光强均匀度对GaAs电池组光电转换效率的影响

为了研究激光光强均匀度对GaAs电池转换效率的影响,基于单结GaAs电池的工作原理,利用等效电路对其在受到不同光强激光照射时的光电转换效率进行分析,并通过实验测量不同光强均匀度情况下GaAs串联电池组的光电转换效率。结果表明,光强均匀度对GaAs电池组的光电转换效率有很大影响。在极限条件下,由光强不匀均性引起的热斑效应还会造成电池片的损毁。     

透射式GaAs光电阴极时间分辨特性研究

时间分辨特性是GaAs光电阴极应用于泵浦探测等领域的一种极为重要的性能参量。采用矩阵差分求解光电子扩散模型的方式计算了光电子连续性方程和出射光电子流密度方程，发现影响GaAs光电阴极时间分辨特性的因素包括GaAs/GaAlAs后界面复合速率、GaAs电子扩散系数和GaAs激活层厚度，之后较为系统地研究了这三种物理因素对GaAs光电阴极时间分辨特性的影响。研究结果表明，GaAs电子扩散系数和GaAs/GaAlAs后界面复合速率与光电阴极的响应速率存在非线性正比关系，且随着两者的增大，GaAs光电阴极将出现饱和响应速率。激活层厚度对GaAs光电阴极响应时间的影响最大，通过激活层厚度的适当减薄可以将GaAs光电阴极的响应时间缩短至20 ps，可满足绝大多数光子、粒子探测的快响应需求。该研究为快响应GaAs光电阴极的实验和应用提供了必要的理论支撑。     

Diffusion of zinc into gaas layers grown by molecular beam epitaxy at low substrate temperatures

We report the diffusion of zinc into low temperature (LT) GaAs grown by MBE at 200° C, the problems associated with using a silicon nitride film directly deposited on the LT GaAs as a Zn diffusion mask, and several schemes to avoid the problems. The Zn diffusion coefficient is measured (sealed-ampoule technique) to be about one order of magnitude higher in the LT GaAs than in normal GaAs, attributed to a large quantity of defects including arsenic antisites (As_Ga) in the LT GaAs. The effectiveness of silicon nitride as a Zn diffusion mask depends if the mask is deposited directly on the LT GaAs. The failure of the nitride directly deposited on the LT GaAs to stop the Zn is attributed to arsenic atoms outdiffusing from the As-rich LT GaAs (about 1 at. % excess As) into the nitride. Several structures are introduced including a 100-Å thick GaAs layer on the LT GaAs that are effective in preserving the diffusion mask properties of the silicon nitride.     

GaAs/Si/AlAs异质结的DLTS实验研究

利用深能级瞬态谱(DLTS)技术研究了Si夹层和GaAs层不同生长温度对GaAs/AlAs异质结晶体品质的影响.发现Si夹层的引入并没有引起明显深能级缺陷,而不同温度下生长的GaAs/Si/AlAs异质结随着温度的降低,深能级缺陷明显增加,并进行了分析,得到深能级是由Ga空位引起的,在600℃时生长的晶体质量最佳.     

Application of low temperature GaAs to GaAs/Si

Low Temperature grown GaAs (LT-GaAs) was incorporated as a buffer layer for GaAs on Si (GaAs/Si) and striking advantages of this structure were confirmed. The LT-GaAs layer showed high resistivity of 1.7 × 10⁷ ω-cm even on a highly defective GaAs/Si. GaAs/Si with the LT-GaAs buffer layers had smoother surfaces and showed much higher photoluminescence intensities than those without LT-GaAs. Schottky diodes fabricated on GaAs/Si with LT-GaAs showed a drastically reduced leakage current and an improved ideality factor. These results indicate that the LT-GaAs buffer layer is promising for future integrated circuits which utilize GaAs/Si substrates.     

