Novel positive‐working aqueous‐base developable photosensitive polyimide precursors based on diazonaphthoquinone‐capped polyamic esters

Novel positive‐working aqueous‐base developable photosensitive polyimide (PSPI) precursors based on partially diazonaphthoquinone (DNQ)‐capped polyamic esters bearing phenolic hydroxyl groups and a DNQ photosensitive compound (PIC‐3) were developed. The partially DNQ capped polyamic esters were prepared from an esterification reaction of 1,2‐naphthoquinone diazide‐5‐sulfonyl chloride with the polyamic esters. The partially DNQ capped polyamic esters decreased the dark film loss effectively in the aqueous‐base developer and were able to make thicker film resists compared to the uncapped polyamic esters. The 25 mol % DNQ‐capped BisAPAF–PMDA polyamic ester and BisAPAF–ODPA polyamic ester containing 25 wt % PIC‐3 photosensitive compound showed a sensitivity of 176 and 185 mJ/cm², and a contrast of 1.68 and 1.02, respectively, in a 3‐μm film with 1.25 wt % tetramethylammonium hydroxide developer. A pattern with a resolution of 5 μm was obtained from both PSPI precursor compositions. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 2293–2300, 2003     

A novel synthesis method for the preparation of aromatic poly(imide benzoxazole) from trimellitic anhydride chloride and bis(o‐aminophenol)

A poly(imide benzoxazole) was prepared directly from trimellitic anhydride chloride and 2,2‐bis(3‐amino‐4‐hydroxyphenyl)hexafluoropropane (BisAPAF) monomers in a two‐step method. In the first step, a poly(hydroxyamide amic acid) precursor was synthesized by the low‐temperature solution polymerization in an organic solvent. Subsequently, thermal cyclodehydration of the poly(hydroxyamide amic acid) precursor at 350°C produced the corresponding poly(imide benzoxazole). The inherent viscosity of the precursor polymer was 0.22 dL/g. The cyclized poly(imide benzoxazole) showed a glass transition temperature (T_g) at 329°C and a 5% weight loss temperature at 530°C in nitrogen and at 525°C in air. The poly(imide benzoxazole) is amorphous as evidenced by the wide‐angle X‐ray diffraction measurement. The structures of the precursor polymer and the fully cyclized polymer were characterized by Fourier transform infrared (FTIR) and proton nuclear magnetic resonance spectroscopy (¹H NMR). © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 88: 2388–2391, 2003     

Synthesis of poly(propylene glycol)‐grafted polyimide precursors and preparation of nanoporous polyimides

A novel approach to prepare a polyimide nanofoam was explored by using a polyimide precursor grafted with a labile poly(propylene glycol) (PPG) oligomer. The PPG‐grafted polyimide precursor, poly((amic acid)‐co‐(amic ester)), was synthesized via partial esterification of poly(amic acid) derived from pyromellitic dianhydride (PMDA) and 4,4′‐oxydianiline (ODA) with bromo‐terminated poly(propylene glycol) in the presence of K₂CO₃ in hexamethylphosphoramide and N‐methylpyrrolidone. The precursor polymer film was spin‐coated onto a glass substrate, then imidized at 200 °C under nitrogen, and subsequently the PPG graft was decomposed by heating the film at 300 °C for 9 h in air, resulting in the PMDA/ODA polyimide nanofoam. The precursor polymers, polyimides and foamed polyimides were characterized by a variety of techniques including ¹H‐NMR spectroscopy, Fourier‐transform infrared (FT‐IR) spectroscopy, differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The homogeneously distributed nano‐sized pores of 20–40 nm were observed by transmission electron microscopy (TEM) of the foamed polyimide. Copyright © 2004 Society of Chemical Industry     

Positive‐working aqueous base developable photosensitive polybenzoxazole precursor/organoclay nanocomposites

