厌氧胶在夹具上应用十一例

厌氧胶是一种新型胶粘剂,它与我厂过去常用的环氧树脂胶粘剂区别在于;厌氧胶在空(氧)气中呈液态,不会凝固,而当注入(或渗入)金属接缝,与空(氧)气隔绝时,在常温下即能自行固化;单组分,无需按比例配方和加热即能使用,操作和使用十分方便;并具有粘接强度高,密封性、浸渗性和吸振性好,粘接力大而且可拆卸等特点,用于夹具零件的粘接,能提高夹具的精度,简化结构和工艺,节约材料,延长夹具的使用寿命,具有较大的经济效益。 我厂自1980年以来,在夹具上推广应用厌气胶粘接工艺(胶粘剂均为浙江省机械科学研究所研制的ZY 800型系列厌氧胶),经六年来的试…     

室温快速固化高性能环氧树脂胶粘剂研究

为了提高胶粘剂在室温条件下的固化速度,并改善其力学性能,研究了固化剂含量、填料含量对环氧树脂胶粘剂固化速度和力学性能的影响.结果表明,当固化剂含量为95～100 phr,填料含量为60～ 80 phr时,胶粘剂的综合性能最好;该新型胶粘剂在室温12 min即可快速固化,剪切强度可达13.8 MPa,拉伸强度和弯曲强度分别达到了43.1MPa和83.2 MPa.     

铁浆糊

铁桨糊是一种室温固化高强度结构胶粘剂,在机床制造与修理中应用效果良好。一、特点1.配方(重量比):E44环氧树脂100二缩水甘油醚24     

厌氧胶在夹具上的应用十一例

厌氧胶是一种新型胶粘剂,它与环氧树脂胶粘剂区别在于:厌氧胶在空气中呈液态,不会凝固,而当注入(或渗入)金属接缝,与空气隔绝时,在常温下即能自行固化;单组分,无需配方和加热即能使用,操作和使用十分方便;并具有粘接强度高,密封性、浸渗性和吸振性好,粘接力大,仍可拆下等特点,用于夹具零件的粘接,能提高夹具的精度,简化结构和工艺,节约材料,延长夹具的使用寿命,具有较大的经济效益。我厂在夹具上推广应用厌氧胶粘接工艺(胶粘剂均为ZY800型系列厌氧胶),经六年来的试验和生产验证,技术经济效果很好。现将应用十一例介绍如下: 1.加工箱体类工件的镗模如图1所示。前支架镗套孔d_1对于后支架镗套孔d的同轴度允差φt不易控制。如采用前后支架分别     

软管泵在胶粘剂输送装置上的应用

在百叶砂布轮自动涂胶设备中,根据胶粘剂的特性,采用软管泵来输送环氧树脂胶粘剂,可以解决输送介质粘度高、产生固化后清理困难的问题,为输送高粘度、易固化液体提供了一种较好的方案.     

解码环氧树脂胶粘剂及其胶粘技术

环氧树脂胶粘剂是以环氧树脂为主体配制而成的。树脂大分子末端有环氧基,链间有羟基和醚键,并在固化过程中还会继续产生羟基和醚键,结构中含有苯环和杂环,这些结构决定了环氧树脂胶粘剂具有优异的性能。环氧树脂胶粘剂是一种使用历史较久,     

固化方式和纤维表面处理对碳纤维-树脂界面化学组成的影响

对碳纤维进行低温等离子法表面处理,分别在室温和微波固化条件下将碳纤维与环氧树脂复合成型,制备出碳纤维复合材料.采用原子力显微镜、拉曼光谱对碳纤维表面形貌和微观结构进行表征,采用扫描电镜和能量散射光谱对碳纤维-树脂界面区形貌和元素分布进行表征.结果表明,碳纤维经处理后,表面无序结构比例增大,有利于提高纤维的微波吸收能力,使微波固化复合材料的界面结合比室温固化复合材料更牢固.经过表面处理的碳纤维与树脂形成良好的化学键合,S i元素在复合材料界面区发生偏聚.     

胶粘剂固化智能温控系统

胶粘剂作为胶接修理的关键材料,其固化法度对损伤结构的胶接强度有着重要影响。把DS18B20采集的温度信号写入1602。然后温度是否高于80度,如果高于80度,则通过继电器切断微波加热电源。     

室温快速固化纳米环氧胶粘剂的力学性能

对纳米SiO2进行表面修饰获得了稳定的悬浮液,将改性纳米SiO2以溶液共混法加入到胶粘剂中,制备出一种室温快速固化纳米环氧胶粘剂.透射电子显微镜下可观察到,经表面活性剂改性后的纳米SiO2比较均匀地分散在环氧胶粘剂中,粒径约为30nm,提高了胶粘剂剪切强度值.利用扫描电子显微镜观察了固化物断口形貌,发现当基体受到冲击时,纳米粒子与基体之间产生大量银纹,消耗了大量能量,起到了增韧增强的作用.此外,分析并讨论了纳米SiO2对胶粘剂的力学性能影响.     