Influence of the cap layer thickness on photoluminescence properties in strained InGaAs/GaAs single quantum wells

The influence of the GaAs cap layer thickness on the luminescence properties in strained In_0.20Ga_0.80As/GaAs single quantum well (SQW) structures has been investigated using temperature-dependent photoluminescence (PL) spectroscopy. The luminescence peak is shifted to lower energy as the GaAs cap layer thickness decreases, which demonstrates the effect of the GaAs cap layer thickness on the strain of InGaAs/GaAs single quantum wells (SQW). We find the PL quenching mechanism is the thermal activation of electron hole pairs from the wells into the GaAs cap layer for the samples with thicker GaAs cap layer, while in sample with thinner GaAs cap layer exciton trapping on misfit dislocations is dominated.     

GaAs solar cells grown on Si substrates for space use

GaAs single‐junction and InGaP/GaAs multi‐junction thin‐film solar cells fabricated on Si substrates have great potential for high‐efficiency, low‐cost, lightweight and large‐area space solar cells. Heteroepitaxy of GaAs thin films on Si substrates has been examined and high‐efficiency GaAs thin‐film solar cells with total‐area efficiencies of 18·3% at AM0 and 20·0% at AM 1·5 on Si substrates (GaAs‐on‐Si solar cells) have been fabricated. In addition, 1‐MeV electron irradiation damage to GaAs‐on‐Si cells has been studied. The GaAs‐on‐Si cells are found to show higher end‐of‐life efficiency than the conventional GaAs cells fabricated on GaAs substrates (GaAs‐ on‐GaAs cells) under high‐fluence 1‐MeV electron irradiation of more than 1 × 10¹⁵ cm⁻². The first space flight to make use of them has been carried out. Forty‐eight 2 × 2 cm GaAs‐on‐Si cells with an average AM0 total‐area efficiency of 16·9% have been evaluated in the Engineering Test Satellite No.6 (ETS‐VI). The GaAs‐on‐Si cells have been demonstrated to be more radiation‐resistant in space than GaAs‐on‐GaAs cells and 50, 100 and 200‐μm‐thick Si cells. These results show that the GaAs‐on‐Si single‐junction and InGaP/GaAs‐on‐Si multi‐junction cells have great potential for space applications. Copyright © 2001 John Wiley & Sons, Ltd.     

Effect of iso-electronic dopants on the dislocation density of GaAs

The addition of 1% In to LEC GaAs has been reported to reduce the dislocation density in this material; similar data exists for Sb doping. Several effects have been inferred to explain these phenomena, the most prevailing one stating that the solid stoichiometry is affected by an as yet unknown mechanism. Similar postulations have been made to explain the growth of semi-insulating GaAs. A thermodynamic model is described, based on earlier work, that shows a broadening of the existence region of GaAs when In or Sb are added to GaAs. Comparing the solidus phase diagrams of In- or Sb-doped GaAs to undoped GaAs shows that addition of either one of these two iso-electronic dopants has a similar effect on the solid stoichiometry as adding more As to the melt. However, the increased pressure problems in LEC growth of GaAs, normally associated with adding As, are circumvented if instead In or Sb are added to the melt. From our calculations it is also shown that the addition of the iso-electronic dopants Al or P to GaAs would not result in the same effect on the solid stoichiometry. Published experimental evidence supports this and shows that no dislocation reduction and semi-insulating GaAs is obtained with the use of these dopants. The model described in this paper explains the postulation that iso-electronic doping is of critical significance in controlling the solid stoichiometry and thereby obtaining zero dislocation density LEC GaAs and semi-insulating GaAs.     

Band-bending effect of low temperature GaAs on a pseudomorphic modulation-doped field-effect transistor

Low temperature photoluminescence (PL) measurements on pseudomorphic modulation-doped transistors with a low-temperature (LT) GaAs layer in the GaAs buffer layer clearly show a decrease in the quantum well PL transition energies compared to a structure with no LT GaAs. Self-consistent calculations of the electron and hole bandstructure suggest that the observed increase in the redshift in PL energies with increasing quantum well-LT GaAs spacing can be attributed to band bending induced by the Fermi level pinning at the undoped GaAs/LT GaAs interface and a novel carrier compensation effect of LT GaAs.     

