Low-Threshold Strained Quantum-Well GaSb-Based Lasers Emitting in the 2.5- to 2.7-$mu$ m Wavelength Range

GaInAsSb–GaSb strained quantum-well (QW) ridge waveguide diode lasers emitting in the wavelength range from 2.51 to 2.72 $ mu{hbox {m}}$ have been grown by molecular beam epitaxy. The devices show ultralow threshold current densities of 44 $hbox{A}/{hbox {cm}}^{2}$ (${L}rightarrow infty $) for a single QW device at 2.51 $ mu{hbox {m}}$, which is the lowest reported value in continuous-wave operation near room temperature (15 $^{circ}hbox{C}$) at this wavelength. The devices have an internal loss of 3 ${hbox {cm}}^{-1}$ and a characteristic temperature of 42 K. By using broader QWs, wavelengths up to 2.72 $mu{hbox {m}}$ could be achieved.      

High Heat Flux Two-Phase Cooling in Silicon Multimicrochannels

This paper presents performances of two-phase cooling of a chip at very high heat flux with refrigerant R236fa in a silicon multimicrochannel heat sink. This heat sink was composed of 134 parallel channels, 67 $mu {hbox {m}}$ wide, 680 $mu {hbox {m}}$ high, and 20 mm long, with 92-$mu {hbox {m}}$ -thick fins separating the channels. The base heat flux was varied from 3 to 255 ${hbox {W/cm}}^{2}$ , the volume flow rate from 0.18 to 0.67 l/min, and the exit vapor quality from 0 to 80%. The working pressure and saturation temperature were set at 273 kPa and 25 $^{circ}{hbox {C}}$, respectively. The present database includes 1040 local heat transfer coefficients. The base temperature of the chip could be maintained below 52 $^{circ}{hbox {C}}$ while dissipating 255 ${hbox {W/cm}}^{2}$ with 10 $~^circ{hbox {C}}$ of inlet subcooling and 90 kPa of pressure drop. A comparison of the respective performances with an extrapolation of the present results shows that two-phase cooling should be able to cool the chip 13 K lower than liquid cooling for the same pumping power at a base heat flux of 350 ${hbox {W/cm}}^{2}$.      

A Compact Four-Wavelength Quantum-Cascade Laser Source

A four-wavelength quantum-cascade (QC) laser source that operates using a single current channel is presented. The source includes two different heterogeneous cascade QC lasers, one with emission wavelengths of 7.0 $mu{hbox {m}}$ and 11.2 $mu{hbox {m}}$, and the other with 8.7 $mu{hbox {m}}$ and 12.0 $mu{hbox {m}}$ . For 3.0-mm and 3.5-mm cavity lengths, QC lasers with emission wavelengths of 8.7, 11.2, and 12.0 $mu{hbox {m}}$ have threshold current densities within less than a factor of 2, which allows them to be conveniently driven in series by a single current source.      

Enhanced Transmission in a Fiber-Coupled Au Stripe Waveguide System

We experimentally demonstrated the enhanced transmission in a fiber-coupled Au stripe waveguide system using a linearly tapered (LT) structure at a telecommunication wavelength of 1.55 $mu{hbox {m}}$. The LT structure consists of two 100- $mu{hbox {m}}$-long tapered regions connecting various widths of input and output waveguides with a waist region. The lowest insertion loss of the 1-cm-long LT-Au stripe waveguide is $sim$4.3 dB, when it has 6-$mu{hbox {m}}$ -wide input and output waveguides and a 4- $mu{hbox {m}}$-wide waist waveguide. The insertion loss is reduced by $sim$ 2 dB compared to the 4-$mu{hbox {m}}$-wide and 1-cm-long straight Au stripe waveguide, which is achieved by decreasing the coupling loss. The losses of the LT region, which has a tapered angle of less than 0.3$^{circ}$ between the input–output waveguides and the waist waveguide, are smaller than 0.4 dB. We showed that the insertion loss of the Au stripe waveguide can be reduced by introducing the LT structure, which can also provide efficient mode conversion.      

