硅酸铝纤维增强铝基复合材料的疲劳断裂特征

采用压力铸造法, 制得Al₂O₃?SiO₂短纤维增强的铝合金复合材料, 对其弯曲疲劳性能进行了测试, 并详细观察了疲劳裂纹的形成及扩展方式。结果表明: Al₂O₃?SiO₂f/ ZL 108复合材料存在 多种疲劳源; 疲劳裂纹的扩展是通过主裂纹与裂尖前方孔洞的相互联接而进行的, 是不连续的, 沿着纤维及渣球密集的路径扩展; 疲劳过程中主裂纹的形成消耗了大部分的疲劳寿命, 一旦主裂纹形成就快速扩展瞬间断裂。该复合材料的断裂宏观上是脆性的, 但微观上显示出塑性的特征。     

考虑界面过渡层的编织CMC裂尖混合度的研究

对于界面断裂的三维编织CMC,其断裂混合度Ψ对材料的断裂韧性影响显著。尽管由于一个不确定的参量——断裂特征长度,界面断裂混合度几乎难以确定,但是与界面断裂混合度相关的裂纹尖端断裂混合度Ψ_tip可以唯一确定。这样,就可以用裂纹尖端断裂混合度Ψ_tip研究三维编织CMC的断裂韧性。本文通过数值方法分析了倾斜角度、界面层厚度与混合度的关系,进一步研究了三维编织CMC的裂纹扩展路径对于裂尖混合度的影响,为材料断裂韧性的优化设计提供了依据。     

YAl 2P / Mg -Li -Al复合材料动态拉伸断裂过程原位观察

通过 SEM中静载动态拉伸 , 原位观察和研究了搅拌铸造法制备的 YAl _2P/ Mg-Li-Al 基复合材料裂纹的萌生及扩展机制。结果表明 , 微裂纹萌生位置主要为复合材料的铸造缺陷处、 复合材料的基体中以及颗粒/基体界面处 , 并以在复合材料基体中萌生为主。微裂纹的扩展主要在基体和 YAl ₂颗粒/基体界面处进行。主裂纹的长大方向具有选择性 , 裂纹主要沿颗粒贫化区与颗粒富集区的交界处开裂 , 主裂纹扩展到一定程度后 , 试样全面失稳而迅速断裂。基体的断裂失效在 YAl 2P/ Mg2Li2Al复合材料拉伸断裂过程中起很大作用。     

层状Ti3SiC2陶瓷的组织结构及力学性能

利用热压烧结TiH₂,Si和C粉获得了致密度大于98%的层状Ti₃SiC₂陶瓷。利用压痕法,在不同的载荷下测定了材料的维氏硬度, 发现其硬度值随载荷的增加而降低,在最大载荷30kg时,硬度值为4GPa。压痕对角线没有发现径向裂纹的出现。 这归因于多重能量吸收机制——颗粒的层裂、裂纹的扩展、颗粒的变形等。利用三点弯曲法和单边切口梁法测定了材料的强度和韧性分别为270MPa和6.8MPa·m1/2。Ti₃SiC₂材料的断口表现出明显的层状性质,大颗粒易于发生层裂和穿晶断裂,小颗粒易被拔出。当裂纹沿平行于Ti₃SiC₂基面的方向扩展造成颗粒的层裂,当裂纹沿垂直于基面的方向扩展时,裂纹穿过颗粒的同时,在颗粒内部发生偏转,使裂纹的扩展路径增加。裂纹的扩展路径类似人们根据仿生结构设计的层状复合材料。裂纹在颗粒内的多次偏转、裂纹钉扎以及颗粒的层裂和拔出等是材料韧性提高的主要原因。此外,在室温下得到的荷载-位移曲线,说明Ti₃SiC₂材料不象其它陶瓷材料的脆性断裂,而是具有金属一样的塑性。     

带半无限长界面裂纹的内界面模型

本文分析了现有内界面模型[1,3,4]在裂纹尖端邻域失效的原因,建议了一个内界面两侧位移差[u]与界面应力σ的非局部关系式(见公式(6)).特别地,对裂尖处应力具有(1/2)阶奇性的情形,以法向分量为例,导出了简单的关系式(参见§3中的公式(10)):其中d₁为某非局部特征长度,K₁为内界面常数,x为从裂尖标起的内界面线坐标.对切向分量也有类似结果,新模型保留了原有模型简洁的形式,且在远离裂尖处退化为原有模型.     