Detailed structural analysis of GaAs grown on patterned Si

The growth of GaAs on patterned Si substrates is essential for the integration of GaAs and Si devices. Moreover this growth may have to be done in wells to planarize the surfaces of the Si and GaAs devices for their interconnection. In this study, GaAs is grown by MBE on such patterned Si substrates, with window width down to 3 μm, and a complete structural characterization of the material is made by electron microscopy. In every case, SEM observations show a very good definition of the pattern by the contrast of the flat surface of the monocrystalline GaAs compared to the very rough surface of the polycrystalline GaAs. Cross-sectional observations by STEM or TEM on non-etched samples reveal that the quality of the monocrystalline GaAs is at least as good in terms of defect density as that of the standard GaAs on Si. On samples etched with a plasma to produce wells, grains often form against the Si sidewall. Chemical etching with lateral etching avoids contact of the growing GaAs with the Si sidewall and subsequent grain formation. The crystalline quality obtained on etched samples is not as good as on non etched samples. A way of preparing the wells to improve this crystalline quality is proposed.     

MOCVD growth of GaAs on Si substrates with AlGaP and strained superlattice layers

GaAs with a mirror-like surface is grown by MOCVD on an Si substrate using an AlP, AlGaP, GaP/GaAs0.5P0.5 super-lattice and GaAs0.5P0.5/GaAs superlattice as intermediate layers. The photoluminescence intensity is found to be about 56% of that of a GaAs substrate grown under the same conditions and is one order of magnitude higher than that grown on a Ge-coated Si substrate, in spite of the early stage of the experiment.     

Si衬底上MBE长成的GaAs中剩余应力起源的研究(英文)

<正> High qualities of GaAs layers directly grown on Si substrates have been obtained by MBE. The residual stress in those MBE grown GaAs layers on     

Terahertz Emission from GaAs Films on Si(100) and Si(111) Substrates Grown by Molecular Beam Epitaxy

We report on the terahertz emission from femtosecond-laser-irradiated GaAs layers grown on Si(100) and Si(111) substrates. The results show that the terahertz emission from GaAs on Si is stronger than that of a semi-insulating bulk GaAs crystal. This increase is attributed to the strain field at the GaAs/Si interface. In the GaAs of the Si(100) sample, the stronger terahertz emission is observed compared with GaAs on Si(111). Moreover, the effect of changing the doping type of the Si substrate from n-type to semi-insulating was also studied and it was found that the terahertz emission intensity of GaAs on semi-insulating Si(100) is stronger than that of GaAs on n-type Si(100). Finally, strong terahertz emission from GaAs on semi-insulating Si(100) was observed not only in the reflection geometry but also in the transmission geometry. These results hold promise for new applications of terahertz optoelectronics.     

Lateral ordering of GaAs nanowhiskers on GaAs(111)As and GaAs (110) surfaces during molecular-beam epitaxy

Possibilities of obtaining laterally ordered arrays of GaAs nanowhiskers on GaAs (110) and GaAs(111)As surfaces during the molecular beam epitaxy are considered. As in the case of the GaAs(111)As substrate, nanowhiskers are formed in the hexagonal phase on the GaAs(110) surface, which is also confirmed by the patterns of the reflection high-energy electron diffraction (obtained during the growth of nanowhiskers) and by the photoluminescence spectra.     

Preparation and properties of GaAs layers for novel f.e.t. structures

N-type GaAs/Ga0.4Al0.6As heterostructures have been grown on semi-insulating GaAs substrates using metal-organic chemical vapour deposition. The GaAs layers were mounted on insulator supports and the substrates and Ga0.4Al0.6As removed using a preferential etching procedure. The preparation and electrical properties of submicrometre thick insulator-supported n-type GaAs layers are described.     