Positive‐working aqueous base developable photosensitive polybenzoxazole (PBO) precursor/organoclay nanocomposites have been prepared through the addition of an organoclay to a PBO precursor. The organoclay was formed by a cation exchange reaction between a Na⁺‐montmorillonite clay and an ammonium salt of dodecylamine. The PBO precursor used in this study was a polyhydroxyamide that was prepared from a low‐temperature polymerization of 2′2′‐bis(3‐amino‐4‐hydroxyphenyl) hexafluoropropane and 4,4′‐oxydibenzoyl chloride with an inherent viscosity of 0.3 dL/g. The photosensitive resin/clay formulations were prepared from the precursor with 2,3,4‐tris(1‐oxo‐2‐diazonaphthoquinone‐5‐sulfonyloxy)‐benzophenone photosensitive compound and 3–5 wt % organoclay. The PBO precursor/clay was subsequently thermally cured to PBO/clay at 350°C. Both X‐ray diffraction and transmission electron microscope analyses showed that the organoclay was dispersed in the PBO matrix in a nanometer scale. The thermal expansion coefficient of PBO/clay film, which contained 5 wt % organoclay, was decreased 33% compared to the pure PBO film. The PBO/clay nanocomposite films also displayed higher thermal stability, glass transition temperature, and water resistance than the pure PBO film. The photosensitive PBO precursor/clay nanocomposite showed a line/space pattern with a resolution of 5 μm and its sensitivity and contrast were not affected by the organoclay. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 97: 2350–2356, 2005     

Preparation of Fully Imidized Hyperbranched Photosensitive Polyimide with Excellent Organosolubility and Thermal Property Based on 4,4'-(Hexafluoroisopropylidene) Diphthalic Anhydride (A<Subscript>2</Subscript>) and 1,3,5-Tris(4-aminophenoxy)benzene (B<Subscript>3</Subscript>)

Summary A negative-tone hyperbranched photosensitive polyimide (HB-PSPI) based on a new triamine, 1,3,5-tris(4-aminophenoxy)benzene (TAPOB), and 4,4'-(hexafluoroisopropy1idene)diphthalic anhydride (6FDA) was synthesized. The photosensitive cinnamate groups were incorporated at the periphery of thepolymer by the reaction of cinnamoyl chloride with the terminal phenol groups of the fully imidized hyperbranched polyimide, which was obtained via the end group modification of the anhydride-terminated hyperbranched poly(amic acid) precursor. The polymer showed good thermal property with 10 wt % loss temperature at 517 °C, and exhibited excellent organosolubility even in acetone and 1,1,2-trichloroethane. Photolithographic property of the polymer was examined by UV exposure. SEM analysis revealed that highly resolved patterns with a line width of 10 pm were obtained; and well-defined line as thin as 3pm in width could be patterned, though the line edges were jagged and rounded due to the broad molecular weight distribution. Received: 8 August 2002/Revised version: 10 October 2002/ Accepted: 26 November 2002 Correspondence to Jie Yin     

A novel positive‐type photosensitive polyimide based on soluble block copolyimide showing low dielectric constant with a low‐temperature curing process

A soluble block copolyimide (Bco‐PI) was prepared by direct one‐pot polycondensation of 2,2‐bis‐(3‐amino‐4‐hydroxyphenyl)hexafluoropropane, 2,2‐bis[4‐(4‐aminophenoxy)phenyl]hexafluoropropane, and cyclohexane‐tetracarboxylic dianhydride in the presence of γ‐valerolactone and a pyridine catalyst system using γ‐butyrolactone as the solvent. The thermal transmission temperature (T_g) of Bco‐PI was 282°C. By having the curing process occur at 250°C, which was below the T_g, colorless and transparent films could be obtained. The film showed excellent optical characteristics. Such properties could not be attained by the conventional high‐temperature thermal imidization process of poly(amic acid). The hydroxy groups in the polyimide backbone gave the Bco‐PI the potential to become alkaline. To the Bco‐PI was added 15 wt % ester of 2,3,4‐trihydroxybenzophenone with 1,2‐naphthoquinone‐(2) diazide‐5‐sulfonic acid (NT200) as the photoreactive compound. The system worked as a positive‐type photosensitive polyimide (PSPI). The sensitivity and contrast of the PSPI system were 220 mJ/cm² and 1.27, respectively, when exposed to UV light, followed by development with a 5% tetramethylammonium hydroxide (TMAH) aqueous solution at room temperature. After curing at 250°C for 1 h, the average refractive index of Bco‐PI with and without NT200 was 1.5543 and 1.5563, and the optically estimated dielectric constant of the polyimides was 2.66 and 2.67, respectively. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 4240–4246, 2006     

