环境、环境影响与控制

0622598医用空气灭菌净化装置的灭菌净化效果实验检测[刊,中]/谢森林//洁净与空调技术．—2006,(5)．—55-57 (G) 0622599重症监护病房环境控制依据与实施[刊,中]/沈晋明//洁净与空调技术．—2006,(5)．—48-51(G) 0622600洁净室气态分子污染物的监测技术[刊,中]/田世爱//洁净与空调技术．—2006,(5)．—12-17(G)随着微电子工业工序复杂性的增加和产品尺寸的不断缩小,气态分子污染物(AMC)对产品的影响成为洁净室环境控制中重点关注的问题。文章介绍了洁净室中AMC的定义,重点阐述了AMC的监测技术。参10     

空气分子污染探讨

介绍空气分子污染(AMC)的定义、国际标准AMC分级、国外污染物分类、洁净室AMC路径、AMC控制设施。     

8"、12"集成电路厂房洁净室设计探讨

随着IC生产工艺技术的不断发展,对于洁净室生产环境及其它配套系统要求也相应更为严格,本文就8"、12"IC生产的洁净室设计中有关洁净室形式和送风方式、空气处理及温湿度保证措施,悬浮分子污染物(AMC)的控制,以及洁净室排烟等方面的设计方案,进行了多方案的综合分析和评价。     

谈300 mm晶圆厂洁净室光刻区域环境中NH3和SO2的控制

在半导体业中,对生产作业环境要求极为严格,其中对AMC(AirborneMolecularContami-nation)有更严格的控制要求。SO2和NH3属于AMC中的2种,即MA(分子酸)和MB(分子碱)。主要讨论洁净室中NH3和SO2的含量对晶圆和光罩的影响,以及采取各种有效措施对其进行控制,满足先进制程对于产品生产的超高空气品质要求。     

8＇＇、12＇＇集成电路厂房洁净室设计探讨

随着IC生产工艺技术的不断发展，对于洁净室生产环境及其它配套系统要求也相应更为严格，本文就8”、12”IC生产的洁净室设计中有关洁净室形式和送风方式、空气处理及温湿度保证措施，悬浮分子污染物(AMC)的控制，以及洁净室排烟等方面的设计方案，进行了多方案的综合分析和评价。     

洁净室AMC浅析

半导体工艺的不断升级,使洁净室对空气的品质要求越来越高。传统的空气净化主要针对大颗粒的气态分子污染物,而如今这样的处理能力已经远远不够,小颗粒的悬浮分子污染物对制品的影响越来越大。AMC在生产过程中对不同制程有不良影响,会导致成品合格率降低。在此从AMC定义、来源、危害以及控制方法对其进行分析。污染物的分类可以帮助我们更有针对性的对污染物处理。按照新风生产的过程,提出一系列的控制方法,使得最终通入洁净室的空气尽可能的干净。     

TFT-LCD生产工艺环境

文章介绍了TFT-LCD的生产工艺环境,主要阐述了洁净室的管理和在洁净室的一些操作流程。洁净室的洁净等级非常重要,它将直接影响到TFT-LCD生产的合格性,如果没有良好的洁净度等级,那产品的成品率会大大地降低。对于洁净室的管理,必须要做到不带入、不产生和不积累任何的灰尘,这样才可以保证产品生产的正常运行。     

药厂洁净室的运行管理

洁净室的软硬件设施是洁净工业能否生产合格产品的前提保证,也是制药企业ＧＭＰ认证的关键指标,本文主要探讨了药厂洁净室运行管理中的一些热点问题,阐明了作者的观战邮运行管理中的一些注意事项,力争在确保产品符合相应的质量要求,制药企业能够顺利通过ＧＭＰ认证的前提下,尽可能地加强管理,减少运行费用,使洁净室能够长期,安全,高效的运行。     

浅析FFU在电子洁净室的应用

重点阐述了FFU的特点及控制方式，并结合现代电子洁净室对空气洁净度等级的要求；分析了FFU应用在洁净室中的优势，并介绍了FFU在实际工程案例中的应用。     

高新技术企业洁净环境控制研究

通过对以纳米技术为代表的高新技术产品的特性和其对洁净室的要求的研究,分析了高新技术企业洁净室污染的主要因素和控制理念、内容、程序,并以半导体中的污染控制技术为例,对其进行了详细介绍。     

The removal of airborne molecular contamination in cleanroom using PTFE and chemical filters

Cleanroom contamination and its impact on the performance of devices are beginning to be investigated due to the increasing sensitivity of the semiconductor manufacturing process to airborne molecular contamination (AMC). A clean bench was equipped with different filter modules and then most AMC in the cleanroom and in the clean bench was detected through air-sampling and wafer-sampling experiments. Additionally, the effect of AMC on device performance was examined by electrical characterization. A combination of the NEUROFINE PTFE filter and chemical filters was found to control metal, organic, and inorganic contamination. We believe that the new combination of filters can be used to improve the manufacturing environment of devices, which are being continuously shrunk to the nanometer scale.     