Properties of MODFET's grown on Si substrates at DC and microwave frequencies

We report the first microwave characterization of 1-µm gate GaAs/AlGaAs modulation-doped field-effect transistors (MODFET's) grown on Si substrates by MBE. Maximum transconductances of 170 mS/mm at room temperature were obtained in structures on Si, which compares to values of 200-250 mS/mm for this type of structure on GaAs. At 77 K, no collapse was observed in these structures, and transconductances of 270 mS/mm were obtained. From microwave S-parameter measurements at room temperature, current gain cutoff frequencies of 15 GHz were obtained from these GaAs/AlGaAs MOD FET's on Si, which compares with 12-15 GHz obtained on GaAs substrates. From high-frequency equivalent circuit modeling, very little difference was observed in any of the parameters between growth on Si and on GaAs. This is significant in that it demonstrates the suitability of GaAs on Si for device applications.     

Reduction of backgating effect in MBE-Grown GaAs/AlGaAs HEMT's

We have investigated the backgating effect in high electron mobility transistors (HEMT's) fabricated on MBE-grown GaAs/AlGaAs layers, which is undesirable for LSI fabrication. Comparing five different types of devices, we related the backgating effect to the interface between the GaAs substrate and the undoped GaAs buffer layer. By using a thermally etched GaAs substrate, we successfully reduced the backgating to the same order as that of ion-implanted GaAs MESFET's.     

GaAs on Si as a substrate for microwave and millimeter-wavemonolithic integration

The authors calculated the effective dielectric constant, characteristic impedance, and dielectric loss of a shielded microstrip line manufacture on namely GaAs, Si, and GaAs/Si. Dielectronic loss versus frequency for the GaAs and Si substrates are shown. The same parameters for GaAs/Si substrate were plotted for two different resistivities of the GaAs overlay material, and for each of three different GaAs overlayer thicknesses. The measurements covered the 10-100-GHz frequency range. Depending on the thickness, results show that high-resistivity GaAs epitaxial layers on Si substrates having moderate resistivities reduce the dielectric loss     

Characterization of interface stress at InGaPAs/GaAs by cr-related luminescence line in GaAs

The interface stress at InGaPAs/GaAs heterostructure has been investigated using the energy shift and splitting of the Cr-related zero-phonon photoluminescence line at 0.839 eV observed in GaAs. It has been found that the GaAs substrate suffers both compressive uniaxial stress and tensile hydrostatic pressure at the InGaPAs/GaAs heterointerface. These shifts and splittings of the 0.839 eV line have been systematically examined as a function of the lattice mismatch between InGaPAs and GaAs, and the thicknesses of the epitaxial-layer and substrate. The amount of the interface stress existing at InGaPAs/GaAs heterostructure has been estimated, based on uniaxial stress data for GaAs: Cr wafers.     

Ion-implantation and activation behavior of Si in MBE-Grown GaAs on Si substrates for GaAs MESFET's

The suitability of MBE-grown GaAs layers on Si substrates has been studied for ion-implanted GaAs MESFET technology. The undoped as-grown GaAs layers had a carrier concentration below 10¹⁴cm^-3. Uniform Si ion implants into 4-µm-thick GaAs layers on Si were annealed at 900°C for 10 s, using a rapid-thermal-annealing (RTA) system. Both the activation and the doping profile were similar to those obtained in bulk semi-insulating GaAs under similar conditions. The SIMS profiles of Si and As atoms near the GaAs/Si heterointerface were identical before and after the RTA process, indicating negigible interdiffusion during the implant activation. Dual implants of a shallow n+ layer and an n-channel layer were used to fabricate GaAs MESFET's with a recess-gate technology. Selective oxygen ion implantation was used for device isolation. The maximum transconductance obtained was 135 mS/ mm compared to typical values of 150-180 mS/mm obtained in our laboratory on GaAs substrates in similar device structures.