Active Region Cascading for Improved Performance in InAs–GaSb Superlattice LEDs

Cascading of active regions in InAs–GaSb superlattice light-emitting diodes (LEDs) grown by molecular beam epitaxy is demonstrated as an effective means of increasing optical emission. Devices were fabricated into $120times 120 mu{hbox {m}}^{2}$ mesas to demonstrate suitability for high resolution projection systems. Devices with 1, 4, 8, and 16 stages were designed for midwave infrared emission at 3.8 $mu{hbox {m}}$ operating at 77 K, and quasi-continuous-wave output powers in excess of 900 $mu{rm W}$ from a 16-stage LED have been demonstrated. External quantum efficiency is shown to improve substantially with cascading, approaching 10% for a 16-stage device.      

17 GHz RF Front-Ends for Low-Power Wireless Sensor Networks

A 17 GHz low-power radio transceiver front-end implemented in a 0.25 $mu{hbox {m}}$ SiGe:C BiCMOS technology is described. Operating at data rates up to 10 Mbit/s with a reduced transceiver turn-on time of 2 $mu{hbox {s}}$, gives an overall energy consumption of 1.75 nJ/bit for the receiver and 1.6 nJ/bit for the transmitter. The measured conversion gain of the receiver chain is 25–30 dB into a 50 $Omega$ load at 10 MHz IF, and noise figure is 12 $pm$0.5 dB across the band from 10 to 200 MHz. The 1-dB compression point at the receiver input is $-$37 dBm and ${hbox{IIP}}_{3}$ is $-$25 dBm. The maximum saturated output power from the on-chip transmit amplifier is $-$1.4 dBm. Power consumption is 17.5 mW in receiver mode, and 16 mW in transmit mode, both operating from a 2.5 V supply. In standby, the transceiver supply current is less than 1 $mu{hbox {A}}$.      

Interfacial Reaction Between Molten Sn-Bi Based Solders and Electroless Ni-P Coatings for Liquid Solder Interconnects

This paper reports on the interfacial reactions and lifetime of electroless Ni-P coatings in contact with molten Sn-Bi based solders. A layer of approximately 4 $mu{hbox{m}}$ thick electroless Ni-P in contact with the molten Sn-58Bi solder began to fail at 48 h at temperatures between 200 $^{circ}{hbox{C}}$ and 240 $^{circ}{hbox{C}}$ . Elemental additions to modify the solder, included 1–2wt.% of Al, Cr, Si, Zn, Ag, Au, Ru, Ti, Pt, Nb, and Cu. Of these, only Cu modified the interfacial intermetallic compound growth from ${hbox{Ni}}_{3}{hbox{Sn}}_{4}$ to $({hbox{Cu,Ni}})_{6}{hbox{Sn}}_{5}$ , resulting in significantly decreased consumption rates of the Ni-P substrate in contact with the molten solder and increasing the lifetime of the Ni-P layer to between 430 and 716 h. Micro cracks were observed in all but the thinnest Ni-P layers, allowing the solder to penetrate.      

Near-Stoichiometric Ti : LiNbO$_{3}$ Strip Waveguides Fabricated by Standard Ti Diffusion and Post-VTE

We report near-stoichiometric (NS) Ti : LiNbO$_{3}$ waveguides fabricated by indiffusion of 4-, 5-, 6-, 7- $mu{hbox {m}}$-wide 120-nm-thick Ti-strips at 1060 $^{circ}hbox{C}$ for 10 h into a congruent $hbox{LiNbO}_{3}$ (i.e., standard Ti diffusion procedure) and post-vapour-transport-equilibration (VTE) treatment at 1100 $^{circ}hbox{C}$ for 5 h. These waveguides are NS and single-mode at 1.5 $mu{hbox {m}}$, and have a loss of 1.0/0.8 dB/cm for the TM/TE mode. In the width/depth direction of the waveguide, the mode field follows a Gauss/Hermite–Gauss profile, and the Ti profile follows a sum of two error functions/a Gauss function. The post-VTE resulted in increase of diffusion width/depth by 2.0/1.0 $mu{hbox {m}}$. A two-dimensional refractive index profile in the guiding layer is suggested.      

