硼在体心立方Fe—3%Si合金中的晶界偏聚行为

利用硼径迹显微照相(PTA)技术研究了体心立方Fe—3%Si合金试样在冷却和淬火等温过程中硼向晶界的偏聚行为结果表明:Fe-3%Si合金中硼的晶界平衡偏聚趋势高于奥氏体合金,也不存在淬火诱导硼向晶界的非平衡偏聚.硼原子与晶界结合能Q=55.7 kJ/mol用淬火诱导非平衡偏聚的复合体机制解释了硼在Fe-3%Si合金与奥氏体合金中偏聚行为异同的原因.     

利用APT对RPV模拟钢中界面上原子偏聚特征的研究

核反应堆压力容器(RPV)模拟钢样品经过660℃调质处理和370℃时效3000 h后,用原子探针层析法研究了晶界和相界面上原子偏聚的特征.结果表明,Ni,Mn,Si.C,P和Mo在晶界处均有不同程度的偏聚,偏聚倾向由强到弱依次为:C,P,Mo,Si,Mn和Ni.Cu在晶界处会出现贫化现象.Si在晶界上的偏聚程度与晶界的特性有关.在这几种元素中,C在晶界上偏聚的宽度最大,如以成分分布图中浓度峰的半高宽来比较,C的偏聚宽度是Mn,Ni和M0的1.5倍.在富Cu相与α-Fe的相界面处,Ni和Mn有明显的偏聚,而C,P.Mo和Si倾向偏聚在相界面的α-Fe一侧,且偏聚的程度比晶界处的低.     

S,P在高速钢晶界上的偏聚与稀土元素的净化作用

本文用Auger能谱仪较详细地研究了S,P等杂质元素在高速钢铸态晶界和奥氏体晶界上的偏聚情况与稀土元素的净化作用。钢中的S,P含量不同,在晶界上偏聚的量也不同。加入稀土元素后,可以使偏聚在晶界上的S,P减少,并观察到了稀土能使晶界上的硫消失.文中对S,P在晶界上偏聚和稀土元素净化作用的原因进行了讨论。     

SEGREGATION OF S AND P ALONG GRAIN BOUNDARY IN HIGH SPEED STEELS AND CLEANING ACTION OF RE ELEMENTS

本文用Auger能谱仪较详细地研究了S,P等杂质元素在高速钢铸态晶界和奥氏体晶界上的偏聚情况与稀土元素的净化作用。钢中的S,P含量不同,在晶界上偏聚的量也不同。加入稀土元素后,可以使偏聚在晶界上的S,P减少,并观察到了稀土能使晶界上的硫消失.文中对S,P在晶界上偏聚和稀土元素净化作用的原因进行了讨论。     

微量Sn在高磁感取向硅钢中的晶界偏聚

采用扫描Auger微探针(SAM)对微量Sn在高磁感取向硅钢中的晶界偏聚行为进行了研究,证明Sn在发生晶界偏聚时与取向硅钢中其它元素间没有明显的交互作用.在二次再结晶起始温度950℃,Sn在晶界仍有一定的偏聚量,作者认为,Sn通过在晶界偏聚起到了辅助抑制剂的作用.此外,根据理论分析,在高磁感取向硅钢中加入微量Sn可降低二次再结晶温度,这一结论与实验结果相吻合。     

微量溶质元素在金属晶界的偏聚

溶质元素在金属晶界的偏聚可以分为两类，即平衡偏聚和非平衡偏聚。本文回顾了这两类偏聚现象及其机理，着重讨论分析了有重要工程用途的三类典型的晶界偏聚：硼在奥氏体晶界的两类偏聚的实验规律及对硼钢淬透性影响；磷在奥氏体晶界的平衡偏聚及对钢回火脆性的作用，钢中的其他合金元素对磷的偏聚的影响；硼在多种金属间化合物的偏聚及对这些金属间化合物塑性的影响及其机理。     

Fe-C-Si-Mn晶界多元偏聚研究与热力学分析SCIEI

采用Auger谱仪、二次离子质谱仪(SIMS)对Fe-C-Si-Mn合金(475℃等温处理)原始奥氏体晶界C,Si,Mn元素偏聚进行了研究。根据C,Mn正偏聚,Si负偏聚的实验结果,对晶界碳偏聚偏克分子自由能及活度进行热力学计算,结果表明Si,Mn元素促进碳在晶界的偏聚,并降低了它在晶界上的活度。从而使Fe-C-Si-Mn合金上贝氏体等温C曲线右移的现象得到解释。     

高温合金GH4169(Inconel 718)中磷晶界偏聚特性的实验研究

采用Auger电子能谱仪测量了镍基高温合金GH4169中磷(P)的晶界偏聚量.结果表明,经1020与1200 ℃固溶处理后在720 ℃时效2 h的样品,P的晶界偏聚浓度分别是0.344%与0.412%(原子分数).晶界偏聚浓度随固溶处理温度的升高而升高.基于这一实验结果,确定了P在该合金中的非平衡晶界偏聚特性.     