单晶γ-TiAl合金中裂纹沿[111]晶向扩展的分子动力学研究

为了从微观角度探索γ-TiAl合金中特定晶向的裂纹扩展机理,研究了γ-TiAl合金中[111]晶向微裂纹扩展的过程及其断裂机理。首先在单晶γ-TiAl合金中预置[111]晶向的微裂纹,然后通过分子动力学方法模拟该裂纹的扩展过程,最终分析了裂尖原子组态变化、微裂纹扩展路径以及应力-应变情况。研究表明,该晶向的微裂纹不是沿直线扩展,而是启裂时裂尖发生偏转,表现出明显的取向效应;微裂纹以裂尖发射滑移位错以及裂尖上形成孪晶的方式进行扩展;受边界的影响,微裂纹扩展到一定阶段会在边界位错堆积处萌生子裂纹,且扩展机制与主裂纹类似;在两个裂纹尖端发射滑移位错的相互作用下,在主裂尖前端再次萌生子裂纹,最终主、子裂纹相连导致断裂;微裂纹扩展过程中的应力分布主要集中于裂尖和扩展过程中形成的孪晶面上,并且随着微裂纹的扩展,裂尖应力值随时间的增大而减小。     

复合材料中增强粒子与基体中微观应力和残余应力分析

按球对称模型对粒子增强复合材料中热膨胀差(DCTE)热应力和残余应力进行了弹-塑性分析。结果表明,热应力或残余应力具有短程分布特点;粒子内部为常水静应力,界面和基体中径向应力与粒子内部同号,切向和周向应力与径向应力符号相反。存在一个基体发生初始屈服的临界温差t_P,屈服范围随温差|t|而扩大。单程变温产生的残余应力与热应力完全相同;经过一个热循环后,若温差小于t_P则残余应力为零;若大于t_P,则在粒于和基体中产生残余应力。讨论了粒子形状和尺寸对残余应力和基体塑性变形对复合材料性能的影响。     

Al2O3短纤维/Al-12Si复合材料启裂特征的TEM原位观察研究

利用挤压铸造法制备了Al₂O₃(15%)/Al-12Si复合材料,并采用透射电镜动态拉伸技术对复合材料的裂纹形成及微观断裂过程进行了原位观察,发现该复合材料的纤维/基体界面是破坏路径之一,并发现了纤维中裂纹形成及扩展至完全破坏的现象.     

铁素体管线钢的分层裂纹及其对断裂的影响

通过对针状铁素体管线钢缺口根部三维应力状态的有限元分析和不同形式的断裂实验,研究了管线钢分层裂纹产生的条件及其对断裂性能的影响.结果表明裂纹或缺口根部的三维应力状态是产生分层裂纹的必要条件,材料的强度分布影响分层裂纹的形式和方向.分层裂纹均为主裂纹扩展前材料中的弱界面在垂直该弱界面的拉应力作用下产生的,其数量和方向受裂纹端部三维应力场和材料的强度分布状态控制.分层裂纹面上的应力为零,分层裂纹有一定的间距.在断裂过程中产生的分层裂纹使裂纹或缺口根部的构形发生改变,从而对裂尖的应力状态和材料的断裂性能产生巨大的影响.穿透裂纹体的分层裂纹使其有效厚度减小,表面裂纹体的分层裂纹与裂纹扩展方向垂直.在断裂过程中产生分层裂纹需要消耗更多的能量、降低裂端三维应力约束、有效厚度降低或裂尖钝化.这些因素均使断裂扩展更加困难,而使材料韧性得到提高.     

NiCr/ZrO2功能梯度复合材料中混合型准静态裂纹启裂的数字散斑相关方法实验研究

采用粉末冶金方法制备出NiCr/ZrO₂功能梯度材料FGMs。通过2种断裂试件研究了材料梯度对混合型断裂行为的影响(FGM-A试件,裂纹位于试件的弹性模量较大一侧;FGM-B试件,裂纹位于试件的弹性模量较小一侧)。对2种断裂试件在非对称载荷下进行准静态断裂实验,并利用数字散斑相关方法测得Ⅰ、Ⅱ型应力强度因子。结果表明：FGM-A的裂纹的开裂角小于FGM-B的开裂角;FGM-A的弹性梯度对静态裂纹有保护作用;弹性模量的梯度变化和裂尖局部材料的断裂韧性会影响混合型裂纹的启裂。     

Debonding of a thin rubberised and fibre-reinforced cement-based repairs: Analytical and experimental study