Synthesis and characterization of poly(acrylate amic acid) and its application as negative‐tone photosensitive polyimides

The dianhydride monomer 3,3′,4,4′‐benzophenone tetracarboxylic acid dianhydride and two diamine monomers, 4,4′‐diamino‐3,3′‐biphenyldiol (HAB) and 2,4‐diaminophenol dihydrochloride (DAP), were used to synthesize a series of poly(hydroxyl amic acid). Further functionalization by grafting acrylate groups yields the corresponding poly(acrylate amic acid) that underwent a crosslinking reaction on exposure to UV‐light and was used as a negative‐tone photosensitive polyimide (PSPI). The analysis of chemical composition and molecular weight of these poly(amic acid)s determined by nuclear magnetic resonance (NMR) spectroscopy, Fourier transform infrared spectroscopy, and gel permeation chromatography revealed that the molecular weight of the poly(hydroxyl amic acid) increased with the molar content of HAB in the feedstock, because HAB exhibited higher polymerization reactivity than DAP. Moreover, the degree of grafting acrylate groups onto poly(hydroxyl amic acid) was determined by ¹H‐NMR spectroscopy. The photoresist was formulated by adding 2‐benzyl‐2‐N,N‐dimethylamino‐1‐(4‐morpholinophenyl) butanone (IRG369) and isopropylthioxanthone as a photoinitiator, tetra(ethylene glycol) diacrylate as a crosslinker, and tribromomethyl phenyl sulfone as a photosensitizer. The PSPI precursor exhibited a photosensitivity of 200 mJ/cm² and a contrast of 1.78. A pattern with a resolution of 10 μm was observed in an optical micrograph after thermal imidization at 300°C. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Silver–polyimide nanocomposite membranes: Macromolecular‐matrix‐mediated metallization of an aromatic,fluorinated polyimide yielding highly reflective films at low metal concentrations

Highly reflective, surface‐metalized, flexible polyimide films were prepared by the incorporation of a soluble silver‐ion complex, (hexafluoroacetylacetonato)silver(I) (AgHFA), into dimethylacetamide solutions of poly(amic acid) prepared from 2,2‐bis(3,4‐dicarboxyphenyl)hexafluoropropane dianhydride and 2,2‐bis[4‐(4‐aminophenoxy)phenyl]hexafluoropropane. The thermal curing of solution‐cast silver(I)–poly(amic acid) films to 300°C led to cycloimidization of the amic acid with concomitant silver(I) reduction and the formation of a reflective, air‐side‐silvered surface at very low (2 wt % and 0.3 vol %) silver concentrations. The reflective surface evolved only when the cure temperature reached about 275°C, although X‐ray diffraction showed metallic silver in the hybrid film by 200°C. After a maximum specular reflectivity greater than 80% was achieved for the 2 wt % silver film, the specular reflectivity diminished sharply with further heating at a constant temperature of 300°C. Incorporating the AgHFA complex into the soluble, fully imidized form of poly{(1,3‐dihydro‐1,3‐dioxo‐2H‐isoindole‐2,5‐diyl)[2,2,2‐trifluoro‐1‐(trifluoromethyl)ethylidene](1,3‐dihydro‐1,3‐dioxo‐2H‐isoindole‐5,2‐diyl)‐1,4‐phenyleneoxy‐1,4‐phenylene[2,2,2‐trifluoro‐1‐(trifluoromethyl)ethylidene]‐1,4‐phenyleneoxy‐1,4‐phenylene} gave films that were 25% less reflective than those beginning with poly(amic acid). Though highly reflective, the films were not electrically conductive. The metalized membranes were thermally stable and maintained mechanical properties similar to those of the parent polyimide. Transmission electron microscopy revealed an air‐side, near‐surface layer of silver that was about 40 nm thick; the interior of the film had well‐dispersed metal particles with diameters mostly less than 2 nm. The near‐surface silver layer maintained its integrity because of physical entrapment of the metal nanoparticles beneath a thin layer of polyimide; that is, the practical adhesion of the metal layer was good. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 2409–2418, 2007     

Synthesis and properties of new aromatic polyimides containing redox‐active anthraquinone moieties

