抛光路径,防止干涉,实现微小非球面的超精密抛光.并对微小磁性斜轴抛光工具头的抛光路径轨迹进行了分析计算,采用驻留时间修正方法对误差进行修正,在此基础上开发出适用于微小非球面斜轴抛光的数控加工与修正软件.  相似文献   

17.
磁流变抛光消除磨削亚表面损伤层工艺研究   总被引:1,自引:1,他引:1  
针对传统光学制造技术对亚表面控制局限性和磁流变抛光的特点,提出用磁流变抛光替代研磨工序直接衔接磨削工序的新工艺流程。采用自研的磁流变抛光机床KDMRF−1000和水基磁流变抛光液KDMRW-2进行了磁流变抛光去除磨削亚表面损伤层的实验研究。直径为100mm的K9材料平面玻璃,经过156min的磁流变粗抛,去除50um深度的亚表面损伤层,表面粗糙度Ra值提升至0.926nm,经过17.5min磁流变精抛,去除了200nm深度的材料,并消除磁流变粗抛产生的抛光纹路,表面粗糙度Ra值提升至0.575nm。应用磁流变抛光可以高效消除磨削产生的亚表面损伤层。磁流变抛光替代研磨工序直接衔接磨削工序的新工艺流程可以实现近零亚表面损伤和纳米精度抛光两个工艺目标。  相似文献   

18.
以永磁型磁流变抛光机为基础,提出了在光栅式加工轨迹下结合四轴联动机床(不含抛光轮转动轴)和变去除函数实现磁流变抛光技术确定性加工曲面的方法。讨论了曲面上光栅式加工轨迹等面积规划原则和基于矩阵乘积运算的驻留时间求解算法。分析了磁流变四轴联动机床的机械补偿方式,同时以变去除函数模型为基础从算法上实现了机械的剩余补偿。应用以氧化铈为抛光粉的水基磁流液对口径为80mm、曲率半径为800mm的BK7材料凸球面进行了修形验证实验,一次加工(5.5min)后显示:面形误差分布峰谷值(PV)和均方根值(RMS)从117.47nm和22.78nm分别收敛到60.80nm和6.28nm。实验结果表明:结合四轴联动的低自由度机床和变去除函数算法补偿的磁流变加工工艺能够有效地实现球面及低陡度非球面等曲面的高效确定性加工,为磁流变抛光在光学制造中的应用提供了有力的支持。  相似文献   

19.
对磁流变抛光技术中磁场的分析   总被引:3,自引:0,他引:3  
本文对磁流变抛光(magnetorheological finishing)过程中所采用的梯度磁场,以及磁流变抛光液(MRP fluid)中的磁性颗粒在磁场中的受力情况进行了分析,进而证明了该磁场满足磁流变抛光的要求。最后以实验对其进行了验证。  相似文献   

20.
The surface finishing techniques can be divided into two categories: traditional and advanced. To overcome some of the problems of traditional finishing techniques, hybridized processes have been evolved by the researchers. Some of the advanced finishing processes that have been reviewed are abrasive flow machining (AFM), magnetorheological finishing (MRF), magnetorheological abrasive flow finishing (MRAFF), magnetic abrasive finishing (MAF), chemo mechanical polishing (CMP), etc. Most of these processes have been developed in the recent past and they can be employed to produce optical, mechanical, and electronic components with micrometer or sub-micrometer form accuracy and surface roughness within nanometer range with hardly any surface defects. However for large size flat components, MAF seems to be the most suitable finishing process. In MAF, DC power supply is given to the electromagnet hence intermixing of ferromagnetic abrasive particles during the process does not take place and the worn out cutting edges keep interacting with the workpiece surface. As a result, the finishing rate is quite low. The use of pulsed DC power supply to the electromagnet results in pulsating flexible magnetic abrasive brush (P-FMAB), which substantially enhances the finishing rate. The on-line measurement of the forces has helped in understanding the mechanism of material removal during Static-FMAB (S-FMAB) and Pulsating-FMAB. The magnitude of normal magnetic force (originating indentations) in P-FMAB has been found to be dynamic in nature and substantially high in magnitude as compared to S-FMAB.  相似文献   

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