An analytical approach for the prediction of debonding initiation between a rubberised cement-based overlay and old concrete substrate under monotonous mechanical loading was applied. Based on the linear elastic fracture mechanics, a model has been developed taking into account the interlocking between two crack surfaces in the overlay. Assuming that the debonding initiation just occurs after the crack cutting the overlay layer reaches the overlay–substrate interface, the stress intensity factor of the debonding tip can be calculated, allowing prediction of stress fields near the interface debonding tip. Then with a criterion of debonding initiation and propagation depending on the interface tensile strength, the load associated could be determined and might be interesting for the design of thin bonded cement-based overlays. The adequateness of this analytical approach was verified by both experimental data and finite element calculations. It has been used to show the relevance of a cement-based material with low modulus of elasticity combined with a high residual post crack strength to achieve sustainable repairs.     

Effect of residual stress on delamination from interface edge between nano-films

The focus in this study is on the effect of residual stress on the delamination crack initiation from the interface edge between thin films, Cu/TiN, where the stress is intensified by the free edge effect. The delamination tests, where the mechanical stress is applied on the interface, show that the specimen with the thinner Cu film has an apparently higher strength at the interface edge. The residual stress in the films is then evaluated by curvature measurement of film/substrate coupon and the influence on the delamination is analyzed. The residual stress increases with the increase of film thickness and remarkably intensifies the stress near the edge. By superimposing the contributions of the applied load and the residual stress, a good agreement is obtained in the normal stress intensity near the interface edge at the delamination independent of the Cu thickness. This signifies that the combination of intensified stresses due to the applied load and the residual stress governs the crack initiation at the interface edge, and the toughness at the interface edge is evaluated by the stress intensity factor on the basis of the fracture mechanics concept.     

A Zener–Stroh crack at the interface of a thin film bonded to a substrate

A Zener–Stroh crack can nucleate at the interface of a multi-layered structure when a dislocation pileup is stopped by the interface which works as an obstacle. During the entire fracture procedure of a crack, Zener–Stroh crack mechanism controls the initial stage, or the first phase of crack initiation and propagation. In our current research, stress investigation on a Zener–Stroh crack initiated at the interface of a thin film bonded to a half plane substrate has been carried out. With the application of dislocation-based fracture mechanics, the micro crack is simulated by the distributed dislocations along the crack line. To eliminate the contradictory oscillation phenomenon for the stress field near the interfacial crack tip, a contact zone behind the crack tip is introduced. The physical problem is thus formulated into a set of non-linear singular integral equations. Through careful examination of the crack singularities at the crack tips for different configurations, the formulated integral equations are solved with numerical methods developed in our research. The contact zone length, the stress fields near the crack tip and the stress intensity factors of the crack are evaluated accordingly. Numerical examples based on practical engineering structures are provided to discuss the influence of the key parameters, such as the thickness of the film, and the Dundurs constants, on the fracture behaviour of the crack.     

Delamination of thin bonded cement-based overlays: analytical analysis

This paper deals with an analytical approach for the prediction of debonding initiation between cement-based overlay and old concrete substrate under monotonous mechanical loading. Based on the linear elastic fracture mechanics, an available analytical model has been used. The calculations take into account the interlocking between two crack surfaces in the overlay. To validate the model, three point static bending tests on composite specimens were carried out. Assuming that the debonding initiation just occurs after the crack cutting the overlay layer reaches the overlay–substrate interface, the stress intensity factor of the debonding tip can be calculated, allowing prediction of stress fields near the interface debonding tip. Then with a criterion of debonding initiation and propagation depending on the interface tensile strength, the load associated could be determined and might be interesting for the design of thin bonded cement-based overlays. The adequateness of this analytical approach was verified by both experimental data and finite element calculations.     

锌漆薄膜/2Cr13钢基体系统薄膜裂纹试验与模拟

本文采用试验和数值模拟方法研究锌漆薄膜/2Cr13钢基体系统薄膜开裂和裂纹扩展情况。创新性地使用三点弯曲试验结合声发射技术监测到薄膜裂纹萌生时刻,并计算薄膜断裂韧性。采用扩展有限元法研究三点弯曲作用下薄膜裂纹扩展过程,发现模拟得到的荷载-位移曲线与试验曲线相吻合。模拟结果表明,薄膜裂纹尖端区域存在应力峰值,当该值达到损伤判据临界应力时,裂纹发生扩展。同时,对多种因素影响下薄膜周期裂纹无量纲能量释放率进行分析,发现薄膜厚度一定时,薄膜相对于基体刚度越大,半无限基体上薄膜裂纹前缘达到稳定状态时对应的基体厚度与裂纹间距越大。      