A novel anthraquinone‐containing bis(ether amine) monomer, 2,6‐bis(4‐aminophenoxy)anthraquinone, was synthesized from readily available reagents. A series of novel aromatic polyimides were prepared from the newly synthesized diamine monomer with various aromatic tetracarboxylic dianhydrides. The intermediate poly(amic acid)s had inherent viscosities of 0.67–1.12 dL g^?1, and those derived from less stiff dianhydrides could be solution‐cast and thermally cyclodehydrated into flexible and tough polyimide films. The polyimides exhibited glass transition temperatures between 270 and 297 °C, and they were fairly stable up to a temperature of 500 °C in air or nitrogen. The electrochemical and electrochromic properties of one of the polyimides were investigated. The polymer could undergo two reversible steps of electrochemical reduction, with a color change from a colorless neutral state to pink and rose‐red reduced states. © 2012 Society of Chemical Industry     

A novel positive‐type photosensitive polyimide having excellent transparency based on soluble block copolyimide with hydroxyl group and diazonaphthoquintone

A novel positive‐type photosensitive polyimide having excellent transparency based on soluble block copolyimide (Bco‐PI) with hydroxyl group and diazonaphthoquinone (DNQ) as a photoreactive compound was developed. The base Bco‐PI A was prepared by a direct one‐pot polycondensation of cyclohexanetetracarboxylic dianhydride (H‐PMDA), 2,2‐bis(3‐amino‐4‐hydroxyphenylhexafluoropropane) (Bis‐AP‐AF), and bis(4‐(3‐aminophenoxy)phenyl)sulfone (m‐BAPS) in the presence of a γ‐valerolactone and pyridine catalyst system by using dipolar aprotic solvent such as N‐methyl‐2‐pyrrolidone (NMP).The wholly aromatic polyimides have strong absorptions in the visible regions, because of their change–transfer complex formation. On the other hand, alicyclic dianhydride, H‐PMDA, contributed to the resulting Bco‐PI film with colorlessness and transparency, which are the important factors for a photosensitive polyimide. Photosensitive Bco‐PI, containing 20 wt % 1,2‐naphthoqiunonediazide‐5‐sulfonic acid p‐cresol ester (PC5), showed a sensitivity of 250 mJ/cm² and a contrast of 2.56 when it was exposed to UV light, followed by development with 5% tetramethylammonium hydroxide (TMAH) aqueous solution at room temperature. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 96: 1619–1624, 2005     

Preparation and properties of thermally conductive photosensitive polyimide/boron nitride nanocomposites

A new thermally conductive photoresist was developed. It was based on a dispersion of boron nitride (BN) nanoflakes in a negative‐tone photosensitive polyimide (PSPI) precursor. 3‐Mercaptopropionic acid was used as the surfactant to modify the BN nanoflake surface for the dispersion of BN nanoflakes in the polymer. The thermal conductivity of the composite films increased with increasing BN fraction. The thermal conductivity of the PSPI/BN nanocomposite was up to 0.47 W m⁻¹ K⁻¹ for a mixture containing 30 wt % nanosized BN filler in the polyimide matrix. Patterns with a resolution of 30 μm were obtained from the PSPI/BN nanocomposites. The PSPI/BN nanocomposites had excellent thermal properties. Their glass‐transition temperatures were above 360°C, and the thermal decomposition temperatures were over 460°C. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Preparation and characterization of poly(silyl ester)s containing 2,2‐bis(p‐dimethylsiloxy‐phenyl)propane units in the polymer backbones

The two poly(silyl ester)s containing 2,2‐bis(p‐dimethylsiloxy‐phenyl)propane units in the polymer backbones have been prepared via polycondensation reaction of di‐tert‐butyl adipate and di‐tert‐butyl fumarate with 2,2‐bis(p‐chloro dimethylsiloxy‐phenyl)propane to give tert‐butyl chloride as the condensate. The polymerizations were performed under nitrogen at 110°C for 24 h without addition of solvents and catalysts to obtain the poly(silyl ester)s with weight average molecular weights typically ranging from 5000 to 10,000 g/mol. Characterization of the poly(silyl ester)s included ¹H NMR and ¹³C NMR spectroscopies, infrared spectroscopy, ultraviolet spectroscopy, differential scanning calorimetry, thermogravimetric analysis (TGA), gel permeation chromatography, and Ubbelohde viscometer. The glass transition temperatures (T_g) of the obtained polymers were above zero because of the introducing 2,2‐bis(p‐dimethylsiloxy‐phenyl)propane units in the polymer backbones. The TGA/DTG results showed that the obtained poly(silyl ester)s were stable up to 180°C and the residual weight percent at 800°C were 18 and 9%, respectively. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 1937–1942, 2006     