Strain Enhanced nMOS Using In Situ Doped Embedded $hbox{Si}_{1 - x}hbox{C}_{x}$ S/D Stressors With up to 1.5% Substitutional Carbon Content Grown Using a Novel Deposition Process

This letter reports on the implementation of high carbon content and high phosphorous content $hbox{Si}_{1 - x}hbox{C}_{x}$ layers in the source and drain regions of n-type MOSFET in a 65-nm-node integration scheme. The layers were grown using a novel epitaxial process. It is shown that by implementing stressors with $x approx hbox{0.01}$ , nMOSFET device performance is enhanced by up to 10%, driving 880 $mu hbox{A}/muhbox{m}$ at 1-V $V_{rm DD}$. It is also demonstrated that the successful implementation of $hbox{Si}_{1 - x} hbox{C}_{x}$ relies on the careful choice of integration and epitaxial layer parameters. There is a clear impact of the postepitaxial implantation and thermal treatment on the retained substitutional C content $([C_{rm sub}])$. Furthermore, adding a Si capping layer on top of the $hbox{Si}_{1 - x}hbox{C}_{x}$, greatly improves upon the stressors' stability during the downstream processing and the silicide sheet resistance.      

CMOS Avalanche Photodiode Embedded in a Phase-Shift Laser Rangefinder

This paper presents the design and the characterization of a CMOS avalanche photodiode (APD) working as an optoelectronic mixer. The $hbox{P}^{+}hbox{N}$ photodiode has been implemented in a commercial 0.35-$muhbox{m}$ CMOS technology after optimization with SILVACO. The surface of the active region is $ hbox{3.78} cdot hbox{10}^{-3} hbox{cm}^{2}$. An efficient guard-ring structure has been created using the lateral diffusion of two n-well regions separated by a gap of 1.2 $mu hbox{m}$. When biased at $-$2 V, the best responsitivity $S_{lambda ,{rm APD}} = hbox{0.11} hbox{A/W}$ is obtained at $lambda = hbox{500} hbox{nm}$. This value can easily be improved by using an antireflection coating. At $lambda = hbox{472} hbox{nm}$, the internal gain is about 75 at $-$6 V and 157 at $-$7 V. When biased at $-$6 V, the APD achieves a dark current of 128 $muhbox{A} cdot hbox{mm}^{-2}$ and an excess noise factor $F = hbox{20}$ . Then, the APD is successfully used as an optoelectronic mixer to improve the signal-to-noise ratio of a low-voltage embedded phase-shift laser rangefinder.      

A Noise-Coupled Time-Interleaved Delta-Sigma ADC With 4.2 MHz Bandwidth, ${-}$ 98 dB THD, and 79 dB SNDR

This paper describes a wideband high-linearity $Delta Sigma $ ADC. It uses noise coupling combined with time interleaving. Two versions of a two-channel time-interleaved noise-coupled $Delta Sigma $ ADC were realized in a 0.18- $mu{hbox {m}}$ CMOS technology. Noise coupling between the channels increases the effective order of the noise-shaping loops, provides dithering, and prevents tone generation in all loops. Time interleaving enhances the effects of noise coupling. Using a 1.5 V supply, the device achieved excellent linearity (${rm SFDR} > {hbox {100~dB}}$, ${rm THD}= -{hbox {98~dB}}$) and an SNDR of 79 dB in a 4.2 MHz signal band.      

A Theoretical Comparison of the Breakdown Behavior of $hbox{In}_{0.52}hbox{Al}_{0.48}hbox{As}$ and InP Near-Infrared Single-Photon Avalanche Photodiodes

We study the breakdown characteristics and timing statistics of InP and $hbox{In}_{0.52}hbox{Al}_{0.48}hbox{As}$ single-photon avalanche photodiodes (SPADs) with avalanche widths ranging from 0.2 to 1.0 $mu{hbox {m}}$ at room temperature using a random ionization path-length model. Our results show that, for a given avalanche width, the breakdown probability of $hbox{In}_{0.52}hbox{Al}_{0.48}hbox{As}$ SPADs increases faster with overbias than InP SPADs. When we compared their timing statistics, we observed that, for a given breakdown probability, InP requires a shorter time to reach breakdown and exhibits a smaller timing jitter than $hbox{In}_{0.52}hbox{Al}_{0.48}hbox{As}$ . However, due to the lower dark count probability and faster rise in breakdown probability with overbias, $hbox{In}_{0.52}hbox{Al}_{0.48}hbox{As}$ SPADs with $hbox{avalanche} hbox{widths}leq 0.5 mu{hbox {m}}$ are more suitable for single-photon detection at telecommunication wavelengths than InP SPADs. Moreover, we predict that, in InP SPADs with $hbox{avalanche} hbox{widths}leq 0.3 mu{hbox {m}}$ and $hbox{In}_{0.52}hbox{Al}_{0.48}hbox{As}$ SPADs with $hbox{avalanche} hbox{widths}leq 0.2 mu{hbox {m}}$, the dark count probability is higher than the photon count probability for all applied biases.      