TEMPER BRITTLENESS OF P-DOPED STEELS 35CrMnSi AND 35CrNi3——Grain Boundary Segregation of P and Effect of La Addition

用Auger电子能谱(AES)研究了含磷450ppm的35CrMnSi和35CrNi3钢回火脆性与杂质元素磷及合金元素Ni,Cr,Mn晶界偏聚的关系。含磷钢的回火脆性主要是由磷在原奥氏体晶界偏聚所致。经1200℃油淬、625℃回火1h水冷的所谓“韧态”,磷已在晶界大量偏聚,钢已明显脆化;经阶梯冷却脆化处理后,晶界磷浓度成倍增加。在阶梯冷却脆化期间,Ni-Cr钢中磷的晶界偏聚速率比Cr-Mn-Si钢大。试验钢的FATT与晶界含磷量成正比;Ni-Cr钢中晶界Ni与磷呈线性关系。试验钢中加入La能够减少相同状态下的晶界磷浓度,从而改善钢的回火脆性。     

硼向奥氏体晶界的非平衡偏聚

采用高分辨率的径迹显微照相技术,研究了淬火硼钢中硼向奥氏体晶界偏聚的规律,定量地测定出跨过奥氏体晶界的硼的成分剖面图以及非平衡晶界偏聚的特征参量(晶界贫硼区宽度、晶界富集程度和富集带宽度)。试验表明,这种偏聚具有如下特征: 在偏聚晶界的两侧存在有一定宽度的贫硼区,晶界偏聚的硼是在冷却过程中由该区富集而来;这种偏聚对冷却速度很敏感,急速冷却可以抑制这种偏聚。冷却速度降低,晶界偏聚由连续的偏聚带,逐步发展为不连续的聚集直至明显地析出硼相,贫硼区宽度与冷却速度的平方根成反比;它的温度关系与晶界平衡偏聚预言相反,随淬火温度升高,晶界偏聚程度与贫硼区宽度增加。通过试验,论证了淬火钢中硼向奥氏体晶界的偏聚,是在冷却过程中发生的一种非平衡的晶界偏聚现象。     

STUDY OF INTERFACES AND SURFACES OF YBa_2Cu_3O_(7-x)-Ag

Interfaces and surfaces of YBa_2Cu_3O_(7-x)(YBCO)-Ag have been studied by SEM-EDXand AES.No effect of Ag on 123 structure in X-ray diffraction pattern was observedfor 0.4 mol Ag doped YBCO.AES analysis indicated that Ag segregated on surfaceof YBCO and resulted in decrease of YBCO-metal lead resistance.In addition,solutionand segregation of Ag as elemental state were often appeared on interfaces and surfacesof high temperature annealed YBCO,whether elemental Ag or compound Ag_2O andAgNO_3 adopted as doping material.     

On the role of pre-existing defects and magnetic flux avalanches in the degradation of YBa2Cu3O7–x coated conductors by quenching

YBa₂Cu₃O_7–x (YBCO) coated conductors are emerging as an important option for magnets for energy systems and experimental science. One of the remaining challenges for YBCO superconducting magnets is quench protection, i.e. ensuring that the YBCO is not damaged due to a fault condition. One key issue is understanding the underlying causes of degradation during a quench. Here, the microstructure of a quenched, degraded sampled is compared to that of an unquenched control sample. To facilitate microstructural analysis of the YBCO surface, the Cu stabilizer and Ag cap layer were removed by etching. Reactions between the Cu etchant and YBCO proved to be a signature of Ag/YBCO delamination. Two types of pre-existing defects were identified as initiation points of degradation. Defects on the conductor edge resulting in delaminated Ag lead to dendritic flux avalanches and high local heating, which cause further Ag delamination. This self-propagating effect results in dendritic Ag delamination, which is seen through etchant–YBCO reactions. Defects within the YBCO layer result in breaches in the protective Ag layer such that Cu etchant penetrates and reacts with the YBCO. Energy-dispersive X-ray spectroscopy analysis showed similar reactions as in the edge degradation but also showed pure Ag particles, which indicates that the local temperature was sufficient to cause localized Ag melting.     