Phosphorus‐containing poly(ester‐imide)–polydimethylsiloxane copolymers

New phosphorus‐containing poly(ester‐imide)‐polydimethylsiloxane copolymers were prepared by solution polycondensation of 1,4‐[2‐(6‐oxido‐6H‐dibenz < c,e > < 1, 2 > oxaphosphorin‐6‐yl)]naphthalene‐bis(trimellitate) dianhydride with a mixture of an aromatic diamine (1,3‐bis(4‐aminophenoxy)benzene) and α,ω‐bis(3‐aminopropyl)oligodimethylsiloxane of controlled molecular weight, in various ratios. Poly(amic acid) intermediates were converted quantitatively to the corresponding polyimide structures using a solution imidization procedure. The polymers are easily soluble in polar organic solvents, such as N‐methyl‐2‐pyrrolidone and N,N‐dimethylformamide, as well as in less polar solvents such as tetrahydrofuran. They show good thermal stability, the decomposition temperature being above 370 °C. The glass transition temperatures are in the range 165–216 °C. Solutions of the polymers in N‐methyl‐2‐pyrrolidone exhibit photoluminescence in the blue region. Copyright © 2010 Society of Chemical Industry     

Novel positive‐type photosensitive polyimide with low dielectric constant

A novel positive‐type photosensitive polyimide (PSPI) with a low dielectric constant was developed. The PSPI system was composed of soluble block PI (Bco‐PI) with a hydroxy group and diazonaphthoquinone as a photoreactive compound. The base Bco‐PI was prepared by a direct one‐pot polycondensation of 2,2‐bis(3‐amino‐4‐hydroxy‐phenylhexafluoropropane), 2,2‐bis[4‐(4‐aminophenoxy)phenyl]hexafluoropropane, and cyclohexanetetracarboxylic dianhydride in the presence of a γ‐valerolactone and pyridine catalyst system using N‐methyl‐2‐pyrrolidone as the solvent. The film of Bco‐PI was colorless and transparent, both important factors for a PSPI. Photosensitive soluble block PI (Bco‐PI), containing 20 wt % ester of 2,3,4‐trihydroxybenzophenone with 1,2‐naphthoquinone‐(2)‐diazide‐5‐sulfonic acid (NT200), showed a sensitivity of 350 mJ/cm² and a contrast of 1.20 when it was exposed to UV light, followed by development with 5% tetramethylammonium hydroxide aqueous solution at room temperature. The estimated optical dielectric constants of the PIs with and without NT200 were 2.68 and 2.75, respectively. These values were significantly lower than those of conventional aromatic PIs, such as Kapton film (50EN). © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 98: 15–21, 2005     

Water‐sorption behavior of P‐phenylene diamine–based polyimide thin films

Four different p‐PDA–based polyimide thin films were prepared from their respective poly(amic acid)s through thermal imidization at 400°C: poly(p‐phenylene pyromellitimide) (PMDA‐PDA); poly(p‐phenylene biphenyltetra carboximide) (BPDA‐PDA); poly(p‐phenylene 3,3′,4,4′‐oxydiphthalimide) (ODPA‐PDA); and poly(p‐phenylene 4,4′‐hexafluoroisopropylidene diphthalimide) (6FDA‐PDA). Water‐sorption behaviors of polyimide films were gravimetrically investigated at 25°C and 22–100% relative humidity by using the modified electromicrobalance (Thin Film Diffusion Analyzer). The diffusion coefficients of water for the polyimides varies in the range of 1.6 to 10.5 × 10⁻¹⁰ cm²/s, and are in the increasing order: BPDA‐PDA < PMDA‐PDA ∼ ODPA‐PDA < 6FDA‐PDA. The water uptakes of polyimides vary from 1.46 to 5.80 wt %, and are in the increasing order: BPDA‐PDA < ODPA‐PDA < 6FDA‐PDA < PMDA‐PDA. The water‐sorption behaviors for the p‐PDA–based polyimides are closely related to the morphological structure; specifically, the diffusion coefficients in p‐PDA–based polyimide thin films are closely related to the in‐plane orientation and mean intermolecular distance, whereas the water uptakes are affected by the packing order. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 76: 1315–1323, 2000     