Broadband Micro-Coaxial Wilkinson Dividers

This paper presents several micro-coaxial broadband 2 : 1 Wilkinson power dividers operating from 2 to 22 GHz, a 11 : 1 bandwidth. Circuits are fabricated on silicon with PolyStrata technology, and are implemented with 650 $mu{hbox{m}}times$ 400 $mu{hbox{m}}$ air-supported micro-coaxial lines. The measured isolation between the output ports is greater than 11 dB and the return loss at each port is more than 13 dB over the entire bandwidth. The footprints of these dividers can be miniaturized due to the high isolation between adjacent coaxial lines and their tight bend radius. For higher power handling, larger lines with a cross section of 1050 $ mu{hbox{m}}times$ 850 $ mu{hbox{m}}$ are also demonstrated. The effect of mismatch at the output ports is investigated in order to find the power loss in the resistors.      

Thermal Properties of Ultrathin Hafnium Oxide Gate Dielectric Films

Thin-film $hbox{HfO}_{2}$ is a promising gate dielectric material that will influence thermal conduction in modern transistors. This letter reports the temperature dependence of the intrinsic thermal conductivity and interface resistances of 56–200- $hbox{rm{AA}}$-thick $ hbox{HfO}_{2}$ films. A picosecond pump–probe thermoreflectance technique yields room-temperature intrinsic thermal conductivity values between 0.49 and 0.95 $ hbox{W}/(hbox{m}cdot hbox{K})$. The intrinsic thermal conductivity and interface resistance depend strongly on the film-thickness-dependent microstructure.      

A $Q$ -Band Four-Element Phased-Array Front-End Receiver With Integrated Wilkinson Power Combiners in 0.18-$mu{{hbox{m}}}$ SiGe BiCMOS Technology

A four-element phased-array front-end receiver based on 4-bit RF phase shifters is demonstrated in a standard 0.18- $mu{{hbox{m}}}$ SiGe BiCMOS technology for $Q$-band (30–50 GHz) satellite communications and radar applications. The phased-array receiver uses a corporate-feed approach with on-chip Wilkinson power combiners, and shows a power gain of 10.4 dB with an ${rm IIP}_{3}$ of $-$13.8 dBm per element at 38.5 GHz and a 3-dB gain bandwidth of 32.8–44 GHz. The rms gain and phase errors are $leq$1.2 dB and $leq {hbox{8.7}}^{circ}$ for all 4-bit phase states at 30–50 GHz. The beamformer also results in $leq$ 0.4 dB of rms gain mismatch and $leq {hbox{2}}^{circ}$ of rms phase mismatch between the four channels. The channel-to-channel isolation is better than $-$35 dB at 30–50 GHz. The chip consumes 118 mA from a 5-V supply voltage and overall chip size is ${hbox{1.4}}times {hbox{1.7}} {{hbox{mm}}}^{2}$ including all pads and CMOS control electronics.      

A Low-Voltage Mobility-Based Frequency Reference for Crystal-Less ULP Radios

The design of a 100 kHz frequency reference based on the electron mobility in a MOS transistor is presented. The proposed low-voltage low-power circuit requires no off-chip components, making it suitable for application in wireless sensor networks (WSN). After a single-point calibration, the spread of its output frequency is less than 1.1% (3$sigma $) over the temperature range from $-{hbox{22}},^{circ}{hbox{C}}$ to 85$,^{circ}{hbox{C}}$ . Fabricated in a baseline 65$~$nm CMOS technology, the frequency reference circuit occupies 0.11$ hbox{mm}^{2}$ and draws 34 $ muhbox{A}$ from a 1.2 V supply at room temperature.      