Fabrication of YBCO films on Ag substrate by TFA-MOD method

Biaxial aligned YBCO films have been successfully deposited on Ag { 110 } (110) textured polycrystalline substrates by metal-organic decomposition (MOD) method using Trifluoroacetate Salt (TFA). The influence of firing temperature and Ag surface defects on phase purity and texture, surface morphology of YBCO films was studied. Holding temperature at 900℃ for 30 rain benefits to improve orientation and connectivity of YBCO films. The surface of YBCO films deposited on unpolished Ag substrate has many holes and stripes, which are parallel to the rolling stripe on Ag substrates. To eliminate the rolling stripe on the Ag surface, Ag substrates were polished prior to films deposition. The film grown on polished Ag substrates has a smooth surface and good connectivity of grains without parallel stripes. The YBCO films have an onset of transition around 90K and critical current densities of 15000 A/cm^2.     

Highly c-axis Oriented YBCO Thin Films Deposited on Cold Rolling Ag Substrates and Textures of Cold-Rolling and Recrystallization in Ag

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Al2O3和Cr过渡层对Ag膜光学性质及其附着力的影响

研究了在玻璃基底上镀制Al2O3和Cr过渡层对Ag膜反射率及附着力的影响.分光光度计测试了Ag膜的反射率,结果表明,与Cr过渡层相比,Al2O3过渡层对Ag膜反射率的降低相对较小;而且,随着Al2O3厚度的增加,Ag膜的反射率先增大后减小.XRD与AES测试表明,引入Al2O3或Cr可明显细化Ag晶粒,减弱Ag膜(111)织构;Al2O3作过渡层时,Al原子向Ag层中扩散显著;而Cr作过渡层时,只有少量Cr原子扩散进入Ag层.因此,Al2O3作过渡层能显著增强薄膜与玻璃基体之间的附着力.     

Corrosion Process and Surface Protection for YBCO Superconductor

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CRYSTALLOGRAPHIC ORIENTATION AND ELEMENTAL SEGREGATION OF FLAKES IN STEELS

利用电子光学仪器(扫描电镜、透射电镜、电子探针和Auger能谱仪)对钢中白点的晶体取向和元素偏析进行了综合研究。结果表明:白点断口以晶内的准解理和沿晶的波状撕裂条纹的混合断裂形态为特征;白点断裂面的晶体学取向主要是沿铁素体{112}晶面的准解理断裂,显徽空隙内枝晶表面为{111}自由面;白点断口上有P和Cr,Mo,Mn的正偏析,其中以P最为明显。     

采用低氟溶胶-凝胶法在725℃煅烧温度下制备YBCO超导薄膜的研究

采用低氟溶胶-凝胶法在LaAlO₃(100)基板上制备了YBa₂Cu₃O_7-x (YBCO)薄膜,研究了725℃的煅烧过程中氧含量对最终所得到YBCO薄膜的临界电流密度J_c的影响。研究发现,煅烧过程中氧气含量在100-1700 ppm范围内时,所获得的YBCO薄膜均具有良好的双轴织构特征。然而,当氧气含量较小时,所获得的YBCO薄膜致密性差,J_c较低。随着氧气含量的增大,YBCO薄膜表面逐渐变得致密。当氧气含量增加到300ppm时,YBCO薄膜表面较致密,J_c值达到4.3MA/cm₂。继续增大氧含量,薄膜表面出现富铜的第二相颗粒并逐渐增多,导致薄膜J_c降低。     

Effects of Al, Ga, and Ag on the anti-oxidation and wetting reactions of Sn-9Zn-X solders

The effects of Ca, Al, and Ag on the anti-oxidation of Sn-9Zn-X solders and the interface reactions between the solders and Cu substrate were investigated by Auger electron spectroscopy (AES) and scanning electron microscope (SEM) analysis, respectively. The mechanism of improving the wettability of Sn-g Zn lead-flee solder by adding Ca, Al, and Ag was also revealed. The AES analysis indicated that Al and Ca might enrich on the molten solder surface which resulted in improving the anti-oxidation of Sn-gZn-O. O05Al and Sn-gZn-O. 3C, a alloys. The addition of Ca reduced the apparent activation energy and promoted the interface reaction. With the addition of 0.3 wt. % Ag, some scallop-like intermetallic compounds (IMCs) formed at the interface, according to the energy dispersive spectroscopy (EDS) analysis, these scallop-like IMCs might be the mixture of Ag-Zn and Cu-Sn compounds.     

碳钢海水工业冷却器的腐蚀控制技术

应用电化学联合保护新技术,通过冷却管管内保护电位与保护电流测量,研究静止与流动海水中管内保护电位变化,保护电位与保护电流随时间变化以及管径与海水流速对管内保护电位的影响。冷却管11个月平均保护电流密度约0．4mA/m^2,11个月后冷却管（管内径19mm,长3m）管内远端保护电位为－940mV（相对于Ag/AgCI参比电极）。实现冷却管（管内径19mm)内保护距离从以前的0．3m提高到3m以上（单端）。经过近一年的模拟实验,冷却管完好如初。