Synthesis,spectral, and thermal characterization of photosensitive poly(ether–ester)s containing α,β‐unsaturated ketone moieties in the main chain derived from 2,6‐bis[4‐(3‐hydroxypropyloxy)‐3‐methoxybenzylidene]cyclohexanone

A series of photosensitive poly(ether–ester)s containing α,β‐unsaturated ketone moieties in the main chain were synthesized from 2,6‐bis[4‐(3‐hydroxypropyloxy)‐3‐methoxybenzylidene]cyclohexanone (BHPMBCH) and aliphatic and aromatic diacid chlorides. The diol precursor, BHPMBCH, was synthesized from 2,6‐bis(4‐hydroxy‐3‐methoxybenzylidene)cyclohexanone and 3‐bromo‐1‐propanol. The solubility of the polymers was tested in various solvents. The intrinsic viscosity of the synthesized polymers, determined by an Oswald viscometer, was found to be 0.06–0.80 g/dL. The molecular structures of the monomer and polymers were confirmed by Fourier transform infrared, ultraviolet–visible, ¹H‐NMR, and ¹³C‐NMR spectral analyses. The thermal properties were studied with thermogravimetric analysis and differential scanning calorimetry. The thermogravimetric analysis data revealed that the polymers were stable up to 220°C and started degrading thereafter. The thermal stability initially increased with increasing spacer length and then decreased due to negative effects of the spacer. The self‐extinguishing properties of the synthesized polymers were studied by the determination of the limiting oxygen index values with Van Krevelen's equation. In addition, the photocrosslinking properties of the polymer chain were studied with UV spectroscopy, and we observed that the rate of photocrosslinking increased significantly with increasing methylene carbon chain length of the acid spacer. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Adhesion property of novel polyimides with 1‐[3′,5′‐bis(trifluoromethyl)phenyl] pyromellitic dianhydride

Novel polyimides were synthesized from 1‐[3′,5′‐bis(trifluoromethyl)phenyl] pyromellitic dianhydride (6FPPMDA) by a conventional two‐step process: the preparation of poly(amic acid) followed by solution imidization via refluxing in p‐chlorophenol. The diamines used for polyimide synthesis included bis(3‐aminophenyl)‐3,5‐bis(trifluoromethyl)phenyl phosphine oxide, bis(3‐aminophenyl)‐4‐trifluoromethylphenyl phosphine oxide, and bis(3‐aminophenyl)phenyl phosphine oxide. The synthesized polyimides were designed to have a molecular weight of 20,000 g/mol by off‐stoichiometry and were characterized by Fourier transform infrared, NMR, differential scanning calorimetry, and thermogravimetric analysis. In addition, their intrinsic viscosity, solubility, water absorption, and coefficient of thermal expansion (CTE) were also measured. The adhesion properties of the polyimides were evaluated via a T‐peel test with bare and silane/Cr‐coated Cu foils, and the failure surfaces were investigated with scanning electron microscopy. The 6FPPMDA‐based polyimides exhibited high glass‐transition temperatures (280–299°C), good thermal stability (>530°C in air), low water absorption (1.46–2.16 wt %), and fairly low CTEs (32–40 ppm/°C), in addition to good adhesion properties (83–88 g/mm) with silane/Cr‐coated Cu foils. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 96: 1801–1809, 2005     