Compact In-Fiber Interferometer Formed by Long-Period Gratings in Photonic Crystal Fiber

We reported the design and implementation of an in-fiber Mach–Zehnder interferometer (MZI) based on a pair of long-period gratings (LPGs) written on a photonic crystal fiber (PCF). The LPG was fabricated by using a pulsed CO$_{2}$ laser to carve grooves periodically along the PCF. The MZI relies on the interference between the fundamental core mode and a cladding mode of the PCF. The MZI was further demonstrated as a temperature sensor and a strain sensor. The temperature and strain sensitivities were measured to be 42.4 pm/$^{circ}hbox{C}cdot hbox{m}$ and $-$ 2.6 pm/$mu varepsilon $, respectively. We also fabricated an MZI on a single-mode fiber, which has a temperature sensitivity of 1215.56 pm/( $^{circ}hbox{C}cdot hbox{m}$) and a strain sensitivity of $+$ 0.445 pm/$mu varepsilon $.      

A BiCMOS Dual-Band Millimeter-Wave Frequency Synthesizer for Automotive Radars

Design and implementation of a millimeter-wave dual-band frequency synthesizer, operating in the 24 GHz and 77 GHz bands, are presented. All circuits except the voltage controlled oscillators are shared between the two bands. A multi-functional injection-locked circuit is used after the oscillators to simplify the reconfiguration of the division ratio inside the phase-locked loop. The 1 mm $, times , $0.8 mm synthesizer chip is fabricated in a 0.18 $mu{hbox{m}}$ silicon-germanium BiCMOS technology, featuring 0.15 $mu{hbox{m}}$ emitter-width heterojunction bipolar transistors. Measurements of the prototype demonstrate a locking range of 23.8–26.95 GHz/75.67–78.5 GHz in the 24/77 GHz modes, with a low power consumption of 50/75 mW from a 2.5 V supply. The closed-loop phase noise at 1 MHz offset from the carrier is less than ${- }$ 100$~$dBc/Hz in both bands. The frequency synthesizer is suitable for integration in direct-conversion transceivers for K/W-band automotive radars and heterodyne receivers for 94$~$GHz imaging applications.      

Q-Band pHEMT and mHEMT Subharmonic Gilbert Upconversion Mixers

This letter makes a comparison between Q-band 0.15 $mu{rm m}$ pseudomorphic high electron mobility transistor (pHEMT) and metamorphic high electron mobility transistor (mHEMT) stacked-LO subharmonic upconversion mixers in terms of gain, isolation and linearity. In general, a 0.15 $mu{rm m}$ mHEMT device has a higher transconductance and cutoff frequency than a 0.15 $mu{rm m}$ pHEMT does. Thus, the conversion gain of the mHEMT is higher than that of the pHEMT in the active Gilbert mixer design. The Q-band stacked-LO subharmonic upconversion mixers using the pHEMT and mHEMT technologies have conversion gain of $-$7.1 dB and $-$0.2 dB, respectively. The pHEMT upconversion mixer has an ${rm OIP}_{3}$ of $-$12 dBm and an ${rm OP}_{1 {rm dB}}$ of $-$24 dBm, while the mHEMT one shows a 4 dB improvement on linearity for the difference between the ${rm OIP}_{3}$ and ${rm OP}_{1 {rm dB}}$. Both the chip sizes are the same at 1.3 mm $times$ 0.9 mm.      

Soft Glass Equiangular Spiral Photonic Crystal Fiber for Supercontinuum Generation

An equiangular spiral photonic crystal fiber (ES-PCF) design in soft glass is presented that has high nonlinearity ( $gamma>5250 hbox{W}^{-1}cdothbox{km}^{-1}$ at 1064 nm and $gamma>2150 hbox{W}^{-1}cdothbox{km}^{-1}$ at 1550 nm) with a low and flat dispersion (${D}sim {hbox {0.8}} hbox{ps/km}cdothbox{nm}$ and dispersion slope $sim-0.7 hbox{ps/km}cdothbox{nm}^{2}$ at 1060 nm). The design inspired by nature is characterized by a full-vectorial finite element method. The ES-PCF presented improves over the mode confinement of triangular core designs and dispersion control of conventional hexagonal PCF, combining the advantages of both designs; it can be an excellent candidate for generating supercontinuum pumped at 1.06 $mu{hbox {m}}$.