Crack patterns in brittle thin films

The physical system studied is a brittle elastic film bonded to an elastic substrate with different elastic properties; a residual tensile stress is presumed to exist in the film. The focus of the study is the influence of the mismatch in elastic properties on patterns of crack formation in the film. The stress intensity factor and crack driving force for growth of a periodic array of cracks in the direction normal to the interface under two-dimensional conditions are determined for any crack depth and any mismatch in elastic parameters. It is found that, even for a relatively stiff film material, the stress intensity factor of each crack as a function of crack depth exhibits a local maximum. The driving force for crack extension in the direction parallel to the interface is then determined on the basis of these two-dimensional results, and the equilibrium spacing of crack arrays is estimated for given residual stress. The results of the calculations are used as a basis for qualitative arguments to explain the crack patterns which have been observed in GaN films on Si substrates.     

Crack patterns in brittle thin films

The physical system studied is a brittle elastic film bonded to an elastic substrate with different elastic properties; a residual tensile stress is presumed to exist in the film. The focus of the study is the influence of the mismatch in elastic properties on patterns of crack formation in the film. The stress intensity factor and crack driving force for growth of a periodic array of cracks in the direction normal to the interface under two-dimensional conditions are determined for any crack depth and any mismatch in elastic parameters. It is found that, even for a relatively stiff film material, the stress intensity factor of each crack as a function of crack depth exhibits a local maximum. The driving force for crack extension in the direction parallel to the interface is then determined on the basis of these two-dimensional results, and the equilibrium spacing of crack arrays is estimated for given residual stress. The results of the calculations are used as a basis for qualitative arguments to explain the crack patterns which have been observed in GaN films on Si substrates.     

Hybrid spectral/finite element analysis of dynamic delamination of patterned thin films

A combined spectral and finite element analysis is performed to investigate the dynamic edge delamination of patterned thin films from a substrate. The analysis is motivated by an emerging experimental technique in which high-amplitude laser-induced stress waves initiate progressive interfacial debonding of thin film interfaces. The numerical method relies on the spectral representation of the elastodynamic solutions for the substrate and the finite element model for the thin film. A cohesive model is introduced along the interface of the bimaterial system to capture the decohesion process. The important role of the film inertia on the crack extension and the appearance of the mixed-mode failure are demonstrated by observing the traction stress evolution at various points along the bond line. Parametric studies on the effect of film thickness, interface fracture toughness, loading pulse shape and amplitude on the debonding process are performed. A semi-analytical investigation on the inertial effect is carried out to predict the final crack length as a function of the film thickness and pulse amplitude.     

Interfacial crack propagation in a thin viscoelastic film bonded to an elastic substrate

Edge decohesion along the interface of a thin viscoelastic film bonded to an elastic substrate under tensile residual stresses is considered. The tensile residual stress in the film is replaced by a combination of edge loads, and an explicit relation of strain energy with respect to time is obtained through simple beam analysis. The strain energy function is discretized into time steps which are assumed to be very small so that the dissipation effects over the time steps can be neglected. The energy release rate is then calculated using a Griffith type energy balance. An analytical model is developed to predict the crack growth and its velocity. Extent of crack growth along the interface is prediced based on a fracture criteria. The analytical predictions are compared with results from a viscoelastic finite element analysis.     

Effect of residual stress on cleavage fracture toughness by using cohesive zone model

This study presents the effect of residual stresses on cleavage fracture toughness by using the cohesive zone model under mode I, plane stain conditions. Modified boundary layer simulations were performed with the remote boundary conditions governed by the elastic K‐field and T‐stress. The eigenstrain method was used to introduce residual stresses into the finite element model. A layer of cohesive elements was deployed ahead of the crack tip to simulate the fracture process zone. A bilinear traction–separation‐law was used to characterize the behaviour of the cohesive elements. It was assumed that the initiation of the crack occurs when the opening stress drops to zero at the first integration point of the first cohesive element ahead of the crack tip. Results show that tensile residual stresses can decrease the cleavage fracture toughness significantly. The effect of the weld zone size on cleavage fracture toughness was also investigated, and it has been found that the initiation toughness is the linear function of the size of the geometrically similar weld. Results also show that the effect of the residual stress is stronger for negative T‐stress while its effect is relatively smaller for positive T‐stress. The influence of damage parameters and material hardening was also studied.