High-performance polymer films. III. Preparation and characterization

A series of polyimide and copolyimide films were prepared by film casting, drying, and thermal imidization from the respective precursor poly(amic acid) (PAA) and copoly(amic acid) solutions derived from two dianhydrides, pyromellitic dianhydride (PMDA) and 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), and two diamines, 4,4′-oxydianiline (ODA) and a proprietary aromatic diamine (PD) as monomers. Depending on the solution's inherent viscosity value (molecular weight) and the nature of the polymer chains (derived from rigid or flexible monomers), precursor poly(amic acid) and copoly(amic acid) solution concentrations of 8–12% (w/w) were found to be suitable for the preparation of good quality polyimide/copolyimide films. The recovery of film toughness and creasability from the brittleness at the intermediate temperature of the cure cycle depended not only on the molecular weight of the precursor poly(amic acids)/copoly(amic acids) but also on their chain flexibility. The poly(amic acid) derived from both rigid dianhydride and diamine practically gave rise to a brittle film of polyimide even after curing to 360°C. The resulting polyimide and copolyimide films were compared with Du Pont's Kapton H film. The density of the films was in the range 1.39–1.42 g/cm³. The thickness of most of the films was in the range 20–30 μm. The HPF 3 film, based on PMDA–PD, appeared to be highly colored (reddish brown), and the HPF 2 film, based on BTDA–ODA, had the lightest yellow coloring among the films in this investigation, including Kapton H film. HPF 2, HPF 6, and HPF 8 films were more amorphous than the other films. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 976–988, 2001     

Fabrication and characterization of in situ synthesized iron oxide‐modified polyimide nanoweb by needleless electrospinning

A series of poly(amic acid) (PAA) solutions were prepared by sol–gel condensation of 4,4′‐oxydianiline (ODA) and 4,4′‐oxydiphthalic anhydride (ODPA), containing various wt % (5, 10, 15) of an iron oxide precursor, that is, tris(acetylacetonato)iron(III) complex. The resulting PAA solutions were electrospun at 78 kV and collected as webs of nonwoven nanofibers of diameter ～60–70 nm and subsequently converted to iron oxide‐modified polyimide (PI) nanofibers by slow thermal imidization. Aminopropyl triethoxysilane (APTES) and tetraethoxyorthosilicate (TEOS) were used as coupling agent and silica precursor, respectively, to enhance the compatibility between organic polymer matrix and inorganic moieties. SEM images reveal smooth and defect‐free surface morphologies of the nanofibers. Superparamagnetic properties of the nanofibers were revealed by vibrating sample magnetometer (VSM). FT‐infrared spectroscopy (IR), powder XRD, thermogravimetric analysis, and differential scanning calorimetry were employed to systematically characterize material structural properties, thermal stabilities, etc. Nanowebs showed excellent thermal stability around 446°C, with a glass transition temperature around 270°C. The above study demonstrates a good example for fabrication of highly thermally stable bead‐free nanofiber webs by needleless electrospinning. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40432.     

Photosensitive poly(amic acid)/organoclay nanocomposites

A project was carried out aimed at reducing the coefficient of thermal expansion (CTE) of photosensitive polyimide formulations (photoresists) through the incorporation of small amounts of an organoclay. The organoclay was formed by a cation exchange reaction between a NA⁺-montmorillonite clay and an ammonium salt of dodecylamine. Two polyimide precursors, a poly(amic ester) (PAE) and a poly(amic acid) (PAA), were used in this study. The PAE was prepared by direct polymerization of 2,2′-bis-(3-amino-4-hydroxyphenyl)hexafluoropropane and bis(n-butyl)ester of pyromellitic acid in the presence of phenylphosphonic dichloride as an activator. The polymer had an inherent viscosity of 0.23 dL/g. The PAA copolymer was prepared by polymerization of pyromellitic dianhydride, oxydiphthalic anhydride and oxydianiline. The polymer had an inherent viscosity of 1.00 dL/g. Two photosensitive resin/clay formulations were prepared from these two PI precursors using 2,3,4-tris(1-oxo-2-diazonaphthoquinone-5-sulfonyloxy)-benzophenone as the photosensitizer and 3 wt% organoclay. The films obtained from the PAA formulation were transparent and tough, while the films prepared from the PAE formulation were opaque and brittle. Both X-ray diffraction and transmission electron microscope analyses showed that, although the organoclay was not dispersed well in the PAE matrix, it was dispersed in the PAA matrix on a nanometer scale. The clay particles remained well dispersed after the PAA film was thermally imidized. The CTE of the polyimide film obtained was 23% lower than that of a similar film that did not contain the organoclay. The temperature at which the polyimide underwent a 5% weight loss when subjected to TGA in nitrogen was also increased by 13%. The photosensitive PAA/clay nanocomposite showed a sensitivity of 301 mJ/cm² and a contrast of 1.66 when a 0.2 wt% tetramethylammonium hydroxide developer was used. A line/space pattern with a resolution of 10 μm was obtained from this formulation.