农机胶粘剂

Ⅰ号和Ⅱ号农机肢粘剂是一种通用型胶粘剂。它具有常温固化速度快,胶接工艺简便,不需要特殊的加热、加压和固化设备,粘接强度较高,密封性好,耐水、耐油、耐一般化学药品性能好,成本低,特别适用于公社、生产队用来快速修补农业机械。一、组成Ⅰ号和Ⅱ号农机胶粘剂是由树脂组份(甲)和固化剂组份(乙)组成的双组份胶粘剂,其配方及制备方法如下:     

Numerical Modelling and Optimisation of a Microwave Enhanced Rapid Prototyping

Microwave heating technology is a cost-effective alternative way for assisting the thermosetting process of thin epoxy resin layers of material. With the benefit of existing modelling for computing the electromagnetic field and power density distribution in a cavity, an investigation has been conducted about the application of an electromagnetic field and its effects on a thin epoxy resin layer. The results of the simulations have been used to optimise the design of a microwave heating system for curing a thin epoxy resin layer. The investigation leads to a feasibility study to combine the microwave heating process with the rapid product development technique, to build 3D models efficiently through the fast-curing of thin epoxy resin layers. Numerous configurations were investigated, by changing the design of microwave applicator. A numerical model was used to identify the strength and weakness of each design, leading to an optimised configuration that can be used for microwave heating, and fast curing of a thin epoxy resin layer. From the present study it can be concluded that a mathematical model can be used to optimise microwave heating devices, enabling the configuration to deliver a uniform electric field.     

鳞片石墨对环氧胶固化过程的影响

用应变片电测法和阿基米德法,分别测定了鳞片石墨含量不同的环氧胶加热固化中的应变和固化完成后试样的密度,以研究石墨含量对金属-环氧胶接头胶层固化内应力的影响。结果表明:在所采取的研究条件下,石墨含量为5%的试样固化收缩应变值最大,而最初9m in所测得的应变谷值与试样峰值应变和最终应变之差,对应石墨鳞片含量存在着较为一致的对应关系。对鳞片石墨含量变化所带来的影响进行了讨论,综合考虑多方面因素,石墨鳞片的添加量为15%较为适宜。     

离子液体改性环氧树脂复合材料摩擦学性能研究

为探讨离子液体的加入对环氧树脂固化过程及摩擦学性能的影响,制备离子液体(1-丁基-3-甲基咪唑六氟磷酸盐)改性环氧树脂复合材料,并通过红外光谱、核磁共振氢谱、扫描电镜元素分析等考察离子液体在环氧树脂中的存在及分散状态,分析离子液体含量对复合材料动态热力学性能及减摩抗磨性能的影响.结果表明:离子液体与环氧树脂本体及固化剂...     

环氧树脂灌封结构热力耦合特性研究

对固化温度为60℃的环氧树脂灌封材料在-30~60℃环境温度下的力学和物性参数以及固化残余应变进行测试,并以此为输入条件,采用有限元模型对环氧树脂灌封结构的热应变进行模拟,并与试验结果进行对比,研究了环氧树脂灌封结构的热力耦合特性。结果表明:该环氧树脂灌封结构的仿真热应变和试验热应变的相对误差均在工程允许范围内,有限元模拟结果较准确;在-30~60℃范围内产生的热应力远小于其断裂强度,在该温度范围内不会因热应力而开裂。     

Analysis of glass fabric impregnation using a resin drop method

Wettability of a glass fabric was studied by use of a resin drop method. The mixing ratios of epoxy resin and anhydride hardener were adopted as 1:0.5, 1:1 and 1:1.2. A catalyst of 2-ethyl-4-methylimidazole added as much as 0.1wt% of the mixed resin. A curing analysis by differential scanning calorimeter (DSC) showed that the mixed resin could be infiltrative at room temperature. An effective contact angle and the height of the resin drop onto the glass fabric preset on a flat glass plate were measured as a function of time. The wet area of the resin drop was also measured. Behaviors of the contact angle, the drop height, the net wet area and the coefficient of wettability were analyzed in the glass fabric impregnation. The resin drop method was shown to be quite effective in evaluating the capillary-mode resin penetration into the fabric.     

TPB对HTPB—TDI固化反应的影响

采用非等温示差扫描量热法（DSC）研究了三苯基铋（TPB）对HTPB—TDI体系固化反应动力学的影响。测定了其固化峰温,以Kissinger法和Crane法计算其活化能等动力学参数,列出了固化反应动力学方程。结果表明,未加催化剂时活化能为51．29kJ／mol,加入TPB后活化能降至46．43kJ／mol。因此,TPB能有效地降低固化反应的活化能,加快反应速率,降低反应温度,缩短固化时间,并使固化体系在27℃时的反应速率达到未加催化剂时80℃的值,当催化剂浓度为0．5％时,催化活性达到最大。     

Medium temperature epoxy resin for immunocytochemistry: Quetol 651 with water.

The addition of 1% water to the epoxy resin Quetol increased the labeling intensity of the sample. The significant decrease of the curing temperature of the epoxy resin may assist in preservation of antigens. Water may also reduce the cross-linkage of the resin allowing more antigen to be available to the antibodies. The modified Quetol resin is an option for use in immunocytochemistry studies.     

RTM技术在波纹板制造中的应用探讨

通过DSC、TMA等测试手段研究了5218和5640两种环氧树脂体系的粘度、固化和热机械特性等。实验结果表明5640环氧树脂体系不但满足RTM工艺对树脂基体工艺性的要求,而且其机械性能和耐热性也可以满足制件的使用要求,同时按照实验确定的注胶温度,注射压力等工艺参数利用RTM技术制造了波纹板。     

Pitting and bubbling artefacts in surface replicas made with silicone elastomers

Pitting or bubbling on the surface of epoxy resin replicas is a frequently encountered artefact associated with the use of silicone rubber impression materials. Several variants of this type of artefact are illustrated. It is suggested that bubbles or pits form at the mould: epoxy interface during curing of the epoxy, and that they are caused by gas escaping from the mould material itself. Duration of silicone rubber polymerization, base-catalyst ratios, and surface porosity of the object may all influence the occurrence of mould degassing.