空气传播分子污染物、源头及监控系统的研究

通过研究某半导体制造工厂应用AMC控制程序的案例,探讨关于AMC控制的具体内容,了解AMC并掌握如何制定正确的AMC评估战略、描述与建立AMC控制原则和规范、理解AMC控制系统的设计理念。     

XPS analysis with an ultra clean vacuum substrate carrier for oxidation and airborne molecular contamination prevention

Germanium wafer oxidation has been studied by angle resolved X-ray photoelectron spectroscopy (ARXPS). These analyses have been used for testing a new concept for substrate contamination prevention methods using an ultra clean vacuum substrate carrier for semiconductor manufacturing environments. Satisfying the International Technology Roadmap for Semiconductors (ITRS) under 65 nm nodes has introduced many assignments to future semiconductor manufacture such as haze problems in lithography masks, wafer oxidation growth in queue time, or contact with airborne molecular contaminations (AMC). From our experience, silicon and germanium wafers, after HF passivation and cleaning, were transported to XPS in order to measure various aspects of the oxidation progress; one case with normal ambient air exposure and another with vacuum carrier storage without ambient exposure. The results give information on the Ge oxidation kinetic, in term of speed and bounding environment. Moreover, the tests performed using the vacuum carrier are significant proof of the efficiency of germanium oxidation prevention. The methods have a large potential for solving critical problems and decontamination methods in the short term IT road map.     

净化厂房中气相分子沾污(AMC)的来源和危害

越来越多的研究发现,在半导体圆片加工净化厂房中,除了存在空气悬浮颗粒沾污外,还存在以气相或蒸汽形式存在的分子污染物(Airborne Molecular Contaminants,AMC)。随着特征尺寸(CD)的不断缩小,AMC将会越来越严重地影响圆片加工质量和成品率,并会影响净化厂房内工作人员的身体健康。文章介绍了AMC的分类、来源、危害性、控制标准和方法,希望以此引起人们对AMC的重视,并采取相应的控制措施。     

Reducing airborne molecular contamination by efficient purging ofFOUPs for 300-mm wafers-the influence of materials properties

The control of airborne molecular contamination (AMC) plays an increasing role in semiconductor manufacturing processes. A method to reduce AMC is purging of wafer boxes with inert gas. In this study, data on the practicability and optimization of purging a front opening unified pod (FOUP), a wafer box for 300-mm wafers, are presented. Different parameters for the purge process are evaluated experimentally. Key values for the assessment of efficiency are the time-dependent content of oxygen and humidity in the FOUP. The increase in the key values after the purge was measured and the construction of the FOUP was modified in order to obtain sufficient tightness. Spatially resolved measurements reveal the homogeneity of the purge. Experimental data are compared to data obtained by a simulation using a computational fluid dynamics program. Values for oxygen are in agreement with the calculated curves. In contrast to this, an additional, long-lasting contribution that was not taken into account in the simulations makes depletion of humidity slower than expected. This contribution is explained with the desorption and permeation of humidity through the plastic walls of the FOUP. The presence of both effects, desorption and permeation, is proved and quantified. Materials properties turn out to heavily affect purge effectiveness and the postpurge ingress of certain contaminants in a wafer box     

半导体洁净室内分子级污染物的控制方法

对洁净室内分子级污染物(AMC)的分类、取样监测方法以及针对不同制程所采用通用的污染控制方法进行了较为全面的归纳和总结.对不同类型的污染源头进行分类识别,并举出实例.给出了几种控制污染的方法.分析了具体问题的实际情况,讨论了主要的污染源及具体产品的环境控制要求,以找到最合理、有效的处理方法.     

有效控制AMC的化学过滤方案

AMC对微电子制程存在潜在严重危害并会导致成品率降低.将传统检测方法和Gigacheck或Gigamonitor相结合,会得到更多的AMC信息.化学过滤器是去除AMC的有效手段,评价化学过滤器的指标不仅要考察吸附效率、吸附容量等指标,还必须对化学过滤器整体进行测试,从而能够提供对特定的AMC有很强针对性和突出去除效果的化学过滤解决方案.     

室内颗粒状污染物与空气过滤器的确定

针对室内颗粒状污染物的来源和危害性,重点分析影响室内空气含尘浓度的各个因素及控制尘粒方式,讨论确定空调系统过滤器效率的方法与步骤,提出合理地选择合适的空气过滤器应该遵守的原则。